TI TPS61181RTER

TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
WLED DRIVER FOR NOTEBOOK DISPLAY
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
5 V to 24 V Input Voltage
Integrated 1.5 A 40 V MOSFET
1.0 MHz/1.3 MHz Switching Frequency
Boost Output Auto-Adaptive to WLED Voltages
Small External Components
Integrated Loop Compensation
Six Current Sink of 25 mA
Up to 10 WLED in Series
Less Than 3% Current Matching and Accuracy
100:1 PWM Brightness Dimming Range
Minimized Output Ripple Under PWM Dimming
Driver for Input/Output Isolation PFET
•
•
•
•
•
True Shutdown
Over Voltage Protection
WLED Open/Short Protection
Built-in Soft Start
16L 3 mm×3 mm QFN
APPLICATIONS
•
•
•
Notebook LCD Display Backlight
UMPC LCD Display Backlight
Backlight for Media Form Factor LCD display
DESCRIPTION
The TPS61180/1/2 ICs provide highly integrated solutions for media size LCD backlight. These devices have a
built-in high efficiency boost regulator with integrated 1.5A/40V power MOSFET. The six current sink regulators
provide high precision current regulation and matching. In total, the device can support up to 60 WLED. In
addition, the boost output automatically adjusts its voltage to the WLED forward voltage to improve efficiency.
The devices support pulse width modulation (PWM) brightness dimming. During dimming, the WLED current is
turned on/off at the duty cycle and frequency determined by the PWM signal input on the DCRTL pin. One
potential issue of PWM dimming is audible noises from the output ceramic capacitors. The TPS61180/1/2 family
is designed to minimize this output AC ripple across a wide dimming duty cycle and frequency range; and,
therefore reduce the audible noise.
The TPS61180/1/2 ICs provide a driver output for an external PFET connected between the input and inductor.
During short circuit or over-current conditions, the ICs turn off the external PFET and disconnect the battery from
the WLEDs. The PFET is also turned off during IC shutdown (true shutdown) to prevent any leakage current of
the battery. The device also integrates over-voltage protection, soft-start and thermal shutdown.
The TPS61180 IC requires external 3.3V IC supply, while TPS61181 and TPS61182 ICs have a built-in linear
regulator for the IC supply. All the devices are in a 3×3 mm QFN package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
L1
10 mH
Optional
5 V to 24 V
C1
4.7 mF
Q1
R2
51Ω
R3
100 kW
SW
VBAT
VO
TPS61181/2
EN
IFB6
DCTRL
PWM Dimming
IFB1
IFB2
IFB3
IFB4
IFB5
Cin
C4
0.1 mF
EN
C2
4.7 mF 10 WLED in series,120 mA total
D2
Fault
C3
1 mF
D1
ISET
PGND
GND
R1
62 kW
Figure 1. TPS61181/2 TYPICAL APPLICATION
ORDERING INFORMATION (1)
PACKAGE
IC SUPPLY
SWITCHING FREQUENCY
(TYP)
PACKAGE MARKING
TPS61180RTE
External 3.3 V
1.0 MHz
CCG
TPS61181RTE
Built-in LDO
1.0 MHz
CCH
TPS61182RTE
Built-in LDO
1.3 MHz
CCI
(1)
2
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
PINOUT
Fault
EN
IFB6
IFB5
QFN PACKAGE
16 Pin 3x3
(TOP VIEW)
16
15
14
13
12
2
11
DCTRL
VBAT
3
10
GND
VO
4
9
IFB3
6
7
IFB4
8
IFB2
5
IFB1
SW
Cin
1
ISET
PGND
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NO.
NAME
1
PGND
I
Power ground of the IC. Internally, it connects to the source of the PWM switch.
2
SW
I
This pin connects to the drain of the internal PWM switch, external Schottky diode and inductor.
3
VBAT
I
This pin is connected to the battery supply. It provides the pull-up voltage for the Fault pin and battery
voltage signal. For TPS61181/2, this is also the input to the internal LDO.
4
VO
O
This pin monitors the output of the boost regulator. Connect this pin to the anode of the WLED strings.
5
ISET
I
The resistor on this pin programs the WLED output current.
6
Cin
I
Supply voltage of the IC. For TPS61181/2, it is the output of the internal LDO. Connect 0.1 µF bypass
capacitor to this pin. For TPS61180, connect an external 3.3 V supply to power the IC.
I
Current sink regulation inputs. They are connected to the cathode of WLEDs. The PWM loop regulates
the lowest VIFB to 400 mV. Each channel is limited to 25 mA current.
7, 8, 9
IFB1-IFB3
12, 13, 14 IFB4-IFB6
10
GND
I
Signal ground of the IC.
11
DCTRL
I
Dimming control logic input. The dimming frequency range is 100 Hz to 1 kHz.
