ZMD31020 Sensor Signal Conditioner Datasheet Features Brief Description • Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity • Adjustable to nearly all piezo-resistive bridge sensor types • Digital one-shot calibration: quick and precise • Selectable temperature compensation reference: internal or external diode • Output options: 0...5V analog ratiometric voltage 2 or 12 bit digital I C interface • Product traceability by user-defined EEPROM entries • Operation temperature range, depending on product version, up to –40...+125°C • Supply voltage +4.5...+5.5V • Sampling rate ≥100Hz • Available in SSOP14 or as die ZMD31020 is a CMOS integrated circuit for highlyaccurate amplification and sensor-specific correction of bridge sensor signals. The device provides digital compensation of sensor offset, sensitivity, temperature drift and non-linearity by a 16-bit RISC micro controller running a correction algorithm. ZMD31020 accommodates nearly all piezo-resistive bridge sensor types. 2 The bi-directional digital I C interface can be used for a simple PC-controlled one-shot calibration procedure, in order to program a set of calibration coefficients into an on-chip EEPROM. Thus a specific sensor and a ZMD31020 are mated digitally: fast, precise and without the cost overhead associated with trimming by external devices or laser. ZMD31020 has been designed for industrial and consumer applications and is specifically suited for most pressure sensors. Benefits • • • No external trimming components required PC-controlled configuration and calibration via digital bus interface - simple, low cost High accuracy (±0.1% FSO @ -25 to 85°C; ±0.25% FSO @ -40 to 125°C) § Demo kit available (incl. calibration PCB, SSOP14 samples, software, technical documentation) § Support for industrial calibration available § Quick circuit customization possible for large production volumes Application Circuit Example Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 1/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet CONTENT 1. 2. PIN DESCRIPTION ......................................................................................................................................3 CIRCUIT DESCRIPTION .............................................................................................................................4 2.1 Signal Flow ....................................................................................................................................................4 2.2 Configuration Word........................................................................................................................................5 2.3 Differential Sensor ....................................................................................................................................5 2.4 Temperature Sensing ...............................................................................................................................5 2.5 Analog Input Channel ...............................................................................................................................6 2.5.1 Bridge Polarity Setting .......................................................................................................................6 2.5.2 Programmable Gain Amplifier PGA...................................................................................................6 2.5.3 Analog-to-digital Converter ADC .......................................................................................................6 2.5.4 Temperature Measurement ...............................................................................................................7 2.6 Correction Microcontroller CMC................................................................................................................7 2.7 Parameter EEPROM.................................................................................................................................7 2.8 Sensor Signal Correction Method and Sequence.....................................................................................8 2 2.9 Digital I C Interface ...................................................................................................................................8 2.9.1 Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test .............................8 2.9.2 Data Communication Specifics..........................................................................................................8 2.10 The Analog Output