TI ULN2003A

 The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
D 500-mA-Rated Collector Current
D
D
D
D
ULN2001A . . . D OR N PACKAGE
ULN2002A . . . N PACKAGE
ULN2003A . . . D, N, NS, OR PW PACKAGE
ULN2004A . . . D, N, OR NS PACKAGE
ULQ2003A, ULQ2004A . . . D OR N PACKAGE
(TOP VIEW)
(Single Output)
High-Voltage Outputs . . . 50 V
Output Clamp Diodes
Inputs Compatible With Various Types of
Logic
Relay-Driver Applications
1B
2B
3B
4B
5B
6B
7B
E
description/ordering information
1
16
2
15
3
14
4
13
5
12
1C
2C
3C
4C
5C
6C
7C
COM
The ULN2001A, ULN2002A, ULN2003A,
11
6
ULN2004A, ULQ2003A, and ULQ2004A are
10
7
high-voltage, high-current Darlington transistor
9
8
arrays. Each consists of seven npn Darlington
pairs that feature high-voltage outputs
with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single
Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications
include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and
logic buffers. For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the
SN75468 and SN75469, respectively.
ORDERING INFORMATION
PDIP (N)
−20°C
−20
C to 70
70°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
Tube of 25
SOIC (D)
SOP (NS)
TSSOP (PW)
PDIP (N)
−40°C to 85°C
SOIC (D)
ULN2002AN
ULN2002AN
ULN2003AN
ULN2003AN
ULN2004AN
ULN2004AN
Tube of 40
ULN2003AD
Reel of 2500
ULN2003ADR
Tube of 40
ULN2004AD
Reel of 2500
ULN2004ADR
Reel of 2000
TOP-SIDE
MARKING
ULN2003A
ULN2004A
ULN2003ANSR
ULN2003A
ULN2004ANSR
ULN2004A
Tube of 90
ULN2003APW
Reel of 2000
ULN2003APWR
UN2003A
ULQ2003AN
ULQ2003A
ULQ2004AN
ULQ2004AN
Tube of 40
ULQ2003AD
ULQ2003A
Reel of 2500
ULQ2003ADR
ULQ2003A
Tube of 40
ULQ2004AD
ULQ2004A
Reel of 2500
ULQ2004ADR
Tube of 25
ULQ2004A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
description/ordering information (continued)
The ULN2001A is a general-purpose array and can be used with TTL and CMOS technologies. The ULN2002A
is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a Zener diode
and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have a 2.7-kΩ
series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The
ULN2004A and ULQ2004A have a 10.5-kΩ series base resistor to allow operation directly from CMOS devices
that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the
ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A.
logic diagram
9
1B
2B
3B
4B
5B
6B
7B
2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
POST OFFICE BOX 655303
COM
1C
2C
3C
4C
5C
6C
7C
• DALLAS, TEXAS 75265
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
schematics (each Darlington pair)
COM
COM
Output
C
Input
B
Output
C
7V
Input
B
10.5 kΩ
7.2 kΩ
E
7.2 kΩ
3 kΩ
3 kΩ
ULN2001A
E
ULN2002A
COM
Input
B
ULN/ULQ2003A: RB = 2.7 kΩ
ULN/ULQ2004A: RB = 10.5 kΩ
Output
C
RB
7.2 kΩ
3 kΩ
E
ULN2003A, ULN2004A, ULQ2003A, ULQ2004A
All resistor values shown are nominal.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
absolute maximum ratings at 25°C free-air temperature (unless otherwise noted)†
Collector-emitter voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
Clamp diode reverse voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
Peak collector current (see Figures 14 and 15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA
Output clamp current, IOK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA
Total emitter-terminal current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −2.5 A
Operating free-air temperature range, TA, ULN200xA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20°C to 70°C
ULQ200xA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
ULQ200xAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 105°C
Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Package thermal impedance, θJC (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with MIL-STD-883.
