TI TPS2064DGN

TPS2060
TPS2064
DGN−8
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
70-mΩ High-Side MOSFET
1.5-A Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit (1.6 A min, 2.6 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
No OC Glitch During Power Up
1-µA Maximum Standby Supply Current
Bidirectional Switch
Ambient Temperature Range: 0°C to 70°C
ESD Protection
UL Listed - File No. E169910
Heavy Capacitive Loads
Short-Circuit Protections
TPS2060
DGN PACKAGE
(TOP VIEW)
GND
IN
EN1
EN2
1
2
3
4
TPS2064
DGN PACKAGE
(TOP VIEW)
OC1
OUT1
OUT2
OC2
8
7
6
5
GND
IN
EN1
EN2
1
2
3
4
8
7
6
5
OC1
OUT1
OUT2
OC2
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches
for power-distribution systems that require multiple power switches in a single package. Each switch is controlled
by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch
rise times and fall times to minimize current surges during switching. The charge pump requires no external
components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 2.1 A
typically.
GENERAL SWITCH CATALOG
80 mΩ, dual
33 mΩ, single TPS201xA 0.2 A − 2 A
TPS202x
TPS203x
TPS2014
TPS2015
80 mΩ, single TPS2041B
TPS2051B
TPS2045
TPS2055
TPS2061
TPS2065
0.2 A − 2 A
0.2 A − 2 A
600
1A
500
500
250
250
1A
1A
mA
mA
mA
mA
mA
IN1
1.3 Ω
500 mA
500 mA
250 mA
250 mA
1A
1A
1.5 A
1.5 A
TPS2100/1
IN1 500 mA
IN2 10 mA
260 mΩ
IN2
TPS2042B
TPS2052B
TPS2046
TPS2056
TPS2062
TPS2066
TPS2060
TPS2064
OUT TPS2102/3/4/5
IN1
500 mA
IN2
100 mA
80 mΩ, dual
TPS2080
TPS2081
TPS2082
TPS2090
TPS2091
TPS2092
500 mA
500 mA
500 mA
250 mA
250 mA
250 mA
80 mΩ, triple
TPS2043
TPS2053B
TPS2047
TPS2057
TPS2063
TPS2067
500
500
250
250
1A
1A
mA
mA
mA
mA
80 mΩ, quad
TPS2044B
TPS2054B
TPS2048
TPS2058
500
500
250
250
mA
mA
mA
mA
80 mΩ, quad
TPS2085
TPS2086
TPS2087
TPS2095
TPS2096
TPS2097
500 mA
500 mA
500 mA
250 mA
250 mA
250 mA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
TA
ENABLE
TYPICAL
SHORT-CIRCUIT
CURRENT LIMIT
AT 25°C
NUMBER OF
SWITCHES
1.5 A
2.1 A
Dual
Active low
0°C to 70°C
(1)
(2)
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
Active high
PACKAGED
DEVICES (1) (2)
MSOP (DGN)
TPS2060DGN
TPS2064DGN
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN).
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
UNIT
VI
Input voltage range, VI(IN) (2)
-0.3 V to 6 V
Input voltage range, VI(/ENx), VI(ENx)
-0.3 V to 6 V
Voltage range, VI(/OC), VI(/OCx)
-0.3 V to 6 V
VO
Output voltage range, VO(OUT) (2), VO(OUTx)
-0.3 V to 6 V
IO
Continuous output current, IO(OUT), IO(OUTx)
Internally limited
Continuous total power dissipation
TJ
Operating virtual junction temperature range
Tstg
Storage temperature range
See Dissipation Rating Table
0°C to 105°C
-65°C to 150°C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds
Electrostatic discharge (ESD) protection
(1)
(2)
260°C
Human body model MIL-STD-883C
2 kV
Charge device model (CDM)
500 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to GND.
DISSIPATING RATING TABLE
PACKAGE
TA < 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
DGN-8
1712.3 mW
17.123 mW/°C
941.78 mW
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
2.7
5.5
V
Input voltage, VI(ENx), VI(/ENx)
0
5.5
V
IO
Continuous output current, IO(OUTx)
0
1.5
A
TJ
Operating virtual junction temperature
0
105
°C
VI
2
Input voltage, VI(IN)
UNIT
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(/ENx) = 0 V, or VI(ENx) = 5.5 V (unless
otherwise noted)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP MAX
UNIT
POWER SWITCH
rDS(on)
tr (2)
Static drain-source on-state resistance, 5-V operation and 3.3-V operation
VI(IN) = 5 V or
3.3 V,
IO = 1.5 A
0°C < TJ < 105°C
70
115
mΩ
Static drain-source on-state resistance, 2.7-V
operation (2)
VI(IN) = 2.7 V,
IO = 1.5 A
0°C < TJ < 105°C
75
125
mΩ
0.6
1.5
Rise time, output
tf (2)
Fall time, output
VI(IN) = 5.5 V
VI(IN) = 2.7 V
VI(IN) = 5.5 V
CL = 1 µF,
RL = 5 Ω
TJ = 25°C
VI(IN) = 2.7 V
0.4
1
0.05
0.5
0.05
0.5
ms
ENABLE INPUT EN OR EN
VIH
High-level input voltage
2.7 V < VI(IN) < 5.5 V
2
VIL
Low-level input voltage
2.7 V < VI(IN) < 5.5 V
II
Input current
VI(/ENx) = 0 V or 5.5 V, VI(ENx) = 0 V or 5.5 V
ton (3)
Turnon time
CL = 100 µF, RL = 5 Ω
3
toff (3)
Turnoff time
CL = 100 µF, RL = 5 Ω
10
0.8
-0.5
0.5
V
µA
ms
CURRENT LIMIT
IOS
Short-circuit output current
VI(IN) = 5 V, OUT connected to GND, device enabled into
short-circuit
IOC_TRIP (3)
Over-current trip threshold
VI(IN) = 5 V, Current ramp (≤ 100 A/s) on OUT
1.6
2.1
2.6
3.2
3.9
A
Supply current, low-level output
No load on OUT, VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
TJ = 25°C
0.5
1
0°C < TJ < 105°C
0.5
5
Supply current, high-level output
No load on OUT, VI(/ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
50
70
0°C < TJ < 105°C
50
90
Leakage current
OUT connected to ground,
VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
0°C < TJ < 105°C
1
µA
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground (3)
TJ = 25°C
0.2
µA
µA
µA
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN
Hysteresis, IN
2
TJ = 25°C
2.5
75
V
mV
OVERCURRENT OC1 and OC2
Output low voltage, VOL(OCx)
Off-state
current (3)
OC deglitch (3)
IO(/OCx) = 5 mA
0.4
VO(/OCx) = 5 V or 3.3 V
OCx assertion or deassertion
4
8
V
1
µA
15
ms
THERMAL SHUTDOWN (4)
Thermal shutdown threshold (3)
135
Recovery from thermal shutdown (3)
125
Hysteresis (3)
(1)
(2)
(3)
(4)
°C
°C
10
°C
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
Not tested in production, specified by design.
Not tested in production, specified by design.
The thermal shutdown only reacts under overcurrent conditions.
3
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
DEVICE INFORMATION
Terminal Functions (TPS2060 and TPS2064)
TERMINAL
NAME
I/O
NO.
DESCRIPTION
TPS2060
TPS2064
EN1
3
-
I
Enable input, logic low turns on power switch IN-OUT1
EN2
4
-
I
Enable input, logic low turns on power switch IN-OUT2
EN1
-
3
I
Enable input, logic high turns on power switch IN-OUT1
EN2
-
4
I
Enable input, logic high turns on power switch IN-OUT2
GND
1
1
IN
2
2
I
Input voltage
OC1
8
8
O
Overcurrent, open-drain output, active low, IN-OUT1
OC2
5
5
O
Overcurrent, open-drain output, active low, IN-OUT2
OUT1
7
7
O
Power-switch output, IN-OUT1
OUT2
6
6
O
Power-switch output, IN-OUT2
4
Ground
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
Functional Block Diagram
OC1
Thermal
Sense
GND
Deglitch
EN1
(See Note B)
Driver
Current
Limit
Charge
Pump
(See Note A)
CS
OUT1
UVLO
(See Note A)
IN
CS
OUT2
Charge
Pump
Driver
Current
Limit
OC2
EN2
(See Note B)
Thermal
Sense
Deglitch
Note A: Current sense
Note B: Active low (ENx) for TPS2060. Active high (ENx) for TPS2064.
PARAMETER MEASUREMENT INFORMATION
OUT
RL
tf
tr
CL
VO(OUT)
90%
10%
90%
10%
TEST CIRCUIT
50%
VI(EN)
50%
toff
ton
VO(OUT)
50%
VI(EN)
90%
50%
toff
ton
VO(OUT)
10%
90%
10%
VOLTAGE WAVEFORMS
Figure 1. Test Circuit and Voltage Waveforms
5
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION (continued)
RL = 5 W,
CL = 1 mF,
TA = 25 °C
VI(EN)
5 V/div
VI(EN)
5 V/div
VO(OUT)
2 V/div
VO(OUT)
2 V/div
t - Time - 400 ms
t - Time - 400 ms
Figure 2. Turnon Delay and Rise Time With 1-µF Load
RL = 5 W,
CL = 100 mF,
TA = 25 °C
VI(EN)
5 V/div
VO(OUT)
2 V/div
Figure 3. Turnoff Delay and Fall Time With 1-µF Load
VI(EN)
5 V/div
RL = 5 W,
CL = 100 mF,
TA = 25 °C
VO(OUT)
2 V/div
t - Time - 400 ms
Figure 4. Turnon Delay and Rise Time With 100-µF Load
6
RL = 5 W,
CL = 1 mF,
TA = 25 °C
t - Time - 400 ms
Figure 5. Turnoff Delay and Fall Time With 100-µF Load
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION (continued)
VIN = 5 V,
RL = 3 ,
TA = 25C
VI(EN)
5 V/div
VI(EN)
5 V/div
220 F
470 F
IO(OUT)
500 mA/div
100 F
IO(OUT)
500 mA/div
t − Time − 500 s/div
t − Time − 500 s/div
Figure 6. Short-Circuit Current,
Device Enabled Into Short
Figure 7. Inrush Current With Different
Load Capacitance
VO(OUT)
2 V/div
IO(OUT)
1 A/div
t − Time − 2 ms/div
Figure 8. 0.6-Ω Load Connected to Enabled Device
7
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS
TURNON TIME
vs
INPUT VOLTAGE
TURNOFF TIME
vs
INPUT VOLTAGE
1.0
2
CL = 100 F,
RL = 5 ,
TA = 25C
0.9
0.8
CL = 100 F,
RL = 5 ,
TA = 25C
1.9
Turnoff Time − mS
Turnon Time − ms
0.7
0.6
0.5
0.4
1.8
1.7
0.3
0.2
1.6
0.1
0
2
3
4
5
VI − Input Voltage − V
1.5
6
2
4
5
VI − Input Voltage − V
Figure 9.
Figure 10.
RISE TIME
vs
INPUT VOLTAGE
FALL TIME
vs
INPUT VOLTAGE
6
0.25
0.6
CL = 1 F,
RL = 5 ,
TA = 25C
CL = 1 F,
RL = 5 ,
TA = 25C
0.5
0.2
0.4
Fall Time − ms
Rise Time − ms
3
0.3
0.15
0.1
0.2
0.05
0.1
0
2
3
4
5
VI − Input Voltage − V
Figure 11.
8
6
0
2
3
4
5
VI − Input Voltage − V
Figure 12.
6
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
I I (IN) − Supply Current, Output Disabled − µ A
I I (IN) − Supply Current, Output Enabled − µ A
70
VI = 5.5 V
60
50
VI = 5 V
VI = 3.3 V
40
30
VI = 2.7 V
20
10
0
−50
0
50
100
0.5
0.45
VI = 5 V
0.4
0.35
0.3
0.2
0.15
0.1
0.05
50
100
Figure 13.
Figure 14.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
SHORT-CIRCUIT OUTPUT CURRENT
vs
JUNCTION TEMPERATURE
120
150
2.6
IO = 0.5 A
2.5
Out1 = 5 V
IOS - Short-Circuit Current Limit - A
100
On-State Resistance − mΩ
0
TJ − Junction Temperature − C
TJ − Junction Temperature − C
r DS(on) − Static Drain-Source
VI = 3.3 V
VI = 2.7 V
0.25
0
−50
150
VI = 5.5 V
Out1 = 3.3 V
80
Out1 = 2.7 V
60
40
20
2.4
VI = 2.7 V
2.3
VI = 3.3 V
2.2
2.1
VI = 5.5 V
VI = 5 V
2
1.9
1.8
1.7
1.6
0
−50
0
50
100
TJ − Junction Temperature − C
Figure 15.
