TPS797xx www.ti.com SLVS332H – MARCH 2001 – REVISED APRIL 2012 Ultra-Low IQ, 50mA LDO Linear Regulators with Power Good Output in SC70 Package Check for Samples: TPS797xx FEATURES DESCRIPTION • • • • • • The TPS797xx family of low-dropout (LDO) voltage regulators offers the benefits of low-dropout voltage and ultralow-power operation. The device is stable with any capacitor (> 0.47μF). Therefore, implementations of this device require very little board space due to the miniaturized packaging and potentially small output capacitor. In addition, the family includes an integrated open drain active-high power good (PG) output. Intended for use in microcontroller-based, battery-powered applications, the TPS797xx family low dropout and ultralowpowered operation results in a significant increase in system battery operating life. The small packaging minimizes consumption of board space. 1 2 • • 50mA Low-Dropout Regulator Ultralow 1.2μA Quiescent Current at 10mA 5-Pin SC70 (DCK) Package Integrated Power Good Output Stable With Any Capacitor (> 0.47μF) Dropout Voltage Typically 105mV at 10mA (TPS79733) Over-Current Limitation –40°C to +85°C Operating Junction Temperature Range APPLICATIONS • The device is enabled when the applied voltage exceeds the minimum input voltage. The usual PNP pass transistor has been replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the dropout voltage is very low, typically 105mV at 10mA of load current, and is directly proportional to the load current. The quiescent current is ultralow (1.2μA typically) and is stable over the entire range of output load current (0mA to 50mA). When properly configured with a pullup resistor, the PG output can be used to implement a power-on reset or low battery indicator. Battery-Powered Microcontrollers and Microprocessors 2.00 PG 1 GND NC 5 OUT 2 3 4 IN Ground Current (mA) DCK PACKAGE (Top View) VI = 4.3V VO = 3.3V CO = 1mF IO = 10mA 1.75 1.50 1.25 1.00 0.75 0.50 -40 -15 10 35 60 85 Free-Air Temperature (°C) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2012, Texas Instruments Incorporated TPS797xx SLVS332H – MARCH 2001 – REVISED APRIL 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT VOUT TPS797xx yy yz (1) (2) (2) XX is nominal output voltage (for example, 25 = 2.5V). YYY is package designator. Z is package quantity. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Output voltages from 1.25V to 4.9V in 50mV increments are available through the use of probe level programming; minimum order quantities may apply. Contact factory for details and availability. ABSOLUTE MAXIMUM RATINGS (1) Over operating junction temperature range, unless otherwise noted. Input voltage range (2) –0.3V to 6V Maximum dc output voltage 4.9V Peak output current Internally limited ESD rating, HBM 2kV ESD rating, CDM 500V Continuous total power dissipation See Dissipation Ratings Table Operating virtual junction temperature range, TJ –40°C to +85°C Storage temperature range, TSTG –65°C to +150°C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. PACKAGE DISSIPATION RATINGS BOARD PACKAGE RθJC °C/W RθJA °C/W DERATING FACTOR ABOVE TA = +25°C TA ≤ +25°C POWER RATING TA = +70°C POWER RATING TA = +85°C POWER RATING Low K (1) DCK 165.39 396.24 2.52mW/°C 252mW 139mW 101mW High K (2) DCK 165.39 314.74 3.18mW/°C 318mW 175mW 127mW (1) (2) 2 The JEDEC low K (1s) board design used to derive this data was a 3-inch × 3-inch, two layer board with 2 ounce copper traces on top of the board. The JEDEC high K (2s2p) board design used to derive this data was a 3-inch × 3-inch, multilayer board with 1 ounce internal power and ground planes and 2 ounce copper traces on top and bottom of the board. Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated TPS797xx www.ti.com SLVS332H – MARCH 2001 – REVISED APRIL 2012 ELECTRICAL CHARACTERISTICS Over operating temperature range TJ = –40°C to +85°C, VIN = VOUT (typ) +0.5V or 2.0V, whichever is greater; IOUT = 0.5mA, VSET, VEN = VIN, and COUT = 1.0μF, unless otherwise noted. Typical values are at TA = +25°C. TPS797xx PARAMETER VIN Input voltage (1) IOUT Continuous output current (2) TEST CONDITIONS IOUT = 3mA IOUT = 10mA MIN TYP MAX UNIT 1.8 5.5 2 5.5 0 50 mA –4 4 % V VOUT Output voltage accuracy (3) VOUT + 1V ≤ VIN ≤ 5.5V 1mA < IOUT < 10mA ΔVOUT% / ΔVIN Line regulation (3) VOUT + 1V ≤ VIN ≤ 5.5V ΔVOUT% / ΔIOUT Load regulation 1μA < IOUT < 10mA VDO Dropout voltage (4), IOUT = 10mA VIN = VOUT (NOM) – 0.1V TPS79730 110 200 TPS79733 105 200 ISC Output current limit VOUT = 0V 190 300 mA IGND Ground pin