SCAS652F − AUGUST 2000 − REVISED MAY 2007
D 1.0-to 1.6-Gigabits Per Second (Gbps)
D
D
D
D
D
D
D
D Interfaces to Backplane, Copper Cables, or
Serializer/Deserializer
Low Power Consumption < 250 mW at
1.25 Gbps
PECL Compatible Differential I/O on
High-Speed Interface
Single Monolithic PLL Design
Support for 10-Bit Interface (TBI) or
Reduced Interface 5-Bit Double Data Rate
(DDR) Clocking
Receiver Differential Input Thresholds
200 mV Minimum
IEEE 802.3 (Gigabit Ethernet) Compliant
Advanced 0.25-µm CMOS Technology
Optical Modules
No External Filter Capacitors Required
Comprehensive Suite of Built-In Testability
IEEE 1149.1 JTAG Support
2.5-V Supply for Lowest Power Operation
3.3-V Tolerant on TTL Inputs
Hot Plug Protection
ESD Protection 2-kV HBM
5 mm × 5 mm Footprint Removes Space
Limitations With Small Form-Factor
MicroStar Junior BGA Packaging
D
D
D
D
D
D
D
D
description
The TLK2201JR is a member of the transceiver family of multigigabit transceivers, optimized for use with small
form-factor optical transceivers that require footprints smaller than 14 mm. The TLK2201JR gigabit ethernet
transceiver is fully compliant with IEEE 802.3 requirements for serializer/deserializer functions at 1.25 Gbps.
The TLK2201JR supports a wide range of serial data rates from 1.0 Gbps to 1.6 Gbps.
The primary application of this device is to provide building blocks for point-to-point baseband data transmission
over controlled impedance media of 50 Ω or 75 Ω. The transmission media can be printed-circuit board traces,
copper cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the
attenuation characteristics of the media and the noise coupling to the environment.
A
B
C
D
E
F
G
H
J
9
RD1
RD2
RD3
RD4
RD5
RD6
RD7
RD8
RD9
9
8
RD0
VDD
VDD
JTDI
VDD
VDD
SYNC/
PASS
8
7
RXN
VDDA GNDA GNDA
GND
GND
GND
RBC
RBC0
MODE
7
6
RXP
GND
GND
GND
TEST
EN
RBC1
6
5
LOS
VDDA GNDA GNDA GNDA
GND
GND
JTCLK JTDO
5
4
TXN
VDDA
GND
GND
GND
GND
GND
PRBS
EN
SYNC
EN
4
3
TXP
VDD
PLL
Open
GND
GND
GND
GND
MODE
SEL
REF
CLK
3
2
TD0
VDD
VDD
VDD
VDD
EN
ABLE
VDD
VDD
LOOP
EN
2
1
TD1
TD2
TD3
TD4
TD5
TD6
TD7
TD8
TD9
1
A
B
C
D
E
F
G
H
J
VDDA
JTMS JTRST
N
GNDA GNDA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments.
Copyright 2001, Texas Instruments Incorporated
!"#$ % &'""( $% ! )'*&$ +$(
"+'&% &!"# %)(&!&$% )(" ,( ("#% ! (-$% %"'#(%
%$+$"+ .$""$/ "+'& )"&(%%0 +(% (&(%%$"*/ &*'+(
(%0 ! $** )$"$#(("%
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1
SCAS652F − AUGUST 2000 − REVISED MAY 2007
description (continued)
The TLK2201JR performs the data serialization, deserialization, and clock extraction functions for a physical
layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1.0 Gbps of data
bandwidth over a copper or optical media interface.
The TLK2201JR supports both the defined 10-bit interface (TBI) and a reduced 5-bit interface with double data
rate (DDR) clocking. In the TBI mode the serializer/deserializer (serdes) accepts 10-bit wide 8-bit/10-bit
(8b/10b) parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at
PECL compatible voltage levels. The serdes extracts clock information from the input serial stream and
deserializes the data, outputting a parallel 10-bit data byte.
In the DDR mode the parallel interface accepts 5-bit wide 8-bit/10-bit encoded data aligned to both the rising
and falling edge of the reference clock. The data is clocked most significant bit first (i.e., bits 0−4 of the
8-bit/10-bit encoded data) on the rising edge of the clock, and the least significant bits (i.e., bits 5−9 of the
8-bit/10-bit encoded data) are clocked on the falling edge of the clock.
The transceiver automatically locks onto incoming data without the need to prelock.
