74HC7541; 74HCT7541 Octal Schmitt trigger buffer/line driver; 3-state Rev. 3 — 25 July 2011 Product data sheet 1. General description The 74HC7541; 74HCT7541 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A. The 74HC7541; 74HCT7541 provides eight non-inverting buffer/line drivers with 3-state outputs and Schmitt-trigger action. The 3-state outputs are controlled by the output enable inputs OE1 and OE2. A HIGH on OEn causes the outputs to assume a high-impedance OFF-state. Schmitt trigger action on the data inputs transforms slowly changing input signals into sharply defined, jitter-free output signals. The 74HC7541; 74HCT7541 is identical to the 74HC541; 74HCT541 but has hysteresis on the data inputs. 2. Features and benefits Non-inverting outputs Low-power dissipation ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 40 C to +125 C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 40 C to +125 C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 74HC7541DB 40 C to +125 C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 74HC7541PW 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 74HC7541N 74HCT7541N 74HC7541D 74HCT7541D 74HCT7541PW 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 4. Functional diagram 2 3 4 5 A0 Y0 A1 Y1 A2 Y2 A3 Y3 18 17 16 15 1 19 6 7 8 9 1 19 Y4 A4 A5 12 Y7 11 OE1 OE2 Fig 1. 13 Y6 A7 EN 14 Y5 A6 & 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 aaa-000085 aaa-000084 Logic symbol Fig 2. IEC logic symbol 5. Pinning information 5.1 Pinning 74HC7541 74HCT7541 74HC7541 74HCT7541 OE1 1 20 VCC OE1 1 20 VCC A0 2 19 OE2 AO 2 19 OE2 A1 3 18 Y0 A1 3 18 Y0 A2 4 17 Y1 A2 4 17 Y1 A3 5 16 Y2 A3 5 16 Y2 A4 6 15 Y3 A4 6 15 Y3 A5 7 14 Y4 A5 7 14 Y4 A6 8 13 Y5 A6 8 13 Y5 A7 9 12 Y6 A7 9 12 Y6 GND 10 11 Y7 GND 10 11 Y7 aaa-000086 Fig 3. aaa-000087 Pin configuration DIP20, SO20 74HC_HCT7541 Product data sheet Fig 4. Pin configuration SSOP20, TSSOP20 All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 2 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 5.2 Pin description Table 2. Pin description Symbol Pin Description OE1 1 output enable input (active LOW) A0 to A7 2, 3, 4, 5, 6, 7, 8, 9 data input GND 10 ground (0 V) Y0 to Y7 18, 17, 16, 15, 14, 13, 12, 11 data output OE2 19 output enable input (active LOW) VCC 20 supply voltage 6. Functional description Table 3. Functional table[1] Control Input Output OE1 OE2 An Yn L L L L L L H H X H X Z H X X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7 V - 20 mA - 20 mA - 25 mA input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] IO output current 0.5 V < VO < VCC + 0.5 V ICC supply current - 50 mA IGND ground current 50 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation DIP20 - 750 mW SO20, SSOP20, TSSOP20 - 500 mW IIK [1] [2] [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For DIP20 packages: above 70 C the value of Ptot derates linearly with 12 mW/K. For SO20 packages: above 70 C the value of Ptot derates linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K. 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 3 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC7541 Min 74HCT7541 Typ Max Min Unit Typ Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 C Conditions Min Typ Max Tamb = 40 C to +85 C Tamb = 40 C to +125 C Min Min Max Unit Max 74HC7541 VOH VOL HIGH-level output voltage LOW-level output voltage VI = VT+ or VT IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V VI = VT+ or VT II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1.0 - 1.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 A CI input capacitance - 3.5 - - - - - pF 74HCT7541 VOH VOL HIGH-level output voltage LOW-level output voltage 74HC_HCT7541 Product data sheet VI = VT+ or VT; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 6.0 mA 3.98 4.32 - 3.84 - 3.7 - V IO = 20 A; - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; - 0.15 0.26 - 0.33 - 0.4 V VI = VT+ or VT; VCC = 4.5 V All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 4 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 C Conditions Tamb = 40 C to +85 C Tamb = 40 C to +125 C Min Typ Max Min Max Min Max Unit II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1.0 - 1.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 - 80 - 160 A ICC additional supply current per input pin; IO = 0 A; VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V CI An input - 20 72 - 90 - 98 A OEn input - 130 468 - 585 - 637 A - 3.5 - - - - - pF input capacitance 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; CL = 50 pF; for test circuit see Figure 7. Symbol Parameter Tamb = 25 C Conditions Min Tamb = 40 C to +125 C Typ Max Max (85 C) Max (125 C) Unit 74HC7541 tpd propagation delay An to Yn; see Figure 5 [1] VCC = 2.0 V - 39 120 150 180 ns VCC = 4.5 V - 14 24 30 36 ns VCC = 5.0 V; CL = 15 pF - 10 - - - ns - 11 20 26 32 ns VCC = 2.0 V - 44 160 200 240 ns VCC = 4.5 V - 16 32 40 48 ns - 13 27 34 41 ns VCC = 2.0 V - 58 160 200 240 ns VCC = 4.5 V - 21 32 40 48 ns - 17 27 34 41 ns VCC = 2.0 V - 14 60 75 90 ns VCC = 4.5 V - 5 12 15 18 ns - 4 10 13 15 ns - 30 - - - pF VCC = 6.0 V ten enable time OEn to Yn; see Figure 6 [1] VCC = 6.0 V tdis disable time OEn to Yn; see Figure 6 [1] VCC = 6.0 V tt transition time see