electrical characteristics, TA = 25°C (unless otherwise noted)
PARAMETER
TEST
FIGURE
ULN2001A
TEST CONDITIONS
VI(on)
On-state input voltage
6
IC = 300 mA
IC = 100 mA
VCE(sat)
Collector-emitter
saturation voltage
VCE = 2 V,
II = 250 µA,
5
II = 350 µA,
II = 500 µA,
IC = 200 mA
IC = 350 mA
VF
Clamp forward voltage
8
1
ICEX
Collector cutoff current
2
VCE = 50 V,
TA = 70°C
VCE = 50 V,
TA = 70°C
II(off)
Off-state input current
3
II
Input current
4
IR
Clamp reverse current
7
hFE
Static forward-current
transfer ratio
5
Ci
Input capacitance
4
IF = 350 mA
VCE = 50 V,
VI = 17 V
VR = 50 V,
MIN
TYP
MIN
TYP
0.9
1.1
0.9
1.1
1
1.3
1
1.3
1.2
1.6
1.2
1.6
2
1.7
1.7
50
100
100
50
65
50
VR = 50 V
VI = 0,
f = 1 MHz
POST OFFICE BOX 655303
V
V
V
µA
A
µA
65
0.82
IC = 350 mA
2
50
UNIT
500
TA = 70°C
VCE = 2 V,
MAX
13
II = 0
II = 0
VI = 6 V
IC = 500 µA,
ULN2002A
MAX
1.25
100
100
50
50
mA
µA
A
1000
• DALLAS, TEXAS 75265
15
25
15
25
pF
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
electrical characteristics, TA = 25°C (unless otherwise noted) (continued)
PARAMETER
TEST
FIGURE
ULN2003A
TEST CONDITIONS
MIN
TYP
IC = 125 mA
IC = 200 mA
VI(on)
VCE(sat)
ICEX
On-state input voltage
Collector-emitter
saturation voltage
Collector cutoff current
6
VCE = 2 V
MAX
IC = 250 mA
IC = 275 mA
2.7
IC = 300 mA
IC = 350 mA
3
6
7
1.1
5
1
1.3
1
1.3
IC = 350 mA
II = 0
1.2
1.6
1.2
1.6
1
II = 500 µA,
VCE = 50 V,
2
VCE = 50 V,
TA = 70°C
II = 0
VI = 1 V
Off-state input current
3
VCE = 50 V,
TA = 70°C
II
Input current
4
7
50
VI = 3.85 V
VI = 5 V
0.93
TA = 70°C
f = 1 MHz
POST OFFICE BOX 655303
50
100
100
• DALLAS, TEXAS 75265
2
65
VI = 12 V
VR = 50 V
VR = 50 V,
VI = 0,
50
V
µA
500
1.7
IC = 500 µA,
V
8
0.9
II(off)
UNIT
5
2.4
1.1
IF = 350 mA
Input capacitance
TYP
0.9
8
Ci
MIN
IC = 100 mA
IC = 200 mA
Clamp forward voltage
Clamp reverse current
MAX
II = 250 µA,
II = 350 µA,
VF
IR
ULN2004A
15
1.7
50
2
V
µA
A
65
1.35
0.35
0.5
1
1.45
50
50
100
100
25
15
25
mA
A
µA
pF
5
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
electrical characteristics over recommended operating conditions (unless otherwise noted)
ULQ2003A
TEST
FIGURE
PARAMETER
TEST CONDITIONS
MIN
TYP
ULQ2004A
MAX
IC = 125 mA
IC = 200 mA
VI(on)
On-state input voltage
VCE(sat)
ICEX
Collector-emitter
saturation voltage
Collector cutoff current
6
VCE = 2 V
3
1
1.4
1
1.3
IC = 350 mA
II = 0
1.2
1.7
1.2
1.6
1
II = 500 µA,
VCE = 50 V,
2
VCE = 50 V
II = 0
VI = 1 V
VCE = 50 V,
VI = 3.85 V
100
7
V
50
100
µA
500
1.7
A
IC = 500 µA
2.3
65
0.93
1.7
50
VR = 50 V,
VR = 50 V
TA = 25°C
VI = 0,
f = 1 MHz
2
V
A
µA
65
1.35
VI = 5 V
VI = 12 V
4
V
8
5
3
Input capacitance
IC = 300 mA
IC = 350 mA
7
1.1
Off-state input current
Ci
2.9
0.9
II(off)
Clamp reverse current
IC = 250 mA
IC = 275 mA
6
1.2
IF = 350 mA
UNIT
5
2.7
0.9
8
IR
MAX
IC = 100 mA
IC = 200 mA
Clamp forward voltage
Input current
TYP
II = 250 µA,
II = 350 µA,
VF
II
MIN
15
0.35
0.5
1
1.45
100
50
100
100
25
15
25
mA
µA
A
pF
switching characteristics, TA = 25°C
PARAMETER
TEST CONDITIONS
ULN2001A, ULN2002A,
ULN2003A, ULN2004A
MIN
tPLH
tPHL
VOH
Propagation delay time, low- to high-level output
See Figure 9
Propagation delay time, high- to low-level output
See Figure 9
High-level output voltage after switching
VS = 50 V,
See Figure 10
IO ≈ 300 mA,
UNIT
TYP
MAX
0.25
1
µs
0.25
1
µs
VS−20
mV
switching characteristics over recommended operating conditions (unless otherwise noted)
ULQ2003A, ULQ2004A
PARAMETER
tPLH
tPHL
VOH
6
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Propagation delay time, low- to high-level output
See Figure 9
1
10
µs
Propagation delay time, high- to low-level output
See Figure 9
1
10
µs
High-level output voltage after switching
VS = 50 V,
See Figure 10
POST OFFICE BOX 655303
IO ≈ 300 mA,
• DALLAS, TEXAS 75265
VS−500
mV
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
Open
Open
VCE
ICEX
VCE
ICEX
Open
VI
Figure 1. ICEX Test Circuit
Open
Figure 2. ICEX Test Circuit
VCE
Open
II(off)
IC
II(on)
Open
VI
Figure 3. II(off) Test Circuit
Figure 4. II Test Circuit
Open
Open
IC
hFE =
II
VCE
II
IC
VI(on)
VCE
IC
NOTE: II is fixed for measuring VCE(sat), variable for
measuring hFE.
Figure 5. hFE, VCE(sat) Test Circuit
Figure 6. VI(on) Test Circuit
VR
IR
VF
Open
IF
Open
Figure 7. IR Test Circuit
POST OFFICE BOX 655303
Figure 8. VF Test Circuit
• DALLAS, TEXAS 75265
7
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
50%
Input
50%
tPHL
tPLH
50%
Output
50%
VOLTAGE WAVEFORMS
Figure 9. Propagation Delay-Time Waveforms
VS
Input
Pulse
Generator
(see Note A)
2 mH
Open
1N3064
ULN2001A Only
2.7 kΩ
200 Ω
Output
ULN2002A
ULN/ULQ2003A
ULN/ULQ2004A
CL = 15 pF
(see Note B)
TEST CIRCUIT
≤5 ns
≤10 ns
90%
1.5 V
Input
10%
VIH
(see Note C)
90%
1.5 V
10%
40 µs
0V
VOH
Output
VOL
VOLTAGE WAVEFORMS
NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
C. For testing the ULN2001A, the ULN2003A, and the ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V;
for the ULN2004A and the ULQ2004A, VIH = 8 V.
Figure 10. Latch-Up Test Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
TYPICAL CHARACTERISTICS
COLLECTOR-EMITTER
SATURATION VOLTAGE
vs
TOTAL COLLECTOR CURRENT
(TWO DARLINGTONS IN PARALLEL)
COLLECTOR-EMITTER
SATURATION VOLTAGE
vs
COLLECTOR CURRENT
(ONE DARLINGTON)
VCE(sat)
VCE(sat) − Collector-Emitter Saturation Voltage − V
TA = 25°C
2
II = 250 µA
II = 350 µA
II = 500 µA
1.5
1
0.5
0
0
100
200
300
400
500
600
700
800
2.5
TA = 25°C
II = 250 µA
2
II = 350 µA
1.5
II = 500 µA
1
0.5
0
0
100
200
300
400
500
600
700
800
IC(tot) − Total Collector Current − mA
IC − Collector Current − mA
Figure 12
Figure 11
COLLECTOR CURRENT
vs
INPUT CURRENT
500
RL = 10 Ω
TA = 25°C
450
IC
IC − Collector Current − mA
VCE(sat)
VCE(sat) − Collector-Emitter Saturation Voltage − V
2.5
400
VS = 10 V
350
VS = 8 V
300
250
200
150
100
50
0
0
25
50
75
100
125
150
175
200
II − Input Current − µA
Figure 13
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
THERMAL INFORMATION
N PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
D PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
600
IIC
C − Maximum Collector Current − mA
IIC
C − Maximum Collector Current − mA
600
500
N=1
400
N=4
N=3
300
N=2
N=6
200 N = 7
N=5
100
TA = 70°C
N = Number of Outputs
Conducting Simultaneously
0
500
400
N=4
300
N=5
N=6
N=7
200
100
TA = 85°C
N = Number of Outputs
Conducting Simultaneously
0
0
10
20
30
40
50
60
70
80
90 100
0
10
20
30
40
50
60
70
Duty Cycle − %
Duty Cycle − %
Figure 14
10
N=1
N=3
N=2
Figure 15
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
80
90 100
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G − DECEMBER 1976 − REVISED JUNE 2004
APPLICATION INFORMATION
ULN2002A
VSS
P-MOS
Output
ULN2003A
ULQ2003A
VCC
V
V
1
16
1
16
2
15
2
15
3
14
3
14
4
13
4
13
5
12
5
12
6
11
6
11
7
10
7
10
8
9
8
9
Lamp
Test
TTL
Output
Figure 17. TTL to Load
Figure 16. P-MOS to Load
ULN2004A
ULQ2004A
VDD
ULN2003A
ULQ2003A
VCC
V
V
1
16
1
16
2
15
2
15
3
14
3
14
4
13
4
13
5
12
5
12
6
11
6
11
7
10
7
10
8
9
8
9
RP
CMOS
Output
TTL
Output
Figure 18. Buffer for Higher Current Loads
POST OFFICE BOX 655303
Figure 19. Use of Pullup Resistors
to Increase Drive Current
• DALLAS, TEXAS 75265
11
PACKAGE OPTION ADDENDUM
www.ti.com
22-Aug-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
ULN2001AD
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
ULN2001ADR
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
ULN2001AN
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
ULN2002AD
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
ULN2002AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2002ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2003AD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003AJ
OBSOLETE
CDIP
J
16
TBD
Call TI
ULN2003AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2003ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2003ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004AD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
22-Aug-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ULN2004ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2004ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2004ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULQ2003AD
NRND
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2003ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULQ2003ADR
NRND
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2003ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULQ2003AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULQ2004AD
NRND
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2004ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULQ2004ADR
NRND
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2004ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ULQ2004AN
ACTIVE
PDIP
N
16
CU NIPDAU
N / A for Pkg Type
25
Pb-Free
(RoHS)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
22-Aug-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ULN2003ADR
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
ULN2003ADR
D
16
SITE 41
330
16
6.5
10.3
2.1
8
16
Q1
ULN2003ANSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
ULN2003APWR
PW
16
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
ULN2004ADR
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
ULN2004ADR
D
16
SITE 41
330
16
6.5
10.3
2.1
8
16
Q1
ULN2004ANSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
ULN2003ADR
D
16
SITE 27
342.9
336.6
0.0
ULN2003ADR
D
16
SITE 41
346.0
346.0
0.0
ULN2003ANSR
NS
16
SITE 41
346.0
346.0
0.0
ULN2003APWR
PW
16
SITE 41
346.0
346.0
0.0
ULN2004ADR
D
16
SITE 27
342.9
336.6
0.0
ULN2004ADR
D
16
SITE 41
346.0
346.0
0.0
ULN2004ANSR
NS
16
SITE 41
346.0
346.0
0.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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