DATA SHEET SHEET DATA BIPOLAR ANALOG INTEGRATED CIRCUIT µPC317 3-TERMINAL POSITIVE ADJUSTABLE REGULATOR DESCRIPTION The µPC317 is an adjustable 3-terminal positive voltage regulator, which has 1.5 A capable for the output current. The output voltage can be set any value between 1.3 V and 30 V by two external resistors. FEATURES PIN CONFIGURATION (Marking Side) 3-pin plastic SIP (MP-45G) • Output current excess of 1.5 A • On-chip some protection circuit (over current protec- µPC317HF tion, SOA protection and thermal shut down). ORDERING INFORMATION Part Number Package µPC317HF 1 2 3 3-pin plastic SIP (MP-45G) (isolated TO-220) 1 : ADJ 2 : OUTPUT 3 : INPUT EQUIVALENT CIRCUIT INPUT R1 R2 R3 R4 R5 Q22 Q10 Q23 R27 Q4 Q2 Q8 Q14 R6 Q18 R8 Q21 Q9 D1 Q3 Q5 Q6 Q7 C3 Q15 R20 Q24 Q17 Q19 Q11 Q12 C1 R15 C2 R9 R10 R11 R12 R13 R19 R17 Q20 Q16 Q13 R7 R16 R18 R21 Q25 D2 Q26 R23 R22 D3 R24 R14 R26 R25 OUTPUT ADJ The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G12826EJ3V0DS00 (3rd edition) Date Published January 2000 N CP(K) Printed in Japan © 2000 µPC317 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified.) Parameter Input-Output Voltage Differential Symbol Rating Unit VIN − VO –0.3 to +40 V Note 15 Total Power Dissipation (TC = 25°C) PT W Operating Ambient Temperature TA –20 to +80 °C Operating Junction Temperature TJ –20 to +150 °C Storage Temperature Tstg –65 to +150 °C Thermal Resistance (junction to case) Rth (J–C) 5 °C/W Thermal Resistance (junction to ambient) Rth (J–A) 65 °C/W Note Internally limited. When operating junction temperature rise up to 150°C (≤200°C), the internal circuit shutdown output voltage. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. RECOMMENDED OPERATING CONDITIONS Symbol MIN. MAX. Unit VIN – VO 3 38.7 V Input Voltage VIN 4.3 40 V Output Voltage VO 1.3 30 V Output Current IO 0.01 1.5 A Operating Junction Temperature TJ –20 +125 °C Parameter Input-Output Voltage Differential TYP. Caution The recommended operating range may be exceeded without causing any problems provided that the absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds the recommended operating conditions, the margin between the actual conditions of use and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The recommended operating conditions do not imply that the device can be used with all values at their maximum values. 2 Data Sheet G12826EJ3V0DS00 µPC317 TYPICAL CONNECTION D2 INPUT µ PC317 VIN OUTPUT VO D1 ADJ R1 240 Ω + CIN 0.1 µ F CO 1 µF R2 + CADJ 10 µ F Remark R1, R2 : Resistor to set the output voltage. VO = (1 + CIN : CO : R2 R2 . ) • VREF + IADJ • R2 .= (1 + ) • VREF R1 R1 VO (V) R2 (Ω : TYP.) 1.25 0 2.5 240 5.0 720 12 2064 24 4368 30 5520 Need to stop the oscillation for the long input wiring length. Need to stop the oscillation for the long output wiring length. Improve the transient stability of the output voltage when the lord current is suddently changed. CADJ : Improve the ripple rejection and the oscillate rejection. D1 : Protect against CADJ from output short. D2 : Need for VIN < VO. Data Sheet G12826EJ3V0DS00 3 µPC317 ELECTRICAL CHARACTERISTICS (VIN − VO = 5 V, IO = 0.5 A, 0°°C ≤ TJ ≤ +125°°C, unless otherwise specified.) Parameter Line Regulation Load Regulation Thermal Regulation ADJ pin Output Current Symbol REGIN REGL REGTH Conditions MIN. TYP. MAX. Unit TA = 25°C, 3 V ≤ (VIN – VO) ≤ 40 V, IO = 0.1 A 0.01 0.04 %/V 3 V ≤ (VIN – VO) ≤ 40 V, IO = 0.1 A 0.02 0.07 %/V Note Note VO ≤ 5 V 5 25 mV 10 mA ≤ lO ≤ 1.5 A Note VO ≥ 5 V 0.1 0.5 % 10 mA ≤ lO ≤ 1.5 A Note VO ≤ 5 V 20 70 mV VO ≥ 5 V 0.3 1.5 % 0.01 0.07 %/W 50 100 µA 0.4 5 µA 1.25 1.30 V TJ = 25°C TA = 25°C, 0.2 ms ≤ t ≤ 20 ms IADJ IADJ Change ∆IADJ 10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W Reference Voltage VREF 10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W 1.20 Temperature Stability of VREF ∆VREF/∆T 0.7 Minimum Load Current IOMIN. VIN − VO = 40 V Peak Output Current IOpeak 5 V ≤ (VIN − VO) ≤ 15 V VIN − VO = 40 V Output Noise Voltage (RMS) Ripple Rejection Vn R•R 4.7 10 mA 1.5 2.2 2.9 A 0.15 0.8 A 0.001 % 48 dB 65 dB TA = 25°C, 10 Hz ≤ f ≤ 10 kHz TA = 25°C, ∆VIN = 1 Vr.m.s CADJ = 0 f = 120 Hz, VO = 10 V CADJ = 10 µF 56 Note Measured at constant junction temperature, using pulse testing with a low duty cycle. PW = 10 ms, Duty Cycle ≤ 2 % 4 Data Sheet G12826EJ3V0DS00 % µPC317 TYPICAL CHARACTERISTICS (TA = 25°°C, unless otherwise specified. Reference Values.) PT vs TA REGL vs TJ 1.0 VIN = 10 V VO = 5 V 20 REGL - Load Regulation - % PT - Total Power Dissipation - W 25 Infinite heatsink 15 10 With 10°C/W heatsink 0.5 5 No heatsink 0 25 50 75 100 0 −25 125 TA - Operating Ambient Temperature - °C 0 25 50 75 1.27 VIN−VO = 5 V IO = 0.5 A TJ = −20 °C 25 °C VREF - Reference Voltage - V IOpeak - Peak Output Current - A 125 VREF vs TJ IOpeak vs (VIN – VO) 3.0 125 °C 2.0 1.0 0 10 20 30 1.26 1.25 1.24 1.23 −25 40 0 25 IADJ vs TJ 75 100 125 IOMIN. vs VDIF 60 6 IOMIN. - Minimum Load Current - mA VIN−VO = 5 V IO = 0.5 A 50 40 −25 50 TJ - Operating Junction Temperature - °C (VIN – VO) - Input - Output Voltage Differential - V IADJ - ADJ pin Output Current - µA 100 TJ - Operating Junction Temperature - °C 0 25 50 75 100 125 5 TJ = −20 °C 4 TJ = 125 °C 3 2 TJ = 25 °C 1 0 TJ - Operating Junction Temperature - °C 10 20 30 40 VDIF - Minimum Dropout Voltage - V Data Sheet G12826EJ3V0DS00 5 µPC317 VDIF vs TJ R • R vs f 80 ∆VO =2% VO 3.0 IO = 1.5 A 2.5 IO = 1.0 A 2.0 IO = 0.5 A IO = 0.2 A 1.5 0 25 50 75 100 60 CADJ = 0 50 40 30 20 VIN = 15 V VO = 10 V IO = 0.5 A CO = 0 TA = 25 °C 100 10 IO = 0.02 A 1.0 −25 CADJ = 10 µ F 70 3.5 R • R - Ripple Rejection - dB VDIF - Minimum Dropout Voltage - V 4.0 125 0 10 150 TJ - Operating Junction Temperature - °C 10 60 50 CADJ = 0 µ F 40 30 VIN−VO = 5 V IO = 0.5 A f = 120 Hz TA = 25 °C 20 10 0 5 10 15 20 25 30 0.1 CADJ = 0 CADJ = 10 µ F 0.01 100 1k 10 k VO - Output Voltage - V f - Frequency - Hz LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE VIN = 15 V, TA = 25 °C VO = 10 V IO = 50 mA +1 0 −1 CADJ = 10 µ F, CO = 10 µ F 0 µF 1 µF 1.0 0.5 0 1 VIN = 15 V VO = 10 V IO = 0.5 A TA = 25 °C 0.001 10 IO - Output Current -A ∆VO - Output Voltage Deviation - V RO - Output Impedance - Ω CADJ = 10 µ F ∆VO - Output Voltage Deviation - V R • R - Ripple Rejection - dB 70 ∆VIN - Input Voltage Deviation - V 100 k RO vs f R • R vs VO 10 20 30 40 +2 100 k VIN = 15 V VO = 10 V TA = 25 °C 0 CADJ = 10 µ F, CO = 10 µ F −2 0 µF 1 µF 1.5 1.0 0.5 0 t - Time - µ s 6 10 k f - Frequency - Hz 80 0 1k IOL = 10 mA 0 10 20 t - Time - µ s Data Sheet G12826EJ3V0DS00 30 40 µPC317 PACKAGE DRAWING 3PIN PLASTIC SIP (MP-45G) A N E P B I L M D 1 2 3 K Y V J H U Z C F G M NOTE ITEM Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A B 10.0±0.2 7.0±0.2 C 1.50±0.2 D E 17.0±0.3 φ 3.3±0.2 F 0.75±0.10 G 0.25 H 2.54 (T.P.) I 5.0±0.3 J K 2.46±0.2 5.0±0.2 L 8.5±0.2 M 8.5±0.2 N 4.5±0.2 P U V 2.8±0.2 2.4±0.5 0.65±0.10 Y Z 8.9±0.7 1.30±0.2 P3HF-254B-4 Data Sheet G12826EJ3V0DS00 7 µPC317 RECOMMENDED SOLDERING CONDITIONS When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Type of Through-hole Devices µPC317HF: 3-pin plastic SIP (MP-45G)(isolated TO-220) Conditions Process Wave soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial heating method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNTING THCHNOLOGY MANUAL C10535E SEMICONDUCTORS SELECTION GUIDE – Products and Packages – (CD-ROM) X13769X SEMICONDUCTORS SELECTION GUIDE X10679E NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM IEI-1212 -THREE TERMINAL REGULATOR 8 Data Sheet G12826EJ3V0DS00 µPC317 [MEMO] Data Sheet G12826EJ3V0DS00 9 µPC317 [MEMO] 10 Data Sheet G12826EJ3V0DS00 µPC317 [MEMO] Data Sheet G12826EJ3V0DS00 11 µPC317 [MEMO] • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8