TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION FEATURES 1 • Available in the Texas Instruments NanoFree™ Package • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State • OE Input Circuit Referenced to VCCA • Low Power Consumption, 5-µA Max ICC • Ioff Supports Partial-Power-Down Mode Operation • 2 DBV PACKAGE (TOP VIEW) VCCA 1 6 • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – A Port – 2000-V Human-Body Model (A114-B) – 250-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – 15-kV Human-Body Model (A114-B) – 250-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) DCK PACKAGE (TOP VIEW) VCCA VCCB GND 2 5 OE A 3 4 B 1 6 DRL PACKAGE (TOP VIEW) VCCB GND 2 5 OE A 3 4 B VCCA GND A 1 2 3 6 5 4 VCCB OE B YZP PACKAGE (BOTTOM VIEW) A C1 3 4 C2 B GND VCCA B1 2 5 B2 A1 1 6 A2 OE VCCB See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2008, Texas Instruments Incorporated TXB0101 SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com ORDERING INFORMATION (1) –40°C to 85°C ORDERABLE PART NUMBER PACKAGE (2) TA NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 TXB0101YZPR (5) 27_ SOP – DRL Reel of 4000 TXB0101DRLR (5) 27R Reel of 3000 TXB0101DBVR NFC_ Reel of 250 TXB0101DBVT NFC_ Reel of 3000 TXB0101DCKR (5) 27_ (5) 27_ SOT (SOT-23) – DBV SOT (SC-70) – DCK (1) (2) (3) (4) (5) TOP-SIDE MARKING (3) (4) Reel of 250 TXB0101DCKT For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Package preview PIN DESCRIPTION NO. NAME 1 VCCA A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB FUNCTION 2 GND Ground 3 A Input/output A. Referenced to VCCA. 4 B Input/output B. Referenced to VCCB. 5 OE 6 VCCB 3-state output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V 1.8-V System Controller VCCA VCCB OE 3.3-V System TXB0101 Data GND 2 A B Data GND Submit Documentation Feedback GND Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range –0.5 4.6 VCCB Supply voltage range –0.5 6.5 VI Input voltage range (2) –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 UNIT V VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCCA, VCCB, or GND θJA Package thermal impedance (4) Tstg Storage temperature range DBV package 165 DCK package 259 DRL package 142 YZP package (1) (2) (3) (4) V °C/W 123 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) (2) VCCA VCCA VCCB Supply voltage VIH High-level input voltage VIL Low-level input voltage Δt/Δv Input transition rise or fall rate TA (1) (2) (3) VCCB MIN MAX 1.2 3.6 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65 (3) VCCI OE 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35 (3) OE 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.35 A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40 B-port inputs 1.2 V to 3.6 V 1.65 V to 3.6 V 40 4.5 V to 5.5 V 30 Operating free-air temperature –40 85 UNIT V V V ns/V °C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 3 TXB0101 SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com Electrical Characteristics (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA TA = 25°C VCCB MIN 1.2 V IOH = –20 µA VOLA IOL = 20 µA VOHB IOH = –20 µA 1.65 V to 5.5 V VOLB IOL = 20 µA 1.65 V to 5.5 V IOZ MIN 1.4 V to 3.6 V MAX 1.2 V 0.9 0.4 VCCB – 0.4 V V µA 1.65 V to 5.5 V ±1 ±2 A port 0V 0 V to 5.5 V ±1 ±2 B port 0 V to 3.6 V 0V ±1 ±2 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 3 3.6 V 0V 2 0V 5.5 V –2 OE = GND VI = VCCI or GND, IO = 0 ICCA 1.2 V 1.65 V to 5.5 V ICCB 1.4 V to 3.6 V 1.65 V to 5.5 V 5 3.6 V 0V –2 0V 5.5 V ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZA 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZB 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V Cio (1) (2) OE A port 1.2 V to 3.6 V B port µA µA 0.06 VI = VCCI or GND, IO = 0 Ci V 0.4 1.2 V to 3.6 V A or B port UNIT V VCCA – 0.4 1.4 V to 3.6 V OE Ioff –40°C to 85°C MAX 1.1 VOHA II TYP µA 3.4 µA 2 3.5 8 0.05 3 3.3 5 1.65 V to 5.5 V 2.5 3 5 6 11 13 µA µA µA pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Timing Requirements TA = 25°C, VCCA = 1.2 V Data rate tw Pulse duration Data inputs VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns UNIT Timing Requirements over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Data rate tw 4 Pulse duration MAX VCCB = 2.5 V ± 0.2 V MIN 40 Data inputs 25 Submit Documentation Feedback MAX VCCB = 3.3 V ± 0.3 V MIN 40 25 MAX VCCB = 5 V ± 0.5 V MIN 40 25 40 25 UNIT MAX Mbps ns Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN MAX Data rate tw VCCB = 2.5 V ± 0.2 V MIN MAX 60 Pulse duration Data inputs VCCB = 3.3 V ± 0.3 V MIN MAX 60 17 VCCB = 5 V ± 0.5 V MIN 60 17 60 17 UNIT MAX 17 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN MAX Data rate tw VCCB = 3.3 V ± 0.3 V MIN MAX 100 Pulse duration Data inputs VCCB = 5 V ± 0.5 V MIN 100 10 100 10 UNIT MAX 10 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 3.3 V ± 0.3 V MIN Data rate tw VCCB = 5 V ± 0.5 V MAX MIN 100 Pulse duration Data inputs 10 UNIT MAX 100 10 Mbps ns Switching Characteristics TA = 25°C, VCCA = 1.2 V FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP A B 6.9 5.7 5.3 5.5 B A 7.4 6.4 6 5.8 A 1 1 1 1 B 1 1 1 1 A 18 15 14 14 B 20 17 16 16 trA, tfA A-port rise and fall