TN8, TS8 and TYNx08 Series ® 8A SCRS SENSITIVE & STANDARD Table 1: Main Features A Symbol Value Unit IT(RMS) 8 A VDRM/VRRM 600 to 1000 V IGT 0.2 to 15 mA G K A A K A G DESCRIPTION Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits... Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area. K DPAK (TN8-B / TS8-B) G IPAK (TN8-H / TS8-H) A K A TO-220AB (TS8-T) REV. 5 A K G Table 2: Order Codes Part Numbers February 2006 A A G TO-220AB (TYNx08RG) Marking TN805-x00B TN805x00 TN805-x00B-TR TN805x00 TN805-x00H TN805x00 TN815-x00B TN815x00 TN815-x00B-TR TN815x00 TN815-x00H TN815x00 TS820-x00B TS820x00 TS820-x00B-TR TS820x00 TS820-x00H TS820x00 TS820-x00T TS820x00T TYNx08RG TYNx08 1/10 TN8, TS8 and TYNx08 Series Table 3: Absolute Ratings (limiting values) Symbol Value Parameter TS8/TN8 TYN08 IT(RMS) RMS on-state current (180° conduction angle) Tc = 110°C 8 IT(AV) Average on-state current (180° conduction angle) Tc = 110°C 5 ITSM Non repetitive surge peak onstate current tp = 10 ms I²t Value for fusing tp = 10 ms I²t tp = 8.3 ms Tj = 25°C Tj = 25°C Unit A A 73 100 70 95 A 24.5 45 A 2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125°C 4 A Tj = 125°C 1 W - 40 to + 150 - 40 to + 125 °C 5 V PG(AV) Tstg Tj VRGM Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage (for TN8 & TYN08 only) Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SENSITIVE Symbol IGT VGT Test Conditions RL = 140 Ω VD = 12 V RL = 3.3 kΩ RGK = 220 Ω Unit MAX. 200 µA MAX. 0.8 V MIN. 0.1 V MIN. 8 V VGD VD = VDRM VRG IRG = 10 µA IH IT = 50 mA RGK = 1 kΩ MAX. 5 mA IL IG = 1 mA RGK = 1 kΩ MAX. 6 mA Tj = 125°C MIN. 5 V/µs Tj = 25°C MAX. 1.6 V RGK = 220 Ω Tj = 125°C TS820 dV/dt VD = 65 % VDRM VTM ITM = 16 A Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V Rd Dynamic resistance Tj = 125°C MAX. 46 mΩ 5 µA 1 mA IDRM IRRM 2/10 tp = 380 µs VDRM = VRRM RGK = 220 Ω Tj = 25°C Tj = 125°C MAX. TN8, TS8 and TYNx08 Series STANDARD ■ Symbol Test Conditions IGT TN805 RL = 33 Ω VD = 12 V VGT VGD VD = VDRM RL = 3.3 kΩ IH IT = 100 mA Gate open IL IG = 1.2 IGT dV/dt VD = 67 % VDRM VTM ITM = 16 A Vt0 Rd IDRM IRRM MIN. 0.5 2 2 MAX. 5 15 15 Unit mA MAX. 1.3 V MIN. 0.2 V Tj = 125°C MAX. 25 40 30 mA MAX. 30 50 70 mA MIN. 50 150 150 V/µs Gate open Tj =125°C tp = 380 µs TN815 TYNx08 Tj = 25°C MAX. 1.6 V Threshold voltage Tj = 125°C MAX. 0.85 V Dynamic resistance Tj = 125°C MAX. 46 mΩ 5 µA 2 mA Tj = 25°C VDRM = VRRM MAX. Tj = 125°C Table 6: Thermal resistance Symbol Rth(j-c) Parameter Junction to case (D.C.) S = 0.5 cm² Rth(j-a) Junction to ambient (D.C.) Value Unit 20 °C/W DPAK 70 IPAK 100 TO-220AB 60 °C/W S = Copper surface under tab. Figure 1: Maximum average power dissipation versus average on-state current Figure 2: Average and D.C. on-state current versus case temperature P(W) IT(AV)(A) 8 10.0 D.C. 9.0 α = 180° 7 8.0 6 7.0 5 6.0 4 α = 180° 5.0 4.0 3 360° 3.0 2 2.0 1 α IT(AV)(A) 1.0 Tcase(°C) 0.0 0 0 1 2 3 4 5 6 0 25 50 75 100 125 3/10 TN8, TS8 and TYNx08 Series Figure 3: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK) Figure 4: Relative variation of thermal impedance junction to case versus pulse duration IT(AV)(A) K=[Zth(j-c)/Rth(j-c)] 2.0 1.0 1.8 1.6 D.C. 1.4 0.5 1.2 α = 180° 1.0 0.8 0.2 0.6 0.4 0.2 tp(s) Tamb(°C) 0.1 0.0 0 25 50 75 100 1E-3 125 Figure 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK) 1E-2 1E+0 1E-1 Figure 6: Relative variation of gate trigger current and holding current versus junction temperature for TS8 series K=[Zth(j-a)/Rth(j-a)] IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 1.00 2.0 1.8 IGT 1.6 1.4 DPAK 1.2 IH & IL RGK = 1kΩ 1.0 0.10 0.8 TO-220AB / IPAK 0.6 0.4 0.2 tp(s) Tj(°C) 0.0 0.01 1E-2 1E+0 1E-1 1E+1 1E+2 -40 5E+2 Figure 7: Relative variation of gate trigger current and holding current versus junction temperature for TN8 & TYN08 series -20 0 20 40 60 80 120 140 Figure 8: Relative variation of holding current versus gate-cathode resistance (typical values) for TS8 series IH[RGK] / IH[RGK=1kΩ] IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 6.0 2.4 Tj = 25°C 5.5 2.2 5.0 IGT 2.0 100 1.8 4.5 1.6 4.0 3.5 1.4 1.2 3.0 IH & IL 1.0 2.5 0.8 2.0 0.6 1.5 0.4 1.0 Tj(°C) 0.2 -40 4/10 -20 0 20 40 RGK(kΩ) 0.5 0.0 60 80 100 120 140 0.0 1E-2 1E-1 1E+0 1E+1 TN8, TS8 and TYNx08 Series Figure 9: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) for TS8 series Figure 10: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS8 series dV/dt[RGK] / dV/dt[RGK=220Ω] dV/dt[CGK] / dV/dt[RGK=220Ω] 10.00 15.0 Tj = 125°C VD = 0.67 x VDRM VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω 12.5 10.0 1.00 7.5 5.0 0.10 2.5 RGK(kΩ) CGK(nF) 0.0 0.01 0 200 400 600 800 1000 1200 1400 1600 1800 0 2000 Figure 11: Surge peak on-state current versus number of cycles 20 40 60 80 100 120 140 160 180 200 220 Figure 12: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t ITSM(A) 2 2 ITSM(A), I t (A s) 100 1000 Tj initial = 25°C 90 80 tp=10ms TYN08 ITSM One cycle 70 TYN08 Non repetitive Tj initial=25°C 60 dI/dt limitation TN8 / TS8 50 TN8 / TS8 100 40 TYN08 30 Repetitive TC=110°C 20 I2t TN8 / TS8 10 tp(ms) Number of cycles 0 10 10 1 100 1000 Figure 13: On-state characteristics (maximum values) 0.01 0.10 1.00 10.00 Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35µm) (DPAK) Rth(j-a)(°C/W) ITM(A) 100 50.0 Tj max.: Vt0=0.85V Rd=46mΩ 80 10.0 Tj=max 60 40 1.0 Tj=25°C 20 S(cm²) VTM(V) 0.1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 14 16 18 20 5/10 TN8, TS8 and TYNx08 Series Figure 17: Ordering Information Scheme (TN8 series) TN 8 05 - 600 B (-TR) Standard SCR series Current 8 = 8A Sensitivity 05 = 5mA 15 = 15mA Voltage 600 = 600V 800 = 800V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel Figure 18: Ordering Information Scheme (TS8 series) TS 8 20 - 600 B (-TR) Sensitive SCR series Current 8 = 8A Sensitivity 20 = 200µA Voltage 600 = 600V 700 = 700V Package B = DPAK H = IPAK T = TO-220AB Packing mode Blanck = Tube -TR = Tape & Reel Figure 19: Ordering Information Scheme (TYN08 series) TYN Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 8 = 8A Packing mode RG = Tube 6/10 6 08 RG TN8, TS8 and TYNx08 Series Table 7: Product Selector Voltage (xxx) Part Numbers 600 V 700 V 800 V 1000 V Sensitivity Package TN805-xxxB X X 5 mA DPAK TN805-xxxH X X 5 mA IPAK TN815-xxxB X X 15 mA DPAK TN815-xxxH X X 15 mA IPAK TS820-xxxB X X 0.2 mA DPAK TS820-xxxH X X 0.2 mA IPAK TS820-xxxT X X 0.2 mA TO-220AB TYNx08RG X 15 mA TO-220AB X X Figure 20: DPAK Package Mechanical Data REF. E A B2 C2 L2 D R H L4 A1 B R G C A2 0.60 MIN. V2 A A1 A2 B B2 C C2 D E G H L2 L4 V2 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0° 8° 0° 8° Figure 21: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/10 TN8, TS8 and TYNx08 Series Figure 22: IPAK Package Mechanical Data REF. A E C2 B2 L2 D H L B3 L1 A1 B V1 B5 e C A3 G A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10° 10° Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039 Figure 23: TO-220AB Package Mechanical Data REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G 8/10 A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 TN8, TS8 and TYNx08 Series Figure 24: TO-220AB Package Mechanical Data REF. C B ØI b2 L F A I4 l3 c2 a1 l2 a2 M c1 b1 e A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type TN805-x00B TN805-x00B-TR TN805-x00H TN815-x00B TN815-x00B-TR TN815-x00H TS820-x00B TS820-x00B-TR TS820-x00H TS820-x00T TYNx08RG Marking TN805x00 TN805x00 TN805x00 TN815x00 TN815x00 TN815x00 TS820x00 TS820x00 TS820x00 TS820x00T TYNx08 Package DPAK DPAK IPAK DPAK DPAK IPAK DPAK DPAK IPAK TO-220AB TO-220AB Weight 0.3 g 0.3 g 0.4 g 0.3 g 0.3 g 0.4 g 0.3 g 0.3 g 0.4 g 2.3 g 2.3 g Base qty 75 2500 75 75 2500 75 75 2500 75 50 50 Delivery mode Tube Tape & reel Tube Tube Tape & reel Tube Tube Tape & reel Tube Tube Tube Note: x = voltage Table 9: Revision History Date Revision Apr-2002 4A 13-Feb-2006 5 Description of Changes Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 9/10 TN8, TS8 and TYNx08 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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