ZXMN3A01E6 30V N-CHANNEL ENHANCEMENT MODE MOSFET SUMMARY V(BR)DSS = 30V; RDS(ON) = 0.12 ID = 3.0A DESCRIPTION This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. SOT23-6 FEATURES • Low on-resistance • Fast switching speed • Low threshold • Low gate drive • SOT23-6 package APPLICATIONS • DC - DC Converters • Power Management Functions • Disconnect switches • Motor control PINOUT ORDERING INFORMATION DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXMN3A01E6TA 7” 8mm 3000 units ZXMN3A01E6TC 13” 8mm 10000 units DEVICE MARKING Top View • 3A1 ISSUE 2 - JULY 2002 1 ZXMN3A01E6 ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL Drain-Source Voltage V DSS Gate Source Voltage V GS Continuous Drain Current V GS =10V; T A =25°C (b) V GS =10V; T A =70°C (b) V GS =10V; T A =25°C (a) Pulsed Drain Current (c) ID Continuous Source Current (Body Diode) (b) LIMIT 30 UNIT V 20 V 3.0 2.4 2.4 A I DM 10 A IS 2.4 A Pulsed Source Current (Body Diode) (c) I SM 10 A Power Dissipation at T A =25°C (a) Linear Derating Factor PD 1.1 8.8 W mW/°C Power Dissipation at T A =25°C (b) Linear Derating Factor PD 1.7 13.6 W mW/°C Operating and Storage Temperature Range T j :T stg -55 to +150 °C VALUE UNIT THERMAL RESISTANCE PARAMETER SYMBOL Junction to Ambient (a) R θJA 113 °C/W Junction to Ambient (b) R θJA 70 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t⭐5 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. ISSUE 2 - JULY 2002 2 ZXMN3A01E6 CHARACTERISTICS 1.2 RDS(on) Limited Max Power Dissipation (W) IC Drain Current (A) 10 1 DC 1s 100ms 100m 10ms 10m Single Pulse 1ms Tamb=25°C 100m 100µs 1 10 VDS Collector-Emitter Voltage (V) 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 160 Temperature (°C) Safe Operating Area Derating Curve 100 Tamb=25°C 100 Maximum Power (W) Thermal Resistance (°C/W) 120 80 60 40 D=0.5 D=0.2 Single Pulse D=0.05 D=0.1 20 100µ 1m 10m 100m 1 10 100 Single Pulse Tamb=25°C 10 1 0.1 100µ 1m 1k 10m 100m 1 10 100 Pulse Width (s) Pulse Width (s) Transient Thermal Impedance Pulse Power Dissipation ISSUE 2 - JULY 2002 3 1k ZXMN3A01E6 ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated). PARAMETER SYMBOL MIN. Drain-Source Breakdown Voltage V (BR)DSS 30 Zero Gate Voltage Drain Current I DSS Gate-Body Leakage I GSS Gate-Source Threshold Voltage V GS(th) TYP. MAX. UNIT CONDITIONS. STATIC V I D =250µA, V GS =0V 0.5 µA V DS =30V, V GS =0V 100 nA 1 V GS =⫾20V, V DS =0V V I =250µA, V DS = V GS D Static Drain-Source On-State Resistance R DS(on) (1) 0.106 0.12 0.18 Ω Ω V GS =10V, I D =2.5A V GS =4.5V, I D =2.0A Forward Transconductance (1)(3) g fs 3.5 S V DS =4.5V,I D =2.5A Input Capacitance C iss 190 pF Output Capacitance C oss 38 pF Reverse Transfer Capacitance C rss 20 pF Turn-On Delay Time t d(on) 1.7 ns Rise Time tr 2.3 ns Turn-Off Delay Time t d(off) 6.6. ns Fall Time tf 2.9 ns Gate Charge Qg 2.3 nC Total Gate Charge Qg 3.9 nC Gate-Source Charge Q gs 0.6 nC Gate-Drain Charge Q gd 0.9 nC Diode Forward Voltage (1) V SD 0.84 Reverse Recovery Time (3) t rr Reverse Recovery Charge (3) Q rr DYNAMIC (3) V DS =25 V, V GS =0V, f=1MHz SWITCHING(2) (3) V DD =15V, I D =2.5A R G =6.0Ω, V GS =10V V DS =15V,V GS =5V, I D =2.5A V DS =15V,V GS =10V, I D =2.5A SOURCE-DRAIN DIODE 0.95 V T J =25°C, I S =1.7A, V GS =0V 17.7 ns T J =25°C, I F =2.5A, di/dt= 100A/µs 13.0 nC NOTES (1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤ 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing. ISSUE 2 - JULY 2002 4 ZXMN3A01E6 10V T = 25°C 10 7V T = 150°C 5V 4.5V ID Drain Current (A) ID Drain Current (A) TYPICAL CHARACTERISTICS 4V 3.5V 1 3V VGS 0.1 2.5V 0.1 1 5V 1 4V 3.5V 3V 2.5V VGS 0.1 2V 10 0.1 1 10 VDS Drain-Source Voltage (V) Output Characteristics Output Characteristics 10 1.6 VDS = 10V Normalised RDS(on) and VGS(th) ID Drain Current (A) 7V 4.5V VDS Drain-Source Voltage (V) T = 150°C 1 T = 25°C 0.1 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VGS = 10V ID = 2.5A 1.4 RDS(on) 1.2 1.0 VGS(th) 0.8 VGS = VDS ID = 250uA 0.6 0.4 -50 VGS Gate-Source Voltage (V) 3V 3.5V 4V 1 VGS 4.5V 5V 7V 0.1 10V T = 25°C 0.1 1 ID Drain Current (A) 50 100 150 Normalised Curves v Temperature ISD Reverse Drain Current (A) ) W ( 2.5V 0 Tj Junction Temperature (°C) Typical Transfer Characteristics RDS(on) Drain-Source On-Resistance 10V 10 10 10 T = 150°C 1 T = 25°C 0.1 0.4 0.6 0.8 1.0 1.2 VSD Source-Drain Voltage (V) Source-Drain Diode Forward Voltage On-Resistance v Drain Current ISSUE 2 - JULY 2002 5 ZXMN3A01E6 TYPICAL CHARACTERISTICS 10 VGS = 0V f = 1MHz 250 VGS Gate-Source Voltage (V) C Capacitance (pF) 300 200 CISS 150 COSS CRSS 100 50 0 0.1 1 10 ID = 2.5A 8 6 VDS = 15V 4 2 0 0 1 2 3 4 Q - Charge (nC) Gate-Source Voltage v Gate Charge VDS - Drain - Source Voltage (V) Capacitance v Drain-Source Voltage ISSUE 2 - JULY 2002 6 ZXMN3A01E6 PACKAGE OUTLINE PAD LAYOUT DETAILS e b L 2 E1 E DATUM A a e1 D C A A2 A1 CONTROLLING DIMENSIONS IN MILLIMETRES APPROX CONVERSIONS INCHES. PACKAGE DIMENSIONS Millimetres Inches Millimetres DIM Inches DIM Min Max Min Max Min Max Min Max A 0.90 1.45 0.35 0.057 E 2.60 3.00 0.102 0.118 A1 0.00 0.15 0 0.006 E1 1.50 1.75 0.059 0.069 A2 0.90 1.30 0.035 0.051 L 0.10 0.60 0.004 0.002 b 0.35 0.50 0.014 0.019 e 0.95 REF 0.037 REF C 0.09 0.20 0.0035 0.008 e1 1.90 REF 0.074 REF D 2.80 3.00 0.110 0.118 L 0° 10° 0° 10° © Zetex plc 2002 Americas Asia Pacific Zetex GmbH Streitfeldstraße 19 D-81673 München Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY11788 Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] USA Telephone: (631) 360 2222 Fax: (631) 360 8222 [email protected] Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 [email protected] These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 2 - JULY 2002 7