THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 50 MHz to 400 MHz CASCADEABLE AMPLIFIER FEATURES APPLICATIONS • • • • • High Dynamic Range – OIP3 = 36 dBm – NF < 4.5 dB Single Supply Voltage High Speed – VS = 3 V to 5 V – IS = Adjustable Input / Output Impedance – 50 Ω IF Amplifier – TDMA: GSM, IS-136, EDGE/UWE-136 – CDMA: IS-95, UMTS, CDMA2000 – Wireless Local Loop – Wireless LAN: IEEE802.11 DESCRIPTION The THS9000 is a medium power, cascadeable, gain block optimized for high IF frequencies. The amplifier incorporates internal impedance matching to 50 Ω. The part mounted on the standard EVM achieves greater than 15-dB input and output return loss from 50 MHz to 325 MHz with VS = 5 V, R(BIAS) = 237 Ω, L(COL) = 470 nH. Design requires only 2 dc-blocking capacitors, 1 power-supply bypass capacitor, 1 RF choke, and 1 bias resistor. Functional Block Diagram VS C(BYP) L(COL) IF(OUT) C(BLK) 6 5 4 1 2 3 THS9000 IF(IN) C(BLK) VS R(BIAS) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2006, Texas Instruments Incorporated THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICE (1) PACKAGE TYPE TRANSPORT MEDIA, QUANTITY THS9000DRDT Tape and Reel, 250 THS9000DRDR Tape and Reel, 3000 THS9000DRWT 2 x 2 QFN (2) Tape and Reel, 250 THS9000DRWR (1) Tape and Reel, 3000 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. The PowerPAD is electrically isolated from all other pins. (2) ABSOLUTE MAXIMUM RATINGS over operating free-air temperature (unless otherwise noted) (1) UNIT Supply voltage, GND to VS 5.5 V Input voltage GND to VS Continuous power dissipation See Dissipation Ratings Table Maximum junction temperature, TJ 150°C Maximum junction temperature, continuous operation, long term reliability, TJ (2) 125°C Storage temperature, Tstg -65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds ESD Ratings: (1) (2) 300°C HBM 2000 CDM 1500 MM 100 The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. DISSIPATION RATING TABLE (1) (2) (3) POWER RATING (1) PACKAGE ΘJA (°C/W) TA ≤ 25°C TA = 85°C DRD (2) (3) 91 1.1 W 440 mW DRW (2) (3) 91 1.1 W 440 mW Power rating is determined with a junction temperature of 125°C. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance. This data was taken using the JEDEC standard High-K test PCB. The THS9000 incorporates a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD™ thermally-enhanced package RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage 2.7 5 V Operating free-air temperature, TA -40 85 °C Supply current 2 100 Submit Documentation Feedback mA THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 ELECTRICAL CHARACTERISTICS Typical Performance (VS = 5 V, R(BIAS) = 237 Ω, L(COL) = 470 nH) (unless otherwise noted) PARAMETER TEST CONDITIONS Gain OIP3 1-dB compression Input return loss Output return loss