DATA SHEET GaAs INTEGRATED CIRCUIT µPG174TA L-BAND PA DRIVER AMPLIFIER DESCRIPTION The µPG174TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This device feature high output power and low distortion with 2.8 V low voltage and 35 mA low current operation. It is housed in a very small 6-pin minimold package available on tape-and-reel and easy to install and contributes to miniaturizing the systems. FEATURES y Low operation voltage : VDD = 2.8 V : Padj1 = –60 dBc TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, Pout = +10 dBm y Low distortion Off-chip input and output matching y Low operation current : IDD = 35 mA TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, Pout = +10 dBm Off-chip input and output matching y 6-pin minimold package APPLICATION y Digital Cellular: PDC1.5G, DCS1800, PCS, etc. ORDERING INFORMATION Part Number Package µPG174TA-E3 6-pin minimold Supplying Form Carrier tape width is 8 mm. Qty 3kp/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPG174TA) ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameters Supply Voltage Symbol Ratings Unit VDD 6.0 V –10 dBm Input Power Pin Total Power Dissipation Ptot Note 170 mW Operating Ambient Temperature TA –30 to +90 °C Storage Temperature Tstg –35 to +150 °C Note Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13230EJ2V0DS00 (2nd edition) Date Published January 2000 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 2000 µPG174TA PIN CONNECTION AND INTERNAL BLOCK DIAGRAM G1D (Top View) 3 2 1 Pin No. Connection 1 GND (Bottom View) 4 3 4 2 GND 2 5 3 IN 1 6 4 VDD1 5 GND 6 VDD2 & OUT 3 4 5 5 2 6 6 1 RECOMMENDED OPERATING CONDITIONS (TA = +25°C) Parameters Supply Voltage 1, 2 Input Power Symbol MIN. TYP. MAX. Unit VDD1, 2 +2.7 +2.8 +3.0 V Pin – –22 –20 dBm ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VDD1 = VDD2 = +2.8 V, π/4DQPSK modulated signal input, off-chip input and output matching) Parameters Operating Frequency Symbol Test Conditions f MIN. TYP. MAX. Unit 1 429 – 1 453 MHz Power Gain GP Pin = –22 dBm 32.0 34.0 – dB Total Current IDD Pin = –22 dBm – 35 40 mA Adjacent Channel Power Leakage 1 Padj1 Pout = +10 dBm, ∆f = ±50 kHz – –60 –55 dBc Adjacent Channel Power Leakage 2 Padj2 Pout = +10 dBm, ∆f = ±100 kHz – –65 –60 dBc REFERENCE CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VDD1 = VDD2 = +2.8 V, f = 1 429 to 1 453 MHz, off-chip input and output matching) Parameters 2 Symbol MIN. TYP. MAX. Unit Input Return Loss RLin – 10 – dB Output Return Loss RLout – 10 – dB Data Sheet P13230EJ2V0DS00 µPG174TA EVALUATION CIRCUIT VDD1 = VDD2 = +2.8 V, f = 1 429 to 1 453 MHz VDD1 VDD2 C2 R1 L2 C1 OUT C3 4 5 Zo = 50 Ω 6 G1D 3 2 1 IN Zo = 50 Ω L1 Using the NEC Evaluation board Parts List C1, C2 Value 1 000 pF C3 2.0 pF R1 10 Ω L1 6.8 nH L2 3.3 nH Data Sheet P13230EJ2V0DS00 3 µPG174TA EVALUATION BOARD (Epoxy Glass, ε = 4.6, 0.4 mm thickness) VDD1 OUT VDD2 38 mm IN 40 mm VDD1 OUT C3 R1 C1 L2 C2 L1 IN 4 Data Sheet P13230EJ2V0DS00 VDD2 µPG174TA TYPICAL CHARACTERISTICS 20 15 Output Power Pout (dBm) 10 −20 Pout −30 Padj1 −40 −50 5 Padj2 −60 0 Adjacent Channel Power Leakage Padj1, Padj2 (dBc) OUTPUT POWER AND ADJACENT CHANNEL POWER LEAKAGE vs. INPUT POWER @VDD = +2.8 V, f = 1 450 MHz −70 −35 −30 −25 −20 −80 −15 Input Power Pin (dBm) Data Sheet P13230EJ2V0DS00 5 µPG174TA POWER GAIN AND TOTAL CURRENT vs. INPUT POWER @VDD = −2.8 V, f = 1 450 MHz Power Gain Gp (dB) Gp 35 35 IDD 30 −35 −25 Input Power Pin (dBm) 6 Data Sheet P13230EJ2V0DS00 30 −15 Total Current IDD (mA) 40 40 µPG174TA PACKAGE DIMENSIONS 6 PIN MINIMOLD PACKAGE (UNIT: mm) +0.1 0.3 –0.0 3 +0.2 2 1.5 –0.1 2.8 –0.3 +0.2 1 0.13 ±0.1 0 to 0.1 6 5 4 0.95 0.95 1.9 0.8 +0.2 1.1–0.1 2.9 ±0.2 Data Sheet P13230EJ2V0DS00 7 µPG174TA RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 8 Data Sheet P13230EJ2V0DS00 µPG174TA [MEMO] Data Sheet P13230EJ2V0DS00 9 µPG174TA [MEMO] 10 Data Sheet P13230EJ2V0DS00 µPG174TA [MEMO] Data Sheet P13230EJ2V0DS00 11 µPG174TA Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8