The TLK2201JR provides a comprehensive series of built-in tests for self-test purposes including loopback and
PRBS generation and verification. An IEEE 1149.1 JTAG port is also supported.
The TLK2201JR is housed in a high-performance, thermally enhanced, 80-pin land grid array (LGA) MicroStarJr
package. Use of the MicroStarJr package does not require any special considerations. All ac performance
specifications in this data sheet are measured with the MicroStarJr soldered to the test board.
The TLK2201JR is characterized for operation from 0°C to 70°C.
The TLK2201JR uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply the chipset
is very power efficient dissipating less than 250 mW typical power when operating at 1.25 Gbps.
The TLK2201JR is designed to be hot plug capable. A power-on reset holds RCB0 and RCB1 low. The parallel
side output pins, TXP and TXN go to high-impedance during power up.
differences between TLK2201JR and TNETE2201
The TLK2201JR is a functional equivalent of the TNETE2201B. There are several differences between the two
devices as noted below.
D The VCC is 2.5 V for the TLK2201JR versus 3.3 V for TNETE2201.
D The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required.
D No pulldown resistors are required on the TXP/TXN outputs.
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SCAS652F − AUGUST 2000 − REVISED MAY 2007
transceiver family
The TLK2201JR is a member of the transceiver family of CMOS multigigabit transceivers intended for use in
high-speed bidirectional point-to-point data transmission systems. Other members of the the transceiver family
include:
D TLK1501 − A 0.6-Gbps to 1.5-Gbps transceiver with on-chip 8-bit/10-bit ENDEC providing up to 1.28 Gbps
of data bandwidth, packaged in a 64-pin VQFP PowerPAD package.
D TLK2500/TLK2501 − A 1.6-Gbps to 2.5-Gbps transceiver with on-chip 8-bit/10-bit ENDEC, providing up
to 2 Gbps of data bandwidth, packaged in a 64-pin VQFP PowerPAD package.
D TLK2701 − A 2.5-Gbps to 2.7-Gbps transceiver with on-chip 8-bit/10-bit ENDEC, providing up to 2.16 Gbps
of data bandwidth with k-character control, packaged in a 64-pin VQFP PowerPAD package.
D TLK3101 − A 2.5-Gbps to 3.125-Gbps transceiver with on-chip 8-bit/10-bit ENDEC, providing up to 2.5
Gbps of data bandwidth, packaged in a 64-pin VQFP PowerPAD package.
D TLK3104SC − A 3-Gbps to 3.125-Gbps quad transceiver with on-chip 8-bit/10-bit ENDEC and a 16-bit low
voltage differential signaling (LVDS) parallel interface, packaged in 289 pin PBGA.
D TLK3104SA − A 3-Gbps to 3.125-Gbps quad transceiver with on-chip 8-bit/10-bit ENDEC, an IEEE 802.3ae
defined XGMII parallel interface with SSTL_2 I/O, packaged in 289 pin PBGA.
functional block diagram
PRBSEN
LOOPEN
TXP
PRBS
Generator
TXN
2:1
MUX
TD0−9
Parallel to
Serial
10 Bit
Register
Clock
Phase
Generator
REFCLK
MODESEL
ENABLE
TESTEN
RBC1
RBC0
SYNC/PASS
Control
Logic
Interpolator and
Clock Extraction
PRBS
Verification
Clock
Clock
Serial to Parallel
and
Comma Detect
RD0−RD9
2:1
MUX
2:1
MUX
Data
RXP
RXN
SYNCEN
RBCMODE
LOS
JTMS
JTRSTN
JTDI
TCK
JTAG
Control
Register
JTDO
PowerPAD is a trademark of Texas Instruments.
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3
SCAS652F − AUGUST 2000 − REVISED MAY 2007
detailed description
data transmission
The TLK2201JR supports both the defined 10-bit interface (TBI) and a reduced 5-bit interface with DDR
clocking. When MODESEL is low, the TBI mode is selected. When MODESEL is high, the DDR mode is
selected.
In the TBI mode, the transmitter portion registers incoming 10-bit wide data words (8b/10b encoded data,
TD0−TD9) on the rising edge of REFCLK. The REFCLK is also used by the serializer, which multiplies the clock
by a factor of 10, providing a signal that is fed to the shift register. The 8b/10b encoded data is transmitted
sequentially bit 0 through 9 over the differential high-speed I/O channel.