Reverse isolation Noise figure MIN TYP f = 50 MHz 15.9 f = 350 MHz 15.6 f = 50 MHz 36 f = 350 MHz 35 f = 50 MHz 20.8 f = 350 MHz 20.6 f = 50 MHz 15 f = 350 MHz 19.7 f = 50 MHz 17.2 f = 350 MHz 15.1 f = 50 MHz 21 f = 350 MHz 20 f = 50 MHz 3.6 f = 350 MHz 4 MAX UNITS dB dBm dBm dB dB dB dB PIN ASSIGNMENT IF(IN) 1 6 VS GND 2 5 L(COL) BIAS 3 4 IF(OUT) Terminal Functions Pin Numbers Name 1 IF(IN) Description Signal input 2 GND Negative power supply input 3 BIAS Bias current adjustment input 4 IF(OUT) Signal output 5 L(COL) Output transistor load inductor 6 VS Positive power supply input SIMPLIFIED SCHEMATIC VS L(COL) BIAS IF(OUT) IF(IN) GND Submit Documentation Feedback 3 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 TYPICAL CHARACTERISTICS TABLE OF GRAPHS FIGURE IS S21 Frequency response 1 S22 Frequency response 2 S11 Frequency response 3 S12 Frequency response 4 S21 vs R(Bias) 5 Output power vs Input power 6 OIP2 vs Frequency 7 Noise figure vs Frequency 8 OIP3 vs Frequency 9 Supply current vs R(Bias) 10 S21 Frequency response 11 S22 Frequency response 12 S11 Frequency response 13 S12 Frequency response 14 Noise figure vs Frequency 15 OIP2 vs Frequency 16 Output power vs Input power 17 OIP3 vs Frequency 18 S-Parameters of THS9000 as mounted on the EVM with VS = 5 V, R(BIAS) = 237 Ω, and L(COL) = 68 nH to 470 nH at room temperature. S21 FREQUENCY RESPONSE 17 S22 FREQUENCY RESPONSE 0 L(COL) = 470 nH L(COL) = 68 nH L(COL) = 220 nH 16 L(COL) = 100 nH L(COL) = 330 nH −5 S22 − dB S21 − dB 15 14 −10 L(COL) = 220 nH 13 L(COL) = 100 nH L(COL) = 330 nH 12 −15 L(COL) = 470 nH L(COL) = 68 nH 11 VS = 5 V, R(BIAS) = 237, 10 1M 10 M 100 M VS = 5 V, R(BIAS) = 237, −20 1G 1M Figure 1. 4 10 M 100 M f − Frequency − Hz f − Frequency − Hz Figure 2. Submit Documentation Feedback 1G THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 S11 FREQUENCY RESPONSE 0 S12 FREQUENCY RESPONSE −15 L(COL) = 68 nH −5 −20 L(COL) = 100 nH −10 L(COL) = 220 nH −15 S12 − dB S11 − dB VS = 5 V, R(BIAS) = 237, L(COL) = 470 nH L(COL) = 330 nH −20 L(COL) = 470 nH −25 L(COL) = 330 nH −25 L(COL) = 220 nH −30 L(COL) = 100 nH −30 L(COL) = 68 nH −35 −35 VS = 5 V, R(BIAS) = 237, −40 −45 1M 10 M 100 M f − Frequency − Hz −40 1G 10 M 100 M f − Frequency − Hz 1M Figure 3. 1G Figure 4. S-Parameters of THS9000 as mounted on the EVM with VS = 3 V and 5 V, R(BIAS) = various, and L(COL) = 470 nH at room temp. S21 vs R(BIAS) 17 OUTPUT POWER vs INPUT POWER 22 R(BIAS) = 56.2 , VS = 3 V R(BIAS) = 237 , VS = 5 V VS = 5 V, IS = 97 mA 21 16 PO − Output Power − dBm 15 S21 − dB VS = 5 V, IS = 71 mA 20 R(BIAS) = 97.7, VS = 3 V 14 R(BIAS) = 340 , VS = 5 V 13 R(BIAS) = 174 , VS = 3 V R(BIAS) = 549 , VS = 5 V 12 19 VS = 5 V, IS = 48 mA 18 17 16 15 VS = 3 V, IS = 69 mA 14 VS = 3 V, IS = 49 mA 13 VS = 3 to 5 V, R(BIAS) = Various, L(COL) = 