REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to “VREFH to VREFL” limits as specified in 1.3 and add functional test to table I. - ro 01-06-05 R. Monnin B Redraw. Update drawing to current requirements. - drw 12-03-22 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra B. Rooney STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY Charles E. Besore APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL-LINEAR, 12-BIT, QUAD, D/A CONVERTER, MONOLITHIC SILICON 93-05-20 REVISION LEVEL B SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-91764 1 OF 14 5962-E117-12 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91764 Federal stock class designator \ RHA designator (see 1.2.1) 01 M X A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number 01 DAC8412A 02 DAC8412B 03 DAC8413A 04 DAC8413B Circuit function Output registers on reset (see figure 2) Quad, voltage output, 12-bit BiCMOS DAC with readback Quad, voltage output, 12-bit BiCMOS DAC with readback Quad, voltage output, 12-bit BiCMOS DAC with readback Quad, voltage output, 12-bit BiCMOS DAC with readback Midscale Midscale Zero scale Zero scale 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter X 3 Descriptive designator Terminals GDIP1-T28 or CDIP2-T28 CQCC1-N28 28 28 Package style Dual-in-line Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 2 1.3 Absolute maximum ratings. 1/ VSS to VDD ........................................................................................ -0.3 V dc, +33.0 V dc VSS to VLOGIC ................................................................................... -0.3 V dc, +23.5 V dc VSS to DGND ..................................................................................... -16. 5 V dc VDD to DGND .................................................................................... +16.5 V dc VLOGIC to DGND ............................................................................... -0.3 V dc, +7.0 V dc VSS to VREFL ..................................................................................... -0.3 V dc, VDD – 2.0 V dc VREFH to VDD .................................................................................... +2.0 V dc, +33.0 V dc VREFH to VREFL ................................................................................ Current into any pin............................................................................ Digital input voltage to DGND ............................................................ Digital output voltage to DGND .......................................................... Power dissipation (PD) ....................................................................... 0 V dc, VDD – VSS ±15 mA -0.3 V dc, VLOGIC + 0.3 V dc -0.3 V dc, +7.0 V dc 1000 mW 2/ Junction temperature (TJ) .................................................................. Storage temperature range ................................................................ Lead temperature (soldering, 60 seconds) ........................................ Thermal resistance, junction-to-case (θJC) ........................................ +150°C -65°C to +150°C +300°C See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case X............................................................................................ 50°C/W Case 3 ............................................................................................ 70°C/W 1.4 Recommended operating conditions. Supply voltage range ......................................................................... ±15 V dc Logic supply voltage (VLOGIC) ........................................................... +5 V dc Positive reference voltage range (+VREF) ......................................... +2.5 V dc to +10.0 V dc Negative reference voltage range (–VREF) ........................................ -10.0 V dc to 0 V dc Ground potential ................................................................................ 0 V dc Ambient operating temperature range (TA) ........................................ -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate above +80°C at 14.3 mW/°C for case 3. Derate above +100°C at 20 mW/°C for case X STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Integral linearity Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified INL Group A subgroups Device type Limits Unit Min Max 01, 03 -0.75 +0.75 02, 04 -1.5 +1.5 1, 2, 3 All -1.0 +1.0 LSB 1, 2, 3 LSB Differential linearity DNL Minimum scale error VZSE RL ≥ 2 kΩ 1, 2, 3 All -2.0 +2.0 LSB Full scale error VFSE RL ≥ 2 kΩ 1, 2, 3 All -2.0 +2.0 LSB Linearity matching TA = +25°C 1 All -1.0 +1.0 LSB Minimum scale offset matching TA = +25°C 1 All -1.0 +1.0 LSB Full scale offset matching TA = +25°C 1 All -2.0 +2.0 LSB 1, 2, 3 All -2.75 +2.75 mA 0 +2.75 -10.0098 -9.9902 +9.9853 +10.0048 Reference input current IREFH Code 555H & 000H IREFL Output voltage swing VOUT (MIN) RL = 2 kΩ 1, 2, 3 All VOUT (MAX) V Logic input high voltage VINH 1, 2, 3 All Logic input low voltage VINL 1, 2, 3 All Logic output high voltage VOH IOH = +0.4 mA 1, 2, 3 All Logic output low voltage VOL IOL = -1.6 mA 1, 2, 3 All 0.4 V VIN = 0 V or + 5 V 1, 2, 3 All 10 µA 14.25 V ≤ VDD ≤ 15.75 V 1, 2, 3 All 150 ppm/V Logic input current Power supply sensitivity IIN PSS 2.4 V 0.8 V 2.4 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 5 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min All ISS 1, 2, 3 All ILOGIC 1, 2, 3 All 4 All 7 All 9 All 9, 10, 11 All 90 ns IDD Negative supply current Slew rate SR VREFH = +2.5 V Measured at 10 % to 90 %, TA = +25°C, VO = 0 V to 10 V FT See 4.4.1c Settling time tS 10 V step to 0.01 %, TA = +25°C tWCS 13 mA -10 mA µA 100 2 V/µs 2/ Functional test Chip select write pulse width Max 1, 2, 3 Positive supply current Logic supply current Unit 2/ 2/, 3/ µs 15 Write setup tWS tWCS = 90 ns 2/, 3/ 9, 10, 11 All 0 ns Write hold tWH tWCS = 90 ns 2/, 3/ 9, 10, 11 All 0 ns Address setup tAS 2/, 3/ 9, 10, 11 All 0 ns Address hold tAH 2/, 3/ 9, 10, 11 All 0 ns Load setup tLS 2/, 3/ 9, 10, 11 All 70 ns WRITE load hold tLH 2/, 3/ 9, 10, 11 All 30 ns WRITE data setup tWDS tWCS = 90 ns 2/, 3/ 9, 10, 11 All 20 ns WRITE data hold tWDH tWCS = 90 ns 2,/ 3/ 9, 10, 11 All 0 ns Load pulse width tLWD 2/, 3/ 9, 10, 11 All 170 ns Reset pulse width tRESET 2/, 3/ 9, 10, 11 All 200 ns tRCS 2/, 3/ 9, 10, 11 All 130 ns Chip select read pulse width See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 6 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Read data hold tRDH tRCS = 130 ns 2/ 3/ 9, 10, 11 All 0 ns Read data setup tRDS tRCS = 130 ns 2/ 3/ 9, 10, 11 All 10 ns RL = 3 kΩ, 2/ 3/ 9, 10, 11 All 200 ns 9, 10, 11 All 200 ns Data to high Z Chip select to data 1/ tDZ tCSD CL = 10 pF RL = 3 kΩ, 2/ 3/ CL = 100 pF All supplies can be varied ±5 % and operation is guaranteed. Unless otherwise specified, VDD = +15 V, VSS = -15 V, VLOGIC = +5 V, VREFH = +10 V, and VREFL = -10 V. 2/ Guaranteed by characterization and not 100 % tested. 3/ All input control signals are specified with tr = tf = 5 ns (10 % to 90 % of +5 V) and timed from a voltage level of 1.6 V. See figure 4. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 7 Device types 01, 02, 03, 04 Case outlines X and 3 Terminal number Terminal symbol 1 VREFH 2 VOUTB 3 VOUTA 4 VSS 5 DGND 6 RESET 7 LDAC 8 DB0 (LSB) 9 DB1 10 DB2 11 DB3 12 DB4 13 DB5 14 DB6 15 DB7 16 DB8 17 DB9 18 DB10 19 DB11 (MSB) 20 R/ W 21 A1 22 A0 23 CS 24 VLOGIC 25 VDD 26 VOUTD 27 VOUTC 28 VREFL FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 8 A1 A0 R/ W CS RS LDAC Input reg Output reg Mode DAC L L L L H L Write Write Write A L H L L H L Write Write Write B H L L L H L Write Write Write C H H L L H L Write Write Write D L L L L H H Write Hold Write input A L H L L H H Write Hold Write input B H L L L H H Write Hold Write input C H H L L H H Write Hold Write input D L L H L H H Read Hold Read input A L H H L H H Read Hold Read input B H L H L H H Read Hold Read input C H H H L H H Read Hold Read input D X X X H H L Hold X X X H H H Hold X X X X L X * All registers reset to mid/zero scale ALL X X X H ↑ X * All registers latched to mid/zero scale ALL Update all output registers Hold Hold ALL ALL * Device types 01 and 02 reset to midscale, and device types 03 and 04 reset to zero scale. L = Low H = High X = Don’t care FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 9 FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 10 FIGURE 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 11 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 92 (see MIL-PRF-38535, appendix A) 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 12 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 shall include verifying the functionality of the device. TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V 1 1 1 1, 2, 3 1/ 1, 2, 3 1/ 1, 2, 3 1/ 1, 2, 3, 4, 7, 9, 10, 11 2/ 1, 2, 3, 4, 7, 9, 10, 11 2/ 1, 2, 3, 4, 7, 9, 10, 11 2/ 1 1 1 1 1 1 --- --- --- Subgroups (in accordance with MIL-PRF-38535, table III) 1/ PDA applies to subgroup 1. 2/ Subgroups 4, 9, 10, and 11, not tested, but shall be guaranteed to the limits specified in table I herein. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 13 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91764 A REVISION LEVEL B SHEET 14 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 12-03-22 Approved sources of supply for SMD 5962-91764 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9176401MXA 24355 DAC8412AT/883 5962-9176402MXA 24355 DAC8412BT/883 5962-9176402M3A 24355 DAC8412BTC/883 5962-9176403MXA 24355 DAC8413AT/883 5962-9176404MXA 24355 DAC8413BT/883 5962-9176404M3A 24355 DAC8413BTC/883 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 24355 Vendor name and address Analog Devices Rt 1 Industrial Park PO Box 9106 Norwood, MA 02062 Point of contact: 804 Woburn Street Wilmington, MA 01887-3462 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.