NEC's L-BAND SP3T SWITCH UPG2031TQ FEATURES DESCRIPTION • LOW INSERTION LOSS: LINS = 0.45 dB TYP. @ Vcont = 2.8 V/0 V, f = 1.0 GHz LINS = 0.55 dB TYP. @ Vcont = 2.8 V/0 V, f = 2.0 GHz NEC's UPG2031TQ is an L-band SP3T GaAs FET switch for CDMA/PCS/GPS triple mode digital cellular telephone applications. The device can operate from 500 MHz to above 2.0 GHz, with low insertion loss and high linearity. • HIGH ISOLATION: ISL = 21 dB TYP. @ Vcont = 2.8 V/0 V, f = 2.0 GHz • HIGH POWER: Pin (0.1 dB) = 33.0 dBm TYP. @ Vcont = 2.8 V/0 V, f = 1.0 GHz • HIGH-DENSITY SURFACE MOUNTING: 10-pin plastic TSON package (2.30 × 2.55 × 0.60 mm) APPLICATIONS • CDMA/PCS/GPS triple mode digital cellular telephones ORDERING INFORMATION Part Number Package UPG2031TQ-E1-A 10-pin plastic TSON Marking 2031 Supplying Form • Embossed tape 8 mm wide • Pin 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2031TQ Caution Observe precautions when handling, because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2031TQ PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 10 9 8 7 (Bottom View) 6 6 2 3 4 8 9 10 GND 2031 1 7 5 5 4 3 2 1 Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RF3 6 Vcont3 7 GND 8 ANT 9 GND 10 Vcont1 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings Unit Vcont −6.0 to +6.0 V Input Power Pin +36 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Symbol MIN. TYP. MAX. Unit Switch Control Voltage (High) Parameter Vcont (H) 2.7 2.8 3.0 V Switch Control Voltage (Low) Vcont (L) −0.2 0 0.2 V UPG2031TQ ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, ZO = 50 Ω, off chip DC blocking capacitors value: 56 pF, unless otherwise specified) Parameter Symbol ON-Pass Test Conditions MIN. TYP. MAX. Unit Insertion Loss LINS ANT-RF1/2/3 f = 0.5 to 1.0 GHz − 0.45 0.65 dB f = 1.0 to 2.0 GHz − 0.55 0.80 dB Isolation ISL ANT-RF1/2/3 f = 0.5 to 1.0 GHz 22 26 − dB (OFF) f = 1.0 to 2.0 GHz 17 21 − dB Input Return Loss RLin ANT-RF1/2/3 f = 0.5 to 2.0 GHz 15 20 − dB Output Return Loss RLout ANT-RF1/2/3 f = 0.5 to 2.0 GHz 15 20 − dB Pin (0.1 dB) ANT-RF1/2/3 f = 1.0 GHz 31.0 33.0 − dBm 2nd Harmonics 2f0 ANT-RF1/2/3 f = 1.0 GHz, Pin = 27 dBm 65 75 − dBc 3rd Harmonics 3f0 ANT-RF1/2/3 f = 1.0 GHz, Pin = 27 dBm 65 75 − dBc Switch Control Speed tsw − 150 − ns Switch Control Current Icont − 1 50 μA 0.1 dB Gain Compression Input Power RF Non UPG2031TQ EVALUATION CIRCUIT RF1 Vcont2 C2 RF3 C1 C1 Vcont1 C2 2031 RF2 C1 ANT C1 LESD Note Vcont3 C2 Note Recommend attached LESD to antenna port for ESD protection. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. USING THE NEC EVALUATION BOARD Symbol Values C1 56 pF C2 1 000 pF TRUTH TABLE Vcont1 RF1 Vcont1 GND GND RF2 ANT Vcont2 GND RF3 Vcont3 Vcont2 Vcont3 ANT-RF1 ANT-RF2 ANT-RF3 High Low Low High Low ON OFF OFF Low OFF ON OFF Low Low High OFF OFF ON UPG2031TQ PACKAGE DIMENSIONS (Bottom View) 0.18±0.05 (0.15) (1.70) 2.20±0.1 (0.60 MAX.) 2.30±0.15 (0.125) (1.95) (0.95) 2.25±0.1 2.55±0.15 (0.05) 0.40±0.05 (0.30) 10-PIN PLASTIC TSON (UNIT: mm) Remark ( ): Reference value 5-144 (0.30) UPG2031TQ RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 03/08/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 5-145 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. 5-146