15
EN
I
The enable pin to the IC. For TPS61181/2, a logic high signal turns on the internal LDO and enables the
IC. Therefore, do not connect the EN pin to the Cin pin.
16
Fault
I
Gate driver output for an external PFET used for fault protection. It can also be used as signal output for
system fault report.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
3
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
FUNCTIONAL BLOCK DIAGRAM
L1
10 mH
Optional
5 V to 24 V
Q1
R3
100 kW
R3
51 W
C1
4.7 mF
VBAT
C2
4.7 mF
SW
Fault
Protection
C3
1 mF
Cin
VO
Current Mode IFB 1... IFB 6
PWM Control
Internal Regulator
(TPS61181/2 only)
Dimming
Control
GND
EN
EN
Current
Regulator
DCTRL
PWM Dimming
10 WLED in series,120 mA total
D2
Fault
C4
0.1 mF
D1
PGND
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
ISET
R1
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Voltages on pin VBAT and Fault (2)
–0.3 to 24
V
Voltage on pin Cin (2)
–0.3 to 3.6
V
–0.3 to 40
V
–0.3 to 20
V
–0.3 to 7
V
Voltage on pin SW and VO
(2)
Voltage on pin IFB1 to IFB6 (2)
Voltage on all other pins
(2)
Continuous power dissipation
See Dissipation Rating Table
Operating junction temperature range
–40 to 150
°C
Storage temperature range
–65 to 150
°C
260
°C
Lead temperature (soldering, 10 sec)
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
RθJA
TA ≤ 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TPS61180/1/2RTE (1)
270°C/W
370 mW
204 mW
148 mW
TPS61180/1/2RTE (2)
48.7°C/W
2.05 W
1.13 W
821 mW
PACKAGE
(1)
(2)
4
The JEDEC low-K (1s) board used to derive this data was a 3in×3in, two-layer board with 2-ounce copper traces on top of the board.
The JEDEC high-K (2s2p) board used to derive this data was a 3in×3in, multilayer board with 1-ounce internal power and ground.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
Vbat
Battery input voltage range
5.0
24
V
Cin
IC supply voltage range
2.7
3.6
V
VO
Output voltage range
Vin
38
V
L
Inductor
4.7
10
µH
CI
Input capacitor
CO
Output capacitor
FPWM
PWM dimming frequency
TA
Operating ambient temperature
TJ
Operating junction temperature
–40
µF
1
10
µF
0.1
1
kHz
–40
85
°C
125
°C
2.2
ELECTRICAL CHARACTERISTICS
VBAT = 10.8 V, 0.1 µF at Cin, EN = Logic High, IFB current = 15m A, IFB voltage = 500 mV, TA = –40°C to 85°C, typical
values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VBAT
Battery input voltage range
5.0
24
V
Vcc
IC supply voltage range
TPS61180 only
2.7
Vcin
Cin pin output voltage
TPS61181/TPS61182 only
2.7
3.15
3.6
V
3.15
3.6
Iq_bat
Operating quiescent current into VBAT
Device enable, switching
no load, Vin = 24 V
Iq_Vcc
Operating quiescent current into Cin pin
TPS61180 only
IQ_sw
Operating quiescent current into VO
VO = 35V
ISD
Shutdown current
EN=GND
Vcc_UVLO
Cin pin under-voltage lockout threshold
TPS61180 only
Vbat_UVLO
VBAT under-voltage lockout threshold
When Vin ramp down
4.2
4.5
Vbat_hys
VBAT under-voltage lockout hysteresis
When Vin ramp up
300
TPS61180
1
TPS61181/2
3
V
mA
2
mA
50
µA
2
18
µA
2.2
2.4
V
V
mV
EN AND DCTRL
VH
Logic high voltage
VL
Logic low voltage
RPD
Pull down resistor on both pins
TSD
EN pulse width to shutdown
1.2
V
0.4
400
EN high to low
800
V
1600
kΩ
TPS61180/1
27
37
ms
TPS61182
21
28
CURRENT REGULATION
VISET
ISET pin voltage
1.204
1.229
1.253
KISET
Current multiple Iout/ISET
ISET current = 15 µA and 25 µA
970
1000
1030
IFB
Current accuracy
Riset = 62K
19.4
20
20.6
Km
(Imax–Imin)/IAVG
ISET current = 15 µA and 25 µA
1
2.5
%
Ileak
IFB pin leakage current
IFB voltage = 20 V on all pins
3
µA
IIFB_MAX
Current sink max output current
IFB = 425 mV
25
V
mA
mA
BOOST OUTPUT REGULATION
VIFB_L
VO dial up threshold
Measured on VIFB(min)
400
mV
VIFB_H
VO dial down threshold
Measured on VIFB(min)
700
mV
Vreg_L
Min Vout regulation voltage
Vo_step
VO stepping voltage
16
V
100
150
mV
0.2
0.45
Ω
300
Ω
POWER SWITCH
RPWM_SW
PWM FET on-resistance
Rstart
Start up charging resistance
VO = 0 V
100
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
5
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS (continued)
VBAT = 10.8 V, 0.1 µF at Cin, EN = Logic High, IFB current = 15m A, IFB voltage = 500 mV, TA = –40°C to 85°C, typical
values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Vstart_r
Isolation FET start up threshold
VIN–VO, VO ramp up
ILN_NFET
PWM FET leakage current
VSW = 35 V, TA = 25°C
MIN
TYP
MAX
1.2
2
UNIT
V
1
µA
OSCILLATOR
fS
Oscillator frequency
Dmax
Maximum duty cycle
Dmin
Minimum duty cycle
TPS61182
1.2
1.3
1.5
TPS61180/1
0.9
1.0
1.2
IFB = 0 V
85
94
MHz
%
7
%
OS, SC, OVP AND SS
ILIM
N-Channel MOSFET current limit
D = Dmax
1.5
3
A
Vovp
VO overvoltage threshold
Measured on the VO pin
38
39
40
V
Vovp_IFB
IFB overvoltage threshold
Measured on the IFBx pin
15
17
20
V
Vsc
Short circuit detection threshold
VIN-VO, VO ramp down
1.7
2.5
Vsc_dly
Short circuit detection delay during start up
VIFB_nouse
IFB no use detection threshold
TPS61180 Only
V
32
ms
0.6
V
Fault OUTPUT
Vfault_high
Fault high voltage
Measured as Vbat–VFault
Vfault_low
Fault low voltage
Measured as Vbat–VFault, sink 0.1mA, Vin
= 15 V
0.1
6
8
V
10
V
THERMAL SHUTDOWN
Tshutdown
Thermal shutdown threshold
Thysteresis
Thermal shutdown threshold hysteresis
6
Submit Documentation Feedback
160
°C
15
°C
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS
Table of Graphs
Figure
Load Efficiency TPS61181
Vbat= 11V; VO=28.8V, 23.2V and 17.6V; L=4.7uH
Figure 2
Load Efficiency TPS61181
Vbat= 11V; VO=36.2V and 31.6V; L=4.7uH
Figure 3
Load Efficiency TPS61181
Vbat= 11V; VO=28.8V; L=4.7uH, L=10uH
Figure 4
Load Efficiency TPS61181
Vbat= 7V, 11V and 19V; VO=28.8V; L=4.7uH
Figure 5
PWM Dimming Efficiency
Vbat= 7V, 11V and 19V; VO=28.8V; Iset= 20µA; PWM Freq = 200Hz
Figure 6
PWM Dimming Efficiency
Vbat= 7V, 11V and 19V; VO=36.2V; Iset= 20µA; PWM Freq = 200Hz
Figure 7
Dimming Linearity
Vbat= 11V; VO=28.8V; Iset= 20µA; PWM Freq = 1kHz
Figure 8
Dimming Linearity
Vbat= 11V; VO=28.8V; Iset= 20µA; PWM Freq = 200Hz
Figure 9
Output Ripple
VO=28.8V; Iset= 20µA; PWM Freq = 200Hz; Duty = 50%
Figure 10
Switching Waveform
Vbat= 11V; Iset= 20µA
Figure 11
Output Ripple at PWM Dimming
Vbat= 11V; Iset= 20µA; PWM Freq = 200Hz; Duty = 50%; CO=4.7µF
Figure 12
Short Circuit Protection
Vbat= 11V; Iset= 20µA
Figure 13
Open WLED Protection
Vbat= 11V; Iset= 20µA
Figure 14
Startup Waveform
Vbat= 11V; Iset= 20µA
Figure 15
EFFICIENCY
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
100
98
Vbat = 11 V
Vbat = 11 V
96
98
VO = 17.6 V
96
VO = 23.2 V
Efficiency - %
Efficiency - %
92
90
VO = 28.8 V
88
92
90
86
84
84
82
82
80
25
50
100
75
IO - Output Current - mA
125
150
VO = 36.2 V
88
86
80
0
VO = 31.6 V
94
94
0
Figure 2.
25
50
100
75
IO - Output Current - mA
125
150
Figure 3.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
7
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
EFFICIENCY
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
100
Vbat = 11 V
98
98
Vbat = 19 V
96
96
10 mH
94
Efficiency - %
Efficiency - %
94
92
4.7 mH
90
88
92
90
Vbat = 7 V
88
86
86
84
84
VO = 28.8 V,
TPS61181
82
80
0
25
50
100
75
IO - Output Current - mA
80
150
125
VO = 28.8 V,
TPS61181
82
0
25
Figure 5.
EFFICIENCY
vs
DIMMING DUTY CYCLE
EFFICIENCY
vs
DIMMING DUTY CYCLE
100
90
Vbat = 11 V
Efficiency - %
Efficiency - %
90
150
125
Vbat = 19 V
Vbat = 19 V
Vbat = 7 V
80
70
VO = 28.8 V, TPS61181
60
Vbat = 11 V
80
Vbat = 7 V
70
60
VO = 36.2 V - TPS61181
ISET = 20 mA,
Dimming Frequency = 200 Hz
8
50
100
75
IO - Output Current - mA
Figure 4.
100
50
Vbat = 11 V
0
10
20 30 40 50 60 70 80
PWM Dimming Duty Cycle - %
Figure 6.
90 100
ISET = 20 mA
Dimming Frequency = 200 Hz
50
0
10
Submit Documentation Feedback
20 30 40 50 60 70 80
PWM Dimming Duty Cycle - %
90
100
Figure 7.
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
PWM DIMMING LINEARITY 200Hz
140
120
120
IO - Output Current - mA
IO - Output Current - mA
PWM DIMMING linearity 1kHz
140
100
80
60
40
80
60
40
TPS61181
ISET = 20 mA,
Dimming Frequency = 1 kHz
20
0
0
100
10
20 30 40 50 60 70 80
PWM Dimming Duty Cycle - %
90
TPS61181
ISET = 20 mA,
Dimming Frequency = 200 Hz
20
0
100
0
10
20 30 40 50 60 70 80
PWM Dimming Duty Cycle - %
Figure 8.
90
100
Figure 9.
PWM DIMMING OUTPUT RIPPLE CO=4.7µF
vs
INPUT VOLTAGE
350
Output Ripple Peak to Peak - mV
300
L = 4.7 mH
250
200
L = 10 mH
150
VO = 28.8 V, TPS61181
100
ISET = 20 mA,
Dimming Frequency = 200 Hz
50
5
7.5
10
12.5
Vbat - V
15
17.5
20.0
Figure 10.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
9
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
SWITCHING WAVEFORM
OUTPUT RIPPLE AT PWM DIMMING CO=4.7µF
Vbat
100 mV/div, AC
DCTRL
5 V/div, DC
SW
20 V/div, DC
VO
100 mV/div, AC
VO
100 mV/div, AC
Inductor
Current
1 A/div, DC
Inductor
Current
1 A/div, DC
t - Time - 1 ms/div
t - Time - 2 ms/div
Figure 11.
Figure 12.
OUTPUT SHORT PROTECTION
OPEN WLED PROTECTION
Fault
5 V/div, DC
Fault
5 V/div, DC
VO
20 V/div, DC
VO
20 V/div, DC
Inductor
Current
5 A/div, DC
Inductor
Current
1 A/div, DC
t - Time - 1 s/div
t - Time - 100 ms/div
Figure 13.
Figure 14.
STARTUP WAVEFORM
EN
5 V/div, DC
VO
10 V/div, DC
Inductor
Current
1 A/div, DC
WLED
Current
20 mA/div, DC
t - Time - 10 ms/div
Figure 15.
10
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
DETAILED DESCRIPTION
Recently, WLEDs have gained popularity as an alternative to CCFL for backlighting media size LCD displays.
The advantages of WLEDs are power efficiency and low profile design. Due to the large number of WLEDs, they
are often arranged in series and parallel, and powered by a boost regulator with multiple current sink regulators.
Having more WLEDs in series reduces the number of parallel strings and therefore improves overall current
matching. However, the efficiency of the boost regulator declines due to the need for high output voltage. Also,
there have to be enough WLEDs in series to ensure the output voltage stays above the input voltage range.
Otherwise, a buck-boost (for example, SEPIC) power converter has to be adopted which could be more
expensive and complicated.
The TPS61180/1/2 family of ICs have integrated all the key function blocks to power and control up to 60
WLEDs. The devices include a 40V/1.5A boost regulator, six 25mA current sink regulators and protection circuit
for over-current, over-voltage and short circuit failures. The key advantages of the devices are small solution
size, low output AC ripple during PWM dimming control, and the capability to isolate the input and output during
fault conditions.
SUPPLY VOLTAGE
The TPS61181/2 ICs have built-in LDO linear regulator to supply the IC analog and logic circuit. The LDO is
powered up when the EN pin is high. The output of the LDO is connected to the Cin pin. A 0.1µF bypass
capacitor is required for LDO’s stable operation. Do not connect the Cin pin to the EN pin because this prevents
the IC from starting up. In addition, avoid connecting the Cin pin to any other circuit as this could introduce noise
into the IC supply voltage.
The TPS61180 has no built-in LDO linear regulator, and therefore requires an external supply voltage in the
range of 2.7V to 3.6V connected to the Cin pin. The benefit of using external supply is to reduce the power
losses incurred by the LDO as it provides the IC supply current. This loss could become a significant percentage
of total output power under light load condition. The Cin pin has 2.2V (typical) under-voltage lock out which turns
off the IC when the Cin pin voltage is below this threshold.
The voltage on the VBAT pin is the reference for the pull-up circuit of the Fault pin. In addition, it also serves as
the input signal to the short circuit protection. For TPS61181/2 ICs, the VBAT connects to the input of the internal
LDO, and powers the IC. There is an under-voltage lockout on the VBAT pin which disables the IC when its
voltage reduces to 4.2V (Typical). The IC restarts when the VBAT pin voltage recovers by 300mV.