current (3) IOUT = 10mA 1.2 2 μA PSRR Power-supply rejection ratio (ripple rejection) f = 100Hz, COUT = 10μF, IOUT = 10mA 50 dB VN Output noise voltage (TPS79718) BW = 200kHz to 100kHz, COUT = 10μF, IOUT = 10mA 600 μVRMS VPG(MIN) Minimum input voltage for valid PG V(PG) ≥ 0.8V, IPG = 100μA 1.2 V VIT PG trip threshold voltage VOUT increasing 90 %/VOUT VPG,LO PG output low voltage VIN = 1.4V, IPG = 30μA, IOUT = 1mA IPG,LKG PG leakage current V(PG) = 5V, VIN = VOUT + 1.0V, IOUT = 1mA TJ Operating junction temperature, TJ (1) (2) (3) (4) 0.15 %/V 5 mV 0.14 mV 0.225 0.1 –40 V nA +85 °C Minimum VIN = VOUT + VDO or the minimum value specified here, whichever is greater. Continuous output current is limited by internal protection circuitry, but it is not recommended that the device operate above this maximum for extended periods of time. Minimum VIN is specified in note (1). VDO is not measured for the TPS79718 because minimum VIN > 1.7V. Copyright © 2001–2012, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS797xx SLVS332H – MARCH 2001 – REVISED APRIL 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM VIN VOUT Current Sense R1 ILIM GND R2 VREF = 1.235V VIN Bandgap Reference PG Table 1. TERMINAL FUNCTIONS TERMINAL NAME DESCRIPTION NO. GND 2 Ground NC 3 No connection OUT 5 The OUT terminal provides the regulated output voltage of the device. PG 1 The PG terminal for the fixed voltage option devices is an open drain, active-high output that indicates the status of VO (output of the LDO). When VO exceeds approximately 90% of the regulated voltage, PG goes to a high-impedance state. It goes to a low-impedance state when VO falls below approximately 90% (that is, overload condition) of the regulated voltage. The open drain output of the PG terminal requires a pull-up resistor. IN 4 The IN terminal is the power supply input to the device. 4 Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated TPS797xx www.ti.com SLVS332H – MARCH 2001 – REVISED APRIL 2012 TPS797xx PG Timing Diagram VIN VMIN (1) t VOUT Threshold Voltage (2) VIT+ (2) VIT- t PG Output t NOTES: (1) VMIN = VOUT + VDO. (2) The PG trip voltage is typically 10% lower than the output voltage (90% VO). VIT+ to VIT- is the hysteresis voltage. Copyright © 2001–2012, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS797xx SLVS332H – MARCH 2001 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs OUTPUT CURRENT 3.465 1.890 VIN = 4.3V COUT = 1mF TA = +25°C VOUT = 3.3V Output Voltage (V) 3.399 3.366 VIN = 2.8V COUT = 1mF TJ = +25°C VOUT = 1.8V 1.872 1.854 Output Voltage (V) 3.432 3.333 3.300 3.267 3.234 1.836 1.818 1.800 1.782 1.764 3.201 1.746 3.168 1.728 3.135 1.710 0 10 20 30 40 50 0 10 20 Output Current (mA) Figure 2. OUTPUT VOLTAGE vs JUNCTION TEMPERATURE OUTPUT VOLTAGE vs JUNCTION TEMPERATURE IO = 1mA 1.805 IO = 10mA 3.295 Output Voltage (V) Output Voltage (V) 50 1.810 VIN = 4.3V COUT = 1mF VOUT = 3.3V 3.290 3.285 VIN = 2.8V COUT = 1mF VOUT = 3.3V IO = 10mA 1.800 IO = 1mA 1.795 IO = 25mA 1.790 1.785 IO = 25mA 3.280 1.780 IO = 50mA IO = 50mA 1.775 3.275 -40 -15 10 35 Junction Temperature (°C) Figure 3. 6 40 Figure 1. 3.305 3.300 30 Output Current (mA) Submit Documentation Feedback 60 85 -40 -15 10 35 60 85 Junction Temperature (°C) Figure 4. Copyright © 2001–2012, Texas Instruments Incorporated TPS797xx www.ti.com SLVS332H – MARCH 2001 – REVISED APRIL 2012 TYPICAL CHARACTERISTICS (continued) 1.60 VIN = 4.3V VOUT = 3.3V COUT = 1mF Ground Current (mA) 1.50 1.40 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY Output Spectral Noise Density (nV/ÖHz) GROUND CURRENT vs JUNCTION TEMPERATURE IOUT = 50mA 1.30 1.20 IOUT = 25mA 1.10 1.00 IOUT = 10mA 0.90 0.80 10 -15 -40 35 60 10 VIN = 2.8V VOUT = 1.8V COUT = 1mF 8 IOUT = 10mA 6 IOUT = 1mA 4 2 0 1k 100 85 Figure 6. OUTPUT IMPEDANCE vs FREQUENCY DROPOUT VOLTAGE vs JUNCTION TEMPERATURE 700 VIN = 4.3V VOUT = 3.3V COUT = 1mF TJ = +25°C 30 VIN = 3.2V COUT = 1mF 600 Dropout Voltage (V) 35 Output Impednace (W) 100k Figure 5. 40 25 IOUT = 1mA 20 15 IOUT = 10mA 10 500 IOUT = 50mA 400 IOUT = 25mA 300 IOUT = 10mA 200 100 5 0 0 10 100 1k 10k 100k 1M 10M -40 Frequency (Hz) 20 35 50 POWER-UP/POWER-DOWN TPS79718 LINE TRANSIENT RESPONSE Output Voltage (mV) Input Voltage (V) VIN 4 3 VOUT 2 1 0 10 5 Figure 8. 5 0 -10 Figure 7. VOUT = 3.3V RLOAD = 330W 6 -25 20 30 40 50 60 65 80 Junction Temperature (°C) 7 Output Voltage (V) Input Voltage (V) 10k Frequency (Hz) Free-Air Temperature (°C) 70 80 90 100 IOUT = 10mA COUT = 4.7mF VOUT = 3.3V 5.3 4.3 dv 0.14V = dt ms 200 100 0 -100 -200 0 100 200 300 400 500 600 700 800 900 Time (ms) Time (ms) Figure 9. Figure 10. Copyright © 2001–2012, Texas Instruments Incorporated Submit Documentation Feedback 1k 7 TPS797xx SLVS332H – MARCH 2001 – REVISED APRIL 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) TPS79733 LINE TRANSIENT RESPONSE 100 Output Voltage (mV) Input Voltage (V) Change in Current Load (mA) Output Voltage (mV) TPS79718 LOAD TRANSIENT RESPONSE 50 0 -100 VIN = 2.8V VOUT = 1.8V COUT = 4.7mF -100 10 5 1mA 0 0 200 400 600 800 1k 12 14 16 18 IOUT = 10mA COUT = 4.7mF VOUT = 3.3V 5.3 4.3 dv 0.14V = dt ms 200 100 0 -100 -200 0 2k 100 200 300 400 500 600 700 800 900 1k Time (ms) Time (ms) Figure 11. Figure 12. VIN = 4.3V COUT = 4.7mF VOUT = 3.3V 100 50 Output Current (mA) 0 -50 -100 10 Change In Output Voltage (mV) TPS79733 LOAD TRANSIENT RESPONSE 5 1mA 0 0 200 400 600 800 1k 12 14 16 18 2k Time (ms) Figure 13. 8 Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated TPS797xx www.ti.com SLVS332H – MARCH 2001 – REVISED APRIL 2012 APPLICATION INFORMATION The TPS797xx family of low-dropout (LDO) regulators have been optimized for use in micropower applications. They feature extremely low dropout voltages and ultralow quiescent current (1.2μA typically). The maximum-power-dissipation limit is determined using the following equation: T max - TA PD(max) = J RqJA (1) A typical application circuit is shown in Figure 14. Where: TJmax is the temperature. TPS797xx 4 IN PG 100kW 5 - 3 C1 0.1mF allowable junction RθJA is the thermal resistance junction-to-ambient for the package (see Package Dissipation Ratings). 1 VOUT OUT + maximum NC GND 0.47mF 2 TA is the ambient temperature. The regulator dissipation is calculated using: PD = (VI - VO) x IO (2) Power dissipation resulting from quiescent current is negligible. Regulator Protection Figure 14. Typical Application Circuit External Capacitor Requirements Although not required, a 0.1μF or larger input bypass capacitor, connected between IN and GND and located close to the TPS797xx, is recommended, especially when a highly resistive power supply is powering the LDO in addition to other devices. Like all low-dropout regulators, the TPS797xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 0.47μF. Any 0.47μF capacitor is suitable. Capacitor values larger than 0.47μF are acceptable. Power Dissipation and Junction Temperature Specified regulator operation is assured to a junction temperature of +85°C; restrict the maximum junction temperature to +85°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(MAX), and the actual dissipation, PD, which must be less than or equal to PD(MAX). Copyright © 2001–2012, Texas Instruments Incorporated The TPS797xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (for example, during power down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS797xx features internal current limiting. During normal operation, the TPS797xx limits output current to approximately 190mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. Take care not to exceed the power dissipation ratings of the package. Microcontroller Application One application for which this device is particularly suited is providing a regulated input voltage and power good (PG) supervisory signal to low-power devices such as mixed-signal microcontrollers. The quiescent or ground current of the TPS797xx family is typically 1.2μA even at full load; therefore, the reduction in battery life by including the TPS797xx in the system is negligible. Submit Documentation Feedback 9 TPS797xx SLVS332H – MARCH 2001 – REVISED APRIL 2012 www.ti.com The primary benefits of using the TPS797xx to power low-power digital devices include: • Regulated output voltage that protects the device from battery droop and noise on the line (for example, switch bounce) • Smooth, monotonic power up • PG signal for controlled device RESET • Potential to use an existing 5V power rail to power a 3.3V or lower device • Potential to provide separate digital and analog power and ground supplies for a system with only VIN VOUT one power source Figure 15 shows an application in which the TPS79718 is used to power TI’s MSP430 mixed signal microcontroller. Minimal board space is needed to accommodate the DCK (SC70) packaged TPS79718, the 0.1μF output capacitor, the 0.47μF input capacitor, and the pull-up resistor on the PG pin. 1.8V VCC 0.47mF TPS79718 + MSP430 or Equivalent 0.1mF PG GND RESET VSS Figure 15. MSP430 Microcontroller Powered by the TPS79718 Regulator space REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (November 2009) to Revision H • Page Deleted sentence regarding thermal protection .................................................................................................................... 