Stage....................................................................................................................10 3. ELECTRICAL SPECIFICATION.................................................................................................................10 3.1 Absolute maximum ratings......................................................................................................................10 3.2 Operating Conditions ..............................................................................................................................10 3.3 Electrical Parameters..............................................................................................................................11 3.3.1 Power Supply...................................................................................................................................11 3.3.2 PGA & 12-bit Input ADC ..................................................................................................................11 (4) 3.3.3 Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC ..............................11 (1) 3.3.4 12-bit ADC ...................................................................................................................................12 3.3.5 EEPROM programming ...................................................................................................................12 2 3.3.6 Serial I C Interface...........................................................................................................................12 (2) 3.3.7 11-bit Output DAC & Output BUFFER .........................................................................................14 3.3.8 Total System ....................................................................................................................................14 4. PACKAGE DIMENSIONS ..........................................................................................................................15 5. DIE DIMENSIONS AND PAD COORDINATES .........................................................................................16 5.1 Die Dimensions .......................................................................................................................................16 5.2 Pad Coordinates .....................................................................................................................................17 6. EVALUATION KIT “ZMD31020KIT” ...........................................................................................................18 7. ORDERING INFORMATION ......................................................................................................................19 8. RELATED DOCUMENTS...........................................................................................................................19 Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 2/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 1. PIN DESCRIPTION PIN Number Name Description 1 VOUT analog conditioned sensor signal output 2 3 4 5 6 7 8 9 10 11 12 13 14 VDDA (*) VDD VSS SCL SDA VPP VBN VDDB2 (*) VTN VDDB1 (*) VBP VSSB (**) VSSA (**) (*) (**) analog device functions positive supply digital device functions positive supply digital device functions negative supply I²C clock input, on-chip pull-up resistor I²C data input / output, on-chip pull-up resistor positive EEPROM programming voltage differential sensor signal negative input positive supply for sensor and temperature sensing diode input for temperature sensing diode positive supply for sensor and temperature sensing diode differential sensor signal positive input sensor negative supply analog device functions negative supply VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail VSSA and VSSB tied to common on-chip negative supply rail Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 3/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 2. CIRCUIT DESCRIPTION 2.1 Signal Flow Block diagram of ZMD31050 PGA MUX ADC CMC DAC BAMP TS EEPROM ROM 2 IC programmable gain amplifier multiplexer analog-to-digital converter calibration microcontroller digital-to-analog converter buffer amplifier on-chip temperature sensor (pn-junction) for calibration parameters and configuration for correction formula and –algorithm 2 serial interface: I C data I/O, clock The ZMD31020’s signal path is partly analog (blue) and partly digital (red). The differential signal from the resistive bridge sensor is pre-amplified by the programmable gain amplifier (PGA). There are 3 different adjustable gains. The Multiplexer (MUX) transmits the differential signal or the temperature signal to the ADC in a certain sequence. (The external temperature sensing diode or the internal temperature sensor can be used optionally.) The ADC converts the differential signal with 12 bits resolution and the temperature signal with 10 bits resolution into digital values. Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 4/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special correction formula located in the ROM and on a set of sensor-specific calibration parameters stored in the 2 EEPROM. The resulting corrected sensor signal is output via the I C-interface (with 12 bits resolution) , or, after conversion by the DAC, as analog voltage (with 11 bits resolution) at the buffer amplifier (BAMP). The programming of the configuration data and of the calibration parameters into the EEPROM (during the 2 calibration procedure) is also realized via the I C interface. 2.2 Configuration Word Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part of the configuration word stored under address &H09 of the parameter EEPROM. These bits are settings for a number of on-chip device functions and select specific functional or parametrical behaviour. The contents of the parameter EEPROM are determined and calculated, written and stored under PC-control during the calibration procedure. Hence the configuration bits are coded and non-volatile stored once calibration of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during regular sensing operation, unless re-calibration is performed 15 - 14 - 13 - 12 - 11 - 10 - 9 - 8 - 7 - 6 CH 5 TS 4 BP 3 G1 2 G0 1 O1 0 O0 Configuration word, stored under address &H09 of the parameter EEPROM Only 7 bits of the configuration word are relevant settings as follows: Bit 0, Bit 1 O0, O1: select ADC’s offset compensation Bit 2, Bit 3 G0, G1: select PGA’s gain Bit 4 BP: cross-switches differential sensor inputs VBP and VBN Bit 5 TS: selects on-chip vs. off-chip temperature sensor Bit 6 CH: enables PGA’s chopper-stabilization The possible options of these settings are shown in table form in the following paragraphs. 2.3 Differential Sensor ZMD31020 has been specifically designed for ratiometric differential sensors, e.g. Wheatstone bridge type sensors. A ratiometric sensor typically generates a differential output signal proportional to the supply voltage applied to it. The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise) at the + side and tied to VSSB at the – side. The sensor's differential output signal is routed to VBP and VBN. Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 2.1), hence the differential input voltage seen by ZMD31020 is ratiometric to it’s supply voltage. 2.4 Temperature Sensing The characteristic of a sensor element tends to change with temperature. To compensate for this, ZMD31020 is equipped to measure temperature by an external diode or by an on-chip pn-junction. TS – configuration bit 5 – will select the desired sensor option as follows: TS Temperature sensing diode 0 1 off chip on chip Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 5/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 2.5 Analog Input Channel ZMD31020’s block schematic in section 2.1 shows the structure of the analog input channel. The signal path for the sensor signal as well as for temperature is fully differential up to the ADC. The analog multiplexer provides a cost-effective, sequential conversion by a common ADC. Each signal path can be separated from the source at it‘s input and can be short-circuit there for offset-cancellation purposes; for more details see the ZMD31020 Functional Description. 2.5.1 Bridge Polarity Setting The sensor signal path features a cross-switch to reverse the polarity of the bridge sensor signal. BP – configuration bit 4 – sets the bridge polarity as follows: BP Differential signal 0 1 VBR_P – VBR_N VBR_N – VBR_P 2.5.2 Programmable Gain Amplifier PGA The PGA realizes a coarse sensitivity adaptation of the bridge sensor signal in several amplification steps (sensitivity fine-tuning takes place later in the CMC). Three different gains can be set by G0 and G1 configuration bits 2 and 3 - as follows: G1 G0 Gain aIN 0 1 1 x 0 1 15.66 24 42 The chopper-stabilisation of the PGA reduces the signal noise and is enabled by CH - configuration bit 6: CH Chopper-stabilisation 0 1 Disabled Enabled 2.5.3 Analog-to-digital Converter ADC The ADC is a first order charge balancing analog-to-digital converter in full differential switched capacitor technology. The