In the DDR mode, the transmitter accepts 5-bit wide 8-b/10-b encoded data on pins TD0−TD4. In this mode data
is aligned to both the rising and falling edges of REFCLK. The data is then formed into a 10-bit wide word and
sent to the serializer. The data is clocked most significant bit first (i.e. the bits 0−4 of the 8-b/10-b encoded data).
transmission latency
The data transmission latency of the TLK2201JR is defined as the delay from the initial 10-bit word load to the
serial transmission of bit 9. The minimum latency in TBI mode is 19 bit times. The maximum latency in TBI mode
is 20 bit times. The minimum latency in DDR mode is 29 bit times, and maximum latency in DDR mode is 30
bit times.
10 Bit Code
b9
TXP, TXN
Td(Tx latency)
TD(0−9)
10 Bit Code
REFCLK
Figure 1. Transmitter Latency Full Rate Mode
data reception
The receiver portion of the TLK2201JR deserializes the differential serial data. The serial data is retimed based
on an interpolated clock generated from the reference clock. The serial data is then aligned to the 10-bit word
boundaries and presented to the protocol controller along with receive byte clocks (RBC0, RBC1).
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detailed description (continued)
receiver clock select mode
The TLK2201JR provides two modes of operation for the parallel busses. 1)The 10-bit (TBI) mode and 2) 5-bit
(DDR) mode. When in TBI mode, there are two user-selectable clock modes that are controlled by the
RBCMODE pin:1) Full-rate clock on RBC0 and 2) Half-rate clocks on RBC0 and RBC1. When in the DDR mode,
only a full-rate clock is available on RBC0. Table 1 shows the mode selection.
Table 1. Mode Selection
MODESEL
RBCMODE
MODE
FREQUENCY
0
0
TBI half-rate
100−125 MHz
0
1
TBI full-rate
100−160 MHz
1
0
DDR
100−125 MHz
1
1
DDR
100−125 MHz
In the half-rate mode, two receive byte clocks (RBC0 and RBC1) are 180 degrees out of phase and operate
at one-half the data rate. The clocks are generated by dividing down the recovered clock. The received data
is output with respect to the two receive byte clocks (RBC0, RBC1), allowing a protocol device to clock the
parallel bytes using the RBC0 and RBC1 rising edges. The TLK2201 outputs to the protocol device. Byte 0 of
the received data is valid on the rising edge of RBC1. Figure 2 shows the timing diagram.
td(S)
RBC0
td(S)
RBC1
td(H)
SYNC
td(H)
RD(0−9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 2. Synchronous Timing Characteristics Waveforms (TBI Half-Rate Mode)
In the normal-rate mode, only RBC0 is used, and it operates at full data rate (i.e., 1.25-Gbps data rate produces
a 125-MHz clock). The received data is output with respect to the rising edge of RBC0. RBC1 is low in this mode.
Figure 3 shows the synchronous timing characteristics waveforms (TBI full-rate mode).
RBC0
td(S)
td(H)
SYNC
RD(0−9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 3. Synchronous Timing Characteristics Waveforms (TBI Full-Rate Mode)
In the double data rate mode, the receiver presents the data on both the rising and falling edges of RBC0. RBC1
is low impedance. The data is clocked bit-0 first, and aligned to the rising edge of RBC0. Figure 4 shows the
synchronous timing characteristics waveforms (DDR mode).
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SCAS652F − AUGUST 2000 − REVISED MAY 2007
receiver clock select mode (continued)
td(S)
RBC0
td(S)
td(H)
td(H)
SYNC
RD(0−4)
K28.5
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
K28.5
DXX.X
Bits 0−4 Bits 5−9
Figure 4. Synchronous Timing Characteristics Waveforms (DDR Mode)
The receiver clock interpolator can lock to the incoming data without the need for a lock-to-reference preset.
The received serial data rate (RXP and RXN) must be at the same baud rate as the transmitted data stream,
±0.02% (200 PPM) for proper operation (see page 11).
receiver word alignment
The TLK2201 uses the IEEE 802.3 Gigabit Ethernet defined 10-bit K28.5 character (comma character) word
alignment scheme. The following sections explain how this scheme works and how it realigns itself.
comma character on expected boundary
The TLK2201 provides 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is
enabled by forcing the SYNCEN terminal high. This enables the function that examines and compares serial
input data to the seven-bit synchronization pattern. The K28.5 character is defined by 8-bit/10-bit coding
scheme as a pattern consisting of 0011111010 (a negative number beginning with disparity) with the 7 MSBs
(0011111) referred to as the comma character. The K28.5 character was implemented specifically for aligning
data words. As long as the K28.5 character falls within the expected 10-bit boundary, the received 10-bit data
is properly aligned and data realignment is not required. Figure 2 shows the timing characteristics of RBC0,
RBC1, SYNC, and RD0−RD9 while synchronized. (Note: the K28.5 character is valid on the rising edge of
RBC1).
comma character not on expected boundary
If synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word
realignment is necessary. Realignment or shifting the 10-bit word boundary truncates the character following
the misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in Figure
5. The RBC0 and RBC1 pulse width is stretched or stalled in their current state during realignment. With this
design the maximum stretch that occurs is 20 bit times. This occurs during a worst case scenario when the K28.5
is aligned to the falling edge of RBC1 instead of the rising edge. Figure 5 shows the timing characteristics of
the data realignment.
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comma character not on expected boundary (continued)
31 Bit
Times
Max Receive
Path Latency
INPUT DATA
K28.5
DXX.X
30 Bit
Times (Max)
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
RBC0
RBC1
Worst Case
Misaligned K28.5
RD(0−9)
DXX.X
DXX.X
Misalignment Corrected
Corrupt Data
K28.5
DXX.X
DXX.X
K28.5
DXX.X
DXX.X
DXX.X
K28.5
SYNC
Figure 5. Word Realignment Timing Characteristics Waveforms
Systems that do not require framed data may disable byte alignment by tying SYNCEN low.
When a SYNC character is detected, the SYNC signal is brought high and is aligned with the K28.5 character.
The duration of the SYNC pulse is equal to the duration of the data when in TBI mode. When in DDR mode the
SYNC pulse is present for the entire RBC0 period.
data reception latency
The serial to parallel data latency is the time from when the first bit arrives at the receiver until it is output in the
aligned parallel word with RD0 received as first bit. The minimum latency in TBI mode is 22 bit times and the
maximum latency is 31 bit times. The minimum latency in DDR mode is 28 bit times and maximum latency is
34 bit times.
10 Bit Code
RXP, RXN
Td(Rx latency)
RD(0−9)
10 Bit Code
RBC0
Figure 6. Receiver Latency−TBI Normal Mode Shown
loss of signal detection
The TLK2201 has a loss of signal (LOS) detection circuit for conditions where the incoming signal no longer
has sufficient voltage level to keep the clock recovery circuit in lock. The LOS is intended to be an indication
of gross signal error conditions, such as a detached cable or no signal being transmitted, and not an indication
of signal coding health. Under a PRBS serial input pattern, LOS is high for signal amplitudes greater than 150
mV. The LOS is low for all amplitudes below 50 mV. Between 50 mV and 150 mV, LOS is undetermined.
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SCAS652F − AUGUST 2000 − REVISED MAY 2007
detailed description (continued)
testability
The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The enable
function allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function also
allows for a BIST( built-in self test). The terminal setting, TESTEN high, enables the test mode. The terminal
TESTEN has an internal pulldown resistor, so it defaults to normal operation. The TESTEN is only used for
factory testing, and is not intended for the end-user.
loopback testing
The transceiver can provide a self-test function by enabling (LOOPEN to high level) the internal loopback path.
Enabling this function cause serial transmitted data to be routed internally to the receiver. The parallel data
output can be compared to the parallel input data for functional verification. (The external differential output is
held in a high-impedance state during the loopback testing.)
enable function
When held low, enable disables all quiescent power in both the analog and digital circuitry. This allows an
ultralow-power idle state when the link is not active.
PRBS function
The TLK2201 has a built-in 27−1 PRBS function. When the PRBSEN control bit is set high, the PRBS test is
enabled. A PRBS is generated and fed into the 10-bit parallel transmitter input bus. Data from the normal parallel
input source is ignored during PRBS test mode. The PBRS pattern is then fed through the transmit circuitry as
if it were normal data and sent out to the transmitter. The output can be sent to a (BERT) bit error rate tester
or to the receiver of another TLK2201. Since the PRBS is not really random and is really a predetermined
sequence of ones and zeros, the data can be captured and checked for errors by a BERT. The TLK2201 also
has a built-in BERT function on the receiver side that is enabled by PRBSEN. It can receive a PRBS pattern
and check for errors, and then reports the errors by forcing the SYNC/PASS terminal low. When PRBS is
enabled, RBCMODE is ignored. MODESEL must be low for the PRBS verifier to function correctly. The PRBS
testing supports two modes (normal and latched), which are controlled by the SYNC enable input. When
SYNCEN is low, the result of the PRBS bit error rate test is passed to the SYNC/PASS terminal. When SYNCEN
is high the result of the PRBS verification is latched on the SYNC/PASS output (i.e., a single failure forces
SYNC/PASS to remain low).