470 nH 11 11 10 1M 10 M 100 M f − Frequency − Hz VS = 3 V, IS = 91 mA 12 1G 10 −6 Figure 5. −4 −2 0 2 4 6 8 PI − Input Power − dBm 10 12 14 Figure 6. Submit Documentation Feedback 5 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 OIP2 vs FREQUENCY NOISE FIGURE vs FREQUENCY 50 5 VS = 5 V, IS = 97 mA 48 VS = 3 V, IS = 91 mA VS = 3 V, IS = 69 mA 44 42 40 VS = 5 V, IS = 71 mA 4.5 Noise Figure − dB OIP2 − dBm 46 VS = 5 V, IS = 97 mA 4.75 VS = 5 V, IS = 71 mA VS = 5 V, IS = 48 mA 4.25 4 VS = 3 V, IS = 70 mA 3.75 VS = 3 V, IS = 49 mA VS = 3 V, IS = 49 mA 38 3.5 36 VS = 3 V, IS = 91 mA 3.25 VS = 5 V, IS = 48 mA 34 0 50 100 200 150 f − Frequency − MHz 250 3 300 0 Figure 8. OIP3 vs FREQUENCY SUPPLY CURRENT vs R(BIAS) 400 500 450 550 200 VS = 5 V, IS = 71 mA 38 VS = 5 V, IS = 97 mA 180 I S − Supply Current − mA VS = 3 V, IS = 91 mA 36 OIP3 − dBm 200 300 f − Frequency − MHz Figure 7. 40 34 32 VS = 3 V, IS = 69 mA 30 28 26 24 100 200 300 f − Frequency − MHz 140 120 VS = 5 V 100 80 VS = 3 V 40 VS = 5 V, IS = 48 mA 0 160 60 VS = 3 V, IS = 49 mA 400 500 20 50 Figure 9. 6 100 150 250 350 R(BIAS) − Figure 10. Submit Documentation Feedback THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 THS9000 as mounted on the EVM with VS = 5 V, R(BIAS) = 237 Ω, and L(COL) = 470 nH at 40°C, 25°C, and 85°C. S21 FREQUENCY RESPONSE 17 S22 FREQUENCY RESPONSE 0 TA = −45C VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH 16 15 −5 TA = 85C S22 − dB S21 − S-Parameters − dB TA = 25C 14 −10 TA = 85C 13 12 VS = 5 V, R(BIAS) = 327 , L(COL) = 470 nH 11 10 TA = 25C −15 1M TA = −45C −20 10 M 100 M f − Frequency − Hz 1G 1M 10 M 100 M f − Frequency − Hz Figure 11. Figure 12. S11 FREQUENCY RESPONSE 0 S12 FREQUENCY RESPONSE −15 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH −5 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH TA = −45C −20 −10 −15 S12 − dB S11 − dB 1G −20 TA = 25C −25 TA = 85C −25 −30 TA = 85C −30 −35 TA = −45C −40 TA = 25C −45 −35 −40 1M 10 M 100 M 1G 1M f − Frequency − Hz Figure 13. 10 M 100 M f − Frequency − Hz 1G Figure 14. Submit Documentation Feedback 7 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 NOISE FIGURE vs FREQUENCY OIP2 vs FREQUENCY 50 6 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH 5.5 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH 49 48 47 5 OIP2 − dBm Noise Figure − dB TA = 85C 4.5 TA = 25C 4 45 44 TA = 25C 43 TA = 85C 42 3.5 41 TA = −45C 3 40 0 100 200 300 f − Frequency − MHz 400 500 21 150 200 250 300 f − Frequency − MHz Figure 15. Figure 16. OUTPUT POWER vs INPUT POWER OIP3 vs FREQUENCY 40 TA = 85C VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH f = 100 MHz 39 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH 38 OIP3 − dBm 20 19 18 100 50 22 PO − Output Power − dBm TA = −45C 46 TA = −45C TA = 25C 37 TA = −45C 36 TA = 85C 17 35 16 34 TA = 25C 33 15 14 −2 0 2 4 6 8 PI − Input Power − dBm 10 12 32 50 Figure 17. 8 100 150 200 250 300 350 400 450 500 f − Frequency − MHz Figure 18. Submit Documentation Feedback THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 TYPICAL CHARACTERISTICS S-Parameters Tables of THS9000 with EVM De-Embedded VS = 5 V, R(BIAS) = 237 Ω, L(COL) = 470 nH S21 Frequency (MHz) S11 Gain (dB) Phase (deg) Gain (dB) 1.0 -4.2 -169.5 5.0 11.3 -124.5 10.2 15.8 -147.8 19.7 16.4 50.1 16.0 69.7 S22 S12 Phase (deg) Gain (dB) Phase (deg) Gain (dB) Phase (deg) -2.4 -0.9 -1.9 158.1 -63.1 167.0 -1.5 -14.5 -2.6 138.0 -32.9 122.4 -2.2 -42.3 -5.0 101.0 -24.0 80.4 -169.4 -6.5 -69.7 -10.5 66.6 -21.3 41.6 177.2 -15.6 -91.4 -16.7 30.1 -20.7 14.4 15.9 173.5 -19.8 -97.7 -17.8 17.7 -20.7 9.1 102.4 15.9 168.4 -26.9 -102.6 -18.2 4.3 -20.7 4.4 150.5 15.8 162.0 -39.0 14.1 -18.1 -8.6 -20.7 -0.7 198.1 15.7 155.8 -27.6 50.8 -17.4 -19.6 -20.7 -1.7 246.9 15.7 149.6 -23.7 40.6 -16.4 -26.7 -20.7 -3.5 307.6 15.6 141.9 -19.8 33.1 -14.9 -37.2 -20.6 -5.7 362.8 15.6 134.7 -17.3 24.7 -13.3 -44.3 -20.4 -7.7 405.0 15.6 129.2 -15.5 20.3 -12.1 -51.0 -20.2 -10.0 452.2 15.6 122.3 -13.8 14.7 -10.6 -58.1 -19.9 -12.5 504.7 15.5 114.9 -11.8 6.3 -9.0 -66.5 -19.7 -16.2 563.4 15.4 105.8 -9.7 -2.9 -7.2 -77.5 -19.4 -22.4 595.3 15.3 100.5 -8.6 -9.1 -6.3 -83.6 -19.3 -26.2 664.5 14.9 88.7 -6.3 -24.2 -4.4 -99.7 -19.3 -36.7 702.1 14.6 81.0 -5.3 -33.2 -3.7 -109.2 -19.6 -43.4 741.8 14.1 76.3 -4.4 -42.9 -3.0 -118.8 -19.9 -50.2 828.1 12.7 60.2 -2.9 -65.5 -2.3 -142.8 -21.7 -69.2 874.9 11.2 51.0 -2.5 -77.9 -2.5 -155.0 -23.6 -75.0 924.4 10.1 50.2 -2.4 -90.4 -3.1 -166.0 -25.8 -85.2 976.7 8.8 51.8 -2.5 -100.7 -4.3 -173.7 -28.4 -78.9 1031.9 9.2 58.2 -2.6 -108.7 -4.7 -175.2 -29.7 -68.7 1090.3 8.9 48.0 -2.5 -115.2 -4.4 -164.7 -31.4 -69.1 1151.9 8.8 39.9 -2.3 -123.3 -3.5 -175.4 -33.6 -83.4 1217.1 8.0 27.7 -2.1 -132.0 -3.0 175.3 -38.2 -81.4 1285.9 7.0 30.5 -2.0 -140.7 -2.8 168.7 -42.3 -25.5 1358.6 5.6 20.6 -1.9 -149.4 -2.9 159.1 -42.2 41.6 1435.5 4.3 19.5 -1.8 -159.4 -3.0 151.3 -38.7 63.3 1516.6 3.4 17.7 -1.9 -168.3 -3.2 144.7 -33.6 62.4 1602.4 2.8 16.5 -2.0 -177.2 -3.5 138.2 -30.5 59.6 1693.0 2.2 8.6 -2.1 174.0 -3.8 131.4 -28.1 56.2 1788.8 1.4 -0.7 -2.2 165.4 -4.1 124.6 -26.2 50.4 1889.9 0.5 -4.1 -2.3 157.0 -4.5 118.2 -24.7 42.4 1996.8 -0.6 -4.5 -2.6 150.0 -4.9 111.2 -24.2 39.5 Submit Documentation Feedback 9 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 APPLICATION INFORMATION The THS9000 is a medium power, cascadeable, amplifier optimized for high intermediate frequencies in radios. The amplifier is unconditionally stable and the design requires only 2 dc-blocking capacitors, 1 power-supply bypass capacitor, 1 RF choke, and 1 bias resistor. Refer to Figure 25 for the circuit diagram. The THS9000 operates with a power supply voltage ranging from 2.5 V to 5.5 V. The value of R(BIAS) sets the bias current to the amplifier. Refer to Figure 10. This allows the designer to trade-off linearity versus power consumption. R(BIAS) can be removed without damage to the device. Component selection of C(BYP), CIN, and COUT is not critical. The values shown in Figure 25 were used for all the data shown in this data sheet. The amplifier incorporates internal impedance matching to 50Ω that can be adjusted for various frequencies of operation by proper selection of L(COL). Figure 19 shows the s-parameters of the part mounted on the standard EVM with VS = 5 V, R(BIAS) = 237Ω , and L(COL) = 470 nH. With this configuration, the part is very broadband, and achieves greater than 15-dB input and output return loss from 50 MHz to 325 MHz. Figure 20 shows the S-parameters of the part mounted on the standard EVM with VS = 5 V, R(BIAS) = 237Ω , and L(COL) = 68 nH. With this configuration, the part achieves greater than 15-dB input and output return loss from 250 MHz to 400 MHz. 16 VS = 5 V, R(BIAS) = 237 , L(COL) = 470 nH 0 0 15 −15 13 S22 −20 12 −10 13 −15 12 11 11 −25 S12 −30 1M 10 M 100 M 1G S12 −20 VS = 5 V, R(BIAS) = 237 , L(COL) = 68 nH −25 10 −30 1M 10 M 100 M 1G f − Frequency − Hz f − Frequency − Hz Figure 19. S-Parameters of THS9000 mounted on the standard EVM with VS = 5 V, R(BIAS) = 237 Ω, and L(COL) = 470 nH 10 −5 S11 14 S21 − dB −10 14 S11, S12, S22 − dB −5 15 10 5 S21 S22 Figure 20. S-Parameters of THS9000 mounted on the standard EVM with VS = 5 V, R(BIAS) = 237 Ω, and L(COL) = 68 nH Submit Documentation Feedback S11, S12, S22 − dB S21 S11 S21 − dB 16 5 17 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 APPLICATION INFORMATION (continued) Figure 21 Shows an example of a single conversion receiver architecture and where the THS9000 would typically be used. 900 MHz − 2 GHz 900 MHz − 2 GHz Image Rejection Filter LNA 2 LNA 1 LO Drive Amp 1 RX LO IF Amp 1 Mixer IF Amp 2 IF SAW PGA IF SAW ADC LO Drive Amp 2 THS9000 2x for Diversity Figure 21. Example Single Conversion Receiver Architecture Figure 22 shows an example of a dual conversion receiver architecture and where the THS9000 would typically be used. 900 MHz − 2 GHz LNA 1 100 MHz − 300 MHz 1st IF Amp Image Reject Filter 1st Mixer 1st IF SAW PGA LNA 2 LO1 Drive LO1 Drive Amp 2 RX LO 1 Amp 1 20 MHz − 70 MHz 2nd IF Amp1 2nd IF SAW 2nd IF Amp2 2nd Mixer Alias Filter ADC LO2 Drive LO2 Drive Amp 1 Amp 2 RX LO2 THS9000 2x for Diversity Figure 22. Example Dual Conversion Receiver Architecture Figure 23 shows an example of a dual conversion transmitter architecture and where the THS9000 would typically be used. BB 100 MHz − 300 MHz 900 MHz − 2 GHz 1st IF amp DAC RX LO1 BB Amp Alias Filter 1st Mixer LO1 Drive LO1 Drive Amp 2 Amp 1 IF SAW RX LO2 PGA 2nd Mixer PA LO2 Drive LO2 Drive Amp 2 Amp 1 THS9000 2x for Diversity Figure 23. Example Dual Conversion Transmitter Architecture Submit Documentation Feedback 11 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 Figure 24 shows the THS9000 and Sawtek #854916 SAW filter frequency response along with the frequency response of the SAW filter alone. The SAW filter has a center frequency of 140 MHz with 10-MHz bandwidth and 8-dB insertion loss. It can be seen that the frequency response with the THS9000 is the same as with the SAW except for a 15-dB gain. The THS9000 is mounted on the standard EVM with VS = 5 V, R(BIAS) = 237 Ω, and L(COL) = 470 nH. Note the amplifier does not add artifacts to the signal. SAW + THS9000 THS9000 SAW RED = SAW 140 MHz SAW Only GREEN = 140 MHz SAW: Sawtek #854916 Figure 24. Frequency Response of the THS9000 and SAW Filter, and SAW Filter Only VS C(BYP) 0.1 F CO IF(OUT) L(COL) 1 nF 6 5 4 1 2 3 THS9000 IF(IN) CI R(BIAS) 1 nF VS Figure 25. THS9000 Recommended Circuit (used for all tests) 12 Submit Documentation Feedback THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 Evaluation Module Table 1 is the bill of materials, and Figure 26 and Figure 27 show the EVM layout. Bill Of Materials ITEM (1) DESCRIPTION 1 Cap, 0.1 µF, ceramic, X7R, 50 V 2 Cap, 1000 pF, ceramic, NPO, 100 V 3 REF DES QTY PART NUMBER (1) (AVX) 08055C104KAT2A C1 1 C2, C3 2 (AVX) 08051A102JAT2A Inductor, 470 nH, 5% L1 1 (Coilcraft) 0805CS-471XJBC 4 Resistor, 237 Ω, 1/8 W, 1% R1 1 (Phycomp) 9C08052A2370FKHFT 5 Open TR1 1 6 Jack, banana receptance, 0.25" dia. J3, J4 2 (SPC) 813 7 Connector, edge, SMA PCB jack J1, J2 2 (Johnson) 142-0701-801 8 Standoff, 4-40 Hex, 0.625" Length 4 (KEYSTONE) 1808 9 Screw, Phillips, 4-40, .250" 4 SHR-0440-016-SN 10 IC, THS9000 1 (TI) THS9000DRD 11 Board, printed-circuit 1 (TI) EDGE # 6453521 Rev.A U1 The manufacturer's part numbers are used for test purposes only. Figure 26. EVM Top Layout Figure 27. EVM Bottom Layout Submit Documentation Feedback 13 THS9000 www.ti.com SLOS425B – DECEMBER 2003 – REVISED APRIL 2006 0.110 0.050 0.025 0.010 vias 0.140 0.080 0.028 0.032 Pin 1 0.011 0.015 TOP VIEW Figure 28. THS9000 Recommended Footprint (dimensions in inches) 14 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty THS9000DRDR ACTIVE SON DRD 6 3000 TBD CU SNPB Level-1-220C-UNLIM THS9000DRDT ACTIVE SON DRD 6 250 TBD CU SNPB Level-1-220C-UNLIM THS9000DRWR ACTIVE SON DRW 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS9000DRWRG4 ACTIVE SON DRW 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS9000DRWT ACTIVE SON DRW 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS9000DRWTG4 ACTIVE SON DRW 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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