AD 5962-9176401QXA

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Make change to “VREFH to VREFL” limits as specified in 1.3 and add functional
test to table I. - ro
01-06-05
R. Monnin
B
Redraw. Update drawing to current requirements. - drw
12-03-22
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
REV
B
B
B
B
B
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Sandra B. Rooney
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
Charles E. Besore
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, DIGITAL-LINEAR, 12-BIT, QUAD,
D/A CONVERTER, MONOLITHIC SILICON
93-05-20
REVISION LEVEL
B
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-91764
1 OF 14
5962-E117-12
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
91764
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
X
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
DAC8412A
02
DAC8412B
03
DAC8413A
04
DAC8413B
Circuit function
Output registers on
reset (see figure 2)
Quad, voltage output, 12-bit
BiCMOS DAC with readback
Quad, voltage output, 12-bit
BiCMOS DAC with readback
Quad, voltage output, 12-bit
BiCMOS DAC with readback
Quad, voltage output, 12-bit
BiCMOS DAC with readback
Midscale
Midscale
Zero scale
Zero scale
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
3
Descriptive designator
Terminals
GDIP1-T28 or CDIP2-T28
CQCC1-N28
28
28
Package style
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
2
1.3 Absolute maximum ratings. 1/
VSS to VDD ........................................................................................ -0.3 V dc, +33.0 V dc
VSS to VLOGIC ................................................................................... -0.3 V dc, +23.5 V dc
VSS to DGND ..................................................................................... -16. 5 V dc
VDD to DGND .................................................................................... +16.5 V dc
VLOGIC to DGND ............................................................................... -0.3 V dc, +7.0 V dc
VSS to VREFL ..................................................................................... -0.3 V dc, VDD – 2.0 V dc
VREFH to VDD .................................................................................... +2.0 V dc, +33.0 V dc
VREFH to VREFL ................................................................................
Current into any pin............................................................................
Digital input voltage to DGND ............................................................
Digital output voltage to DGND ..........................................................
Power dissipation (PD) .......................................................................
0 V dc, VDD – VSS
±15 mA
-0.3 V dc, VLOGIC + 0.3 V dc
-0.3 V dc, +7.0 V dc
1000 mW 2/
Junction temperature (TJ) ..................................................................
Storage temperature range ................................................................
Lead temperature (soldering, 60 seconds) ........................................
Thermal resistance, junction-to-case (θJC) ........................................
+150°C
-65°C to +150°C
+300°C
See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case X............................................................................................ 50°C/W
Case 3 ............................................................................................ 70°C/W
1.4 Recommended operating conditions.
Supply voltage range ......................................................................... ±15 V dc
Logic supply voltage (VLOGIC) ........................................................... +5 V dc
Positive reference voltage range (+VREF) ......................................... +2.5 V dc to +10.0 V dc
Negative reference voltage range (–VREF) ........................................ -10.0 V dc to 0 V dc
Ground potential ................................................................................ 0 V dc
Ambient operating temperature range (TA) ........................................ -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Derate above +80°C at 14.3 mW/°C for case 3. Derate above +100°C at 20 mW/°C for case X
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Block diagram. The block diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Integral linearity
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
INL
Group A
subgroups
Device
type
Limits
Unit
Min
Max
01, 03
-0.75
+0.75
02, 04
-1.5
+1.5
1, 2, 3
All
-1.0
+1.0
LSB
1, 2, 3
LSB
Differential linearity
DNL
Minimum scale error
VZSE
RL ≥ 2 kΩ
1, 2, 3
All
-2.0
+2.0
LSB
Full scale error
VFSE
RL ≥ 2 kΩ
1, 2, 3
All
-2.0
+2.0
LSB
Linearity matching
TA = +25°C
1
All
-1.0
+1.0
LSB
Minimum scale offset
matching
TA = +25°C
1
All
-1.0
+1.0
LSB
Full scale offset
matching
TA = +25°C
1
All
-2.0
+2.0
LSB
1, 2, 3
All
-2.75
+2.75
mA
0
+2.75
-10.0098
-9.9902
+9.9853
+10.0048
Reference input current
IREFH
Code 555H & 000H
IREFL
Output voltage swing
VOUT
(MIN)
RL = 2 kΩ
1, 2, 3
All
VOUT
(MAX)
V
Logic input high voltage
VINH
1, 2, 3
All
Logic input low voltage
VINL
1, 2, 3
All
