ZHX2022 FIR Transceiver Product Specification PS021802-1005 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432 www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether a later edition exists, or to request copies of publications, contact: ZiLOG Worldwide Headquarters 532 Race Street San Jose, CA 95126-3432 www.ZiLOG.com ZiLOG is a registered trademark of ZiLOG Inc. in the United States and in other countries. All other products and/or service names mentioned herein may be trademarks of the companies with which they are associated. Document Disclaimer ©2005 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZiLOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. Devices sold by ZiLOG, Inc. are covered by warranty and limitation of liability provisions appearing in the ZiLOG, Inc. Terms and Conditions of Sale. ZiLOG, Inc. makes no warranty of merchantability or fitness for any purpose. Except with the express written approval of ZiLOG, use of information, devices, or technology as critical components of life support systems is not authorized. No licenses are conveyed, implicitly or otherwise, by this document under any intellectual property rights. PS021802-1005 ZHX2022 FIR Transceiver iii Table of Contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Parts Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinout and Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical and Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended Circuit Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 I/O and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Mode Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s) . . . . . . . . 14 Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s) . . . . . . . . 15 Recommended SMD Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ZHX2022 Soldering and Cleaning Recommendations . . . . . . . . . . . . . . . . . . . Reflow Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Manual Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 16 Current Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Taping Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Customer Feedback Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Customer Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Return Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Problem Description or Suggestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PS021802-1005 22 22 22 22 22 ZHX2022 FIR Transceiver iv List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. FIR Transceiver Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Mode Switching Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Pad Layout (mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Temperature Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reel Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. PS021802-1005 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Eye Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical Characteristics—Transceiver . . . . . . . . . . . . . . . . . . . . . . . 6 Optoelectronic Characteristics—Receiver . . . . . . . . . . . . . . . . . . . . . 8 Optoelectronic Characteristics—Transmitter . . . . . . . . . . . . . . . . . . . 9 Recommended Application Circuit Components . . . . . . . . . . . . . . . 13 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ZHX2022 FIR Transceiver 1 Description Whether you need to mount the IrDA transceiver so that its communication is parallel or perpendicular to the plane of the PCB, the ZiLOG ZHX2022 is the solution for applications in portable products, such as USB Adapters, notebook PCs, printers, mobile phones, digital cameras, handheld devices, or personal data assistants (PDAs). Designed to support all IrDA data rates up to 4 Mbits/second as well as LocalTalk™ and Sharp ASK™ modes, the transceiver combines an infrared emitting diode (IRED) emitter, a PIN photodiode detector, an IRED driver, and an integrated AGC (Automatic Gain Control) and amplification receive circuit in a single, miniature package. The ZiLOG ZHX2022 provides an efficient implementation of the IrDA-Data 1.4 standard in a small footprint format. Application circuit space is also minimized, as only three external components (current-limiting resistor, terminating resistor, and a decoupling capacitor) are required to implement a complete IrDA transceiver solution. The ZHX2022 is capable of both mode select and legacy-mode bandwidth switching. Features PS021802-1005 • Supply voltage 2.7 V to 5.5 V, operating idle current (receive mode) < 3 mA, shutdown current < 5 µA over full temperature range • • • • Surface mount package, top and side view, 9.7 mm x 4.7 mm x 4.0 mm • • Tri-state-receiver output, floating in shut down with a weak pull-up Operating temperature: –30 °C to 85 °C Storage temperature: –40 °C to 85 °C Transmitter wavelength typically 886 nm, supporting IrDA® and Remote Control Eye safety class 1 (IEC60825-1, ed. 2001), limited LED on-time, LED current is controlled, no single fault to be considered ZHX2022 FIR Transceiver 2 Applications • Notebook computers, desktop PCs, palmtop computers (Win CE, Palm PC), PDAs • • • • • • Digital still and video cameras Printers, fax machines, photocopiers, screen projectors Telecommunication products (cellular phones, pagers) Internet TV boxes, video conferencing systems External infrared adapters (dongles) Medical and industrial data collection Parts Table Part Description ZHX2022MV040THTR Oriented in carrier tape for side-view surface mounting 1,000 pieces ZHX2022TV040THTR Oriented in carrier tape for top-view surface mounting 1,000 pieces Note: All ZiLOG devices are available lead free. ZHX2022 has always been lead free. These devices meet or exceed RoHS Directive 2002/95/EC. For additional information, please see the ZiLOG Quality and Reliability web page at http://www.zilog.com/quality/index.asp. PS021802-1005 Quantity/ Reel ZHX2022 FIR Transceiver 3 Block Diagram Figure 1 is the block diagram for the FIR transceiver. Tri-State Driver Amplifier Rxd Comparator VCC2 Controlled Driver Mode Logic & SD Txd Control VCC1 Figure 1. FIR Transceiver Block Diagram Pinout and Pin Description Figure 2. Pinout PS021802-1005 GND ZHX2022 FIR Transceiver 4 Table 1. Pin Description Pin Number Function Description I/O Active 1 VCC2 LEDA Connect LEDA directly to either VCC1 (regulated) or to VCC2 (unregulated) or battery. For voltages higher than 3.6 V, an external resistor might be necessary for reducing the internal power dissipation. 2 LEC IRED cathode, internally connected to driver transistor. Do not connect. 3 Txd This input is used to transmit serial data when SD is low. An on-chip protection circuit disables the LED driver if the Txd pin is asserted for longer than 80 µs. When used in conjunction with the SD pin, this pin is also used to receiver speed mode. I HIGH 4 Rxd Received Data Output, push-pull CMOS driver output capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 kΩ (typical) in shutdown mode. O LOW 5 SD Shutdown, also used for dynamic mode switching. Setting this pin active places the module into shutdown mode. On the falling edge of this signal, the state of the Txd pin is sampled and used to set receiver low bandwidth (Txd=Low, SIR) or high bandwidth (Txd=High, MIR and FIR) mode. Will be overwritten by the mode pin input, which must float, when dynamic programming is used. I HIGH 6 VCC1 Supply voltage (regulated) 7 Mode HIGH: High speed mode, MIR and FIR; LOW: Low speed mode, SIR only (see “Mode Switching” on page 13). I 7 Mode The mode pin can also be used to indicate the dynamically programmed mode. The maximum load is limited to 50 pF. High indicates FIR/MIR mode, low indicates SIR mode O 8 GND Ground PS021802-1005 ZHX2022 FIR Transceiver 5 Electrical and Timing Specifications Notes: Reference point: Ground Pin 8, unless otherwise noted Typical values are for design aid only, not guaranteed nor subject to production testing. Table 2. Absolute Maximum Ratings Parameter Symbol Min Typical Max Unit Supply voltage range, transceiver 0 V < VCC2 < 6 V VCC1 –0.5 +6 V Supply voltage range, transmitter 0 V < VCC1 < 6 V VCC2 –0.5 +6.5 V 10 mA 25 mA PD 500 mW Junction temperature TJ 125 °C Ambient temperature range (operating) Tamb –30 +85 °C Storage temperature range Tstg –40 +85 °C 240 °C IRED(DC) 125 mA IRED(RP) 600 mA +6.5 V 5.5 V 50 pF Input currents Test Conditions For all pins, except IRED anode pin Output sinking current Power dissipation Soldering temperature See derating curve (Figure 6). See “ZHX2022 Soldering and Cleaning Recommendations” on page 16. Average output current Repetitive pulse output current < 90 µs, ton < 20% IRED anode voltage Voltage at all inputs and outputs Load at mode pin when used as mode indicator PS021802-1005 VIREDA Vin > VCC1 is allowed VIN –0.5 ZHX2022 FIR Transceiver 6 Notes: Reference point pin: GND, unless otherwise noted Typical values are for design aid only, not guaranteed nor subject to production testing. Table 3. Eye Safety Information Parameter Test Conditions Symbol Min Typical Virtual source size Method: (1 - 1/e) encircled energy d 