ETC YTV-F1S

www.yestechinc.com
YT-Formula-Series_DS(V1)
11/17/05
12:04 PM
Page 1
YTV F1 Series AOI
Automated
PCB
Inspection
• Quick Set-up
• High Speed
• High Defect Coverage
• Low False Failure Rate
• Best Price Performance
YESTech’s advanced Thin Camera™ technology
offers high-speed PCB inspection with
exceptional defect coverage. With up to
two top-down viewing cameras and four side
viewing cameras, the F1-Series inspects
solder joints and verifies correct part
assembly enabling users to improve quality
and increase throughput.
Programming the F1-Series is fast and intuitive. Operators typically take less than 30 minutes to create a
complete inspection program including solder inspection. The F1-Series utilizes a standard package library
to simplify training and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including color,
normalized correlation and rule-based algorithms, to provide complete inspection coverage with an
extremely low false failure rate.
Configurable for all line positions, the F1-Series is equally
effective for paste, pre / post-reflow or final assembly inspection.
Automated Inspection for:
• Solder defects
Off-line programming maximizes machine utilization and real-time
SPC monitoring provides a valuable yield enhancement solution.
• Lead defects
• Component presence
and position
• Correct part / polarity
• Through-hole parts
• Paste
YT-Formula-Series_DS(V1)
11/17/05
12:04 PM
Page 2
www.yestechinc.com
www.yestech.com.cn
Y T V
F 1
S e r i e s
A O I
S p e c i f i c a t i o n s
Models
YTV-F1
Multi-function system with top-down viewing camera
YTV-F1S
Multi-function all purpose system with single top-down and 4 side
viewing cameras
Inspection Capabilities
Throughput:
Up to 5 sq. in./ sec.
> 250,000 components per hour
Maximum Board Size:
22” x 20” (560mm x 510mm)
Clearance:
2” (50mm) top and bottom
Minimum Component Size:
0201; 01005 with high magnification option
Defects Detected:
Component:
position, missing, wrong, polarity, skew, tombstone
Lead:
bent, lifted, bridging
Solder:
open, insufficient, short, solder balls
Software
Algorithms:
Normalized correlation, OCV, OCR, barcode recognition
and rule-based
CAD Input:
Pick and place data, CAD x-y data
CAD Translation Package:
Excel, Circuitcam, Unicam, CIMBridge, Fabmaster
Programming Skill Level:
Technician or operator
Operating System:
Windows XP Professional
Off-line Software:
Optional software for rework and off-line programming
Outputs:
Real-time SPC outputs reporting first pass yield, defect by classification,
reference designator and part number with remote monitoring.
Hardware
Material Handling:
USB 2, SMEMA, dual direction auto width conveyor
Lighting:
LED top light, proprietary bi-color multiangle LED lighting
Imager:
Multiple Thin Camera™ mega-pixel color cameras
Resolution 1280 x 1024; 25 micron pixel size
Board Clamps:
Optional
High Magnification:
Optional 12 micron high magnification camera
Bottom Side Camera:
Optional for bottom side bar codes
Facilities
Power:
110VAC ( 220 optional ) 50/60 Hz, 15 amps
Air input:
30 PSI min., 1/4 air hose
Footprint:
55” x 57” x 50” (1400mm x 1450mm x 1270mm)
Weight:
2,000 lbs (907 kg)
Machine Installation:
< 1 hour
YESTech Inc.
1317 Calle Avanzado • San Clemente CA. 92673 • tel: (949) 361-2714 • fax: (949) 361-2724 • [email protected]