Figure 5 [2] VCC = 6.0 V CPD power dissipation capacitance 74HC_HCT7541 Product data sheet per package; VI = GND to VCC [3] All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 5 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state Table 7. Dynamic characteristics GND = 0 V; CL = 50 pF; for test circuit see Figure 7. Symbol Parameter Tamb = 25 C Conditions Tamb = 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) - 19 32 40 48 ns - 16 - - - ns - 18 32 40 48 ns 74HCT7541 [1] propagation delay An to Yn; see Figure 5 tpd VCC = 4.5 V VCC = 5.0 V; CL = 15 pF ten enable time OEn to Yn; see Figure 6 tdis disable time OEn to Yn; see Figure 6 [1] VCC = 4.5 V [1] VCC = 4.5 V transition time tt power dissipation capacitance CPD [1] - 20 32 40 48 ns VCC = 4.5 V; see Figure 5 [2] - 5 12 15 18 ns per package; VI = GND to VCC 1.5 V [3] - 32 - - - pF tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 11. Waveforms Vl An input VM VM GND tPHL tPLH VOH Yn output 90 % VM VM 10 % VOL tTHL tTLH aaa-000088 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Input to output propagation delays 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 6 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state VI OEn input VM GND tPLZ tPZL VCC Yn output LOW-to-OFF OFF-to-LOW VM VX VOL tPZH tPHZ VOH VY Yn output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs disabled outputs enabled aaa-000089 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. 3-state enable and disable times Table 8. Measurement points Type Input Output VM VM VX VY 74HC7541 0.5VCC 0.5VCC 0.1VCC 0.9VCC 74HCT7541 1.3 V 1.3 V 0.1VCC 0.9VCC 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 7 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistance S1 = Test selection switch Fig 7. Test circuit for measuring switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC7541 VCC 6 ns 15 pF, 50 pF 1 k open GND VCC 74HCT7541 3V 6 ns 15 pF, 50 pF 1 k open GND VCC 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 8 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 12. Transfer characteristics Table 10. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8 and Figure 9. Symbol Parameter Tamb = 25 C Conditions Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 2.0 V - - 1.5 - 1.5 - 1.5 V VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V 74HC7541 VT+ VT VH positive-going threshold voltage VCC = 6.0 V negative-going VCC = 2.0 V threshold VCC = 4.5 V voltage VCC = 6.0 V hysteresis voltage - - 4.2 - 4.2 - 4.2 V 0.3 - - 0.3 - 0.3 - V 1.35 - - 1.35 - 1.35 - V 1.8 - - 1.8 - 1.8 - V VCC = 2.0 V 0.1 0.20 - 0.1 - 0.1 - V VCC = 4.5 V 0.25 0.40 - 0.25 - 0.25 - V VCC = 6.0 V 0.3 0.5 - 0.3 - 0.3 - V VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.1 - 2.1 - 2.1 V negative-going VCC = 4.5 V threshold VCC = 5.5 V voltage 0.7 - - 0.64 - 0.6 - V 0.8 - - 0.74 - 0.7 - V hysteresis voltage VCC = 4.5 V 0.17 0.23 - - - - - V VCC = 5.5 V 0.17 0.23 - - - - - V 74HCT7541 VT+ VT VH positive-going threshold voltage 13. Transfer characteristics waveforms VO VI VT+ VT− VT− Fig 8. VT+ Transfer characteristics 74HC_HCT7541 Product data sheet VO VI VH VH mnb155 mnb154 Fig 9. Transfer characteristics definitions All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 9 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 14. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2 0.25 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC JEITA MS-001 SC-603 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 10. Package outline SOT146-1 (DIP20) 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 10 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT163-1 (SO20) 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 11 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 12. Package outline SOT339-1 (SSOP20) 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 12 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 13. Package outline SOT360-1 (TSSOP20) 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 13 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 15. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 16. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT7541 v.3 20110725 Product data sheet - 74HC_HCT7541_CNV v.2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Added type numbers 74HC7541PW and 74HCT7541PW (TSSOP20 package). 74HC_HCT7541_CNV v.2 19970917 74HC_HCT7541 Product data sheet Product specification - All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 - © NXP B.V. 2011. All rights reserved. 14 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74HC_HCT7541 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 15 of 17 74HC7541; 74HCT7541 NXP Semiconductors Octal Schmitt trigger buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT7541 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 July 2011 © NXP B.V. 2011. All rights reserved. 16 of 17 NXP Semiconductors 74HC7541; 74HCT7541 Octal Schmitt trigger buffer/line driver; 3-state 19. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Transfer characteristics . . . . . . . . . . . . . . . . . . 9 Transfer characteristics waveforms. . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 July 2011 Document identifier: 74HC_HCT7541