2.5 2.8 Maximum Intensity for Class 1 IEC60825-1 or EN60825-1, edition January 2001 Max Unit mm Ie * 500** mW/sr * Due to the internal limitation measures, the device is a “class1” device. ** IrDA specifies the maximum intensity with 500 mW/sr. Notes: Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. Table 4. Electrical Characteristics—Transceiver Parameter Test Conditions Supply voltage Symbol Min VCC 2.7 Typical Max Unit 5.5 V Dynamic supply current (Idle)1 SD=Low, Ee=0 klx ICC 2 3 mA Dynamic supply current (Idle)1 SD=Low, E =1 klx2 ICC 2 3 mA 1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output current depending on Rxd load. 2) Standard Illuminant A 3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is recommended to use the specified min/max values to avoid increased operating current. ESD > 4000 V (HBM), Latchup > 200 mA EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield) PS021802-1005 ZHX2022 FIR Transceiver 7 Table 4. Electrical Characteristics—Transceiver (Continued) Parameter Test Conditions Symbol Shutdown supply current SD=High, Mode=Floating Ee=0 klx SD=High, Mode=Floating Ee=1 klx2 Min Typical Max Unit ISD 2.0 µA ISD 2.5 µA 5 µA +85 °C 0.4 V SD=High, T=85 °C, ISD Mode=Floating, not ambient light sensitive Operating temperature range TA –25 Output voltage low IOL=1 mA, Cload=15 pF Output voltage high IOH=500 µA, Cload=15 pF VOH 0.8 x VCC V IOH=250 µA, Cload=15 pF 0.9 x VCC V VOL VOH Output Rxd current limitation Short to Ground high state 20 mΑ Output Rxd current limitation Short to VCC1 low state 20 mΑ 600 kΩ 0.5 V Rxd to VCC1 impedance SD=High RRxd 400 VIL 0.5 CMOS level3 VIH VCC – 0.5 TTL level, VCC1=4.5 V VIH 2.4 Input leakage current (Txd, SD) IL –10 +10 µA Input leakage current Mode IICH –2 +2 µA Input capacitance (Txd, SD, Mode) CI 5 pF Input voltage low (Txd, SD, Mode) Input voltage high (Txd, SD, Mode) 500 VCC+0.5 V V 1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output current depending on Rxd load. 2) Standard Illuminant A 3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is recommended to use the specified min/max values to avoid increased operating current. ESD > 4000 V (HBM), Latchup > 200 mA EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield) PS021802-1005 ZHX2022 FIR Transceiver 8 Notes: Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. Table 5. Optoelectronic Characteristics—Receiver Parameter Test Conditions Symbol Min Typical Max Unit Minimum detection threshold 9.6 kbit/s to 115.2 kbit/s irradiance, SIR mode λ=850 nm to 900 nm Ee 25 (2.5) 35 mW/m2 (3.5) (µW/cm2) Minimum detection threshold 1.152 Mbit/s irradiance, MIR mode λ=850 nm to 900 nm Ee 65 (6.5) mW/m2 (µW/cm2) Minimum detection threshold 4.0 Mbit/s irradiance, FIR mode λ=850 nm to 900 nm Ee 80 (8.0) 90 mW/m2 (9.0) (µW/cm2) Maximum detection threshold irradiance λ=850 nm to 900 nm Ee 5 (500) kW/m2 (mW/cm2) No detection receiver input irradiance * Ee Rise time of output signal 10% to 90%, 15 pF tr (Rxd) 10 40 ns Fall time of output signal 90% to 10%, 15 pF tf (Rxd) 10 40 ns Rxd pulse width of output signal, 50% SIR mode input pulse length 1.4 µs < PWopt < 25 µs tPW 1.5 1.8 2.1 µs Rxd pulse width of output signal, 50% MIR mode input pulse length PWopt=217 ns, 1.152 kbit/s tPW 110 250 270 ns Rxd pulse width of output signal, 50% FIR mode input pulse length PWopt=125 ns, 4.0 Mbit/s tPW 100 140 ns input pulse length PWopt=250 ns, 4.0 Mbit/s tPW 225 275 ns Stochastic jitter, leading edge input irradiance=100 mW/m2, 4.0 Mbit/s mW/m2 (µW/cm2) 4 (0.4) 20 ns Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header. The data given here are valid 5 µs after starting the preamble. *This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps. PS021802-1005 ZHX2022 FIR Transceiver 9 Table 5. Optoelectronic Characteristics—Receiver (Continued) Parameter Test Conditions Receiver start up time Symbol Min Typical Max Unit input irradiance=100 mW/m2, 1.152 Mbit/s 40 ns input irradiance=100 mW/m2, 576 kbit/s 80 ns input irradiance=100 mW/m2, < 115.2 kbit/s 350 ns After completion of shutdown programming sequence Power on delay 500 µs Latency 170 tL 300 µs Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header. The data given here are valid 5 µs after starting the preamble. *This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps. Notes: Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. Table 6. Optoelectronic Characteristics—Transmitter Parameter Test Conditions Symbol Min IRED operating current, switched current limiter See derating curve (Figure 6). For 3.3 V operations, no external resistor needed. For 5 V application, that might be necessary depending on operating temperature range. ID 500 IIRED –1 Output leakage IRED current Typical Max Unit 550 600 mA 1 µA *Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t. However, at pulse duration larger than 80 µs, the optical output pulse duration is limited to 85 µs. This pulse duration limitation can already start at 20 µs. PS021802-1005 ZHX2022 FIR Transceiver 10 Table 6. Optoelectronic Characteristics—Transmitter (Continued) Parameter Test Conditions Symbol Min Output radiant intensity recommended application circuit α=0 °, 15 ° Ie 120 Output radiant intensity Txd=High, SD=Low, VCC1=VCC2=3.3 V Internally current-controlled, no external resistor VCC1=5.0 V, a=0 °, 15 ° Txd=Low or SD=High, (Receiver is inactive as long as SD=High) Typical Max Unit 170 350 mW/m2 (µW/cm2) 0.04 kW/m2 (mW/cm2) Ie mW/m2 (µW/cm2) Output radiant intensity, angle of half intensity α Peak - emission wavelength λP Spectral bandwidth ∆λ Optical rise time, fall time tropt, tfopt 10 Optical output pulse duration input pulse width 217 ns, 1.152 kbit/s topt 207 217 227 ns input pulse width 125 ns, 4.0 Mbit/s topt 117 125 133 ns input pulse width 250 ns, 4.0 Mbit/s topt 242 250 258 ns input pulse width 0.1 µs < tTxd < 80 µs * topt tTxd ns input pulse width tTxd > 80 µs topt * Optical overshoot +24 880 900 ns 40 20 ns 40 µs 85 ns 25 ns *Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t. However, at pulse duration larger than 80 µs, the optical output pulse duration is limited to 85 µs. This pulse duration limitation can already start at 20 µs. PS021802-1005 ZHX2022 FIR Transceiver 11 Recommended Circuit Diagram ZiLOG transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive, and inductive wiring should be avoided. The inputs (Txd, SD, Mode) and the output Rxd should be directly (DC) coupled to the I/O circuit. See Figure 3 and Table 7. The resistor R1 is only necessary for higher operating voltages and elevated temperatures (see derating curve in Figure 6) to avoid too high internal power dissipation. The capacitor C1 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2 and C1 are optional and dependent on the quality of the supply voltage VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C1 as near as possible to the transceiver power supply pins. In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. For example, see The Art of Electronics, Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press, ISBN: 0521370957. PS021802-1005 ZHX2022 FIR Transceiver 12 1.0 µF ceramic Place within 3 mm of pin. (Note that LEDA may be powered from a separate unregulated voltage supply.) Vcc= 2.7 to 3.3 V C1 L R2 1 LEDA IrDA enabled I/O Controller, Microcontroller, ENDEC, or ASIC IRTxD 3 IRSD 5 IRRxD 4 Vss 6 Vcc TxD SD ZHX2022 RxD MODE GND 8 7 1.0 µF ceramic Place within 3 mm of pin. Vcc= 3.4 to 5.5 V C1 L R1 IrDA enabled I/O Controller, Microcontroller, ENDEC, or ASIC IRTxD 3 IRSD 5 IRRxD 4 Vss Note: Lands to Pins 1, 6, 3, 4, 5, and 7 should be 0.38 mm min. wide. Connect ground plane within 1.58 mm of pins. .254 mm S Ground Plane TxD SD ZHX2022 RxD Value for R 1- For Vcc </= 3.3 V, use 0 ohm. For Vcc > 3.3 V, use 2 ohm. S R2 Values for R 2 .38 mm (.015”) 68 .76 mm (.030”) 91 Length, L, is not important. Maintain land width constant without intermediate vias. Make corners rounded not sharp. .762 mm (min) Figure 3. Application Block Diagram PS021802-1005 6 Vcc MODE GND 8 7 4 oz. copper; 0.0356 mm thicknes FR4 R2 1 LEDA ZHX2022 FIR Transceiver 13 Table 7. Recommended Application Circuit Components Component Recommended Value C1 1.0 µF, Ceramic R1 5 V supply voltage: 2 Ω, 0.25 W (recommended using two 1 Ω, 0.125 W resistor in series) 3.3 V supply voltage: no resistors necessary; the internal controller is able to control the current R2 68 or 91 Ω, 0.125 W I/O and Software In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases, refer to the I/O manual, the ZiLOG application notes, or contact directly ZiLOG Sales, Marketing or Application. Mode Switching The ZHX2022 is in the SIR mode after power on as a default mode; therefore, the FIR data transfer rate has to be set by a programming sequence using the Txd and SD inputs as described in the following sections or selected by setting the Mode Pin. The Mode Pin can be used to statically set the mode (Mode Pin: LOW: SIR, HIGH: 0.576 Mbit/s to 4.0 Mbit/s). If not used or in standby mode, the mode input should float or should not be loaded with more than 50 pF. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. See Figure 4 and Table 8. PS021802-1005 ZHX2022 FIR Transceiver 14 Figure 4. Mode Switching Timing Diagram Table 8. Truth Table Inputs Outputs SD Txd Optical Input Irradiance mW/m2 Rxd Transmitter high x x weakly pulled (500 kΩ to VCC1) 0 low high x high Ie low high > 80 µs x high 0 low low <4 high 0 low low > Min. Detection Threshold Irradiance < Max. Detection Threshold Irradiance low (active) 0 low low > Max. Detection Threshold Irradiance x 0 To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described in the following sections are required. Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s) 1. Set SD input to logic “HIGH”. 2. Set Txd input to logic “HIGH”. Wait ts > 200 ns. 3. Set SD to logic “LOW” (this negative edge latches state of Txd, which determines the speed setting). PS021802-1005 ZHX2022 FIR Transceiver 15 4. After waiting th > 200 ns, Txd can be set to logic “LOW”. The hold time of Txd is limited by the maximum allowed pulse length. After that, Txd is enabled as normal Txd input, and the transceiver is set for the high bandwidth (576 kbit/s to 4 Mbit/s) mode. Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s) 1. Set SD input to logic “HIGH”. 2. Set Txd input to logic “LOW”. Wait ts > 200 ns. 3. Set SD to logic “LOW” (this negative edge latches state of Txd, which determines speed setting). 4. Txd must be held for th > 200 ns. After that Txd is enabled as normal Txd input and the transceiver is set for the lower bandwidth (9.6 kbit/s to 115.2 kbit/s) mode. Recommended SMD Pad Layout The leads of the device should be soldered in the center position of the pads. For more configurations, see inside the device drawing. Figure 5. Pad Layout (mm) Note: Leads of the device should be at least 0.3 mm within the ends of the pads. PS021802-1005 ZHX2022 FIR Transceiver 16 ZHX2022 Soldering and Cleaning Recommendations Follow these recommendations to maintain the performance of the ZHX2022 transceivers. Reflow Soldering Note: Please refer to ZiLOG’s Lead-Free Solder Reflow: Packaging Application Note (AN0161, http://www.zilog.com/docstools.asp) for more information about the solder profile. Manual Soldering • • • • Use 63/37 or silver solder. Temperature at solder iron tip: no more than 280 °C Finish soldering within 3 seconds. Handle only after the ZHX2022 transceivers have cooled off. Cleaning Perform cleaning under the following conditions: • • • PS021802-1005 Cleaning agent: alcohol Temperature and time 30 seconds below 50 °C or 3 minutes below 30 °C Ultrasonic cleaning: below 20 W ZHX2022 FIR Transceiver 17 Current Derating Diagram Figure 6 shows the maximum operating temperature when the device is operated without external current limiting resistor. A power dissipating resistor of 2 Ω is recommended from the cathode of the IRED to Ground for supply voltages above 4 V. In that case the device can be operated up to 85 °C, too. Figure 6. Temperature Derating Diagram PS021802-1005 ZHX2022 FIR Transceiver 18 Mechanical Specifications 2022 Figure 7. Package Dimensions in mm PS021802-1005 ZHX2022 FIR Transceiver 19 Taping Specifications Figure 8. Reel Dimensions in mm PS021802-1005 Version Tape Width A max. N W1 min. W2 max. W3 min. W3 max. mm mm mm mm mm mm mm mm C 24 330 60 24.4 30.4 23.9 27.4 ZHX2022 FIR Transceiver 20 18269 Figure 9. Tape Dimensions in mm PS021802-1005 ZHX2022 FIR Transceiver 21 2022 18283 Figure 10. Tape Dimensions in mm PS021802-1005 ZHX2022 FIR Transceiver 22 Customer Feedback Form If you experience any problems while operating this product, or if you note any inaccuracies while reading this product specification, please copy and complete this form, then mail it to ZiLOG (see Return Information, below). We also welcome your suggestions! Customer Information Name Country Company Phone Address Fax City/State/Zip email Product Information Serial # or Board Fab #/Rev # Software Version Document Number Host Computer Description/Type Return Information ZiLOG System Test/Customer Support 532 Race Street San Jose, CA 95126-3432 Web site: www.zilog.com Problem Description or Suggestion Provide a complete description of the problem or your suggestion. If you are reporting a specific problem, include all steps leading up to the occurrence of the problem. Attach additional pages as necessary. _______________________________________________________________________________ _______________________________________________________________________________ _______________________________________________________________________________ PS021802-1005