74ACT11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS210A − MAY 1987 − REVISED APRIL 1996
D Inputs Are TTL-Voltage Compatible
D Flow-Through Architecture Optimizes
DB, DW, OR NT PACKAGE
(TOP VIEW)
PCB Layout
1Y1
1Y2
1Y3
1Y4
GND
GND
GND
GND
2Y1
2Y2
2Y3
2Y4
D Center-Pin VCC and GND Configurations
D
D
D
Minimize High-Speed Switching Noise
EPICt (Enhanced-Performance Implanted
CMOS) 1-mm Process
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, and Standard
Plastic 300-mil DIPs (NT)
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
1OE
1A1
1A2
1A3
1A4
VCC
VCC
2A1
2A2
2A3
2A4
2OE
description
This octal buffer or line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. This device provides
inverting outputs and symmetrical active-low output-enable (OE) inputs. This device features high fan-out and
improved fan-in.
The 74ACT11240 is characterized for operation from −40°C to 85°C.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
L
L
L
H
H
X
Z
logic symbol†
1OE
1A1
1A2
1A3
1A4
†
24
23
EN
2OE
1
1
22
2
21
3
20
4
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
13
17
EN
1
9
16
10
15
11
14
12
2Y1
2Y2
2Y3
2Y4
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright © 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
74ACT11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS210A − MAY 1987 − REVISED APRIL 1996
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
13
24
2OE
23
1 1Y1
22
2
21
3
20
4
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
9 2Y1
17
16
10
15
11
14
12
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . 0.65 W
DW package . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . 1.3 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
2
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
Dt/Dv
Input transition rise or fall rate
TA
Operating free-air temperature
MIN
NOM
MAX
4.5
5
5.5
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
V
V
0.8
V
0
VCC
V
0
VCC
V
−24
mA
24
mA
0
10
ns/V
−40
85
°C
74ACT11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS210A − MAY 1987 − REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = −50
50 mA
A
VOH
24 mA
IOH = −24
IOH = −75 mA{
TYP
MAX
IOL = 24 mA
MIN
4.5 V
4.4
4.4
5.5 V
5.4
5.4
4.5 V
3.94
3.8
5.5 V
4.94
4.8
5.5 V
IOL = 50 mA
A
VOL
TA = 25°C
MIN
MAX
UNIT
V
3.85
4.5 V
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
5.5 V
0.36
0.44
V
IOL = 75 mA{
5.5 V
IOZ
VO = VCC or GND
5.5 V
±0.5
±5
mA
II
VI = VCC or GND
5.5 V
±0.1
±1
mA
ICC
VI = VCC or GND,
IO = 0
5.5 V
8
80
mA
DICC‡
One input at 3.4 V,
Other inputs at GND or VCC
5.5 V
0.9
1
mA
Ci
VI = VCC or GND
5V
4
pF
Co
VI = VCC or GND
5V
10
pF
1.65
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V .
CC
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
TA = 25°C
MIN
MAX
9.9
1.5
10.6
8
1.5
8.7
7.5
11.7
1.5
12.5
1.5
7.3
11.5
1.5
12.3
1.5
7.3
9.4
1.5
10
1.5
7.9
10.3
1.5
10.8
MIN
TYP
MAX
1.5
6.5
1.5
6
1.5
UNIT
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
Outputs enabled
Cpd
Power dissipation capacitance per buffer
POST OFFICE BOX 655303
Outputs disabled
• DALLAS, TEXAS 75265
TYP
UNIT
47
CL = 50 pF,
pF
f = 1 MHz
13
pF
3
74ACT11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS210A − MAY 1987 − REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
LOAD CIRCUIT
Output
Control
(low-level
enabling)
3V
Input
1.5 V
1.5 V
0V
tPHL
tPLH
VOH
Output
50% VCC
50% VCC
VOL
3V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
1.5 V
1.5 V
50% VCC
20% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
[ VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
TBD
Lead/
Ball Finish
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
74ACT11240DBLE
OBSOLETE
SSOP
DB
24
Call TI
74ACT11240DW
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240DWR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240DWRE4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240DWRG4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11240NT
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11240NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74ACT11240DWR
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.7
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ACT11240DWR
SOIC
DW
24
2000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated