74HC253; 74HCT253 Dual 4-input multiplexer; 3-state Rev. 03 — 22 April 2010 Product data sheet 1. General description The 74HC253; 74HCT253 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). The 74HC253; 74HCT253 provides a dual 4-input multiplexer with 3-state outputs which selects 2 bits of data from up to four sources selected by common data select inputs (S0, S1). The two 4-input multiplexer circuits have individual active LOW output enable inputs (1OE, 2OE). The 74HC253 and 74HCT253 are the logic implementation of a 2-pole, 4-position switch, where the position of the switch is determined by the logic levels applied to S0 and S1. The outputs are forced to a high-impedance OFF-state when nOE is HIGH. The logic equations for the outputs are: 1Y = 1OE • ( 1I0 • S1 • S0 + 1I1 • S1 • S0 + 1I2 • S1 • S0 + 1I3 • S1 • S0 ) 2Y = 2OE • ( 2I0 • S1 • S0 + 2I1 • S1 • S0 + 2I2 • S1 • S0 + 2I3 • S1 • S0 ) 2. Features and benefits Non-inverting data path 3-state outputs interface directly with system bus Complies with JEDEC standard no. 7A Common select inputs Separate output enable inputs Input levels: For 74HC253: CMOS level For 74HCT253: TTL level ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from −40 °C to +85 °C and from −40 °C to +125 °C 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 3. Applications Data selectors Data multiplexers 4. Ordering information Table 1. Ordering information Type number 74HC253N Package Temperature range Name Description Version −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT253N 74HC253D 74HCT253D 74HC253DB 74HCT253DB 5. Functional diagram 1 6 5 4 3 6 5 4 3 10 11 12 14 13 2 1I0 1I1 1I2 1I3 2I0 2I1 2I2 2I3 S0 10 2 S1 11 1 1OE 12 14 15 Fig 1. 2OE Logic symbol 74HC_HCT253_3 Product data sheet 13 1Y 2Y 7 9 1OE 1I0 1I1 1I2 1Y MUX 7 1I3 S0 S1 2I0 2I1 2I2 2Y MUX 9 2I3 2OE 15 001aal850 Fig 2. 001aal851 Functional diagram All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 2 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 1OE 1I3 1I2 1I1 1I0 S0 S1 2I3 2I2 1Y Fig 3. 2I1 2Y 2I0 2OE 001aal852 Logic diagram 6. Pinning information 6.1 Pinning 74HC253 74HCT253 1OE 1 16 VCC S1 2 15 2OE 1I3 3 14 S0 1I2 1I1 1I0 5 6 7 GND 8 1OE 1 16 VCC S1 2 15 2OE 1l3 3 14 S0 12 2I2 1l2 4 13 2l3 11 2I1 1l1 5 12 2l2 1l0 6 11 2l1 1Y 7 10 2l0 GND 8 13 2I3 4 1Y 74HC253 74HCT253 10 2I0 9 2Y Pin configuration DIP16, SO16 74HC_HCT253_3 Product data sheet 2Y 001aal854 001aal853 Fig 4. 9 Fig 5. Pin configuration SSOP16 All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 3 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 6.2 Pin description Table 2. Pin description Symbol Pin Description 1OE, 2OE 1, 15 output enable inputs (active LOW) S0, S1 14, 2 data select inputs 1I0, 1I1, 1I2, 1I3 6, 5, 4, 3 data inputs source 1 1Y 7 multiplexer output source 1 GND 8 ground (0 V) 2Y 9 multiplexer output source 2 2I0, 2I1, 2I2, 2I3 10, 11, 12, 13 data inputs source 2 VCC 16 supply voltage 7. Functional description Table 3. Function table[1] select Inputs data inputs output enable output S0 S1 nI0 nI1 nI2 nI3 nOE nY X X X X X X H Z L L L X X X L L L L H X X X L H H L X L X X L L H L X H X X L H L H X X L X L L L H X X H X L H H H X X X L L L H H X X X H L H [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V IO output current −0.5 V < VO < VCC + 0.5 V - ±35 mA ICC supply current - 70 mA IGND ground current −70 - mA Tstg storage temperature −65 +150 °C 74HC_HCT253_3 Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 Min Max Unit −0.5 +7.0 V [1] - ±20 mA [1] - ±50 mA © NXP B.V. 2010. All rights reserved. 4 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Ptot total power dissipation Tamb = −40 °C to +125 °C [1] Min Max Unit DIP16 package [2] - 750 mW SO16 package [3] - 500 mW SSOP16 package [4] - 500 mW The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Ptot derates linearly with 12 mW/K above 70 °C. [3] Ptot derates linearly with 8 mW/K above 70 °C. [4] Ptot derates linearly with 5.5 mW/K above 60 °C. 9. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature Δt/ΔV input transition rise and fall rate 74HC253 74HCT253 Unit Min Typ Max Min Typ Max 2.0 5.0 6.0 4.5 5.0 5.5 V 0 - VCC 0 - VCC V 0 - VCC 0 - VCC V −40 - +125 −40 - +125 °C VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V 10. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions Min Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max 74HC253 VIH VIL HIGH-level input voltage LOW-level input voltage 74HC_HCT253_3 Product data sheet VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 5 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH VOL HIGH-level output voltage LOW-level output voltage 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max IO = −20 μA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −20 μA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −20 μA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = −6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = −7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V IO = 20 μA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 μA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 μA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V VI = VIH or VIL VI = VIH or VIL II input leakage current VI = VCC or GND; VCC = 6.0 V - - ±0.1 - ±1.0 - ±1.0 μA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V - - ±0.5 - ±5.0 - ±10.0 μA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 μA CI input capacitance - 3.5 - pF 74HCT253 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = −20 μA 4.4 4.5 - 4.4 - 4.4 - V IO = −6 mA 3.98 4.32 - 3.84 - 3.7 - V IO = 20 μA - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA - 0.15 0.26 - 0.33 - 0.4 V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - ±0.1 - ±1.0 - ±1.0 μA IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A - - ±0.5 - ±5.0 - ±10 μA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 - 80 - 160 μA 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 6 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter ΔICC CI additional supply current 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max per input pin; 1In, 2In inputs - 40 144 - 180 - 196 μA per input pin; nOE input - 110 396 - 495 - 539 μA per input pin; Sn input - 110 396 - 495 - 539 μA - 3.5 - VI = VCC − 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A input capacitance pF 11. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to Unit +125 °C Typ Max Max Max VCC = 2.0 V 55 175 220 265 ns VCC = 4.5 V 20 35 44 53 ns VCC = 5.0 V; CL = 15 pF 17 - - - ns VCC = 6.0 V 16 30 37 45 ns 74HC253 tpd propagation delay 1ln to 1Y or 2ln to 2Y; see Figure 6 [1] Sn to nY; see Figure 6 VCC = 2.0 V 58 175 220 265 ns VCC = 4.5 V 21 35 44 53 ns VCC = 5.0 V; CL = 15 pF 18 - - - ns 17 30 37 45 ns VCC = 2.0 V 30 100 125 150 ns VCC = 4.5 V 11 20 25 30 ns 9 17 21 26 ns VCC = 2.0 V 41 150 190 225 ns VCC = 4.5 V 15 30 38 45 ns VCC = 6.0 V 12 26 33 38 ns VCC = 6.0 V ten enable time nOE to nY; see Figure 7 [2] VCC = 6.0 V tdis disable time 74HC_HCT253_3 Product data sheet nOE to nY; see Figure 7 [3] All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 7 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter tt transition time 25 °C Conditions power dissipation capacitance −40 °C to Unit +125 °C Typ Max Max Max VCC = 2.0 V 14 60 75 90 ns VCC = 4.5 V 5 12 15 18 ns 4 10 13 15 ns 55 - VCC = 4.5 V 20 38 48 VCC = 5.0 V; CL = 15 pF 17 - - VCC = 4.5 V 22 40 50 VCC = 5.0 V; CL = 15 pF 19 - 14 30 38 45 ns 13 30 38 45 ns 5 12 15 18 ns 55 - [4] see Figure 6 VCC = 6.0 V CPD −40 °C to +85 °C per multiplexer; VI = GND to VCC [5] 1ln to 1Y or 2ln to 2Y; see Figure 6 [1] pF 74HCT253 propagation delay tpd 57 ns ns Sn to nY; see Figure 6 ten enable time nOE to nY; VCC = 4.5 V; see Figure 7 [2] tdis disable time nOE to nY; VCC = 4.5 V; see Figure 7 [3] tt transition time VCC = 4.5 V; see Figure 6 power dissipation capacitance CPD [1] tpd is the same as tPHL, tPLH. [2] ten is the same as tPZH, tPZL. [3] tdis is the same as tPHZ, tPLZ. [4] tt is the same as tTHL, tTLH. [5] per multiplexer; VI = GND to VCC [5] 60 ns ns pF CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs. 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 8 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 12. Waveforms VI VM Sn, 1In, 2ln input VM GND tPHL tPLH VOH 90 % VM nY output VM 10 % VOL tTHL tTLH 001aal855 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Propagation delays input (Sn, 1In, 2In) to output (nY) and output (nY) transition times tr VI nOE input tf 90 % VM GND 10 % tPLZ output LOW-to-OFF OFF-to-LOW tPZL VCC VM 10 % VOL tPHZ VOH tPZH 90 % output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled 001aal856 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. 3-state output enable and disable times Table 8. Measurement points Type Input Output VM VM 74HC253 0.5VCC 0.5VCC 74HCT253 1.3 V 1.3 V 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 9 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC VI G VO RL S1 open DUT RT CL 001aad983 Measurement points are given in Table 8 and test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistor. Fig 8. Test circuit for switching times Table 9. Type Test data Input Load Switch position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC253 VCC 6 ns 50 pF 1 kΩ open GND VCC 74HCT253 3V 6 ns 50 pF 1 kΩ open GND VCC 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 10 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 9. EUROPEAN PROJECTION Package outline SOT38-4 (DIP16) 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 11 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 10. Package outline SOT109-1 (SO16) 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 12 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 11. Package outline SOT338-1 (SSOP16) 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 13 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 14. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT253_3 20100422 Product data sheet - 74HC_HCT253_CNV_2 Modifications: 74HC_HCT253_CNV_2 74HC_HCT253_3 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 970828 Product specification - All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 - © NXP B.V. 2010. All rights reserved. 14 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74HC_HCT253_3 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 15 of 17 74HC253; 74HCT253 NXP Semiconductors Dual 4-input multiplexer; 3-state 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT253_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 22 April 2010 © NXP B.V. 2010. All rights reserved. 16 of 17 NXP Semiconductors 74HC253; 74HCT253 Dual 4-input multiplexer; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 22 April 2010 Document identifier: 74HC_HCT253_3