STMICROELECTRONICS TDA8172

TDA8172
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
..
.
POWER AMPLIFIER
FLYBACK GENERATOR
THERMAL PROTECTION
DESCRIPTION
The TDA8172 is a monolithic integrated circuit in
HEPTAWATTTM package. It is a high efficiency
power booster for direct driving of vertical windings
of TV yokes. It is intended for use in Color and B &
W television as well as in monitors and displays.
HEPTAWATT
(Plastic Package)
ORDER CODE : TDA8172
PIN CONNECTIONS (top view)
8172-01.EPS
NON-INVERTING INPUT
OUTPUT STAGE SUPPLY
OUTPUT
GROUND
FLYBACK GENERATOR
SUPPLY VOLTAGE
INVERTING INPUT
7
6
5
4
3
2
1
Tab connected to Pin 4
BLOCK DIAGRAM
+ VS
2
6
3
FLYBACK
GENERATOR
1
POWER
AMPLIFIER
THERMAL
P ROTECTION
YOKE
5
7
TDA8172
8172-02.EPS
4
May 1996
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TDA8172
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
Unit
VS
Supply Voltage (pin 2)
35
V
V5 , V6
Flyback Peak Voltage
60
V
V3
V1 , V7
Voltage at Pin 3
+ Vs
Amplifier Input Voltage
+ Vs
– 0.5
V
2.5
A
A
Io
Output Peak Current (non repetitive, t = 2 ms)
Io
Output Peak Current at f = 50 or 60 Hz, t ≤ 10 µs
3
Io
Output Peak Current at f = 50 or 60 Hz, t > 10 µs
2
A
I3
Pin 3 DC Current at V5 < V2
100
mA
I3
Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly ≤ 1.5 ms
3
A
Total Power Dissipation at Tcase = 90 °C
20
W
– 40, +150
°C
Ptot
Tstg, Tj
Storage and Junction Temperature
8172-01.TBL
Symbol
Symbol
Rth (j–c)
Parameter
Thermal Resistance Junction-case
Value
Unit
3
°C/W
Max.
8172-02.TBL
THERMAL DATA
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified)
Parameter
Test Conditions
Typ.
Max.
Unit Fig.
I2
Pin 2 Quiescent Current
I3 = 0, I5 = 0
8
16
mA
1a
I6
Pin 6 Quiescent Current
I3 = 0, I5 = 0
16
36
mA
1a
I1
Amplifier Input Bias Current
V1 = 1 V, V7 = 2 V
– 0.1
–1
µA
1a
V1 = 2 V, V7 = 1 V
– 0.1
–1
µA
1a
V3L
Pin 3 Saturation Voltage to GND
I3 = 20 mA
1
1.5
V
1c
V5
Quiescent Output Voltage
Vs = 35V, Ra = 39 kΩ
18
V
1d
V5L
Output Saturation Voltage to GND
1c
V5H
Output Saturation Voltage to Supply
I5 = 1.2 A
1
1.4
V
I5 = 0.7 A
0.7
1
V
1c
– I5 = 1.2 A
1.6
2.2
V
1b
1.3
1.8
V
1b
– I5 = 0.7 A
Tj
2/5
Min.
Junction Temperature for Thermal Shut Down
140
°C
8172-03.TBL
Symbol
TDA8172
Figure 1 : DC Test Circuits.
Figure 1 a : Measurement of I1 ; I2 ; I6
Figure 1 b : Measurement of V5H
VS
I2
VS
I6
2
2
6
6
V5H
5
10kΩ
S1
1
5
1V
a
1
b
4
1V
I5
V7
8172-03.EPS
V7
4
7
I1
8172-04.EPS
7
S1 : (a) I2 and I6 ; (b) I1
Figure 1 c : Measurement of V3L ; V5L
Figure 1 d : Measurement of V5
VS
VS
2
I 3 or I 5
2
6
S1
6
12kΩ
1
a
3
b
5
2V
1
4
7
3V
V5
V7
5
Ra
4
V 3L
V 5L
5.6kΩ
8172-06.EPS
V7
8172-05.EPS
7
S1 : (a) V3L ; (b) V5L
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TDA8172
Figure 2 : AC Test Circuit
1N4001
VS
C1
0.1 µF
C2
470µF
2
6
3
TDA8172
5
10kΩ
R7
1.5 Ω
4
RT1
4.7kΩ
R3
IN
12kΩ
R2
5.6kΩ
to
C4
0.22µF
1
to
V7
Iy
R1
Vi
t fly
7
VREF
GND
C3
220µF
D1
Ly
24.6mH
R6
330Ω
Ry
9.6 Ω
R4
C6
4.7 µF
8.2kΩ
C5
2200µF
*Re comme nde d for
VREF filtering
to
8172-07.EPS
R 5 Iy
R5
8.2 Ω
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink.
Thanks to the HEPTAWATTTM package attaching
the heatsink is very simple, a screw or a compression spring (clip) being sufficient.
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is connected to Pin 4 which is ground.
8172-08.EPS - 8172-09.EPS
Figure 3 : Mounting Examples
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TDA8172
PM-HEPTV.EPS
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
A
C
D
D1
E
F
F1
G
G1
G2
H2
H3
L
L1
L2
L3
L5
L6
L7
M
M1
Dia.
Min.
Millimeters
Typ.
2.4
1.2
0.35
0.6
2.41
4.91
7.49
2.54
5.08
7.62
10.05
Max.
4.8
1.37
2.8
1.35
0.55
08
0.9
2.67
5.21
7.8
10.4
10.4
Min.
0.094
0.047
0.014
0.024
0.095
0.193
0.295
Max.
0.189
0.054
0.110
0.053
0.022
0.031
0.035
0.105
0.205
0.307
0.409
0.409
0.668
0.587
0.848
0.891
3
15.8
6.6
0.102
0.594
0.236
2.8
5.08
3.65
0.100
0.200
0.300
0.396
16.97
14.92
21.54
22.62
2.6
15.1
6
Inches
Typ.
0.118
0.622
0.260
0.110
0.200
3.85
0.144
HEPTV.TBL
Dimensions
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
 1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to
the I2C Standard Specifications as defined by Philips.
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