BTA/BTB08 and T8 Series 8A TRIACS SNUBBERLESS , LOGIC LEVEL & STANDARD MAIN FEATURES: A2 Symbol Value Unit IT(RMS) 8 A V DRM/VRRM IGT (Q ) 1 600 and 800 5 to 50 A2 A2 G A1 V A1 A2 A2 G A1 G D2PAK (T8-G) DPAK (T8-B) mA A2 DESCRIPTION Available either in through-hole or surface-mount packages, the BTA/BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734) A1 A2 G IPAK (T8-H) A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA08) TO-220AB (BTB08) ABSOLUTE MAXIMUM RATINGS Symbol IT(RMS) ITSM It Parameter RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25°C) I t Value for fusing Value Unit A DPAK / D PAK IPAK / TO-220AB Tc = 110°C TO-220AB Ins. Tc = 100°C F = 50 Hz t = 20 ms 80 F = 60 Hz t = 16.7 ms 84 8 tp = 10 ms A 45 As dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125°C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125°C 4 A Tj = 125°C 1 W - 40 to + 150 - 40 to + 125 °C PG(AV) Tstg Tj Average gate power dissipation Storage junction temperature range Operating junction temperature range September 2000 - Ed: 3 1/10 BTA/BTB08 and T8 Series ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS and LOGIC LEVEL (3 Quadrants) Symbol IGT (1) V GT Test Conditions Quadrant RL = 30 Ω VD = 12 V VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C IH (2) IT = 100 mA IL IG = 1.2 IGT T8 T835 TW SW CW BW 10 35 5 10 35 50 I - II - III MAX. I - II - III MAX. 1.3 I - II - III MIN. 0.2 I - III (dI/dt)c (2) ■ Unit T810 mA V V MAX. 15 35 10 15 35 50 mA MAX. 25 50 10 25 50 70 mA 30 60 15 30 60 80 II dV/dt (2) BTA/BTB08 VD = 67 %VDRM gate open Tj = 125°C MIN. 40 400 20 40 400 1000 V/µs (dV/dt)c = 0.1 V/µs Tj = 125°C MIN. 5.4 - 3.5 5.4 - - A/ms (dV/dt)c = 10 V/µs Tj = 125°C 2.8 - 1.5 2.8 - - Without snubber Tj = 125°C - 4.5 - - 4.5 7 STANDARD (4 Quadrants) Symbol Test Conditions IGT (1) V D = 12 V Quadrant RL = 30 Ω VGT VGD V D = VDRM RL = 3.3 kΩ Tj = 125°C IH (2) IT = 500 mA IL IG = 1.2 IGT BTA/BTB08 25 50 50 100 Unit MAX. ALL MAX. 1.3 V ALL MIN. 0.2 V I - III - IV V D = 67 %VDRM gate open Tj = 125°C (dV/dt)c (2) (dI/dt)c = 3.5 A/ms B I - II - III IV Tj = 125°C mA MAX. 25 50 mA MAX. 40 50 mA 80 100 MIN. 200 400 V/µs MIN. 5 10 V/µs Value Unit MAX. 1.55 V II dV/dt (2) C STATIC CHARACTERISTICS Symbol VTM (2) Test Conditions ITM = 11 A tp = 380 µs Tj = 25°C Vto (2) Threshold voltage Tj = 125°C MAX. 0.85 V Rd (2) Dynamic resistance Tj = 125°C MAX. 50 mΩ I DRM VDRM = VRRM Tj = 25°C 5 µA 1 mA I RRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1 2/10 Tj = 125°C MAX. BTA/BTB08 and T8 Series THERMAL RESISTANCES Symbol Parameter Junction to case (AC) Rth(j-c) R th(j-a) Junction to ambient Value DPAK / D PAK IPAK / TO-220AB 1.6 TO-220AB Insulated 2.5 S = 1 cm D PAK 45 S = 0.5 cm DPAK 70 TO-220AB TO-220AB Insulated 60 IPAK 100 Unit °C/W °C/W S = Copper surface under tab PRODUCT SELECTOR Voltage (xxx) Sensitivity Type Package X 50 mA Standard TO-220AB X X 50 mA Snubberless TO-220AB BTA/BTB08-xxxC X X 25 mA Standard TO-220AB BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB BTA/BTB08-xxxTW X X 5 mA Logic level TO-220AB T810-xxxB X X 10 mA Logic level DPAK T810-xxxH X X 10 mA Logic level IPAK T835-xxxB X X 35mA Snubberless DPAK T835-xxxG X X 35 mA Snubberless D PAK T835-xxxH X X 35 mA Snubberless IPAK Part Number 600 V 800 V BTA/BTB08-xxxB X BTA/BTB108-xxxBW BTB: non insulated TO-220AB package 3/10 BTA/BTB08 and T8 Series ORDERING INFORMATION BT A 08 - 600 BW TRIAC SERIES INSULATION: A: insulated B: non insulated SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS C: 25mA STANDARD CW: 35mA SNUBBERLESS SW: 10mA LOGIC LEVEL TW: 5mA LOGIC LEVEL VOLTAGE: 600: 600V 800: 800V CURRENT: 8A T 8 10 - 600 B (-TR) TRIAC SERIES CURRENT: 8A VOLTAGE: 600: 600V 800: 800V PACKAGE: B: DPAK G: D2PAK H: IPAK SENSITIVITY: 10: 10mA 35: 35mA PACKING MODE: Blank: Tube -TR: DPAK / D2 PAK Tape & Reel OTHER INFORMATION Part Number Marking Weight Base quantity Packing mode BTA/BTB08-xxxyz BTA/BTB08xxxyz 2.3 g 250 Bulk T8yy-xxxB T8yyxxx 0.3 g 75 Tube T8yy-xxxB-TR T8yyxxx 0.3 g 2500 Tape & reel T8yy-xxxH T8yyxxx 0.4 g 75 Tube T8yy-xxxG T8yyxxx 1.5 g 50 Tube T8yy-xxxG-TR T8yyxxx 1.5 g 1000 Tape & reel Note: xxx = voltage, yy = sensitivity, z = type 4/10 BTA/BTB08 and T8 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). Fig. 2-1: RMS on-state current versus case temperature (full cycle). P (W) 10 9 8 7 6 5 4 3 2 1 0 IT(RMS) (A) IT(RMS)(A) 0 1 2 3 4 5 6 7 8 Fig. 2-2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm),full cycle. 