BOOST REGULATOR
The boost regulator is controlled by current mode PWM, and loop compensation is integrated inside the IC. The
internal compensation ensures stable output over the full input and output voltage range. The TPS61180/1
switches at 1.0MHz, and the TPS61182 switches at 1.3MHz. The switching frequencies of the two devices,
including their tolerance, due not over-lap. Therefore, in the unlikely event that one device creates
electromagnetic inference to the system; the other device, switching at a different frequency, can provide an
alternative solution.
The output voltage of the boost regulator is automatically set by the IC to minimize the voltage drop across the
IFB pins. The IC automatically regulates the lowest IFB pin to 400mV, and consistently adjusts the boost output
voltage to account for any changes of the LED forward voltages.
When the output voltage is too close to the input, the boost regulator may not be able to regulate the output due
to the limitation of minimum duty cycle. In this case, increase the number of WLED in series or include series
ballast resistors in order to provide enough headroom for the boost operation.
The TPS61180/1/2 boost regulators cannot regulate their outputs to voltages below 15V.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
11
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
CURRENT PROGRAM AND PWM DIMMING
The six current sink regulators can each provide maximum 25mA. The IFB current must be programmed to
highest WLED current expected using the ISET pin resistor and the following Equation 1.
V
I FB + KISET ISET
R ISET
(1)
Where
KISET = Current multiple (1000 typical)
VISET = ISET pin voltage (1.229 V typical)
RISET = ISET pin resistor
The TPS61180/1/2 ICs have built-in precise current sink regulator. The current matching among 6 current sinks
is below 2.5%. This means the differential value between the maximum and minimum current of the six current
sinks divided by the average current of the six is less than 2.5%.
The WLED brightness is controlled by the PWM signal on the DCTRL pin. The frequency and duty cycle of the
DCTRL signal is replicated on the IFB pin current. Keep the dimming frequency in the range of 100Hz to 1kHz to
avoid screen flickering and maintain dimming linearity. Screen flickering may occur if the dimming frequency is
below the range. The TPS61180/1/2 ICs are designed to minimize the AC ripple on the output capacitor during
PWM dimming. Careful passive component selection is also critical to minimize AC ripple on the output
capacitor. See APPLICATION INFORMATION for more information.
ENABLE AND START UP
A logic high signal on the EN pin turns on the IC. For the TPS61181/2 ICs, taking EN high turns on the internal
LDO linear regulator which provides supply IC current. For all devices, an internal resistor Rstart (start up charging
resistor) is connected between the VBAT pin and VO pin to charge the output capacitor toward Vin. The Fault pin
outputs high during this time, and thus the external isolation PFET is turned off. Once the VO pin voltage is within
2 V (isolation FET start up threshold) of the VBAT pin voltage, Rstart is open, and the Fault pin pulls down the gate
of the PFET and connects the VBAT voltage to the boost regulator. This operation is to prevent the in-rush current
due to charging the output capacitor.
Once the isolation FET is turned on, the IC starts the PWM switching to raise the output voltage above VBAT.
Soft-start is implemented by gradually ramping up the reference voltage of the error amplifier to prevent voltage
over-shoot and in-rush current. See the start-up waveform of a typical example, Figure 15.
Pulling the EN pin low for 32ms (typical) shuts down the IC, resulting in the IC consuming less than 50µA in the
shutdown mode.
OVER-CURRENT, OVER-VOLTAGE AND SHORT-CIRCUIT PROTECTION
The TPS61180/1/2 family has pulse by pulse over-current limit of 1.5A (min). The PWM switch turns off when the
inductor current reaches this current threshold. The PWM switch remains off until the beginning of the next
switching cycle. This protects the IC and external component under over-load conditions. When there is
sustained over-current condition for more than 16ms ( under 100% dimming duty cycle), the IC turns off and
requires PER or the EN pin toggling to restart.
Under severe over-load and/or short circuit conditions, the VO pin can be pulled below the input (VBAT pin). Under
this condition, the current can follow directly from input to output through the inductor and Schottky diode.
Turning off the PWM switch alone does not limit current anymore. In this case, the TPS61180/1/2 ICs detect the
output voltage is 1V (short circuit detection threshold) below the input voltage, turns off the isolation FET, and
shuts down the IC. The IC restarts after input power-on reset (VBAT POR) or EN pin logic toggling.
During the IC start up, if there is short circuit condition on the boost converter output, the output capacitor will not
be charged to within 2V of VBAT through Rstart. After 32ms (short circuit detection delay during start up), the IC
shuts down and does not restart until there is VBAT POR or EN pin toggling. The isolation FET is never turned on
under the condition.