times 4.2 4.2 4.2 4.2 trB, tfB B-port rise and fall times 2.1 1.5 1.2 1.1 ns 20 20 20 20 Mbps PARAMETER tpd ten OE tdis OE Max data rate Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 UNIT ns µs ns ns 5 TXB0101 SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V ± 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.7 A 1 1 1 1 B 1 1 1 1 A 5.9 31 5.7 25.9 5.6 23 5.7 22.4 B 5.4 30.3 4.9 22.8 4.8 20 4.9 19.5 trA, tfA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 Max data rate 40 40 40 40 ns µs ns ns ns Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 A 1.5 12 1.3 8.4 1 7.6 0.9 7.1 A 1 1 1 1 B 1 1 1 1 A 5.9 31 5.1 21.3 5 19.3 5 17.4 B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3 ns µs ns trA, tfA A-port rise and fall times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns Max data rate 6 VCCB = 1.8 V ± 0.15 V 60 Submit Documentation Feedback 60 60 60 Mbps Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX B 1.1 A 1.2 VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX 6.3 1 5.2 0.9 4.7 6.6 1.1 5.1 0.9 4.4 A 1 1 1 B 1 1 1 A 5.1 21.3 4.6 15.2 4.6 13.2 B 4.4 20.8 3.8 16 3.9 13.9 0.8 3 0.8 3 0.8 3 0.7 3 0.5 2.8 0.4 2.7 trA, tfA A-port rise and fall times trB, tfB B-port rise and fall times Max data rate 100 100 100 ns µs ns ns ns Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX B 0.9 4.7 0.8 4 A 1 4.9 0.9 4.5 A 1 1 B 1 1 A 4.6 15.2 4.3 12.1 B 3.8 16 3.4 13.2 ns µs ns trA, tfA A-port rise and fall times 0.7 2.5 0.7 2.5 ns trB, tfB B-port rise and fall times 0.5 2.3 0.4 2.7 ns Max data rate 100 100 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 Mbps 7 TXB0101 SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com Operating Characteristics TA = 25°C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.3 V to 5V VCCB PARAMETER TEST CONDITIONS 5V CpdA CpdB CpdA CpdB 8 A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 1.8 V 1.8 V 1.8 V UNIT TYP TYP TYP TYP TYP TYP 7.8 8 8 7 7 8 TYP 8 12 11 11 11 11 11 11 38.1 28 29 29 29 29 30 25.4 18 17 17 18 20 21 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.01 0.01 0.01 0.01 0.01 0.01 0.03 Submit Documentation Feedback pF pF Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 PRINCIPLES OF OPERATION Applications The TXB0101 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0101 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V, and 40 Ω at VCCO = 3.3 V to 5 V. VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 1. Architecture of TXB0101 I/O Cell Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 9 TXB0101 SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0101 are shown in Figure 2. For proper operation, the device driving the data I/Os of the TXB0101 must have drive strength of at least ±2 mA. IIN VT/4 kΩ VIN –(VD – VT)/4 kΩ A. VT is the input threshold voltage of the TXB0101 (typically VCCI/2. B. VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0101 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). Enable and Disable The TXB0101 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs are actually disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines The TXB0101 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0101 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0101. For the same reason, the TXB0101 should not be used in applications such as I2C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. 10 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 TXB0101 www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008 PARAMETER MEASUREMENT INFORMATION 2 × VCCO From Output Under Test 15 pF 1 MW Open 50 kW 15 pF TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 50 kW From Output Under Test S1 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.1 y VCCO VOH tf tr VCCI VCCO/2 VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuits and Voltage Waveforms Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101 11 PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TXB0101DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLTG4 ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2008 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ TXB0101DBVR SOT-23 3000 180.0 9.2 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 TXB0101DBVT SOT-23 DBV 6 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 TXB0101DCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TXB0101DCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TXB0101DRLR SOT DRL 6 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3 TXB0101DRLT SOT DRL 6 250 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3 TXB0101YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0101DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0 TXB0101DBVT SOT-23 DBV 6 250 202.0 201.0 28.0 TXB0101DCKR SC70 DCK 6 3000 195.0 200.0 45.0 TXB0101DCKT SC70 DCK 6 250 195.0 200.0 45.0 TXB0101DRLR SOT DRL 6 4000 202.0 201.0 28.0 TXB0101DRLT SOT DRL 6 250 202.0 201.0 28.0 TXB0101YZPR DSBGA YZP 6 3000 220.0 220.0 34.0 Pack Materials-Page 2 D: Max = 918 µm, Min = 858 µm E: Max = 1418 µm, Min = 1358 µm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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