8
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Terminal Functions
TERMINAL
NO.
GQE
NO.
RCP†
I/O
DESCRIPTION
TXP
TXN
A3
A4
62
61
PECL
O
Differential output transmit. TXP and TXN are differential serial outputs that interface to a copper
or an optical I/F module. TXP and TXN are put in a high-impedance state when LOOPEN is high
and are active when LOOPEN is low.
RXP
RXN
A6
A7
54
52
PECL
I
Differential input receive. RXP and RXN together are the differential serial input interface from a
copper or an optical I/F module.
REFCLK
J3
22
I
Reference clock. REFCLK is an external input clock that synchronizes the receiver and
transmitter interface (100 MHz to 160 MHz). The transmitter uses this clock to register the input
data (TD0−TD9) for serialization.
NAME
SIGNAL
In the TBI mode that data is registered on the rising edge of REFCLK.
In the DDR mode, the data is registered on both the rising and falling edges of REFCLK with the
most significant bits aligned to the rising edge of REFCLK.
TD0−TD9
RD0−RD9
RBC0
RBC1
A2, A1,
B1, C1,
D1, E1,
F1, G1,
H1, J1
2−4,
6−9,
11−13
I
A8, A9,
B9, C9,
D9, E9,
F9, G9,
H9, J9
45, 44,
43, 41,
40, 39,
38, 36,
35, 34
O
J7
J6
31
30
O
Transmit data. When in the TBI mode (MODESEL = low) these inputs carry 10-bit parallel data
output from a protocol device to the transceiver for serialization and transmission. This 10-bit
parallel data is clocked into the transceiver on the rising edge of REFCLK and transmitted as a
serial stream with TD0 sent as the first bit.
When in the DDR mode (MODESEL = high) only TD0−TD4 are valid. The 5-bit parallel data is
clocked into the transceiver on the rising and falling edge of REFCLK and transmitted as a serial
stream with TD0 sent as the first bit.
Receive data. When in TBI mode (MODESEL = low) these outputs carry 10-bit parallel data output
from the transceiver to the protocol layer. The data is referenced to terminals RBC0 and RBC1,
depending on the receive clock mode selected. RD0 is the first bit received.
When in the DDR mode (MODESEL = high) only RD0−RD4 are valid. RD5−RD9 are held low.
The 5-bit parallel data is clocked out of the transceiver on the rising edge of RBC0.
Receive byte clock. RBC0 and RBC1 are recovered clocks used for synchronizing the 10-bit
output data on RD0−RD9. The operation of these clocks dependant upon the receive clock mode
selected.
In the half-rate mode, the 10-bit output data words are valid on the rising edges of RBC0 and
RBC1. These clocks are adjusted to half-word boundaries in conjunction with synchronous
detect. The clocks are always expanded during data realignment and never slivered or truncated.
RBC0 registers bytes 1 and 3 of received data. RBC1 registers bytes 0 and 2 of received data.
In the normal rate mode, only RBC0 is valid and operates at 1/10 the serial data rate. Data is
aligned to the rising edge.
In the DDR mode, only RBC0 is valid and operates at 1/10 the serial data rate. Data is aligned
to both the rising and falling edges.
RBCMODE
H7
32
I
P/D‡
Receive clock mode select. When RBCMODE and MODESEL are low, half-rate clocks are output
on RBC0 and RBC1. When MODESEL is low and RBCMODE is high, a full baud-rate clock is
output on RBC0 and RBC1 is held low. When MODESEL is high, RBCMODE is ignored and a full
baud-rate clock is output on RBC0 and RBC1 is held low.
SYNCEN
J4
24
I
P/U§
Synchronous function enable. When SYNCEN is asserted high, the internal synchronization
function is activated. When this function is enabled, the transceiver detects the K28.5 comma
character (0011111 negative beginning disparity) in the serial data stream and realigns data on
byte boundaries if required. When SYNCEN is low, serial input data is unframed in RD0−RD9.
SYNC/PASS
J8
47
O
Synchronous detect. The SYNC output is asserted high upon detection of the comma pattern in
the serial data path. SYNC pulses are output only when SYNCEN is activated (asserted high). In
PRBS test mode (PRBSEN=high), SYNC/PASS outputs the status of the PRBS test results
(high=pass).
LOS
A5
26
O
Loss of signal. Indicates a loss of signal on the high-speed differential inputs RXP and RXN.
If magnitude of RXP−RXN > 150 mV, LOS = 1, valid input signal
If magnitude of RXP−RXN < 150 mV and > 50 mV, LOS is undefined
If magnitude of RXP−RXN < 50 mV, LOS = 0, loss of signal
† For cross reference to TLK2201 RCP package only.
‡ P/D = pulldown
§ P/U = pullup
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SCAS652F − AUGUST 2000 − REVISED MAY 2007
Terminal Functions (Continued)
TERMINAL
NO.
GQE
NO.
RCP†
I/O
DESCRIPTION
H3
15
I
P/D‡
Mode select. This terminal selects between the 10-bit interface and a reduced 5-bit DDR
interface. When low the 10-bit interface (TBI) is selected. When pulled high, the 5-bit DDR
mode is selected. The default mode is the TBI.
LOOPEN
J2
19
I
P/D‡
Loop enable. When LOOPEN is high (active), the internal loop-back path is activated. The
transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test
capability in conjunction with the protocol device. The TXP and TXN outputs are held in a
high-impedance state during the loop-back test. LOOPEN is held low during standard
operational state with external serial outputs and inputs active.
JTCLK/TCK
H5
49
I
JTDI
F8
48
I
P/U§
JTDO
J5
27
O
JTRSTN
E8
56
I
P/U§
Reset signal. IEEE1149.1 (JTAG)
JTMS
D8
55
I
P/U§
Test mode select. IEEE1149.1 (JTAG)
ENABLE
F2
28
I
P/U§
When this terminal is low, the device is disabled for Iddq testing. RD0−RD9, RBC, TXP, and
TXN are high-impedance. The pullup and pulldown resisters on any input are disabled.
When ENABLE is high, the device operates normally.
PRBSEN
H4
16
I
P/D§
PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS
verification circuit in the receive side is also enabled. A PRBS signal can be fed to the receive
inputs and checked for errors that are reported by the SYNC/PASS terminal indicating low.
TESTEN
H6
17
I
P/D‡
Manufacturing test terminal.
VDD
B8, C8,
G8, H8,
B2, C2,
D2, E2,
G2, H2
5, 10, 20,
23, 29,
37, 42,
50, 63
Supply
Digital logic power. Provides power for all digital circuitry and digital I/O buffers.
VDDA
B7, B6,
B5, B4
53, 57,
59, 60
Supply
Analog power. VDDA provides power for the high-speed analog circuits, receiver, and
transmitter
B3
18
Supply
PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.
GNDA
C7, D7,
C6, D6,
C5, D5, E5
51,58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GND
C4, D3,
D4, E3,
E4, E6, E7
F3, F4, F5,
F6, F7,
G3, G4,
G5, G6,
G7
1, 14, 21,
25, 33,
46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
NAME
MODESEL
TEST
Test clock. IEEE1149.1 (JTAG)
Test data input. IEEE1149.1 (JTAG)
Test data output. IEEE1149.1 (JTAG)
POWER
VDDPLL
GROUND
GNDPLL
N/A
64
Ground PLL ground. Provides a ground for the PLL circuitry. Tied to GNDA in the GQE package.
† For cross reference to TLK2201 RCP package only.
‡ P/D = pulldown
§ P/U = pullup
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCAS652F − AUGUST 2000 − REVISED MAY 2007
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V
Input voltage, VI, (TTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
DC input voltage (I/O ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V
Voltage range at any terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC +0.3 V
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM:2 kV, CDM: 1 kV
Characterized free-air operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE‡
PACKAGE
θJA
(°C/W)
θJC
(°C/W)
TA = 25°C
POWER RATING
GQE
37.8
4.56
3.3 W
‡ This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard
‡ 4-layer, 3-in. x 3-in. PCB.
thermal characteristics
PARAMETER
RθJA
RθJC
Junction-to-free-air thermal resistance
Junction-to-case-thermal resistance
TEST CONDITION
MIN
TYP
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
21.47
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
42.20
Board-mounted, no air flow, JEDEC test board
75.83
0.38
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
0.38
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
°C/W
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, JEDEC test board
MAX
°C/W
7.8
11
SCAS652F − AUGUST 2000 − REVISED MAY 2007
recommended operating conditions
Supply voltage, VDD, VDD(A)
Total supply current IDD, IDD(A)
Frequency = 1.25 Gbps,
PRBS pattern
Frequency = 1.6 Gbps,
Worst case pattern†
MIN
NOM
MAX
2.3
2.5
2.7
UNIT
V
80
111
Frequency = 1.25 Gbps,
PRBS pattern
Total power dissipation PD
Frequency = 1.6 Gbps,
Worst case pattern†
310
Total shutdown current IDD, IDD(A)
Enable = 0,
Vdda , Vdd = 2.7 V
50
Startup lock time, PLL
VDD, VDD(A) = 2.5 V, EN↑ to PLL acquire
mA
190
Operating free-air temperature, TA
0
mW
µA
500
µs
70
°C
† Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
reference clock (REFCLK) timing requirements over recommended operating conditions (unless
otherwise noted)
MIN
TYP
MAX
UNIT
Frequency
PARAMETER
Minimum data rate
TEST CONDITIONS
TYP−0.01%
100
TYP−0.01%
MHz
Frequency
Maximum data rate
TYP−0.01%
160
TYP−0.01%
MHz
100
ppm
Accuracy
−100
Duty cycle
40%
Jitter
50%
60%
Random plus deterministic
40
ps
TTL electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
VOH
VOL
High-level output voltage
VIH
VIL
High-level input voltage
IIH
IIL
Input high current
Low-level output voltage
TEST CONDITIONS
IOH = −400 µA
IOL = 1 mA
TYP
2.1
2.3
GND
0.25
1.7
Low-level input voltage
Input low current
VDD = 2.3 V,
VDD = 2.3 V,
VIN = 2.0 V
VIN = 0.4 V
CIN
12
MIN
MAX
V
0.5
V
3.6
V
0.8
V
40
µA
µA
−40
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
pf
SCAS652F − AUGUST 2000 − REVISED MAY 2007
transmitter/receiver characteristics
PARAMETER
TEST CONDITIONS
Vod = |TxD−TxN|
V(cm)
Transmit common mode voltage range
MIN
TYP
MAX
Rt = 50 Ω
600
850
1100
Rt = 75 Ω
800
1050
1200
Rt = 50 Ω
1000
1250
1400
Rt = 75 Ω
1000
1250
1400
Receiver Input voltage requirement,
Vid = |RxP − RxN|
200
Receiver common mode voltage range,
(RxP + RxN)/2
1000
Ilkg(R)
CI
Receiver input leakage current
−350
t(TJ)
Serial data total jitter (peak-to-peak)
t(DJ)
Serial data deterministic jitter (peak-to-peak)
tr, tf
Differential signal rise, fall time (20% to 80%)
RL = 50 Ω,
CL = 5 pF,
See Figures 7 and 8
100
Serial data jitter tolerance minimum required eye
opening, (per IEEE-802.3 specification)
Differential input jitter, random +
determinisitc, PRBS pattern at zero
crossing
0.25
1250
Data relock time from loss of synchronization
TBI modes
Tx latency
TBI modes
(see Figure 6)
td(Rx latency)
Rx latency
DDR mode
80%
50%
20%
TX+
mV
2250
mV
350
µA
2
pF
0.24
UI
0.12
UI
250
ps
500
µs
1024
Bit times
19
20
29
30
1 Gpbs
22
27
1.25 Gpbs
23
28
1.6 Gpbs
25
31
1 Gpbs
27
32
1.25 Gpbs
28
33
1.375 Gpbs
30
34
UI
UI
UI
∼V
∼V
tf
tr
80%
50%
20%
TX−
tf
∼V
CL
5 pF
20%
50 kΩ
∼V
50 kΩ
tr
∼ 1V
80%
VOD
See Figure 1
DDR mode
mV
UI
Receiver data acquisition lock time from powerup
td(Tx latency)
mV
1600
Receiver input capacitance
Differential output jitter,
Random + deterministic,
PRBS pattern, Rω = 125 MHz
Differential output jitter, PRBS
pattern,
Rω = 125 MHz
UNIT
0V
CL
5 pF
∼ −1V
Figure 7. Differential and Common-Mode
Output Voltage Definitions
POST OFFICE BOX 655303
Figure 8. Transmitter Test Setup
• DALLAS, TEXAS 75265
13
SCAS652F − AUGUST 2000 − REVISED MAY 2007
1.4 V
CLOCK
tf
tr
80%
50%
20%
DATA
2V
0.8 V
tf
tr
Figure 9. TTL Data I/O Valid Levels for AC Measurement
LVTTL output switching characteristics over recommended operating conditions (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
tr(BRC)
tf(RBC)
Clock rise time
0.3
1.5
Clock fall time
0.3
1.5
tr
tf
Data rise time
0.3
1.5
0.3
1.5
80% to 20% output voltage, C = 5 pF (see Figure 9)
Data fall time
UNIT
ns
ns
tsu(D1)
Data setup time (RD0..RD9), Data
valid prior to RBC0 rising
TBI normal mode, (see Figure 3)
2.5
ns
th(D1)
Data hold time (RD0..RD9), Data valid
after RBC0 rising
TBI normal mode, (see Figure 3)
2
ns
tsu(D2)
th(D2)
Data setup time (RD0..RD4)
DDR mode, Rω = 125 MHz, (see Figure 4)
2
ns
Data hold time (RD0..RD4)
DDR mode, Rω = 125 MHz, (see Figure 4)
0.8
ns
tsu(D3)
th(D3)
Data setup time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz, (see Figure 2)
2.5
ns
Data hold time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz, (see Figure 2)
1.5
ns
transmitter timing requirements over recommended operating conditions (unless otherwise
noted)
TEST CONDITIONS
tsu(D4)
th(D4)
Data setup time (TD0..TD9)
tsu(D5)
th(D5)
Data setup time (TD0..TD9)
tr, tf
TD[0,9] Data rise and fall time
14
Data hold time (TD0..TD9)
Data hold time (TD0..TD9)
MIN
NOM
MAX
UNIT
1.6
TBI modes
ns
0.8
0.7
DDR modes
See Figure 9
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
ns
0.5
2
ns
SCAS652F − AUGUST 2000 − REVISED MAY 2007
APPLICATION INFORMATION
8B/10B transmission code
The PCS maps GMII signals into ten-bit code groups and vice versa, using an 8b/10b block coding scheme.
The PCS uses the transmission code to improve the transmission characteristics of information to be transferred
across the link. The encoding defined by the transmission code ensures that sufficient transitions are present
in the PHY bit stream to make clock recovery possible in the receiver. Such encoding also greatly increases
the likelihood of detecting any single or multiple bit errors that may occur during transmission and reception of
information. The 8b/10b transmission code specified for use has a high transition density, is run length limited,
and is dc-balanced. The transition density of the 8b/10b symbols range from 3 to 8 transitions per symbol. The
definition of the 8b/10b transmission code is specified in IEEE 802.3 Gigabit Ethernet and ANSI X3.230-1994
(FC−PH), clause 11.
8b/10b transmission code uses letter notation describing the bits of an unencoded information octet. The bit
notation of ABCDEFGH for an unencoded information octet is used in the description of the 8b/10b transmission
code-groups, where A is the LSB. Each valid code group has been given a name using the following convention:
/Dx.y/ for the 256 valid data code-groups and /Kx.y/ for the special control code-groups, where y is the decimal
value of bits EDCBA and x is the decimal value of bits HGF (noted as K<HGF.EDCBA>). Thus, an octet value
of FE representing a code-group value of K30.7 is represented in bit notation as 111 11110.
VDD
ZO
TXP
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
ZO
TXN
RXN
Transmitter
Media
7.5 kΩ
GND
Receiver
Figure 10. High-Speed I/O Directly-Coupled Mode
VDD
TXP
ZO
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
TXN
Transmitter
ZO
RXN
Media
7.5 kΩ
GND
Receiver
Figure 11. High-Speed I/O AC-Coupled Mode
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
SCAS652F − AUGUST 2000 − REVISED MAY 2007
APPLICATION INFORMATION
5 Ω at 100 MHz
2.5 V
2.5 V
18
VDD VDDA
0.01 µF
VDDPLL
GND
GNDPLL
64
GNDA
TLK2201
17
TESTEN
10
TD0−TD9
22
16
TXP
62
Controlled Impedance
Transmission Line
61
Controlled Impedance
Transmission Line
54
Controlled Impedance
Transmission Line
REFCLK
PRBSEN
19
LOOPEN
24
Host
Protocol
Device
47
10
SYNCEN
TXN
SYNC/PASS
RD0−RD9
2
RBC0−RBC1
28
26
ENABLE
RXP
LOS
32
Rt
50 Ω
Rt
50 Ω
RBCMODE
15
MODESEL
49
55
JTAG
Controller
48
56
27
TCK
JTMS
RXN
52
JTDI
JTRSTN
JTDO
Figure 12. Typical Application Circuit (AC mode)
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Controlled Impedance
Transmission Line
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
TLK2201JRGQE
NRND
Package
Type
BGA MI
CROSTA
R JUNI
OR
Package
Drawing
GQE
Pins Package Eco Plan (2)
Qty
80
360
TBD
Lead/Ball Finish
MSL Peak Temp (3)
SNPB
Level-2A-235C-4 WKS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 1
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