12
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
For the TPS61181/2 ICs, if one of the WLED strings is open, the boost output rises to over-voltage threshold
(39V typical). The IC detects the open WLED string by sensing no current in the corresponding IFB pin. As a
result, the IC removes the open IFB pin from the voltage feedback loop. Subsequently, the output voltage drops
down and is regulated to a voltage for the connected WLED strings. The IFB current of the connected WLED
string keeps in regulation during the whole transition. The IC only shuts down if it detects that all of the WLED
strings are open.
For the TPS61180, if the IC detects any open WLED string, the IC shuts down and remains off until there is VBAT
POR or EN pin toggling.
For all the devices, if the over-voltage threshold is reached, but the current sensed on the IFB pin is below the
regulation target, the IC regulates the boost output at the over-voltage threshold. This operation could occur
when the WLED is turned on under cold temperature, and the forward voltages of the WLEDs exceed the
over-voltage threshold. Maintaining the WLED current allows the WLED to warm up and their forward voltages to
drop below the over-voltage threshold.
For the TPS61181/2 ICs, if any IFB pin voltage exceeds IFB over-voltage threshold (17V typical), the IC turns off
the corresponding current sink and removes this IFB pin from VO regulation loop. The remaining IFB pins’ current
regulation is not affected. This condition often occurs when there are several shorted WLEDs in one string.
WLED mismatch typically does not create such large voltage difference among WLED strings.
For the TPS61180 IC, if any IFB pin voltage exceeds IFB over-voltage threshold, the IC shuts down and remains
off until there is VBAT POR or EN pin toggling.
IFB PIN UNUSED
If the application requires less than 6 WLED strings, one can easily disable unused IFB pins. The TPS61181/2
ICs simply require leaving the unused IFB pin open or shorting it to ground. If the IFB pin is open, the boost
output voltage ramps up to VO over-voltage threshold during start up. The IC then detects the zero current string,
and removes it from the feedback loop. If the IFB pin is shorted to ground, the IC detects the short immediately
after IC enable, and the boost output voltage does not go up to VO over-voltage threshold. Instead, it ramps to
the regulation voltage after soft start.
For the TPS61180, connect a 10 kΩ resistor from the unused IFB pin to ground. After the device is enabled, the
IC detects the resistor and disables the IFB pin from the feedback loop.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
13
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
APPLICATION INFORMATION
INDUCTOR SELECTION
Because the selection of the inductor affects power supply’s steady state operation, transient behavior and loop
stability, the inductor is the most important component in switching power regulator design. There are three
specifications most important to the performance of the inductor, inductor value, DC resistance and saturation
current. The TPS61180/1/2 ICs are designed to work with inductor values between 4.7µH and 10µH. A 4.7µH
inductor could be available in a smaller or lower profile package, while 10µH may produce higher efficiency due
to lower inductor ripple. If the boost output current is limited by the over-current protection of the IC, using a
10µH inductor can offer higher output current.
The internal loop compensation for the PWM control is optimized for the recommended component values,
including typical tolerances. Inductor values can have ±20% tolerance with no current bias. When the inductor
current approaches saturation level, its inductance can decrease 20 to 35% from the 0A value depending on how
the inductor vendor defines saturation
In a boost regulator, the inductor DC current can be calculated as
V
IO
I dc + O
V in h
(2)
Where
VO = boost output voltage
Io = boost output current
Vin = boost input voltage
η = power conversion efficiency, use 90% for TPS61180/1/2 applications
The inductor current peak to peak ripple can be calculated as
1
I +
pp
L
ǒ
V
1
V
*
O
bat
) 1
V
Ǔ
bat
FS
(3)
Where
Ipp = inductor peak to peak ripple
L = inductor value
Fs= Switching frequency
Vbat= boost input voltage
Therefore, the peak current seen by the inductor is
I pp
I p + I dc )
2
(4)
Select the inductor with saturation current over the calculated peak current. To calculate the worse case inductor
peak current, use minimum input voltage, maximum output voltage and maximum load current.
Regulator efficiency is dependent on the resistance of its high current path, switching losses associated with the
PWM switch and power diode. Although the TPS61180/1/2 ICs have optimized the internal switch resistance, the
overall efficiency still relies on the DC resistance (DCR) of the inductor; lower DCR improves efficiency.
However, there is a trade off between DCR and inductor footprint. Furthermore, shielded inductors typically have
a higher DCR than unshielded ones. Table 1 lists recommended inductor models.
14
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
Table 1. Recommended Inductor for TPS61180/1/2
L
(µH)
DCR Typ
(mΩ)
Isat
(A)
Size
(LXWXH mm)
A915AY-4R7M
4.7
38
1.87
5.2x5.2x3.0
A915AY-100M
10
75
1.24
5.2x5.2x3.0
SLF6028T-4R7M1R6
4.7
28.4
1.6
6.0x6.0x2.8
SLF6028T-100M1R3
10
53.2
1.3
6.0x6.0x2.8
TOKO
TDK
OUTPUT CAPACITOR SELECTION
During PWM brightness dimming, the load transient causes voltage ripple on the output capacitor. Since the
PWM dimming frequency is in the audible frequency range, the ripple can produce audible noises on the output
ceramic capacitor. There are two ways to reduce or eliminate this audible noise. The first option is to select PWM
dimming frequency outside the audible range. This means the dimming frequency needs be to lower than 200Hz
or higher than 30KHz. The potential issue with low dimming frequency is that WLED on/off can become visible
and thus cause a flickering effect on the display. On the other hand, high dimming frequency can compromise
the dimming range since the LED current accuracy and current match are difficult to maintain at low dimming
duty cycle. The TPS61180/1/2 ICs can support minimum 1% dimming duty cycle up to 1KHz dimming frequency.
The second option is to reduce the amount of the output ripple, and therefore minimize the audible noise.
The TPS61180/1/2 ICs adopt a patented technology to limit output ripple even with small output capacitance. In
a typical application, the output ripple is less than 200mV during PWM dimming with 4.7µF output capacitor, and
the audible noise is not noticeable. The devices are designed to be stable with output capacitor down to 1.0µF.
However, the output ripple can increase with lower output capacitor.
Care must be taken when evaluating a ceramic capacitor’s derating due to applied dc voltage, aging and over
frequency. For example, larger form factor capacitors (in 1206 size) have their self resonant frequencies in the
switching frequency range of the TPS61180/1/2. So the effective capacitance is significantly lower. Therefore, it
may be necessary to use small capacitors in parallel instead of one large capacitor.
ISOLATION MOSFET SELECTION
The TPS61180/1/2 ICs provide a gate driver to an external P channel MOSFET which can be turned off during
device shutdown or fault condition. This MOSFET can provide a true shutdown function, and also protect the
battery from output short circuit conditions. The source of the PMOS should be connected to the input, and a pull
up resistor is required between the source and gate of the FET to keep the FET off during IC shutdown. To turn
on the isolation FET, the Fault pin is pulled low, and clamped at 8 V below the VBAT pin voltage.
During device shutdown or fault condition, the isolation FET is turned off, and the input voltage is applied on the
isolation MOSFET. During short circuit condition, the catch diode (D2 in typical application circuit) is forward
biased when the isolation FET is turned off. The drain of the isolation FET swings below ground. The voltage
cross the isolation FET can be momentarily greater than the input voltage. Therefore, select 30V PMOS for 24V
maximum input. The on resistor of the FET has large impact on power conversion efficiency since the FET
carries the input voltage. Select a MOSFET with Rds(on) less than 100mΩ to limit the power losses.
AUDIBLE NOISE REDUCTION
Ceramic capacitors can produce audible noise if the frequency of its AC voltage ripple is in the audible frequency
range. In TPS61180/1/2 applications, both input and output capacitors are subject to AC voltage ripple during
PWM brightness dimming. The ICs integrate a patented technology to minimize the ripple voltage, and thus
audible noises.
To further reduce the audible noise, one effective way is to use two or three small size capacitors in parallel
instead of one large capacitor. The application circuit in Figure 16 uses two 2.2-µF/25V ceramic capacitors at the
input and two 1-µF/50V ceramic capacitors at the output. All of the capacitors are in 0805 package. Although the
output ripple during PWM dimming is higher than one 4.7µF in a 1206 package, the overall audible noise is
lower.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
15
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
In addition, connecting a 10-nF/50V ceramic capacitor between the VO pin and IFB1 pin can further reduce the
output AC ripple during the PWM dimming. Since this capacitor is subject to large AC ripple, choose a small
package such as 0402 to prevent it from producing noise.
LAYOUT CONSIDERATION
As for all switching power supplies, especially those providing high current and using high switching frequencies,
layout is an important design step. If layout is not carefully done, the regulator could show instability as well as
EMI problems. Therefore, use wide and short traces for high current paths. The input capacitor, C3 in the typical
application circuit, needs not only to be close to the VBAT pin, but also to the GND pin in order to reduce the input
ripple seen by the IC. The input capacitor, C1 in the typical application circuit, should be placed close to the
inductor. The SW pin carries high current with fast rising and falling edges. Therefore, the connection between
the pin to the inductor and Schottky should be kept as short and wide as possible. It is also beneficial to have the
ground of the output capacitor C2 close to the PGND pin since there is large ground return current flowing
between them. When laying out signal ground, it is recommended to use short traces separated from power
ground traces, and connect them together at a single point, for example on the thermal pad.
Thermal pad needs to be soldered on to the PCB and connected to the GND pin of the IC. Additional thermal via
can significantly improve power dissipation of the IC.
