PRELIMINARY PRODUCT INFORMATION BIPOLAR ANALOG INTEGRATED CIRCUIT μPC8233TK SiGe:C LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS DESCRIPTION The μPC8233TK is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. This device exhibits low noise figure and high power gain characteristics. This device is suitable for the reduction in power consumption of the mobile communication system because it operates by low voltage and low current. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process. FEATURES • Supply voltage : VCC = 1.7 to 3.3 V (2.7 V TYP.) • Low noise : NF = 0.90 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz NF = 0.90 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz • High gain : GP = 20 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz GP = 19.5 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz • Low current consumption : ICC = 3.5 mA TYP. @ VCC = 2.7 V • Built-in power-saving function VPSon = 1.0V to Vcc VPSoff = 0.0 to 0.4V : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) • High-density surface mounting • Included very robust bandgap regulator (Small VCC and TA dependence) • Included protection circuits for ESD APPLICATION • Low noise amplifier for GPS and mobile communications ORDERING INFORMATION Part Number μPC8233TK-E2 Order Number μPC8233TK-E2-A Package 6-pin lead-less minimold (1511 PKG) (Pb-Free) Marking TBD Supplying Form • 8 mm wide embossed taping • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPC8233TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. (1st edition) Date Published January 2007 NS CP(N) © NEC Electronics Corporation 2007 μPC8233TK PIN CONNECTIONS Pin No. Pin Name 1 INPUT 2 GND 3 Power Save 4 OUTPUT 5 GND 6 VCC INTERNAL BLOCK DIAGRAM INPUT 1 6 VCC GND 2 5 GND Power Save 3 4 OUTPUT Bias ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25°C 4.0 V Power-Saving Voltage VPS TA = +25°C 4.0 V Power Dissipation PD TA = +85°C 232 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin +10 dBm Note Note Mounted on double-side copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 1.7 2.7 3.3 V Operating Ambient Temperature TA −40 +25 +85 °C Power Save Turn-on Voltage VPSon 1.0 − VCC V Power Save Turn-off Voltage VPSoff 0 − 0.4 V 2 μPC8233TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VPS = 2.7 V, fin = 1575 MHz, unless otherwise specified) Parameter Symbol Circuit Current ICC Test Conditions No Signal (VPS = 2.7 V) MIN. TYP. MAX. Unit 2.5 3.5 4.8 mA − − 1 μA 17.5 20 22.5 dB − 0.9 1.2 dB − −7.5 − dBm At Power-Saving Mode (VPS = 0 V) Pin = −35 dBm Power Gain GP Noise Figure NF Input 3rd Order Distortion Intercept IIP3 fin1 = 1574 MHz, fin2 = 1575 MHz Point Input Return Loss RLin 7 16 − dB Output Return Loss RLout 8 16 − dB ISL − 36 − dB Pin (1 dB) − −23 − dBm Isolation Gain 1 dB Compression Input Power STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VCC = VPS = 1.8 V, fin = 1575 MHz, unless otherwise specified) Parameter Symbol Circuit Current ICC Test Conditions No Signal Reference Unit 3.3 mA − μA 19.5 dB 0.9 dB −8 dBm (VPS = 1.8 V) At Power-Saving Mode (VPS = 0 V) Pin = −35 dBm Power Gain GP Noise Figure NF Input 3rd Order Distortion Intercept IIP3 fin1 = 1574 MHz, fin2 = 1575 MHz Point Input Return Loss RLin 16 dB Output Return Loss RLout 15.5 dB ISL 36 dB Pin (1 dB) −23.5 dBm Isolation Gain 1 dB Compression Input Power TEST CIRCUIT 22nF 1.2pF 8.2nH IN Vcc GND GND 1000pF 18nH Power Save 360 OUT 6.8nH 18pF 3 μPC8233TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Bottom View) 0.16±0.05 1.5±0.1 0.48±0.05 0.48±0.05 (Top View) 1.1±0.1 0.2±0.1 4 0.11+0.1 –0.05 0.55±0.03 1.3±0.05 0.9±0.1 μPC8233TK NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180° C : 120±30 seconds Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). 5 μPC8233TK 6 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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