BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3227TB 5 V, SILICON GERMANIUM MMIC WIDEBAND AMPLIFIER DESCRIPTION The PC3227TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES • Low current : ICC = 4.8 mA TYP. @ VCC = 5.0 V • Output power : PO (sat) = 1.0 dBm TYP. @ f = 1.0 GHz : PO (sat) = 3.5 dBm TYP. @ f = 2.2 GHz • High linearity : PO (1dB) = 6.5 dBm TYP. @ f = 1.0 GHz : PO (1dB) = 8.0 dBm TYP. @ f = 2.2 GHz • Power gain : GP = 22.0 dB TYP. @ f = 1.0 GHz : GP = 22.0 dB TYP. @ f = 2.2 GHz • Noise Figure : NF = 4.7 dB TYP. @ f = 1.0 GHz : NF = 4.6 dB TYP. @ f = 2.2 GHz • Supply voltage : VCC = 4.5 to 5.5 V • Port impedance : input/output 50 APPLICATIONS • IF amplifiers in LNB for DBS converters etc. ORDERING INFORMATION Part Number PC3227TB-E3 Order Number Package PC3227TB-E3-A 6-pin super minimold (Pb-Free) Note Marking C3P Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PC3227TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PU10557EJ02V0DS (2nd edition) Date Published July 2005 CP(K) UPC3227TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) 3 4 3 4 4 3 2 5 2 5 5 2 1 6 1 6 6 Pin No. Pin Name 1 INPUT 2 GND 1 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC WIDEBAND AMPLIFIER (TA = +25°C, f = 1 GHz, VCC = 5.0 V, ZS = ZL = 50 ) fu PO (sat) GP NF ICC (GHz) (dBm) (dB) (dB) (mA) 2.9 +1.0 13 5.0 12 2.6 +3.0 20 4.5 12 C1H 2.9 +3.5 20.5 2.3 14 C3H PC3224TB 3.2 +4.0 21.5 4.3 9.0 C3K PC3227TB 3.2 1.0 22 4.7 4.8 C3P Part No. PC2711TB PC2712TB PC3215TB Note Note Package 6-pin super minimold PC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10557EJ02V0DS Marking C1G UPC3227TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C 6.0 V Total Circuit Current ICC TA = +25°C 15 mA Power Dissipation PD TA = +85 C 270 mW Operating Ambient Temperature TA 40 to +85 °C Storage Temperature Tstg 55 to +150 °C Input Power Pin +10 dBm Note TA = +25°C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 °C Data Sheet PU10557EJ02V0DS 3 UPC3227TB ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Parameter Symbol Test Conditions ) MIN. TYP. MAX. Unit Circuit Current ICC No input signal 4.0 4.8 6.0 mA Power Gain 1 GP1 f = 0.1 GHz, P in = 40 dBm 20.5 22.5 24.5 dB Power Gain 2 GP2 f = 1.0 GHz, P in = 40 dBm 19.5 22.0 24.5 Power Gain 3 GP3 f = 1.8 GHz, P in = 40 dBm 19.0 22.0 25.0 Power Gain 4 GP4 f = 2.2 GHz, P in = 40 dBm 19.0 22.0 25.0 Power Gain 5 GP5 f = 2.6 GHz, P in = 40 dBm 19.0 22.0 25.0 Power Gain 6 GP6 f = 3.0 GHz, P in = 40 dBm 18.0 21.0 24.5 Saturated Output Power 1 PO (sat) 1 f = 1.0 GHz, P in = 12 dBm 3.5 1.0 Saturated Output Power 2 PO (sat) 2 f = 2.2 GHz, P in = 12 dBm 6.0 3.5 Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 1.0 GHz 9.0 6.5 Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 2.2 GHz 11.0 8.0 dBm dBm Noise Figure 1 NF1 f = 1.0 GHz 4.7 5.5 Noise Figure 2 NF2 f = 2.2 GHz 4.6 5.5 Isolation 1 ISL1 f = 1.0 GHz, Pin = 40 dBm 35 40 Isolation 2 ISL2 f = 2.2 GHz, Pin = 40 dBm 35 43 Input Return Loss 1 RLin1 f = 1.0 GHz, P in = 40 dBm 7.5 10.5 Input Return Loss 2 RLin2 f = 2.2 GHz, P in = 40 dBm 7.5 10.5 Output Return Loss 1 RLout1 f = 1.0 GHz, P in = 40 dBm 10.0 13.5 Output Return Loss 2 RLout2 f = 2.2 GHz, P in = 40 dBm 7.5 9.5 Input 3rd Order Distortion IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz, Intercept Point 1 Input 3rd Order Distortion IIP32 OIP31 f1 = 2 200 MHz, f2 = 2 201 MHz, dBm 20.5 f1 = 1 000 MHz, f2 = 1 001 MHz, +4.0 OIP32 f1 = 2 200 MHz, f2 = 2 201 MHz, dBm +1.5 Pin = 40 dBm IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, 30.5 Pin = 40 dBm K factor 1 K1 f = 1.0 GHz 3.8 K factor 2 K2 f = 2.2 GHz 3.9 4 dB Pin = 40 dBm Intercept Point 2 2nd Order Intermodulation Distortion dB Pin = 40 dBm Intercept Point 1 Output 3rd Order Distortion dB Pin = 40 dBm Intercept Point 2 Output 3rd Order Distortion 18.0 dB Data Sheet PU10557EJ02V0DS dBc UPC3227TB TEST CIRCUIT VCC C4 1 000 pF 1 000 pF C3 6 50 C1 IN C2 4 1 50 OUT 100 pF 100 pF 2, 3, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR VCC AND INPUT PINS Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. Data Sheet PU10557EJ02V0DS 5 UPC3227TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-2 IN OUT C1 C2 C3 VCC C4 COMPONENT LIST Notes Value 1. 30 C1, C2 100 pF 2. Back side: GND pattern C3, C4 1 000 pF 3. Solder plated on pattern 4. : Through holes 6 30 0.4 mm double sided copper clad polyimide board. Data Sheet PU10557EJ02V0DS UPC3227TB TYPICAL CHARACTERISTICS (TA = +25 C, VCC = 5.0 V, ZS = ZL = 50 CIRCUIT CURRENT vs. SUPPLY VOLTAGE 6 CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 6.0 No Input Signal 5 5.5 4 5.0 3 , unless otherwise specified) No Input Signal 4.5 TA = +85 C 2 4.0 +25 C 1 3.5 –40 C 0 1 2 3 4 5 6 3.0 –60 –40 –20 0 40 20 60 80 Supply Voltage VCC (V) Operating Ambient Temperature TA ( C) POWER GAIN vs. FREQUENCY ISOLATION vs. FREQUENCY 30 100 0 VCC = 5.5 V 25 –10 –20 20 15 –30 5.0 V VCC = 4.5 V 4.5 V 10 –40 5 –50 0 0.1 –60 0.1 5.0 V 0.3 0.5 1.0 2.0 4.0 0.3 0.5 1.0 5.5 V 2.0 4.0 Frequency f (GHz) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 –5 0 VCC = 4.5 V –5 VCC = 4.5 V –10 –10 –15 –15 5.0 V –20 –20 5.5 V –25 –30 0.1 5.5 V 5.0 V –25 0.3 0.5 1.0 2.0 4.0 –30 0.1 Frequency f (GHz) 0.3 0.5 1.0 2.0 4.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 7 UPC3227TB OUTPUT POWER vs. INPUT POWER +5 0 OUTPUT POWER vs. INPUT POWER +5 f = 1.0 GHz f = 2.2 GHz 0 VCC = 5.5 V VCC = 5.5 V –5 –5 5.0 V 4.5 V –10 5.0 V –10 4.5 V –15 –20 –40 –15 –35 –30 –25 –20 –15 –10 –20 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) Input Power Pin (dBm) NOISE FIGURE vs. FREQUENCY NOISE FIGURE vs. FREQUENCY 6.0 6.0 5.5 5.5 TA = +85 C VCC = 4.5 V 5.0 5.0 4.5 4.5 4.0 5.5 V 4.0 5.0 V 3.5 3.0 0 –40 C 3.5 500 1 000 1 500 2 000 2 500 3 000 3.0 0 500 1 000 1 500 2 000 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. 8 +25 C Data Sheet PU10557EJ02V0DS 2 500 3 000 UPC3227TB OUTPUT POWER, IM3 vs. INPUT POWER +10 0 OUTPUT POWER, IM3 vs. INPUT POWER +10 f1 = 1 000 MHz f2 = 1 001 MHz 0 Pout –10 Pout –10 –20 –20 –30 –30 IM3 –40 –40 –50 –50 –60 –60 –70 –70 –80 –50 f1 = 2 200 MHz f2 = 2 201 MHz –40 –30 –20 –10 0 –80 –50 IM3 –40 Input Power Pin (dBm) –30 –20 –10 0 Input Power Pin (dBm) OUTPUT POWER, IM2 vs. INPUT POWER +10 IM2 vs. INPUT POWER 50 0 Pout –10 –20 40 IM2 30 –30 –40 20 –50 –60 10 –70 –80 –60 –50 –40 –30 –20 –10 0 0 –60 Input Power Pin (dBm) –50 –40 –30 –20 –10 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 9 UPC3227TB S-PARAMETERS (TA = +25 C, VCC = 5.0 V, Pin = 40 dBm) S11 FREQUENCY START : 100.000 000 MHz STOP : 5 100.000 000 MHz 1 2 1 : 1 000 MHz 91.02 2 : 2 200 MHz 82.914 2.3789 26.738 S22 FREQUENCY START : 100.000 000 MHz STOP : 5 100.000 000 MHz 1 2 1 : 1 000 MHz 77.086 2 : 2 200 MHz 92.535 10 Data Sheet PU10557EJ02V0DS 6.1797 28.438 UPC3227TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet PU10557EJ02V0DS 11 UPC3227TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260 C or below Time at peak temperature : 10 seconds or less Time at temperature of 220 C or higher : 60 seconds or less Preheating time at 120 to 180 C : 120 30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260 C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120 C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350 C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10557EJ02V0DS HS350 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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