ADDITIONAL APPLICATION CIRCUITS
Optional
5 V to 24 V
C1
2.2 mF
Q1
C1a
R2
51Ω
R3
100 kW
L1
10 mH
D1
C2
C2a
1 mF 1 mF
10 WLED in series, 120 mA total
D2
2.2 mF
Fault
SW
V BAT
C3
1 mF
VO
TPS61181/2
Cin
C4
0.1 mF
PWM Dimming
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
EN
EN
C5
10 nF
DCTRL
ISET
PGND
GND
R1
C1, C1a: Murata GRM219R61E225K
C2, C2a: Murata GRM21BR71H105K
C3: Murata GRM21BR71H105K
C4: Murata GRM185R61A105K
C5: Murata GRM155R71H103K
L1: TOKO A915AY-100M
D1: VISHAY SS2P5-E3/84A
Figure 16. Audible Noise Reduction Circuit
16
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
L1
10 mH
Optional
5 V to 24 V
Q1
C1
4.7 mF
R3
100 kW
R2
51Ω
D2
Fault
SW
V BAT
VO
C3
1 mF
TPS61181/2
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
Cin
C4
0.1 mF
EN/PWM
C2
4.7 mF 10 WLED in series,120 mA total
D1
EN
DCTRL
PGND
GND
ISET
R1
62 kW
Figure 17. Single Input Control Circuit
Optional
5 V to 24 V
C1
4.7 mF
Q1
R2
51Ω
R3
100 kW
L1
10 mH
SW
V BAT
C3
1 mF
VO
TPS61180
Cin
C4
0.1uF
EN
EN
DCTRL
PWM Dimming
C2
4.7 mF 10 WLED in series , 120 mA total
D2
Fault
3.3 V
D1
ISET
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
PGND
GND
R1
62 kW
Figure 18. TPS61180 Typical Application
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
17
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
Optional
5 V to 24 V
C1
4.7 mF
L1
10 mH
Q1
R2
51 W
R3
100 kW
C2
4.7 mF
D2
Fault
SW
VBAT
C3
1 mF
VO
TPS61181/2
Cin
C4
0.1 mF
EN
EN
PWM
10 WLEDs in Series
20 mA Each String
D1
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
PGND
GND
DCTRL
ISET
R1
62 kW
S0333-01
Figure 19. TSP61181/2 for Three Strings of LEDs
Optional
5 V to 24 V
C1
4.7 mF
L1
10 mH
R2
51 W
R3
100 kW
C2
4.7 mF
D2
Fault
C3
1 mF
EN
VO
TPS61181/2
Cin
EN
PWM
SW
VBAT
C4
0.1 mF
DCTRL
ISET
10 WLEDs in Series
40 mA Each String
D1
Q1
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
PGND
GND
R1
62 kW
S0334-01
Figure 20. TSP61181/2 for Three Strings of LEDs with Double Current
18
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
TPS61180/1/2
www.ti.com
SLVS801A – DECEMBER 2007 – REVISED MARCH 2008
5 V to 24 V
C1
4.7 mF
L1
10 mH
Q1
R2
51 W
R3
100 kW
C2
4.7 mF
D2
Fault
SW
VBAT
C3
1 mF
VO
TPS61181/2
Cin
C4
0.1 mF
EN
EN
PWM
10 WLEDs in Series
72 mA Each String
D1
High-Brightness LED
Optional
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
PGND
GND
DCTRL
ISET
R1
51 kW
S0335-01
Figure 21. TSP61181/2 for Two Strings High Brightness LEDs Application
C1
4.7 mF
L1
10 mH
D1
Q1
R2
51 W
R3
100 kW
C2
4.7 mF
D2
Fault
C3
1 mF
EN
VO
TPS61181/2
Cin
EN
PWM
SW
VBAT
C4
0.1 mF
DCTRL
ISET
10 WLEDs 120 mA
High-Brightness LED
Optional
5 V to 24 V
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
PGND
GND
R1
62 kW
S0336-01
Figure 22. TSP61181/2 for One String High Brightness LEDs Application
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS61180/1/2
19
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS61180RTER
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61180RTERG4
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61180RTET
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61180RTETG4
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61181RTER
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61181RTERG4
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61181RTET
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61181RTETG4
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61182RTER
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61182RTERG4
ACTIVE
QFN
RTE
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61182RTET
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS61182RTETG4
ACTIVE
QFN
RTE
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS61180RTER
QFN
RTE
16
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
TPS61180RTET
QFN
RTE
16
250
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
TPS61181RTER
QFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
TPS61181RTET
QFN
RTE
16
250
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
TPS61182RTER
QFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
TPS61182RTET
QFN
RTE
16
250
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61180RTER
QFN
RTE
16
3000
340.5
338.1
20.6
TPS61180RTET
QFN
RTE
16
250
340.5
338.1
20.6
TPS61181RTER
QFN
RTE
16
3000
340.5
338.1
20.6
TPS61181RTET
QFN
RTE
16
250
340.5
338.1
20.6
TPS61182RTER
QFN
RTE
16
3000
340.5
338.1
20.6
TPS61182RTET
QFN
RTE
16
250
340.5
338.1
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated