NEC UPC317

DATA SHEET
SHEET
DATA
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC317
3-TERMINAL POSITIVE ADJUSTABLE REGULATOR
DESCRIPTION
The µPC317 is an adjustable 3-terminal positive voltage regulator, which has 1.5 A capable for the output current.
The output voltage can be set any value between 1.3 V and 30 V by two external resistors.
FEATURES
PIN CONFIGURATION (Marking Side)
3-pin plastic SIP (MP-45G)
•
Output current excess of 1.5 A
•
On-chip some protection circuit (over current protec-
µPC317HF
tion, SOA protection and thermal shut down).
ORDERING INFORMATION
Part Number
Package
µPC317HF
1
2
3
3-pin plastic SIP (MP-45G) (isolated TO-220)
1 : ADJ
2 : OUTPUT
3 : INPUT
EQUIVALENT CIRCUIT
INPUT
R1
R2
R3
R4
R5
Q22
Q10
Q23
R27
Q4
Q2
Q8
Q14
R6
Q18
R8
Q21
Q9
D1
Q3
Q5
Q6
Q7
C3
Q15
R20
Q24
Q17 Q19
Q11 Q12
C1
R15
C2
R9
R10 R11 R12
R13
R19
R17
Q20
Q16
Q13
R7
R16
R18
R21
Q25
D2
Q26
R23
R22
D3
R24
R14
R26 R25
OUTPUT
ADJ
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G12826EJ3V0DS00 (3rd edition)
Date Published January 2000 N CP(K)
Printed in Japan
©
2000
µPC317
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified.)
Parameter
Input-Output Voltage Differential
Symbol
Rating
Unit
VIN − VO
–0.3 to +40
V
Note
15
Total Power Dissipation (TC = 25°C)
PT
W
Operating Ambient Temperature
TA
–20 to +80
°C
Operating Junction Temperature
TJ
–20 to +150
°C
Storage Temperature
Tstg
–65 to +150
°C
Thermal Resistance (junction to case)
Rth (J–C)
5
°C/W
Thermal Resistance (junction to ambient)
Rth (J–A)
65
°C/W
Note Internally limited.
When operating junction temperature rise up to 150°C (≤200°C), the internal circuit shutdown output
voltage.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions
that ensure that the absolute maximum ratings are not exceeded.
RECOMMENDED OPERATING CONDITIONS
Symbol
MIN.
MAX.
Unit
VIN – VO
3
38.7
V
Input Voltage
VIN
4.3
40
V
Output Voltage
VO
1.3
30
V
Output Current
IO
0.01
1.5
A
Operating Junction Temperature
TJ
–20
+125
°C
Parameter
Input-Output Voltage Differential
TYP.
Caution The recommended operating range may be exceeded without causing any problems provided
that the absolute maximum ratings are not exceeded. However, if the device is operated in a way
that exceeds the recommended operating conditions, the margin between the actual conditions
of use and the absolute maximum ratings is small, and therefore thorough evaluation is
necessary. The recommended operating conditions do not imply that the device can be used
with all values at their maximum values.
2
Data Sheet G12826EJ3V0DS00
µPC317
TYPICAL CONNECTION
D2
INPUT
µ PC317
VIN
OUTPUT
VO
D1
ADJ
R1
240 Ω
+
CIN
0.1 µ F
CO
1 µF
R2
+
CADJ
10 µ F
Remark R1, R2 : Resistor to set the output voltage.
VO = (1 +
CIN
:
CO
:
R2
R2
.
) • VREF + IADJ • R2 .= (1 +
) • VREF
R1
R1
VO (V)
R2 (Ω : TYP.)
1.25
0
2.5
240
5.0
720
12
2064
24
4368
30
5520
Need to stop the oscillation for the long input wiring length.
Need to stop the oscillation for the long output wiring length.
Improve the transient stability of the output voltage when the lord current is suddently changed.
CADJ :
Improve the ripple rejection and the oscillate rejection.
D1
:
Protect against CADJ from output short.
D2
:
Need for VIN < VO.
Data Sheet G12826EJ3V0DS00
3
µPC317
ELECTRICAL CHARACTERISTICS
(VIN − VO = 5 V, IO = 0.5 A, 0°°C ≤ TJ ≤ +125°°C, unless otherwise specified.)
Parameter
Line Regulation
Load Regulation
Thermal Regulation
ADJ pin Output Current
Symbol
REGIN
REGL
REGTH
Conditions
MIN.
TYP.
MAX.
Unit
TA = 25°C, 3 V ≤ (VIN – VO) ≤ 40 V, IO = 0.1 A
0.01
0.04
%/V
3 V ≤ (VIN – VO) ≤ 40 V, IO = 0.1 A
0.02
0.07
%/V
Note
Note
VO ≤ 5 V
5
25
mV
10 mA ≤ lO ≤ 1.5 A
Note
VO ≥ 5 V
0.1
0.5
%
10 mA ≤ lO ≤ 1.5 A
Note
VO ≤ 5 V
20
70
mV
VO ≥ 5 V
0.3
1.5
%
0.01
0.07
%/W
50
100
µA
0.4
5
µA
1.25
1.30
V
TJ = 25°C
TA = 25°C, 0.2 ms ≤ t ≤ 20 ms
IADJ
IADJ Change
∆IADJ
10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W
Reference Voltage
VREF
10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W
1.20
Temperature Stability of VREF ∆VREF/∆T
0.7
Minimum Load Current
IOMIN.
VIN − VO = 40 V
Peak Output Current
IOpeak
5 V ≤ (VIN − VO) ≤ 15 V
VIN − VO = 40 V
Output Noise Voltage (RMS)
Ripple Rejection
Vn
R•R
4.7
10
mA
1.5
2.2
2.9
A
0.15
0.8
A
0.001
%
48
dB
65
dB
TA = 25°C, 10 Hz ≤ f ≤ 10 kHz
TA = 25°C, ∆VIN = 1 Vr.m.s
CADJ = 0
f = 120 Hz, VO = 10 V
CADJ = 10 µF
56
Note Measured at constant junction temperature, using pulse testing with a low duty cycle.
PW = 10 ms, Duty Cycle ≤ 2 %
4
Data Sheet G12826EJ3V0DS00
%
µPC317
TYPICAL CHARACTERISTICS (TA = 25°°C, unless otherwise specified. Reference Values.)
PT vs TA
REGL vs TJ
1.0
VIN = 10 V
VO = 5 V
20
REGL - Load Regulation - %
PT - Total Power Dissipation - W
25
Infinite heatsink
15
10
With 10°C/W heatsink
0.5
5
No heatsink
0
25
50
75
100
0
−25
125
TA - Operating Ambient Temperature - °C
0
25
50
75
1.27
VIN−VO = 5 V
IO = 0.5 A
TJ = −20 °C
25 °C
VREF - Reference Voltage - V
IOpeak - Peak Output Current - A
125
VREF vs TJ
IOpeak vs (VIN – VO)
3.0
125 °C
2.0
1.0
0
10
20
30
1.26
1.25
1.24
1.23
−25
40
0
25
IADJ vs TJ
75
100
125
IOMIN. vs VDIF
60
6
IOMIN. - Minimum Load Current - mA
VIN−VO = 5 V
IO = 0.5 A
50
40
−25
50
TJ - Operating Junction Temperature - °C
(VIN – VO) - Input - Output Voltage Differential - V
IADJ - ADJ pin Output Current - µA
100
TJ - Operating Junction Temperature - °C
0
25
50
75
100
125
5
TJ = −20 °C
4
TJ = 125 °C
3
2
TJ = 25 °C
1
0
TJ - Operating Junction Temperature - °C
10
20
30
40
VDIF - Minimum Dropout Voltage - V
Data Sheet G12826EJ3V0DS00
5
µPC317
VDIF vs TJ
R • R vs f
80
∆VO
=2%
VO
3.0
IO = 1.5 A
2.5
IO = 1.0 A
2.0
IO = 0.5 A
IO = 0.2 A
1.5
0
25
50
75
100
60
CADJ = 0
50
40
30
20
VIN = 15 V
VO = 10 V
IO = 0.5 A
CO = 0
TA = 25 °C
100
10
IO = 0.02 A
1.0
−25
CADJ = 10 µ F
70
3.5
R • R - Ripple Rejection - dB
VDIF - Minimum Dropout Voltage - V
4.0
125
0
10
150
TJ - Operating Junction Temperature - °C
10
60
50
CADJ = 0 µ F
40
30
VIN−VO = 5 V
IO = 0.5 A
f = 120 Hz
TA = 25 °C
20
10
0
5
10
15
20
25
30
0.1
CADJ = 0
CADJ = 10 µ F
0.01
100
1k
10 k
VO - Output Voltage - V
f - Frequency - Hz
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
VIN = 15 V, TA = 25 °C
VO = 10 V
IO = 50 mA
+1
0
−1
CADJ = 10 µ F, CO = 10 µ F
0 µF
1 µF
1.0
0.5
0
1
VIN = 15 V
VO = 10 V
IO = 0.5 A
TA = 25 °C
0.001
10
IO - Output Current
-A
∆VO - Output Voltage
Deviation - V
RO - Output Impedance - Ω
CADJ = 10 µ F
∆VO - Output Voltage
Deviation - V
R • R - Ripple Rejection - dB
70
∆VIN - Input Voltage
Deviation - V
100 k
RO vs f
R • R vs VO
10
20
30
40
+2
100 k
VIN = 15 V
VO = 10 V
TA = 25 °C
0
CADJ = 10 µ F, CO = 10 µ F
−2
0 µF
1 µF
1.5
1.0
0.5
0
t - Time - µ s
6
10 k
f - Frequency - Hz
80
0
1k
IOL = 10 mA
0
10
20
t - Time - µ s
Data Sheet G12826EJ3V0DS00
30
40
µPC317
PACKAGE DRAWING
3PIN PLASTIC SIP (MP-45G)
A
N
E
P
B
I
L
M
D
1
2
3
K
Y
V
J
H
U
Z
C
F
G
M
NOTE
ITEM
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
MILLIMETERS
A
B
10.0±0.2
7.0±0.2
C
1.50±0.2
D
E
17.0±0.3
φ 3.3±0.2
F
0.75±0.10
G
0.25
H
2.54 (T.P.)
I
5.0±0.3
J
K
2.46±0.2
5.0±0.2
L
8.5±0.2
M
8.5±0.2
N
4.5±0.2
P
U
V
2.8±0.2
2.4±0.5
0.65±0.10
Y
Z
8.9±0.7
1.30±0.2
P3HF-254B-4
Data Sheet G12826EJ3V0DS00
7
µPC317
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
(C10535E).
Type of Through-hole Devices
µPC317HF: 3-pin plastic SIP (MP-45G)(isolated TO-220)
Conditions
Process
Wave soldering (only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
C11531E
SEMICONDUCTOR DEVICE MOUNTING THCHNOLOGY MANUAL
C10535E
SEMICONDUCTORS SELECTION GUIDE – Products and Packages – (CD-ROM)
X13769X
SEMICONDUCTORS SELECTION GUIDE
X10679E
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM
IEI-1212
-THREE TERMINAL REGULATOR
8
Data Sheet G12826EJ3V0DS00
µPC317
[MEMO]
Data Sheet G12826EJ3V0DS00
9
µPC317
[MEMO]
10
Data Sheet G12826EJ3V0DS00
µPC317
[MEMO]
Data Sheet G12826EJ3V0DS00
11
µPC317
[MEMO]
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8