ZMD31014 RBic iLite™ Low-Cost Sensor Signal Conditioner with I2C & SPI Brief Description RBiciLiteTM The is a CMOS integrated circuit for highly accurate amplification and analog-to-digital conversion of differential and half-bridge input signals. The RBiciLiteTM can compensate the measured signal for offset, 1st and 2nd order span, and 1st and 2nd order temperature (Tco and Tcg). It is well-suited for sensor-specific correction of bridge sensors. Digital compensation of signal offset, sensitivity, temperature drift, and non-linearity is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a non-volatile EEPROM. The RBiciLiteTM is adjustable to nearly all piezo-resistive bridge sensors. Measured and corrected bridge values are provided at digital output pins, which can be configured as I2C or SPI. The digital I2C interface can be used for a simple PC-controlled calibration procedure to program calibration coefficients into an on-chip EEPROM. The calibrated RBiciLiteTM and a specific sensor are mated digitally: fast, precise, and without the cost overhead associated with trimming by external devices or laser trimming. Integrated diagnostics functions make the RBiciLiteTM particularly well-suited for safety-critical applications. Features • • • • • • • High accuracy (±0.1% FSO @ -25 to +85°C; ±0.25% FSO @ -40 to +125°C) 2nd order charge-balancing analog-to-digital converter provides low noise, 14-bit data at sample rates exceeding 2kHz Fast power-up to data output response: 3ms at 4MHz Digital compensation of sensor offset, sensitivity, temperature drift, and non-linearity Eight programmable analog gain settings combine with a digital gain term; accommodates bridges with spans <1mV/V and high offset Internal or optional external temperature compensation for sensor correction and for corrected temperature output 48-bit customer ID field for module traceability Benefits • • • • • Simple PC-controlled configuration and singlepass digital calibration via I2C interface – quick, precise, and low cost; SPI option for measurement modeneed for external trimming Eliminates components On-chip diagnostic features add safety to the application (e.g., EEPROM signature, bridge connection checks, bridge short detection). Low-power Sleep Mode lengthens battery life Enables multiple sensor networks Available Support • • • Evaluation Kit Application Notes Mass Calibration Solution Physical Characteristics • • • • • Wide supply voltage capability: 2.7V to 5.5V Current consumption as low as 70μA depending on programmed sample rate Low-power Sleep Mode (<2μA @ 25°C) Operation temperature: -40°C to +125°C Small SOP8 package ZMD31014 Application: I 2C Interface, Low Power Bsink Option, Internal Temperature Correction Vsupply RBiciLite™ VSS BSINK (2.7V to 5.5V) VDD INT/SS VBP SDA/MISO VBN SCL/SCLK 0.1µF GND © 2009 ZMD AG — Rev. 1.0 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZMD31014 RBic iLite™ Low-Cost Sensor Signal Conditioner with I2C & SPI ZMD31014 Block Diagram VDD 0.1µF Temperature Reference Sensor Applications Diagnostics Industrial: building automation, dataloggers, pressure meters, leak detection monitoring POR/Oscillator RBiciLite™ VBP Medical: infusion pumps, blood pressure meters, air mattresses, apnea monitors A VBN PreAmp INMUX (2.7V - 5.5V) D 14-Bit ADC Optional Bsink White Goods / Appliances: fluid level, refrigerant Bsupply Consumer: body monitors, portable monitors, desktop weather stations, bathroom scales, toys/games Optional EEPROM w/ Charge Pump & Checksum DSP Core I2C or SPI Interface INT/SS SDA/MISO SCL/SCLK RTD VSS Application: Bridge TC Used for External Temperature Application: Generic Differential A2D Converter VSupply RBiciLite™ VSS VDD BSINK INT/SS VBP SDA/MISO VBN SCL/SCLK 0.1µF GND Ordering Information Sales Code Description ZMD31014DAB ZMD31014 RBiciLite™ Die — Temperature range: -40°C to +125°C Package Unsawn on Wafer ZMD31014DAC ZMD31014 RBiciLite™ Die — Temperature range: -40°C to +125°C Sawn on Wafer Frame ZMD31014DAD ZMD31014 RBiciLite™ Die — Temperature range: -40°C to +125°C Waffle Pack ZMD31014DAG1 ZMD31014 RBiciLite™ SOP8 (150 mil) — Temperature range: -40° to +125°C Tube: add “-T” to sales code Reel: add “-R” ZMD31014KIT ZMD31014 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement Board, Software, USB Cable, 5 IC Samples Kit Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG (ZMD AG) ZMD America, Inc. ZMD AG, Japan Office ZMD Far East, Ltd. Grenzstrasse 28 01109 Dresden Germany 8413 Excelsior Drive Suite 200 Madison, WI 53717 USA Phone Fax Phone Fax Phone Fax Phone Fax +49 (0)351.8822.7.772 +49(0)351.8822.87.772 +01 (608) 829-1987 +01 (631) 549-2882 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan +81.3.6895.7410 +81.3.6895.7301 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan +886.2.2377.8189 +886.2.2377.8199 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. © 2009 ZMD AG — Rev. 1.0 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.