Logic output high voltage
VOH
IOH = +0.4 mA
1, 2, 3
All
Logic output low voltage
VOL
IOL = -1.6 mA
1, 2, 3
All
0.4
V
VIN = 0 V or + 5 V
1, 2, 3
All
10
µA
14.25 V ≤ VDD ≤ 15.75 V
1, 2, 3
All
150
ppm/V
Logic input current
Power supply sensitivity
IIN
PSS
2.4
V
0.8
V
2.4
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
5
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
All
ISS
1, 2, 3
All
ILOGIC
1, 2, 3
All
4
All
7
All
9
All
9, 10, 11
All
90
ns
IDD
Negative supply current
Slew rate
SR
VREFH = +2.5 V
Measured at 10 % to 90 %,
TA = +25°C,
VO = 0 V to 10 V
FT
See 4.4.1c
Settling time
tS
10 V step to 0.01 %,
TA = +25°C
tWCS
13
mA
-10
mA
µA
100
2
V/µs
2/
Functional test
Chip select write pulse width
Max
1, 2, 3
Positive supply current
Logic supply current
Unit
2/
2/, 3/
µs
15
Write setup
tWS
tWCS = 90 ns
2/, 3/
9, 10, 11
All
0
ns
Write hold
tWH
tWCS = 90 ns
2/, 3/
9, 10, 11
All
0
ns
Address setup
tAS
2/, 3/
9, 10, 11
All
0
ns
Address hold
tAH
2/, 3/
9, 10, 11
All
0
ns
Load setup
tLS
2/, 3/
9, 10, 11
All
70
ns
WRITE load hold
tLH
2/, 3/
9, 10, 11
All
30
ns
WRITE data setup
tWDS
tWCS = 90 ns
2/, 3/
9, 10, 11
All
20
ns
WRITE data hold
tWDH
tWCS = 90 ns
2,/ 3/
9, 10, 11
All
0
ns
Load pulse width
tLWD
2/, 3/
9, 10, 11
All
170
ns
Reset pulse width
tRESET
2/, 3/
9, 10, 11
All
200
ns
tRCS
2/, 3/
9, 10, 11
All
130
ns
Chip select read pulse width
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
6
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
Read data hold
tRDH
tRCS = 130 ns
2/ 3/
9, 10, 11
All
0
ns
Read data setup
tRDS
tRCS = 130 ns
2/ 3/
9, 10, 11
All
10
ns
RL = 3 kΩ,
2/ 3/
9, 10, 11
All
200
ns
9, 10, 11
All
200
ns
Data to high Z
Chip select to data
1/
tDZ
tCSD
CL = 10 pF
RL = 3 kΩ,
2/ 3/
CL = 100 pF
All supplies can be varied ±5 % and operation is guaranteed. Unless otherwise specified, VDD = +15 V, VSS = -15 V,
VLOGIC = +5 V, VREFH = +10 V, and VREFL = -10 V.
2/
Guaranteed by characterization and not 100 % tested.
3/
All input control signals are specified with tr = tf = 5 ns (10 % to 90 % of +5 V) and timed from a voltage level of 1.6 V.
See figure 4.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
7
Device types
01, 02, 03, 04
Case outlines
X and 3
Terminal
number
Terminal symbol
1
VREFH
2
VOUTB
3
VOUTA
4
VSS
5
DGND
6
RESET
7
LDAC
8
DB0 (LSB)
9
DB1
10
DB2
11
DB3
12
DB4
13
DB5
14
DB6
15
DB7
16
DB8
17
DB9
18
DB10
19
DB11 (MSB)
20
R/ W
21
A1
22
A0
23
CS
24
VLOGIC
25
VDD
26
VOUTD
27
VOUTC
28
VREFL
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
8
A1
A0
R/ W
CS
RS
LDAC
Input
reg
Output
reg
Mode
DAC
L
L
L
L
H
L
Write
Write
Write
A
L
H
L
L
H
L
Write
Write
Write
B
H
L
L
L
H
L
Write
Write
Write
C
H
H
L
L
H
L
Write
Write
Write
D
L
L
L
L
H
H
Write
Hold
Write input
A
L
H
L
L
H
H
Write
Hold
Write input
B
H
L
L
L
H
H
Write
Hold
Write input
C
H
H
L
L
H
H
Write
Hold
Write input
D
L
L
H
L
H
H
Read
Hold
Read input
A
L
H
H
L
H
H
Read
Hold
Read input
B
H
L
H
L
H
H
Read
Hold
Read input
C
H
H
H
L
H
H
Read
Hold
Read input
D
X
X
X
H
H
L
Hold
X
X
X
H
H
H
Hold
X
X
X
X
L
X
* All registers reset to mid/zero scale
ALL
X
X
X
H
↑
X
* All registers latched to mid/zero scale
ALL
Update all output registers
Hold
Hold
ALL
ALL
* Device types 01 and 02 reset to midscale, and device types 03 and 04 reset to zero scale.
L = Low
H = High
X = Don’t care
FIGURE 2. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
9
FIGURE 3. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
10
FIGURE 4. Timing waveforms.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
11
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 92 (see MIL-PRF-38535, appendix A)
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
12
4.4.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
c.
For device class M, subgroups 7 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 shall include verifying the functionality of the device.
TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Device
class Q
Device
class V
1
1
1
1, 2, 3 1/
1, 2, 3 1/
1, 2, 3 1/
1, 2, 3, 4, 7, 9, 10, 11
2/
1, 2, 3, 4, 7, 9,
10, 11 2/
1, 2, 3, 4, 7, 9,
10, 11 2/
1
1
1
1
1
1
---
---
---
Subgroups
(in accordance with
MIL-PRF-38535, table III)
1/ PDA applies to subgroup 1.
2/ Subgroups 4, 9, 10, and 11, not tested, but shall be guaranteed to the limits specified in table I herein.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
13
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table II herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table II herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91764
A
REVISION LEVEL
B
SHEET
14
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 12-03-22
Approved sources of supply for SMD 5962-91764 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9176401MXA
24355
DAC8412AT/883
5962-9176402MXA
24355
DAC8412BT/883
5962-9176402M3A
24355
DAC8412BTC/883
5962-9176403MXA
24355
DAC8413AT/883
5962-9176404MXA
24355
DAC8413BT/883
5962-9176404M3A
24355
DAC8413BTC/883
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
24355
Vendor name
and address
Analog Devices
Rt 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact:
804 Woburn Street
Wilmington, MA 01887-3462
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.