9 Changes from Revision F (May 2009) to Revision G Page • Changed document title ........................................................................................................................................................ 1 • Deleted references to SOT323 package throughout document ........................................................................................... 1 • Changed test conditions for Electrical Characteristics table ................................................................................................. 3 • Changed output voltage accuracy test conditions from 10μA < IOUT < 10mA to 1mA < IOUT < 10mA .................................. 3 • Deleted line regulation maximum specification ..................................................................................................................... 3 • Changed PG trip threshold voltage test conditions from VOUT decreasing to VOUT increasing; deleted minimum and maximum specifications ........................................................................................................................................................ 3 • Revised PG low output low voltage test conditions .............................................................................................................. 3 • Updated PG leakage current test conditions ........................................................................................................................ 3 10 Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 27-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TPS79718DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79718DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79718DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79718DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS797285DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS797285DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79730DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79730DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79730DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79730DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79733DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79733DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79733DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79733DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 27-Apr-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS79718, TPS79730, TPS79733 : • Automotive: TPS79718-Q1, TPS79730-Q1, TPS79733-Q1 • Enhanced Product: TPS79718-EP, TPS79730-EP, TPS79733-EP NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.25 2.4 1.22 4.0 8.0 Q3 TPS79718DCKR SC70 DCK 5 3000 180.0 8.4 TPS79718DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS79718DCKT SC70 DCK 5 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS79718DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS797285DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS797285DCKT SC70 DCK 5 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS79730DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS79730DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS79730DCKT SC70 DCK 5 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS79730DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS79733DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 TPS79733DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS79733DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 TPS79733DCKT SC70 DCK 5 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS79718DCKR SC70 DCK 5 3000 202.0 201.0 28.0 TPS79718DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TPS79718DCKT SC70 DCK 5 250 202.0 201.0 28.0 TPS79718DCKT SC70 DCK 5 250 180.0 180.0 18.0 TPS797285DCKR SC70 DCK 5 3000 202.0 201.0 28.0 TPS797285DCKT SC70 DCK 5 250 202.0 201.0 28.0 TPS79730DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TPS79730DCKR SC70 DCK 5 3000 202.0 201.0 28.0 TPS79730DCKT SC70 DCK 5 250 202.0 201.0 28.0 TPS79730DCKT SC70 DCK 5 250 180.0 180.0 18.0 TPS79733DCKR SC70 DCK 5 3000 202.0 201.0 28.0 TPS79733DCKR SC70 DCK 5 3000 180.0 180.0 18.0 TPS79733DCKT SC70 DCK 5 250 180.0 180.0 18.0 TPS79733DCKT SC70 DCK 5 250 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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