amplified bridge sensor signal is converted by the ADC with full 12 bits resolution against a reference voltage of 0.96 (VDDA – VSSA). As both the signal to be measured as well as the reference voltage, it is measured against, are ratiometric to supply voltage (VDDA - VSSA), the ADC’s conversion result is insensitive to supply-tolerances and -instabilities. In addition, the ADC realizes a coarse offset compensation (ADC-RangeShift RSADC) of the bridge sensor signal (offset fine-tuning takes place afterwards in the CMC). RSADC can be set as follows: O1 O0 RSADC (*) 0 0 1 1 0 1 0 1 15/16 7/8 3/4 1/2 (*) ADC-Range-Shift, related to the maximum processable sensor signal span (former name was “CRROB”) Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 6/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 2.5.4 Temperature Measurement The temperature sensing diode, selected by TS – configuration bit 5, is biased with a constant current of 40µA. It‘s forward drop changes with –2.1mV/°K typically, and is passed as differential temperature signal. The 40µA current source is only on during temperature measurement, to prevent any interference with the bridge sensor signal's measurement. The differential temperature signal is resolved by the ADC with only 10 bits, against a differential reference voltage of 0.980V, derived from an on-chip bandgap. Whenever measuring temperature, the ADC is set to RSADC = 15/16. 2.6 Correction Microcontroller CMC The CMC performs the sensor signal fine-tuning in the digital domain. It is a 16 bit RISC micro-controller, driven by an on-chip clock generator with a nominal clock frequency of 1.5 MHz. The overall clock frequency tolerance is smaller than ±25%. The CMC includes a 16-bit width ALU and a (16 x 16)-bit RAM. Furthermore it has a 12bit input counter into which the ADC will serially transmit conversion results; 4096 clock cycles are needed per result. The CMC is connected to a (1k x 16)-bit instruction ROM and a (12 x 16)-bit parameter EEPROM. At the 2 output side the CMC is equipped with an I C-interface as a digital series output for the corrected sensor signal. Initially, during calibration, the same interface is used bi-directionally: to write the configuration word into the EEPROM, to read non-corrected sensor value as well as temperature, and again and finally to write the valid calibration parameters into the EEPROM. 2.7 Parameter EEPROM The parameter EEPROM is a non-volatile store for 12 parameter values, each with 16 bits of width. Address Parameter Default content 0HEX calibration parameter a0 for sensor's non-linearity correction 5234 Hex 1HEX calibration parameter a1 for sensor's offset correction 0023 Hex 2HEX calibration parameter a2 for first order sensor offset drift correction 2044 Hex 3HEX calibration parameter a3 for second order sensor offset drift correction 3022 Hex 4HEX calibration parameter a4 for gain correction 6356 Hex 5HEX calibration parameter a5 for first order gain drift correction 1045 Hex 6HEX calibration parameter a6 for second order gain drift correction 2073 Hex 7HEX low-side scale limit value for corrected sensor signal 03E8 Hex 8HEX high-side scale limit value for corrected sensor signal 0FA0 Hex 9HEX configuration word 0040 Hex AHEX customer-specific identification word 1234 Hex BHEX customer-specific identification word 5678 Hex Contents of the parameter EEPROM The configuration word and it's contents under address &H09 have been described already in chapter 2.5. The calibration parameters are stored under addresses &H00 through &H06. The calculation of these parameters is described in the ZMD31020 Functional Description. Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 7/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet Address locations &H07 and &H08 contain a low-side resp. high-side scale limit value for the corrected sensor signal. Lower resp. -higher corrected signal values are clamped arithmetically to these limits by the CMC. Both the low and high-side scale limits can be adjusted with a resolution of 12 bits. The 12 bit limit value must be programmed into the least significant portion of either address. The 4 most significant bit locations of either address are don't care bits and may be programmed freely. Address locations &H0A and &H0B are available for customer-specific identification words, e.g. for traceability purposes. The contents of EEPROM addresses &H00 through &H09 are loaded into the RAM register block of the CMC upon power-on. The configuration bits are routed from the configuration register to the various device functions to be set up, see chapter 6.1. Erasing and programming of the various EEPROM address locations during calibration requires programming pulses of about 12V amplitude and about 10ms pulse width (see section 3.3.5). Further programming details are to find in the ZMD31020 Functional Description. Since a calibration is typically performed only once in a sensor's lifetime, no overhead chip-area for a chargepump has been spent. Thus the programming pulse has to be generated off-chip, and applied at the VPP pin/pad. During normal operation mode the VPP pin/pad must be left open. Note: 2.8 An on-chip switch short-circuits VPP to VDD in normal operation mode; the switch is opened to release the VPP pin/pad for programming.) Sensor Signal Correction Method and Sequence In normal operation mode (regular sensing operation) the CMC runs a cyclic program which will output a corrected 12-bit sensor value about every 10ms. Within this cycle the CMC stages measurement of the ‚raw‘ sensor signal with 12 bits resolution, preceded by measurement of temperature in 10 bits, and calculates a corrected sensor output value. Calculation is based on a correction formula to which the 'raw' sensor signal and temperature as measured are applied in first and second order terms - along with the 7 calibration parameters. The measurement procedure of the 'raw' sensor signal and of temperature as well as the correction formula are described in all details in the ZMD31020 Functional description Digital I2C Interface 2.9 2 The 2-wire I C interface encompasses a clock line input SCL and a bi-directional data line SDA. 2.9.1 Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test 2 During normal operation mode (regular sensing operation) the I C interface will output the corrected sensor signal (12 bits) digitally and serially. During calibration the interface is input for the configuration word, output for the 'raw' non-corrected sensor signal as well as for temperature, and finally again input for the calculated calibration parameters as well as the scale limit values and possibly customer-specific identifiers. As a third option, the interface is used to input digital vectors during device test, e.g. to exercise the output DAC, see section 2.10. 2.9.2 Data Communication Specifics 2 An I C bus is controlled by a master device, which generates the clock, controls the bus access, and generates START and STOP conditions. ZMD31020 is designed to work as a slave - thus it will only respond to requests from a master device. Obviously a typical master device during regular sensing operation is a connected electronic controller unit requesting sensor data. (During calibration a connected PC or computer will be the master. During device test the ATE system will be the master.) Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 8/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet ZMD31020 complies with the following protocol (for data communication timing details see parameter section): • • • • • • • • Bus not busy: During idle periods both data line (SDA) and clock line (SCL) remain HIGH. START condition (S): HIGH to LOW transition of SDA line while clock (SCL) is HIGH is interpreted as START condition. All commands must be preceded by START condition. Master can generate START condition at any time. More than one command can be transmitted without generation of intermediate STOP condition. STOP condition (P): LOW to HIGH transition of SDA line while clock (SCL) is HIGH determines STOP condition. All command sequences must be ended with STOP condition. Data valid (D): State of data line represents valid data when, after START condition, data line is stable for duration of HIGH period of clock signal. Data on line must be changed during LOW period of clock signal. There is one clock pulse per bit of data. Acknowledge (A): Data is transferred in pieces of 8 bits (1 byte) on serial bus, MSB first. After each byte receiving device – whether master or slave – is obliged to pull data line LOW as acknowledge for reception of data. Master must generate an extra clock pulse for this purpose. When acknowledge is missed, slave transmitter becomes inactive. It is on master either to send last command again or to generate STOP condition in that case. Slave address: Each device connected to bus has unique slave address. After generating START condition, master transmits address consisting of 7-bit slave address and R/W - bit. Addressed slave responds with acknowledge while other slaves on bus become inactive and ignore following data bytes. R/W – bit determines direction of data transfer. If R/W is “0”, data is transmitted from master to slave (write operation). If R/W is “1”, (read operation) data is transmitted from slave to master. Slave address of the IC is hard coded to value 1111000xb. Write operation: When writing to IC, slave address + R/W - bit (F0h) is followed by command byte and – depending on command – optionally 2 data bytes. Calibration microcontroller reads command byte and executes specific program for each command. Commands available are described below. Read operation: When R/W – bit is set to “1” (F1h), IC sends 2 data bytes containing contents of output register of serial interface. To read specific data, master must send special commands before reading which instruct calibration microcontroller to place requested data in serial interface output register. Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 9/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 2.10 The Analog Output Stage ZMD31020‘s analog output stage consists of an 11-bit resistor-string linear DAC, which converts the MSBportion of the corrected sensor signal, followed by an output buffer amplifier, designed for full supply voltage range output swing and generating the output voltage VOUT. VOUT presents the actual corrected sensor signal as an analog voltage on a linear voltage scale with 11 bits resolution. The output voltage is ratiometric to the supply voltage (VDDA – VSSA). Furthermore it exhibits low- and high-side scale limits; either limit is programmable and clamping to these limit values is performed digitally by the CMC (see section 2.7 and the ZMD31020 Functional Description). VOUT will change as corrected sensor signal values become available, hence with a refresh rate of about 10ms. VOUT can source/sink a maximum load current of 2mA. 3. ELECTRICAL SPECIFICATION 3.1 Absolute maximum ratings (all voltages referred to VSSA) PARAMETER Analog supply voltage Digital supply voltage Voltage at all digital I/O Voltage at all analog I/O SYMBOL VDDA VDD VD_I/O VA_I/O Guaranteed ESD-immunity Guaranteed latch-up immunity Storage temperature CONDITIONS to VSS to VSS MIN -0.3 -0.3 -0.3 -0.3 TYP UNIT V V V V at all pins, HBM -2 2 kV at all pins -100 100 mA -40 150 °C 100 °C TSTG Average storage- and operation temperature for 15 years time of operation 3.2 MAX 6.5 6.5 VDD+0.3 VDDA+0.3 Operating Conditions PARAMETER Supply voltage Ambient temperature Bridge resistance Capacitance SYMBOL VDDA = VDD TAMB RBR CVDD(A) CONDITIONS to VSSA = VSS between VDD = VDDA and VSS = VSSA MIN 4.5 -40 1 100 TYP 5 220 MAX 5.5 125 10 470 UNIT V °C kΩ nF Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 10/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 3.3 Electrical Parameters (for TAMB = -40°C ... +125°C; supply voltage: 4.5V ... 5.5V; all voltages referred to VSSA = VSS) 3.3.1 Power Supply PARAMETER Supply current 3.3.2 SYMBOL IDD + IDDA CONDITIONS no sensor, no diode connected; VOUT open MIN TYP MAX 7.7 UNIT mA PGA & 12-bit Input ADC PARAMETER SYMBOL CONDITIONS MIN TYP MAX Differential input voltage range options @ Input span VIN_SP = 52 mV/V; aIN = 15.66 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -3 49 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -6 46 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -13 39 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -26 26 Sensitivity SIN VDDA = 5V 73 Differential input voltage range options @ Input span VIN_SP = 36 mV/V; aIN = 24 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -2 34 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -4 32 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -9 27 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -18 18 Sensitivity SIN VDDA=5V 50 Differential input voltage range options @ Input span VIN_SP = 20 mV/V; aIN = 42 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -1 19 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -2 18 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -5 15 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -10 10 Sensitivity SIN VDDA=5V 29 Diff. input offset current IIN_OFF -10 UNIT mV/V mV/V mV/V mV/V µV/LSB mV/V mV/V mV/V mV/V µV/LSB mV/V mV/V mV/V mV/V µV/LSB 10 nA Note, that the parameter “RSADC” is equal to the former “CRROB”. 3.3.3 Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC (4) PARAMETER Current source (1) TC current source Input voltage range TC forward drop Sensitivity SYMBOL ITS TCI_TS VTN TCDROP ST CONDITIONS pin / pad VTN pin / pad VTN rel. to VDDB1 = VDDB2 on-chip temp. sensor pin / pad VTN MIN 20 -2000 -810 -1.9 0.84 TYP 40 -2.1 0.97 MAX 55 2000 -200 -2.3 1.1 UNIT µA ppm/K mV mV/K mV/ LSB Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 11/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 3.3.4 12-bit ADC (1) PARAMETER SYMBOL CONDITIONS MIN 12-Bit sensor signal conversion DNLp -0.5 INLp to best-fit straight line -0.5 10-Bit temperature signal conversion DNLT -0.5 INLT to best-fit straight line -0.8 ADC diff. non-lin. ADC integr. non-lin. ADC diff. non-lin. ADC integr. non-lin. 3.3.5 MAX UNIT 0.5 0.5 LSB LSB 0.5 0.8 LSB LSB EEPROM programming PARAMETER SYM. MIN. TYP. MAX. Prog. voltage HIGH level VPPH 11.75 12.25 12.75 Prog. voltage LOW level (conn. to VDD on chip) VPPL Prog. cycle duration VDD tVPP_R Rise time VPP tVPP_R 0.5 1 2 ms Fall time VPP tVPP_F 0.5 1 2 ms Prog. pulse duration tVPP_H 8 Programming temperature tVPP_F V 9 ms Number of write/read cycles tVPP_H VPPH V tVPP 3.3.6 TYP VPPL tVPP ms 100 TPP -40 +85 °C Serial I2C Interface PARAMETER Input high level Input low level Output low level Pull-up-resistance (at SCL and SDA) Pull up current Load capacitance SDA SYMBOL VI2C_IN_H VI2C_IN_L VI2C_OUT_L RI2C_SCL/SDA CONDITIONS II2C_OUT_H CSDA pins SCL and SDA MIN 0.9 0 TYP MAX 1 0.1 0.1 UNIT VDD VDD VDD Ω 20 400 µA pF 470 5 Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 12/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet Timing Characteristics of the serial Interface tI2C_SU_DAT tI2C_HD_DAT tI2C_H PARAMETER SCL clock frequency Bus free time betw. STOP and START condition Hold Time (repeated) START cond. tI2C_L SYMBOL tI2C_F tI2C_SU_STA tI2C_HD_STA tI2C_R tI2C_SU_STO tI2C_BF CONDITIONS MIN tI2C_HD_STA TYP MAX UNIT 100 kHz fSCL - tI2C_BF 4.7 µs 4.0 µs tI2C_HD_STA to first clock pulse LOW period of SCL tI2C_L 4.7 µs HIGH period of SCL tI2C_H 4.0 µs Setup time (repeated) START cond. tI2C_SU_STA 4.7 µs Data hold time tI2C_HD_DAT 0 ns Data setup time tI2C_SU_DAT 250 ns Rise time of both SDA and SCL tI2C_R - 300 ns Fall time of both SDA and SCL tI2C_F - 300 ns tI2C_SU_STO 4 Setup time for STOP condition Input filter spike suppression / noise interception tI2C_NI spikes on SDA or SCL of that length are suppressed µs 50 ns Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 13/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 3.3.7 11-bit Output DAC & Output BUFFER (2) PARAMETER Output current Analog output offset voltage Temp.-coeff output offset voltage DAC differential nonlinearity DAC integral nonlinearity Maximal output voltage Minimal output voltage VOUT low scale limit VOUT low scale limit Load resistance Load capacitance 3.3.8 SYMBOL IOUT VOUT_OFF TCOUT_OFF DNLOUT INLOUT VOUT_MAX VOUT_MIN VOUT_LSL VOUT_HSL RL_OUT CL_OUT CONDITIONS current source & sink to best-fit straight line IOUTSOURCE = 2mA IOUTSINK = -2mA dig. ref.: pmin dig. ref.: pmax MIN ±2 -10 -10 -1 -4 0.975 TYP MAX 0.025 0.25 1 UNIT mA mV µV/K LSB LSB VDDA VDDA VDDA VDDA 25 kΩ nF 10 10 1 4 0 0.75 2.5 10 Total System PARAMETER Startup time Response time Conversion cycle time Non-linearity TC sensor signal TC temperature SYMBOL tSTA tRESP tCYC NL TCp TCT CONDITIONS power up to 1st result MIN to best-fit straight line -2500 TYP MAX 40 11 10 +2500 20 100 UNIT ms ms ms (3) ppm ppm/K ppm/K Notes for the electrical parameters: 1) No measurement in mass production, parameter is guarantied by design. 2) During normal operation mode using the analog output the I C interface allows to read out the output digital value in parallel (= the digital input of the DAC). 3) Analog Signal Conditioning and Analog Digital Conversion for Measurement of the Pressure Sensor Bridge 4) The A/D conversion of the temperature signal is done with 10 bit resolution only. 2 Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 14/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 4. PACKAGE DIMENSIONS SSOP14 (209mil = 5.3mm) weight: ≤ 0.3g package body material: low stress epoxy lead material: FeNi-Alloy or Cu-Alloy lead finish: solder plating lead form: Z-bends Dimensions of Sub-Group B1 Amax 1.99 Bpmin 0.25 bpmax 0.38 enom 0.65 HEmin 7.65 HEmax 7.90 Lpmin 0.63 Zmax 1.22 All dimensions in mm, reference: DIN EN 190000 Dimensions of Sub-Group C1 Amin 1.73 A1min 0.05 A1max 0.21 A2min 1.68 A2max 1.78 cmin 0.09 cmax 0.20 Dmin* 6.07 Dmax* 6.33 Emin* 5.20 Emax* 5.38 kmin 0.25 θmin 0° θmax 10° * without mold-flesh Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 15/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 5. DIE DIMENSIONS AND PAD COORDINATES 5.1 Die Dimensions • Die size (incl. scribeline): 3500µm x 3000µm = 10.5sqmm • Core die size (without scribeline): 3310µm x 2810µm ≈ 9.3sqmm • Die thickness: 390µm • Scribeline (distance between two core dice on wafer): 190µm • Pads size: 90µm x 90µm 14 13 12 11 10 9 8 ZMD31020 Core Die with Pads 2810µm y 0 1 2 x 3 4 5 6 7 725µm 3310µm Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 16/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 5.2 Pad Coordinates All pad coordinates refer to the pad centers and related to the left bottom corner of pad 1. PIN-No. PIN Name Pad coordinates µm X Y 1 VOUT 45 45.00 2 VDDA 380.2 45.00 3 VDD 1403.30 45.00 4 VSS 1627.40 45.00 5 SCL 1868.8 45.00 6 SDA 2143.8 45.00 7 VPP 2385.3 45.00 8 VBN 2353.4 2763.00 9 VDDB2 2091.6 2763.00 10 VTN 1829.5 2763.00 11 VDDB1 1426.7 2763.00 12 VBP 864.1 2763.00 13 VSSB 478 2763.00 14 VSSA 48.1 2763.00 Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 17/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 6. EVALUATION KIT “ZMD31020KIT” An evaluation kit is offered, see the illustration below. The Kit provides easy evaluation and experimental calibration of a sensor element / ZMD31020 combination. It contains a modular calibration board, a CD-ROM (calibration program, USB port driver, technical documentation), an USB cable and some finished samples in SSOP14 package. The evaluation kit is described in detail in its technical documentation. Fig. 3: Evaluation Kit „ZMD31020KIT“ (Hardware) Important Note: The Evaluation Kit is not intended to be used for industrial sensor calibration in serial production. If components of the Evaluation Kit are used for this purpose then an EEPROM programming pulse like specified in section 3.3.5 has to be assured. Otherwise the EEPROM data preservation may be affected. For industrial sensor calibration ZMD and its partners offer a comprehensive support for the development of the required hard- and software. Please contact the ZMD sales offices for detailed information. Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 18/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31020 Sensor Signal Conditioner Datasheet 7. ORDERING INFORMATION Ordering Code Description Operation Temp. Package ZMD31020BCB dice on tested unsawn wafer dice on tested sawn wafer dice in waffle tray finished parts in tube finished parts in tape on reel dice on tested unsawn wafer dice on tested sawn wafer dice in waffle tray finished parts in tube finished parts in tape on reel evaluation kit 0...+70°C die 6” wafer 0...+70°C die plastic frame 0...+70°C die 0...+70°C -40...+125°C* SSOP14 (5.3mm) SSOP14 (5.3mm) die -40...+125°C* die plastic frame -40...+125°C* die -40...+125°C* SSOP14 (5.3mm) SSOP14 (5.3mm) waffle tray (100 dice / tray) tube (77 parts / tube) tape on reel (2000 parts / reel) box, containing PCB, CD, USB cable and SSOP14 samples ZMD31020BCC ZMD31020BCD ZMD31020BCF-T ZMD31020BCF-R ZMD31020BIB ZMD31020BIC ZMD31020BID ZMD31020BIF-T ZMD31020BIF-R ZMD31020KIT 0...+70°C -40...+125°C* Marking Shipping Form * waffle tray (100 dice / tray) ZMD tube 31020BCF (77 parts / tube) ZMD tape on reel 31020BCF (2000 parts / reel) 6” wafer ZMD 31020BIF ZMD 31020BIF Deviant from the regular industrial operation temperature range of –25 to +85°C the ZMD31020 industrial version is specified for –40 to +125°C. * The quantity ordered should be a multiple of the quantity / packing unit as specified 8. RELATED DOCUMENTS • • • ZMD31020 Software description ZMD31020 Functional description ZMD31020 Response time (application note) The information furnished here by ZMD is believed to be correct and accurate. However, ZMD shall not be liable to any licensee or third party for any damages, including, but not limited to, personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental, or consequential damages of any kind in connection with or arising out of the furnishing, performance, or use of this technical data. No obligation or liability to any licensee or third party shall result from ZMD’s rendering of technical or other services. For further information: ZMD AG Grenzstrasse 28 01109 Dresden, Germany Phone +49 (351) 8822-306 Fax +49 (351) 8822-337 [email protected] www.zmd.biz ZMD America, Inc. 201 Old Country Road, Suite 204 Melville, NY 11747, USA Phone +01 (631) 549-2666 Fax +01 (631) 549-2882 [email protected] www.zmd.biz ZMD America, Inc. 15373 Innovation Drive, Suite 110 San Diego, CA 92128, USA Phone +01 (858) 674-8070 Fax +01 (858) 674-8071 [email protected] www.zmd.biz Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19 19/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.