TMP121 TMP123 SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 1.5°C Accurate Digital Temperature Sensor with SPI Interface FEATURES D DIGITAL OUTPUT: SPI-Compatible Interface D RESOLUTION: 12-Bit + Sign, 0.0625°C D ACCURACY: ±1.5°C from −25°C to +85°C (max) LOW QUIESCENT CURRENT: 50µA (max) WIDE SUPPLY RANGE: 2.7V to 5.5V TINY SOT23-6 PACKAGE D D D D OPERATION TO 150°C D POWER-SUPPLY TEMPERATURE D D D D D NOTEBOOK COMPUTERS CELL PHONES BATTERY MANAGEMENT OFFICE MACHINES The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package. Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2°C of accuracy over a temperature range of −40°C to +125°C. Low supply current, and a supply range from 2.7V to 5.5V, make the TMP121 and TMP123 excellent candidates for low-power applications. The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. APPLICATIONS MONITORING COMPUTER PERIPHERAL THERMAL PROTECTION DESCRIPTION Temperature Temperature NC 1 Diode Temp. Sensor Control Logic 6 SO GND 1 Diode Temp. Sensor Control Logic 6 SO GND 2 ∆Σ A/D Converter Serial Interface 5 CS NC 2 ∆Σ A/D Converter Serial Interface 5 CS V+ 3 OSC Config. and Temp. Register 4 SCK V+ 3 OSC Config. and Temp. Register 4 SCK TMP121 TMP123 NC = No Connection(1) NC = No Connection(1) (1) Pins labeled NC should be left floating or connected to GND. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 2003−2005, Texas Instruments Incorporated ! ! www.ti.com "#$# "#$% www.ti.com SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 ABSOLUTE MAXIMUM RATINGS(1) Power Supply, V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltage(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to +7V Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +150°C Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C Lead Temperature (soldering) . . . . . . . . . . . . . . . . . . . . . . . . +300°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input voltage rating applies to all TMP121 and TMP123 input This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. voltages. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SOT23-6 DBV TMP121 PACKAGE MARKING T121 TMP123 T123 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATIONS Top View SOT23-6 TMP121(1) GND 2 V+ 3 6 SO GND 1 5 CS NC 2 4 SCK V+ 3 SOT23−6 NC = No Connection(2) 2 6 SO 5 CS 4 SCK SOT23−6 NC = No Connection(2) Pin 1 orientation is determined by package marking. (1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown. (2) Pins labeled NC should be left floating or connected to GND. T123 1 T121 NC TMP123(1) "#$# "#$% www.ti.com SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 ELECTRICAL CHARACTERISTICS At TA = −40°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted. TMP121, TMP123 PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE INPUT +125 °C −25°C to +85°C ±0.5 ±1.5 °C −40°C to +125°C ±1.0 ±2.0 °C −40°C to +150°C ±1.5 +0.3 °C/V Range −40 Accuracy (temperature error) vs Supply −0.3 0.1 °C ±0.0625 Resolution °C DIGITAL INPUT/OUTPUT Input Logic Levels: VIH VIL Input Current, SO, SCK, CS 0.7(V+) IIN V 0V ≤ VIN ≤ V+ 0.3(V+) V ±1 µA 0.4 V Output Logic Levels: VOL SO VOH SO ISINK = 3mA ISOURCE = 2mA (V+)−0.4 V Resolution 12 Input Capacitance, SO, SCK, CS 2.5 Bits pF Conversion Time 12-Bit 240 320 ms Conversion Period(1) 12-Bit 480 640 ms POWER SUPPLY Operating Range Quiescent Current Shutdown Current (TMP121) Shutdown Current (TMP123) 5.5 V IQ Serial Bus Inactive 2.7 35 50 µA ISD ISD Serial Bus Inactive 0.1 1 µA Serial Bus Inactive 0.1 3 µA TEMPERATURE RANGE Specified Range −40 +125 °C Operating Range −55 +150 °C Storage Range −60 +150 Thermal Resistance qJA SOT23-6 Surface-Mount 200 °C °C/W (1) Period indicates time between conversion starts. 