GaAs HBT INTEGRATED CIRCUIT µPG2314T5N POWER AMPLIFIER FOR BluetoothTM Class 1 DESCRIPTION The µPG2314T5N is GaAs HBT MMIC for power amplifier which was developed for Bluetooth Class 1. This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operation frequency : fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.) • Supply voltage : VCC1, 2 = 2.7 to 3.6 V (3.0 V TYP.) • Control voltage : Vcont = 0 to 3.6 V (3.0 V TYP.) : Vbias + Venable = 0 to 3.1 V (3.0 V TYP.) • Circuit current : ICC = 65 mA TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V, Pin = 0 dBm • Output power : Pout = +20 dBm TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V, Pin = 0 dBm • Gain control range : GCR = 23 dB TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 0 to 3.0 V, Pin = 0 dBm • High efficiency : PAE = 50% TYP. • High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • Power Amplifier for Bluetooth Class 1 ORDERING INFORMATION Part Number Order Number µPG2314T5N-E2 µPG2314T5N-E2-A Package 6-pin plastic TSON (Pb-Free) Marking G5D Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2314T5N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PG10624EJ01V0DS (1st edition) Date Published July 2006 NS CP(K) µPG2314T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 G5D 1 3 (Bottom View) (Top View) 6 1 5 2 4 3 Bias Circuit Bias Circuit 6 6 1 5 5 2 4 3 4 Pin No. Pin Name 1 OUTPUT/VCC2 2 Vbias + Venable 3 Vcont 4 INPUT 5 VCC1 6 GND ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Supply Voltage Symbol Ratings Unit VCC1, 2 5.5 V Vbias + 3.6 V Venable Control Voltage Vcont 3.6 V Circuit Current ICC 400 mA Control Current Icont 0.5 mA Input Power Pin +10 dBm 700 Note Power Dissipation PD mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Operating Frequency Supply Voltage Symbol MIN. TYP. MAX. Unit fopt 2 400 2 450 2 500 MHz VCC1, 2 2.7 3.0 3.6 V Vbias + 0 3.0 3.1 V 0 3.0 3.6 V Venable Control Voltage 2 Vcont Data Sheet PG10624EJ01V0DS µPG2314T5N ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC1, 2 = Vbias + Venable = 3.0 V, f = 2 450 MHz, Pout = +20 dBm, External input and output matching, unless otherwise specified) Parameter Circuit Current Shut Down Current Symbol ICC Ishut down Test Conditions MIN. TYP. MAX. Unit Vcont = 3.0 V, Pin = 0 dBm − 65 70 mA Vcont = 3.0 V, Pin = 0 dBm , − 0 1 µA +18.0 +20.0 − dBm Vbias + Venable = 0 V Output Power 1 Pout1 Vcont = 3.0 V, Pin = 0 dBm Output Power 2 Pout2 Vcont = 0 V, Pin = 0 dBm − −3.0 +1.0 dBm Gain Control Range GCR Vcont = 0 to 3.0 V, Pin = 0 dBm 17 23 − dB Efficiency PAE Vcont = 3.0 V, Pin = 0 dBm − 50 − % Data Sheet PG10624EJ01V0DS 3 µPG2314T5N EVALUATION CIRCUIT VCC2 1 nF 22 nH 6 1 OUTPUT 10 pF Bias Circuit Vbias + Venable 5 2 VCC1 2.7 nH 1 nF Bias Circuit Vcont 4 3 INPUT 4.7 nH The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10624EJ01V0DS µPG2314T5N TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) Condition : f = 2 450 MHz, VCC1 = VCC2 = Vbias + Venable = Vcont = 3.0 V, with external input and output matching circuit 40 80 ICC 70 35 30 60 PAE 50 25 20 40 Pout 30 15 20 10 10 5 0 –25 –20 –15 –10 –5 0 Output Power Pout (dBm) Circuit Current ICC (mA), Efficiency PAE (%) CIRCUIT CURRENT, EFFICIENCY, OUTPUT POWER vs. INPUT POWER 0 10 5 Input Power Pin (dBm) OUTPUT POWER, EFFICIENCY, CIRCUIT CURRENT vs. CONTROL VOLTAGE 90 60 50 PAE 80 40 ICC 70 60 30 Pout 20 50 10 40 0 30 –10 20 –20 10 –30 0 0.5 1 1.5 2 2.5 3 Circuit Current ICC (mA) Output Power Pout (dBm), Efficiency PAE (%) Condition : f = 2 450 MHz, VCC1 = VCC2 = Vbias + Venable = 3.0 V, Pin = 0 dBm, with external input and output matching circuit 0 3.5 Control Voltage Vcont (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10624EJ01V0DS 5 µPG2314T5N Condition : f = 2 450 MHz, VCC1 = VCC2 = Vcont = 3.0 V, Pin = 0 dBm, with external input and output matching circuit 30 70 ICC 60 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBc) 20 Pout 50 10 PAE 0 40 –10 30 –20 20 2f0 –30 10 –40 1.5 2 2.5 0 3.5 3 Circuit Current ICC (mA), Efficiency PAE (%) OUTPUT POWER, 2f0, CIRCUIT CURRENT, EFFICIENCY vs. SUPPLY VOLTAGE Supply Voltage Vbias + Venable (V) Condition : VCC1 = VCC2 = Vbias + Venable = Vcont = 3.0 V, Pin = −20 dBm, with external input and output matching circuit S11-FREQUENCY S11, S22-FREQUENCY 0 m2 –10 m3 m1 –20 –30 START 50.000 000 MHz m1: f = 2.450 GHz S (1,1) = 0.245/–17.795 impedance = Z0 * (1.584 – j0.252) STOP 6 050.000 000 MHz –40 0 m2: f = 2.450 GHz dB (S (1,1)) = –12.214 m3: f = 2.450 GHz dB (S (2,2)) = –15.929 1 2 3 4 5 6 7 Frequency f (GHz) S21-FREQUENCY 25 S22-FREQUENCY m4 20 15 m5 10 5 m4: f = 2.450 GHz dB (S (2,1)) = 24.321 0 0 1 2 3 4 5 6 START 50.000 000 MHz 7 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10624EJ01V0DS m5: f = 2.450 GHz S (2,2) = 0.160/–152.056 impedance = Z0 * (0.745 – j0.115) STOP 6 050.000 000 MHz µPG2314T5N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.2 0.5 1.0 0.5 0.3 0.5 0.3 0.3 SOLDER PAD 0.475 0.15 0.5 0.55 0.5 0.25 0.35 0.475 0.25 Solder thickness : 0.08 mm Remark The mounting pad layouts in this document are for reference only. Data Sheet PG10624EJ01V0DS 7 µPG2314T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Bottom View) (Side View) 0.3±0.07 0.2+0.07 –0.05 1.5±0.1 0.5±0.06 1.5±0.1 1.2±0.1 (Top View) 0.37+0.03 –0.05 8 0.2±0.1 Data Sheet PG10624EJ01V0DS 0.7±0.1 µPG2314T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10624EJ01V0DS 9 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. 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