150
-50
0
50
100
150
TJ - Junction Temperature - °C
Figure 16.
9
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
THRESHOLD TRIP CURRENT
vs
INPUT VOLTAGE
UNDERVOLTAGE LOCKOUT
vs
JUNCTION TEMPERATURE
2.3
2.5
UVLO Rising
UVOL − Undervoltage Lockout − V
TA = 25C
Load Ramp = 1A/10 ms
Threshold Trip Current − A
2.3
2.1
1.9
1.7
2.26
2.22
2.18
2.14
2.1
−50
1.5
2.5
3
3.5
4
4.5
5
5.5
UVLO Falling
6
0
50
VI − Input Voltage − V
Figure 17.
Figure 18.
CURRENT-LIMIT RESPONSE
vs
PEAK CURRENT
200
Current-Limit Response - ms
VI = 5 V,
TA = 25 °C
150
100
50
0
0
2.5
5
Peak Current - A
Figure 19.
10
100
TJ − Junction Temperature − C
7.5
10
150
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
TPS2060
2
Power Supply
2.7 V to 5.5 V
IN
OUT1
0.1 µF
8
3
5
4
7
Load
0.1 µF
22 µF
0.1 µF
22 µF
OC1
EN1
OUT2
6
OC2
Load
EN2
GND
1
Figure 20. Typical Application
A 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before VI(IN) has been applied (see Figure 13). The TPS206x senses the short and
immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current
mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 14). The TPS206x is capable of delivering current up to the current-limit threshold without
damaging the device. Once the threshold has been reached, the device switches into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS206x is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch eliminates
the need for external components to remove unwanted pulses. OCx is not deglitched when the switch is turned
off due to an overtemperature shutdown.
11
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
V+
TPS2060
GND
Rpullup
OC1
IN
OUT1
EN1
OUT2
EN2
OC2
Figure 21. Typical Circuit for the OC Pin
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 15. Using this value, the power
dissipation per switch can be calculated by:
• PD = rDS(on)× I2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
• TJ = PD x RθJA + TA
Where:
• TA= Ambient temperature °C
• RθJA = Thermal resistance
• PD = Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS206x implements a thermal sensing to monitor the operating junction
temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction temperature
rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C due to
overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power
switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
12
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
• Hosts/self-powered hubs (SPH)
• Bus-powered hubs (BPH)
• Low-power, bus-powered functions
• High-power, bus-powered functions
• Self-powered functions
SPHs and BPHs distribute data and power to downstream functions. The TPS206x has higher current capability
than required by one USB port; so, it can be used on the host side and supplies power to multiple downstream
ports or functions.
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and SPHs have a local power supply that powers the embedded functions and the downstream ports (see
Figure 22). This power supply must provide from 5.25 V to 4.75 V to the board side of the downstream
connection under full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection
and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers,
and stand-alone hubs.
13
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
Downstream
USB Ports
D+
D−
VBUS
0.1 µF
22 µF
GND
D+
D−
VBUS
0.1 µF
22 µF
GND
Power Supply
3.3 V
5V
IN
OUT1
0.1 µF
D−
7
VBUS
0.1 µF
8
3
USB
Controller
D+
TPS2060
2
5
4
22 µF
GND
OC1
EN1
D+
OC2
EN2
OUT2
GND
D−
6
VBUS
0.1 µF
2 µF
GND
1
D+
D−
VBUS
0.1 µF
22 µF
GND
D+
D−
VBUS
0.1 µF
22 µF
GND
Figure 22. Typical Six-Port USB Host / Self-Powered Hub
BPHs obtain all power from upstream ports and often contain an embedded function. The hubs are required to
power up with less than one unit load. The BPH usually has one embedded function, and power is always
available to the controller of the hub. If the embedded function and hub require more than 100 mA on power up,
the power to the embedded function may need to be kept off until enumeration is completed. This can be
accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
14
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can
draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω
and 10 µF at power up, the device must implement inrush current limiting (see Figure 23). With TPS206x, the
internal functions could draw more than 500 mA, which fits the needs of some applications such as motor driving
circuits.
Power Supply
3.3 V
D+
D−
VBUS
TPS2060
2
10 µF
0.1 µF
IN
OUT1
GND
8
USB
Control
3
5
4
7
0.1 µF
10 µF
Internal
Function
0.1 µF
10 µF
Internal
Function
OC1
EN1
OC2
EN2
OUT2
GND
1
6
Figure 23. High-Power Bus-Powered Function
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
• Hosts/SPHs must:
– Current-limit downstream ports
– Report overcurrent conditions on USB VBUS
• BPHs must:
– Enable/disable power to downstream ports
– Power up at <100 mA
– Limit inrush current (<44 Ω and 10 µF)
• Functions must:
– Limit inrush currents
– Power up at <100 mA
The feature set of the TPS206x allows them to meet each of these requirements. The integrated current-limiting
and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and controlled rise
times meet the need of both input and output ports on bus-powered hubs, as well as the input ports for
bus-powered functions (see Figure 24).
15
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
Upstream
Port
SN75240
BUSPWR
A C
B D
GANGED
D+
D−
DP0
DP1
DM0
DM1
Tie to TPS2041 EN Input
D+
A C
B D
GND
OC
5V
IN
DM2
5-V Power
Supply
EN
GND
5V
33 µF†
DM3
A C
B D
1 µF
TPS76333
4.7 µF
SN75240
D+
D−
Ferrite Beads
GND
DP4
IN
3.3 V
4.7 µF
VCC
DM4
5V
TPS2060
GND
GND
48-MHz
Crystal
XTAL1
PWRON1
EN1 OUT1
OVRCUR1
OC1 OUT2
PWRON2
EN2
OVRCUR2
OC2
33 µF†
D+
IN
0.1 µF
Tuning
Circuit
D−
DP3
OUT
0.1 µF
Ferrite Beads
SN75240
DP2
TPS2041B
Downstream
Ports
D−
Ferrite Beads
GND
XTAL2
5V
OCSOFF
GND
33 µF†
D+
Ferrite Beads
D−
GND
5V
†
USB rev 1.1 requires 120 µF per hub.
33 µF†
Figure 24. Hybrid Self / Bus-Powered Hub Implementation
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS206x, these devices can be used to
provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the TPS206x
also ensures that the switch is off after the card has been removed, and that the switch is off during the next
insertion. The UVLO feature insures a soft start with a controlled rise time for every insertion of the card or
module.
16
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
PC Board
TPS2060
OC1
GND
Power
Supply
2.7 V to 5.5 V
1000 µF
Optimum
0.1 µF
IN
EN1
EN2
Block of
Circuitry
OUT1
OUT2
OC2
Block of
Circuitry
Overcurrent Response
Figure 25. Typical Hot-Plug Implementation
By placing the TPS206x between the VCC input and the rest of the circuitry, the input power reaches these
devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a slow voltage
ramp at the output of the device. This implementation controls system surge currents and provides a
hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch, the
power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch supplies a
minimum current of 1.5 A.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable (ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce
the supply current. The supply current is reduced to less than 1 µA when a logic high is present on ENx, or when
a logic low is present on ENx. A logic zero input on ENx, or a logic high input on ENx restores bias to the drive
and control circuits and turns the switch on. The enable input is compatible with both TTL and CMOS logic
levels.
Overcurrent (OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature shutdown
occurs, the OCx is asserted instantaneously.
17
TPS2060
TPS2064
www.ti.com
SLVS553A – MARCH 2005 – REVISED JULY 2005
DETAILED DESCRIPTION (continued)
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS206x implements a thermal sensing to monitor the operating temperature of the power distribution
switch. In an overcurrent or short-circuit condition the junction temperature rises. When the die temperature rises
to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry turns off the switch,
thus preventing the device from damage. Hysteresis is built into the thermal sense, and after the device has
cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on until the
fault is removed. The open-drain false reporting output (OCx) is asserted (active low) when an overtemperature
shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
18
PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS2060DGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2060DGNG4
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2060DGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2060DGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2064DGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2064DGNG4
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2064DGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2064DGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated