TOSHIBA TLFGE68CG

TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
TOSHIBA InGaAℓP LED
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
○ LED Lamps for mounting on through-hole PCB using
an automatic insertion machine
•
Lead(Pb)-free products (lead: Sn-Ag-Cu)
•
3mm package wide viewing angle
•
Can be mounted on a PCB using an automatic insertion machine
(please refer to mounting Precautions Using an Automatic Insertion
Machine)
•
InGaAℓP
•
Emitted colors: red, yellow and green
•
Colored, Transparent lens
•
Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting
illumination sources
Unit: mm
Lineup
Product Name
Color
TLRME68CG(F)
Red
TLYE68CG(F)
Yellow
TLGE68CG(F)
Green
TLFGE68CG(F)
Green
Material
JEDEC
―
JEITA
―
TOSHIBA
InGaAlP
4-3U1
Weight: 0.15 g(Typ.)
Absolute Maximum Ratings (Ta = 25°C)
Forward Current
IF (mA)
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
TLRME68CG(F)
50
4
120
TLYE68CG(F)
50
4
120
TLGE68CG(F)
50
4
120
TLFGE68CG(F)
50
4
120
Product Name
Operating
Temperature
Topr (°C)
−40~100
Storage
Temperature
Tstg (°C)
−40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
Electrical and Optical Characteristics (Ta = 25°C)
Luminous Intensity
IV
Typ. Emission Wavelength
Product Name
Forward Voltage
VF
Reverse Current
IR
λd
λP
Δλ
IF
Min
Typ.
IF
Typ.
Max
IF
Max
VR
TLRME68CG(F)
626
(636)
23
20
85
260
20
1.9
2.4
20
50
4
TLYE68CG(F)
587
(590)
17
20
85
300
20
2.0
2.4
20
50
4
TLGE68CG(F)
571
(574)
17
20
47.6
110
20
2.0
2.4
20
50
4
TLFGE68CG(F)
565
(568)
15
20
27.2
70
20
2.0
2.4
20
50
4
mA
μA
V
Unit
nm
mA
mcd
mA
V
Precautions
• These LED lamps made of InGaAlP will also emit some IR light. If a photodetector is located near an LED
lamp, please ensure that it will not be affected by this IR light.
• Manual soldering should be performed within 3 s at a maximum temperature of 300°C or 5 s at a maximum
temperature of 260°C.
• When forming the leads, bend each lead without applying any forming stress. Soldering must be performed
after the leads have been formed.
Mounting Precautions Using an Automatic Insertion Machine
(1) These newly designed LED lamps are intended for mounting on both through-hole PCBs by means of an
automatic mounting machine. Compared to conventional φ3-mm LED lamps, they are less prone to the effects
of stress during automatic mounting (such as mechanical stress within the package resin transmitted via the
leads). This reduced mechanical stress results in a lower incidence of damage to the package resin and lower
emission failure rates. If one of these lamps is subjected to excessive stress, however, the resin part may break
or the lamp may be damaged in such a way that it will not emit light.
Please take the following precautions when mounting these devices.
•
Toshiba recommends the use of a 0.9-mm PCB hole diameter. However, this recommendation is subject to
the type of automatic mounting machine used, the board material and the way in which the board
material has been processed. Please evaluate the mounting process carefully before actually using the
automatic mounting machine to mount these LED lamps.
The use of PCB holes with a diameter larger than 0.9 mm may result in increased stress when soldering
is performed (depending on the lead cutting shape and the clinching method), and devices may easily be
malfunction.
•
The insertion pressure and clinching angle must both be minimized so as to minimize the lead-cutting
stress and clinch stress applied to the LED lamps.
•
Soldering Conditions
Preheating
Soldering Flow
Temperature
120~150°C
No more than 260°C
Time
Within 60 seconds
Within 5 seconds
(2) Precautions when using Panasert radial-Taping automatic mounting machine:
Two-lead LED lamps are suitable for mounting using an anvil due to its movable-blade structure.
When using three-lead type, please take the following precautions.
•
Synchronize the strokes of the two movable blades to one another as closely as possible.
•
Adjust the timings of the movable blades so as to minimize the difference between them. In addition, do
not set the anvil in such a way that the anvil’s center blade will pull the leads, as this will result in
excessive mechanical stress to the LED lamps, which might damage them.
•
Avoid any blade which is defective or which shows signs of excessive wear.
* For using other than Panasert, please refer to the specifications for the automatic mounting machine
which is to be used.
2
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
TLRME68CG(F)
IF – V F
IV – IF
100
1000
Ta = 25°C
Ta = 25°C
Luminous intensity IV (mcd)
Forward current IF
(mA)
50
30
10
5
3
1
1.6
1.7
1.8
1.9
2.0
2.1
Forward voltage VF
2.2
100
10
1
1
2.3
10
(V)
Forward current IF
IV – Tc
100
(mA)
Relative luminous intensity – Wavelength
10
1.0
Ta = 25°C
Relative luminous intensity
3
1
0.5
0.3
0.1
−20
0
20
60
40
0.8
0.6
0.4
0.2
0
580
80
600
620
640
660
680
700
100
120
Wavelength λ (nm)
Case temperature Tc (°C)
Radiation pattern
IF – Ta
80
IF (mA)
Ta = 25°C
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
Allowable forward current
Relative luminous intensity IV
IF = 20 mA
5
80°
0
0.2
0.4
0.6
0.8
90°
1.0
60
40
20
0
0
20
40
60
80
Ambient temperature Ta (°C)
3
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
TLYE68CG(F)
IF – V F
100
IV – IF
1000
Ta = 25°C
Ta = 25°C
Luminous intensity IV (mcd)
Forward current IF
(mA)
50
30
10
5
3
1
1.6
1.7
1.8
1.9
2.0
2.1
Forward voltage VF
2.2
10
1
1
2.3
10
(V)
100
Forward current IF
IV – Tc
3
100
(mA)
Relative luminous intensity – Wavelength
1.0
Relative luminous intensity
Ta = 25°C
1
0.5
0.3
0.1
−20
0
20
60
40
0.8
0.6
0.4
0.2
0
540
80
560
580
600
620
640
660
100
120
Wavelength λ (nm)
Case temperature Tc (°C)
Radiation pattern
IF – Ta
80
IF (mA)
Ta = 25°C
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
Allowable forward current
Relative luminous intensity IV
IF = 20 mA
80°
0
0.2
0.4
0.6
0.8
90°
1.0
60
40
20
0
0
20
40
60
80
Ambient temperature Ta (°C)
4
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
TLGE68CG(F)
IF – V F
IV – IF
100
1000
Ta = 25°C
Ta = 25°C
Luminous intensity IV (mcd)
Forward current IF
(mA)
50
30
10
5
3
1
1.6
1.7
1.8
1.9
2.0
2.1
Forward voltage VF
2.2
100
10
1
1
2.3
10
(V)
100
Forward current IF
IV – Tc
(mA)
Relative luminous intensity – Wavelength
10
1.0
Ta = 25°C
Relative luminous intensity
3
1
0.5
0.3
0.1
0.8
0.6
0.4
0.2
−20
0
20
60
40
0
520
80
540
560
Radiation pattern
10°
0°
10°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
620
640
100
120
IF – Ta
IF (mA)
20°
600
80
Ta = 25°C
30°
580
Wavelength λ (nm)
Case temperature Tc (°C)
Allowable forward current
Relative luminous intensity IV
IF = 20 mA
5
0.4
0.6
0.8
90°
1.0
60
40
20
0
0
20
40
60
80
Ambient temperature Ta (°C)
5
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
TLFGE68CG(F)
IF – V F
IV – IF
100
1000
Ta = 25°C
Ta = 25°C
Luminous intensity IV (mcd)
Forward current IF
(mA)
50
30
10
5
3
1
1.6
1.7
1.8
1.9
2.0
2.1
Forward voltage VF
2.2
100
10
1
1
2.3
10
(V)
100
Forward current IF
IV – Tc
(mA)
Relative luminous intensity – Wavelength
10
1.0
Ta = 25°C
Relative luminous intensity
3
1
0.5
0.3
0.1
−20
0
20
60
40
0.8
0.6
0.4
0.2
0
520
80
540
560
Radiation pattern
10°
0°
10°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
620
640
100
120
IF – Ta
IF (mA)
20°
600
80
Ta = 25°C
30°
580
Wavelength λ (nm)
Case temperature Tc (°C)
Allowable forward current
Relative luminous intensity IV
IF = 20 mA
5
0.6
0.8
90°
1.0
60
40
20
0
0
20
40
60
80
Ambient temperature Ta (°C)
6
2007-10-01
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
7
2007-10-01