3 "#$# "#$% www.ti.com SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 TYPICAL CHARACTERISTICS At TA = +25°C and V+ = 5.0V, unless otherwise noted. SHUTDOWN CURRENT vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE 1.0 50 0.9 V+ = 5V 0.8 40 0.7 30 V+ = 2.7V ISD (µA) IQ (µA) 0.6 0.5 0.4 0.3 0.2 20 0.1 0.0 Serial Bus Inactive −0.1 −60 −40 −20 10 −60 −40 −20 0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 140 Temperature (_ C) Temperature (_ C) CONVERSION TIME vs TEMPERATURE TEMPERATURE ACCURACY vs TEMPERATURE 400 2.0 300 Temperature Error (_C) Conversion Time (ms) 1.5 V+ = 5V 200 V+ = 2.7V 1.0 0.5 0.0 −0.5 −1.0 −1.5 12−Bit Resolution 100 −60 −40 −20 0 20 40 60 Temperature (_ C) 4 80 100 120 140 3 Typical Units 12−Bit Resolution −2.0 −60 −40 −20 0 20 40 60 80 100 120 140 160 Temperature (_ C) "#$# "#$% www.ti.com SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 APPLICATIONS INFORMATION The TMP121 and TMP123 are 12-bit plus sign read-only digital temperature sensors optimal for thermal management and thermal protection applications. The TMP121 and the TMP123 communicate through a serial interface that is SPI-compatible. Temperature is converted to a 12-bit plus sign data word with 0.0625°C resolution. The TMP121 and TMP123 are specified for a temperature range of −40°C to +125°C, with operation extending from −55°C to +150°C. The TMP121 and TMP123 are optimal for low power applications, with a 0.5s conversion period for reduced power consumption. The TMP121 and TMP123 are specified for a supply voltage range of 2.7V to 5.5V, and also feature a hardware shutdown to provide additional power savings. The TMP121 and TMP123 require no external components for operation, though a 0.1µF supply bypass capacitor is recommended. Figure 1 shows typical connections for the TMP121 and TMP123. V+ V+ 0.1µF 0.1µF 3 SCK 4 SO 6 3 1 NC(1) TMP121 5 SCK 4 SO 6 2 5 D15 D14 D13 D12 D11 D10 D9 D8 T12 T11 T10 T9 T8 T7 T6 T5 D7 D6 D5 D4 D3 D2 D1 D0 T4 T3 T2 T1 T0 0 Z Z Table 1. Temperature Register TEMPERATURE (°C) DIGITAL OUTPUT(1) (BINARY) HEX 150 0100 1011 0000 0000 4B00 125 0011 1110 1000 0000 3E80 25 0000 1100 1000 0000 0C80 0.0625 0000 0000 0000 1000 0008 0 0000 0000 0000 0000 0000 −0.0625 1111 1111 1111 1000 FFF8 −25 1111 0011 1000 0000 F380 −55 1110 0100 1000 0000 E480 CS 1 NC = No Connection GND The Temperature Register of the TMP121 and TMP123 is a 16-bit, signed read-only register that stores the output of the most recent conversion. Up to 16 bits can be read to obtain data and are described in Table 1. The first 13 bits are used to indicate temperature with bits D2 = 0, and D1, D0 in a high impedance state. Data format for temperature is summarized in Table 2. Following power-up or reset, the Temperature Register will read 0°C until the first conversion is complete. (1) The last two bits are high impedance and are shown as 00 in the table. TMP123 CS 2 NC(1) TEMPERATURE REGISTER Table 2. Temperature Data Format COMMUNICATING WITH THE TMP121 GND NOTE: (1) Pins labeled NC should be left floating or connected to GND. Figure 1. Typical Connections of the TMP121 and TMP123 The sensing device of both the TMP121 and TMP123 is the chip itself; the die flag of the lead frame is thermally connected to pin 2 of the TMP121, and of the TMP123. Thermal paths run through the package leads as well as the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal path. The GND pin (pin 2) of the TMP121 and the NC pin (pin 2) of the TMP123 are thermally connected to the metal lead frame, and are the best choice for thermal input. To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to isolate the package and leads from ambient air temperature. The TMP121 and TMP123 continuously convert temperatures to digital data while CS is high. CS must be high for a minimum of one conversion time (320ms max) to update the temperature data. Reading temperature data from the TMP121 and TMP123 is initiated by pulling CS low, which will cause any conversion in progress to terminate, and place the device into analog shutdown. Quiescent current is