www.yestechinc.com YT-Formula-Series_DS(V1) 11/17/05 12:04 PM Page 1 YTV F1 Series AOI Automated PCB Inspection • Quick Set-up • High Speed • High Defect Coverage • Low False Failure Rate • Best Price Performance YESTech’s advanced Thin Camera™ technology offers high-speed PCB inspection with exceptional defect coverage. With up to two top-down viewing cameras and four side viewing cameras, the F1-Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. Programming the F1-Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The F1-Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate. Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-reflow or final assembly inspection. Automated Inspection for: • Solder defects Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution. • Lead defects • Component presence and position • Correct part / polarity • Through-hole parts • Paste YT-Formula-Series_DS(V1) 11/17/05 12:04 PM Page 2 www.yestechinc.com www.yestech.com.cn Y T V F 1 S e r i e s A O I S p e c i f i c a t i o n s Models YTV-F1 Multi-function system with top-down viewing camera YTV-F1S Multi-function all purpose system with single top-down and 4 side viewing cameras Inspection Capabilities Throughput: Up to 5 sq. in./ sec. > 250,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option Defects Detected: Component: position, missing, wrong, polarity, skew, tombstone Lead: bent, lifted, bridging Solder: open, insufficient, short, solder balls Software Algorithms: Normalized correlation, OCV, OCR, barcode recognition and rule-based CAD Input: Pick and place data, CAD x-y data CAD Translation Package: Excel, Circuitcam, Unicam, CIMBridge, Fabmaster Programming Skill Level: Technician or operator Operating System: Windows XP Professional Off-line Software: Optional software for rework and off-line programming Outputs: Real-time SPC outputs reporting first pass yield, defect by classification, reference designator and part number with remote monitoring. Hardware Material Handling: USB 2, SMEMA, dual direction auto width conveyor Lighting: LED top light, proprietary bi-color multiangle LED lighting Imager: Multiple Thin Camera™ mega-pixel color cameras Resolution 1280 x 1024; 25 micron pixel size Board Clamps: Optional High Magnification: Optional 12 micron high magnification camera Bottom Side Camera: Optional for bottom side bar codes Facilities Power: 110VAC ( 220 optional ) 50/60 Hz, 15 amps Air input: 30 PSI min., 1/4 air hose Footprint: 55” x 57” x 50” (1400mm x 1450mm x 1270mm) Weight: 2,000 lbs (907 kg) Machine Installation: < 1 hour YESTech Inc. 1317 Calle Avanzado • San Clemente CA. 92673 • tel: (949) 361-2714 • fax: (949) 361-2724 • [email protected]