10 9 8 7 6 5 4 3 2 1 0 BTB/T8 BTA Tc(°C) 0 25 50 75 100 125 Fig. 3: Relative variation of thermal impedance versus pulse duration. IT(RMS) (A) K=[Zth/Rth] 3.5 1E+0 Zth(j-c) 3.0 D2PAK (S=1cm2 ) DPAK/IPAK Zth(j-a) 2.5 1E-1 DPAK (S=0.5cm 2 ) 2.0 TO-220AB/D PAK Zth(j-a) 1.5 1E-2 1.0 0.5 0.0 Tamb(°C) 0 25 Fig. 4: values). 50 On-state 75 100 characteristics 125 (maximum 1E-1 1E+0 1E+1 1E+2 5E+2 ITSM (A) Tj=Tj max Tj max. Vto = 0.85 V Rd = 50 mΩ 10 Tj=25°C VTM(V) 1.0 1E-2 Fig. 5: Surge peak on-state current versus number of cycles. ITM (A) 100 1 0.5 tp(s) 1E-3 1E-3 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 90 80 70 60 50 40 30 20 10 0 t=20ms One cycle Non repetitive Tj initial=25°C Repetitive Tc=100°C Number of cycles 1 10 100 1000 5/10 BTA/BTB08 and T8 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I t. Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C] ITSM (A),I t (A s) 2.5 1000 Tj initial=25°C 2.0 IGT dI/dt limitation: 50A/µs ITSM 1.5 100 IH & IL 1.0 It 0.5 tp (ms) 10 0.01 0.10 Tj(°C) 1.00 10.00 Fig. 8-1: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Snubberless & Logic Level Types (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.2 2.0 TW 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 (dV/dt)c (V/µs) 0.2 0.0 0.1 1.0 10.0 0.0 -40 120 140 1.2 1.0 T810/SW 0.8 0.6 100.0 (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 100.0 Fig. 10: DPAK and D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm). Rth(j-a) (°C/W) 2 Tj(°C) 6/10 100 B 1.4 T835/CW/BW 3 75 80 C 1.6 4 50 60 1.8 5 25 40 Fig. 8-2: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Standard Types (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 0 20 (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 6 0 0 2.0 Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. 1 -20 100 125 100 90 80 70 60 50 40 30 20 10 0 DPAK D PAK S(cm ) 0 4 8 12 16 20 24 28 32 36 40 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA DPAK (Plastic) DIMENSIONS REF. Millimeters Min. R R A A1 A2 B B2 C C2 D E G H L2 L4 R V2 Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0.2 typ. 0° 8° Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0.007 typ. 0° 8° FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic) 6.7 6.7 3 3 1.6 1.6 2.3 2.3 7/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA D PAK (Plastic) DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE V2 FOOTPRINT DIMENSIONS (in millimeters) D PAK (Plastic) 16.90 10.30 5.08 1.30 3.70 8.90 8/10 Millimeters A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 Typ. Inches Max. Min. 4.60 2.69 0.23 0.93 1.40 0.169 0.098 0.001 0.027 0.048 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 0.40 0° Typ. Max. 0.181 0.106 0.009 0.037 0.055 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8° 0° 8° BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA IPAK (Plastic) DIMENSIONS REF. Millimeters Min. A E C2 B2 L2 D H L L1 B3 B6 B A1 V1 B5 G C A3 A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 Typ. 2.2 0.9 0.7 0.64 5.2 Inches Max. Min. 2.4 1.1 1.3 0.9 5.4 0.85 0.086 0.035 0.027 0.025 0.204 0.3 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10° Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.035 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10° 9/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA TO-220AB Ins. DIMENSIONS B REF. C Millimeters Inches b2 Min. L F I A l4 c2 a1 l3 l2 a2 b1 M c1 e Typ. Max. Min. A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 15.20 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.80 16.40 2.65 1.14 14.00 10.40 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 16.80 2.95 1.70 0.511 0.393 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.622 0.104 0.044 l3 M 1.14 1.70 0.044 Typ. 15.90 0.598 3.75 Max. 0.625 0.147 2.60 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.646 0.661 0.116 0.066 0.066 0.102 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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