reduced to 1µA during analog shutdown. Once CS is pulled low, temperature data from the last completed conversion prior to dropping CS is latched into the shift register and clocked out at SO on the falling SCK edge. The 16-bit data word is clocked out sign bit first, followed by the MSB. Any portion of the 16-bit word can be read before raising CS. The TMP121 and TMP123 typically require 0.25s to complete a conversion and consume 50µA of current during this period. If CS is held high for longer than one conversion time period the TMP121 and TMP123 will go into idle mode for 0.25s, requiring only 20µA of current. A new conversion begins every 0.5s. Figure 2 describes the conversion timing for the TMP121 and TMP123. 5 "#$# "#$% www.ti.com SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005 Timing Diagrams 0.5s 0.25s The TMP121 and TMP123 are SPI-compatible. Figure 4 and Figure 5 describe the various timing requirements, with parameters defined in Table 3. 50µA (active) 20µA (idle) PARAMETER Figure 2. Conversion Time and Period MIN SCK Period t1 t2 100 40 CS to Output Data Delay t3 t4 CS Rising Edge to Output High Impedance t5 SCK Falling Edge to Output Data Delay The serial data of the TMP121 and TMP123 consists of 12-bit plus sign temperature data followed by a confirmation bit and two high impedance bits. Data is transmitted in Binary Two’s Complement format. Figure 3 describes the output data of the TMP121 and TMP123. CS to Rising Edge SCK Set-Up Time D15 D14 D13 D12 D11 D10 D9 Table 3. Timing Description D8 D7 D6 D5 D4 D3 1 Z Z Figure 3. Data READ SCK t3 t1 t2 CS t4 SO Figure 4. Output Data Timing Diagram SCK SCK CS CS t5 t5 SO SO Figure 5. High Impedance Output Timing Diagram 6 ns ns SCK Z UNITS ns 30 CS SO/I MAX 30 ns 30 ns PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TMP121AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP121AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP121AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP121AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP123AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP123AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP123AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP123AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP121 : • Enhanced Product: TMP121-EP NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) TMP121AIDBVR SOT-23 DBV 6 3000 180.0 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.4 3.2 3.1 1.39 4.0 8.0 Q3 TMP121AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 TMP123AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 TMP123AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP121AIDBVR SOT-23 DBV 6 3000 190.5 212.7 31.8 TMP121AIDBVT SOT-23 DBV 6 250 190.5 212.7 31.8 TMP123AIDBVR SOT-23 DBV 6 3000 190.5 212.7 31.8 TMP123AIDBVT SOT-23 DBV 6 250 190.5 212.7 31.8 Pack Materials-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) TMP121AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 T121 TMP121AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 T121 TMP121AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 T121 TMP121AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 T121 TMP123AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T123 TMP123AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T123 TMP123AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T123 TMP123AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T123 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP121 : • Enhanced Product: TMP121-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TMP121AIDBVR SOT-23 DBV 6 3000 178.0 9.0 TMP121AIDBVT SOT-23 DBV 6 250 178.0 9.0 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.23 3.17 1.37 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP121AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TMP121AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated