UPB582A UPB582B UPB582C DIVIDE-BY-4 PRESCALER FEATURES TEST CIRCUITS UPB582A • HIGH FREQUENCY OPERATION TO 2.8 GHz VCC • WIDE BAND OPERATION • SINGLE SUPPLY VOLTAGE: VCC = 5 V ±10% 4 3 IN 5 • COMPLEMENTARY OUTPUTS 2 6 1 OUT 7 8 DESCRIPTION The UPB582 series of devices are divide-by-4 silicon bipolar digital prescalers. They feature high frequency response and operate from a single 5 volt supply. The series is available in three package styles: 8 pin can (UPB582A); 8 lead ceramic flat package (UPB582B) and an 8 pin DIP (UPB582C). Applications include: frequency synthesizers, division and prescaling. UPB582B, C VCC IN 1 8 2 7 3 6 4 5 * OUT Note: All capacitors are 2200 pF, all resistors are 50 ohms. * Pin 8 is not connected for UPB582C. ELECTRICAL CHARACTERISTICS (VCC = 5.0 ±0.5 V, ZS = ZL = 50 Ω) PART NUMBER PACKAGE OUTLINE SYMBOLS PARAMETERS AND CONDITIONS UPB582A A08 MIN TYP MAX MIN TYP MAX MIN TYP MAX 25 45 60 25 45 60 25 45 60 Power Supply Current mA fIN Frequency Response at PIN = -10 to -5 dBm1 PIN = -5 to 0 dBm1 PIN = 0 to +5 dBm1 PIN = -2 to +10 dBm2 PIN = +3 to +10 dBm2 PIN = -5 to +10 dBm3 PIN = -5 to +10 dBm4 PIN = -3 to +10 dBm5 GHz GHz GHz GHz GHz GHz GHz GHz Input Power at fIN = 0.5 to 2.4 GHz1 fIN = 0.5 to 2.6 GHz1 fIN = 0.5 to 2.8 GHz1 fIN = 0.5 to 2.6 GHz2 fIN = 0.5 to 2.8 GHz2 fIN = 0.5 to 2.2 GHz3 fIN = 0.5 to 2.4 GHz4 fIN = 0.5 to 2.4 GHz5 dBm dBm dBm dBm dBm dBm dBm dBm -2 +3 Output Power6 dBm -12 Thermal Resistance, Junction to Case (UPB582B) °C/W POUT RTH (J-C) Notes: 1. TA = -40 to +85°C. 2. TA = -20 to +75°C. 3. TA = -35 to +85°C. UPB582C C08 UNITS ICC PIN UPB582B BF08 0.5 0.5 0.5 0.5 0.5 2.4 2.6 2.8 2.6 2.8 -10 -5 0 0.5 0.5 0.5 2.2 2.4 2.4 -5 -5 -3 +10 +10 +10 +5 +5 +5 +10 +10 -8 -12 -8 -12 -8 20 4. TA = -20 to +65 °C, VCC = 5.0 ± 0.25 V. 5. TA = -20 to +70°C, VCC = 5.0 ± 0.25 V. 6. TA = +25°C, fIN = 2.0 GHz, PIN = 0 dBm. California Eastern Laboratories UPB582A, UPB582B, UPB582C ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS VCC VIN PIN PD TOP TSTG PARAMETERS Supply Voltage Input Voltage Input Power Total Power Dissipation UPB582B2 UPB582A UPB582C Operating Temperature UPB582B UPB582A, C Storage Temperature UPB582B UPB582A UPB582C UNITS RATINGS V -0.5 to 6.0 V -0.5 to VCC +0.5 dBm +10 mW mW mW 1500 750 600 °C °C -55 to +125 -55 to +85 °C °C °C -65 to +200 -55 to +200 -55 to +125 Notes 1. Operation in excess of any one of these parameters may result in permanent damage. 2. TA = Absolute Maximum Operating Temperature. RECOMMENDED OPERATING CONDITIONS (TA = 25°C) SYMBOL VCC TOP PARAMETER Supply Voltage Operating Temperature UPB582B UPB582A, C UNITS V RATINGS 4.5 to 5.5 °C °C -40 to +85 -20 to +75 Note: Because of the high internal gain and gain compression of the UPB582, this device is prone to self-oscillation in the absence of an RF input signal. If the device will be used in an application where DC power will be applied in the absence of an RF input signal, this self-oscillation can be suppressed by any of the following means: * Add a shunt resistor from the RF input line to ground. The blocking capacitor should be between the resistor and the UPB582, but physical separation should be minimized. Typically a resistor value between 50 and 100 ohms will suppress the selfoscillation. * Apply a DC offset voltage of +3.0 volts to the INPUT pin. The voltage source should be isolated from the INPUT pin by a series 1000 ohm resistor. * Apply a DC offset voltage of +1.5 volts to the BYPASS pin. The voltage source should be isolated from the BYPASS pin by a series 1000 ohm resistor. All these approaches reduce the input sensitivity of the UPB582 (by as much as 3 dB for the example of a 50 ohm shunt resistor), but otherwise have no affect on the reliability or other electrical characteristics of this device. TYPICAL PERFORMANCE CURVES (VCC = 5 V, TA = 25°C ) UPB582A INPUT POWER vs. FREQUENCY UPB582B INPUT POWER vs. FREQUENCY 20 40 20 Input Power, PIN (dBm) Input Power, PIN (dBm) 30 PIN MAX 10 Guaranteed Operating Window 0 PIN MIN -10 -20 10 0 Guaranteed Operating Window -10 -20 -30 -30 -40 0.5 2 1 5 0 Frequency, f (GHz) UPB582B INPUT POWER vs. FREQUENCY AND TEMPERATURE 0.5 1 1.5 2 2.5 3 3.5 Frequency, f (GHz) UPB582A SSB PHASE NOISE vs. OFFSET FROM CARRIER 20 -80 SSB Phase Noise (dBc/Hz) Input Power, PIN (dBm) -90 10 TA = 85˚C TA = 25˚C TA = -20˚C 0 VCC = 5 V -10 -20 -100 fIN = 500 MHz TA = 25˚C -110 -120 -130 -140 -150 -160 -170 -30 -180 0 0.5 1 1.5 2 2.5 Frequency, f (GHz) 3 3.5 1 10 100 1K 10K Offset from Carrier (Hz) 100K 1M UPB582A, UPB582B, UPB582C TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise noted) UPB582C INPUT POWER vs. FREQUENCY AND TEMPERATURE UPB582C INPUT POWER vs. FREQUENCY 30 30 Guaranteed Operating Window -10 PIN MIN -20 Input Power, PIN (dBm) Input Power, PIN (dBm) * 10 0 TA = 75˚C TA = 25˚C TA = -25˚C 20 PIN MAX 20 -30 VCC = 5 V 10 0 -10 -20 -30 -40 1 0.5 2 -40 5 0.5 2 1 3 5 Frequency, f (GHz) *See special conditions in Electrical Characteristics Table. Frequency, f (GHz) UPB582C OUTPUT POWER VS. TEMPERATURE AND VOLTAGE UPB582C CIRCUIT CURRENT vs. TEMPERATURE AND VOLTAGE 80 VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V Circuit Current, ICC (mA) Output Power, POUT (dBm) 10 0 -10 -20 -30 VCC = 5.5 V 60 VCC = 5.0 V VCC = 4.5 V 40 20 0 -25 0 25 50 75 -25 Ambient Temperature, TA (°C) 25 50 Ambient Temperature, TA (°C) UPB582C INPUT AND OUTPUT S-PARAMETERS VCC = 5.0 V, ICC = 45 mA S11 0 Frequency (GHz) MAG ANG Frequency (GHz) MAG ANG 0.20 0.40 0.80 1.20 1.60 2.00 2.40 2.80 3.20 0.079 0.246 0.231 0.334 0.422 0.553 0.645 0.690 0.674 142 119 100 91 84 75 63 49 33 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0.329 0.395 0.452 0.482 0.484 0.466 0.460 0.474 0.481 142 104 79 59 45 36 31 26 20 S22 75 UPB582A, UPB582B, UPB582C OUTLINE DIMENSIONS (Units in mm) UPB582A PACKAGE OUTLINE A08 UPB582B PACKAGE OUTLINE BF08 7.0±0.5 1.27 1.27 1.27 ±0.1 ±0.1 ±0.1 9.40φ MAX 8.50φ MAX 0.38 8 4.50 MAX 7 6 1.7 MAX 5 12.5 MIN 0.45φ 5.08φ 45˚ 1 0.8 2 3 4 8 7 0.8 45˚ 10.4±0.5 2.6 4.4±0.2 PIN CONNECTIONS 1. Output 1 2. Output 2 3. VCC 4. GND 5. Input 6. Bypass 7. GND 8. GND 5 6 1 7 6 3 4 +0.05 0.2 -0.02 0.4 5.0±0.2 PIN CONNECTIONS 1. VCC 2. Input 3. Bypass 4. GND UPB582C PACKAGE OUTLINE C08 8 2 5. 6. 7. 8. GND Output 1 Output 2 VCC 5 PIN CONNECTIONS 1. VCC 5. GND 2. Input 6. Output 1 3. Bypass 7. Output 2 4. GND 8. NC 1 3 2 4 10.16 MAX 7.62 0.9 MIN 6.4 4.31 MAX 5.08 MAX 0.51 MIN 3.2 ± 0.3 1.4 MIN 2.54 0.50 1.27 +0.10 0.25 -0.05 0 ~15˚ EXCLUSIVE AGENT FOR NEC Corporation RF & MICROWAVE SEMICONDUCTOR PRODUCTS - U.S. & CANADA CALIFORNIA EASTERN LABORATORIES, INC · DATA SUBJECT TO CHANGE WITHOUT NOTICE Headquarters · 4590 Patrick Henry Drive · Santa Clara, CA 95054-1817 · (408) 988-3500 · Telex 34-6393/FAX (408) 988-0279