PHILIPS 74LVC2244APW

INTEGRATED CIRCUITS
DATA SHEET
74LVC2244A
Octal buffer/line driver with 30 Ω
series termination resistors; 5 V
input/output tolerant; 3-state
Product specification
File under Integrated Circuits, IC24
1999 Sep 30
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
FEATURES
DESCRIPTION
• 5 V tolerant inputs/outputs for interfacing with 5 V logic
The 74LVC2244A is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most
advanced CMOS compatible TTL families.
• Wide supply voltage range of 1.2 to 3.6 V
• CMOS low power consumption
Inputs can be driven from either 3.3 or 5 V devices. In
3-state operation, outputs can handle 5 V. These features
allow the use of these devices as translators in a mixed
3.3/5 V environment.
• Direct interface with TTL levels
• Integrated 30 Ω termination resistors.
The 74LVC2244A is an octal non-inverting buffer/line
driver with 3-state outputs. The 3-state outputs are
controlled by the output enable inputs 1OE and 2OE. A
HIGH on nOE causes the outputs to assume a
high-impedance OFF-state. Schmitt-trigger action at all
inputs makes the circuit highly tolerant for slower input rise
and fall times. The 74LVC2244A is designed with 30 Ω
series termination resistors in both HIGH and LOW output
stages to reduce line noise.
QUICK REFERENCE DATA
Ground = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns.
SYMBOL
PARAMETER
tPHL/tPLH
propagation delay 1An to 1Yn; 2An to 2Yn
CI
input capacitance
CPD
power dissipation capacitance per buffer
CONDITIONS
4.0
5.0
pF
VI = GND to VCC; note 1
25
pF
1. CPD is used to determine the dynamic power dissipation (PD in µW).
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
Σ(CL × VCC2 × fo) = sum of the outputs.
1999 Sep 30
2
UNIT
CL = 50 pF; VCC = 3.3 V
Note
PD = CPD × VCC2 × fi + Σ(CL × VCC2 × fo) where:
TYPICAL
ns
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
FUNCTION TABLE
See note 1.
INPUT
OUTPUT
nOE
nAn
nYn
L
L
L
L
H
H
H
X
Z
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
PACKAGE
OUTSIDE NORTH
AMERICA
NORTH AMERICA
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
−40 to +85 °C
20
SO
plastic
SOT163-1
74LVC2244AD
74LVC2244AD
74LVC2244ADB
74LVC2244ADB
20
SSOP
plastic
SOT339-1
74LVC2244APW
74LVC2244APW DH
20
TSSOP
plastic
SOT360-1
PINNING
PIN
SYMBOL
DESCRIPTION
1
1OE
output enable input (active LOW)
2, 4, 6, 8
1A0 to 1A3
data inputs
3, 5, 7, 9
2Y0 to 2Y3
bus outputs
10
GND
ground (0 V)
11, 13, 15, 17
2A3 to 2A0
data inputs
12, 14, 16, 18
1Y3 to 1Y0
bus outputs
19
2OE
output enable input (active LOW)
20
VCC
DC supply voltage
1999 Sep 30
3
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
handbook, halfpage
1OE 1
20 VCC
1A0 2
19 2OE
2Y0 3
18 1Y0
1A1 4
17 2A0
74LVC2244A
16 1Y1
2Y1 5
2244
1A2 6
15 2A1
2Y2 7
14 1Y2
1A3 8
13 2A2
2Y3 9
12 1Y3
GND 10
11 2A3
handbook, halfpage
2
4
6
MNA357
8
1
Fig.1 Pin configuration.
17
15
handbook, halfpage
1
13
1Y0
1A1
1Y1
1A2
1Y2
1A3
1Y3
18
16
14
12
1OE
2A0
2Y0
2A1
2Y1
2A2
2Y2
2A3
2Y3
3
5
7
EN
2
18
4
16
6
14
8
12
19
1A0
11
19
9
2OE
MNA360
EN
17
3
15
5
13
7
11
9
MNA359
Fig.3 IEC logic symbol.
1999 Sep 30
Fig.2 Functional diagram.
4
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
DC supply voltage
for max. speed performance
2.7
3.6
V
for low-voltage applications
1.2
3.6
V
0
5.5
V
0
VCC
V
VI
DC input voltage
VO
DC output voltage
output HIGH or LOW state
0
5.5
V
Tamb
operating ambient temperature
3-state
see DC and AC characteristics per
device
−40
+85
°C
tr,tf
input rise and fall times
VCC = 1.2 to 2.7 V
0
20
ns/V
VCC = 2.7 to 3.6 V
0
10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC
DC supply voltage
CONDITIONS
MIN.
MAX.
UNIT
−0.5
+6.5
V
IIK
DC input diode current
VI < 0
−
−50
mA
VI
DC input voltage
note 1
−0.5
+5.5
V
IOK
DC output diode current
VO > VCC or VO < 0
−
±50
mA
VO
DC output voltage
output HIGH or LOW
note 1
−0.5
VCC + 0.5
V
output 3-state
note 1
−0.5
+6.5
V
VO = 0 to VCC
IO
DC output diode current
−
±50
mA
ICC, IGND
DC VCC or GND current
−
±100
mA
Tstg
storage temperature
−65
+150
°C
Ptot
power dissipation per package
note 2
−
500
mW
plastic shrink mini-pack (SSOP and note 3
TSSOP)
−
500
mW
plastic mini-pack (SO)
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO package: above 70 °C the value of Ptot derates linearly with 8 mW/K.
3. For SSOP and TSSOP package: above 60 °C the value of Ptot derates linearly with 5.5 mW/K.
1999 Sep 30
5
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
DC CHARACTERISTICS
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
−40 to +85
PARAMETER
OTHER
VIH
Tamb (°C)
HIGH-level input voltage
VCC (V)
MIN.
VOH
VOL
LOW-level input voltage
HIGH-level output voltage
−
−
−
−
−
GND
2.7 to 3.6 −
−
0.8
LOW-level output voltage
1.2
VI = VIH or VIL; IO = −6 mA
TYP.(1) MAX.
−
1.2
VCC
2.7 to 3.6 2.0
VIL
UNIT
2.7
VCC − 0.5 −
−
VI = VIH or VIL; IO = −100 µA 3.0
VCC − 0.2 VCC
−
VI = VIH or VIL; IO = −12 mA
3.0
VCC − 0.8 −
−
VI = VIH or VIL; IO = 6 mA
2.7
−
−
0.40
VI = VIH or VIL; IO = 100 µA
3.0
−
−
0.20
V
V
V
V
VI = VIH or VIL; IO = 12 mA
3.0
−
−
0.55
II
input leakage current
VI = 5.5 V or GND
3.6
−
±0.1
±5
µA
IOZ
3-state output OFF-state
current
VI = VIH or VIL;
VO = 5.5 V or GND
3.6
−
0.1
±10
µA
Ioff
power off leakage supply
VI or VO = 5.5 V
0.0
−
0.1
±10
µA
ICC
quiescent supply current
VI = VCC or GND; IO = 0
3.6
−
0.1
20
µA
∆ICC
additional quiescent supply
current per control pin
VI = VCC − 0.6 V; IO = 0
2.7 to 3.6 −
5
500
µA
Note
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
1999 Sep 30
6
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
AC CHARACTERISTICS
Ground = 0 V; tr = tf ≤ 2.5 ns.
SYMBOL
PARAMETER
VCC = 3.3 ±0.3 V
WAVEFORMS
MIN.
TYP.(1)
MAX.
VCC = 2.7 V
MIN.
UNIT
MAX.
tPHL/tPLH
propagation delay
1An to 1Yn; 2An to 2Yn
see Figs 4 and 6
1.5
4.0
6.5
1.5
7.5
ns
tPZH/tPZL
3-state output enable time
1OE to 1Yn; 2OE to 2Yn
see Figs 5 and 6
1.5
4.4
8.1
1.5
9.1
ns
tPHZ/tPLZ
3-state output disable time
1OE to 1Yn; 2OE to 2Yn
see Figs 5 and 6
1.5
3.8
5.4
1.5
6.4
ns
Note
1. Typical values at VCC = 3.3 V and Tamb = 25 °C.
AC WAVEFORMS
handbook, halfpage VI
1An, 2An
VM
input
GND
tPHL
tPLH
VOH
1Yn, 2Yn
VM
output
VOL
MNA361
VM = 1.5 V at VCC ≥ 2.7 V;
VM = 0.5 VCC at VCC < 2.7 V;
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.4 The input nAn to output nYn propagation delays.
1999 Sep 30
7
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
VI
handbook, full pagewidth
nOE input
VM
GND
tPLZ
tPZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
tPZH
VOH
VY
output
HIGH-to-OFF
OFF-to-HIGH
GND
VM
outputs
enabled
outputs
enabled
outputs
disabled
MNA362
Fig.5 The 3-state enable and disable times.
S1
handbook, full pagewidth
VCC
VI
PULSE
GENERATOR
RL
500 Ω
VO
2 × VCC
open
GND
D.U.T.
CL
50 pF
RT
RL
500 Ω
MNA368
TEST
Definitions for test circuit:
RL = Load resistor
CL = Load capacitance including jig and probe capacitance
(see Chapter “AC characteristics”).
RT = Termination resistance should be equal to the output impedance Zo
of the pulse generator.
S1
VCC
VI
tPLH/tPHL
open
tPLZ/tPZL
2 × VCC
<2.7 V
VCC
tPHZ/tPZH
GND
2.7 to 3.6 V
2.7 V
Fig.6 Load circuitry for switching times.
1999 Sep 30
8
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
1999 Sep 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
9
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
D
SOT339-1
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
w M
bp
e
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.9
0.5
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT339-1
1999 Sep 30
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
MO-150AE
10
o
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
1999 Sep 30
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-06-16
95-02-04
MO-153AC
11
o
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
SOLDERING
74LVC2244A
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 30
12
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
74LVC2244A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3), SO, SOJ
suitable
suitable(2)
suitable
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 30
13
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
NOTES
1999 Sep 30
14
74LVC2244A
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 Ω series termination
resistors; 5 V input/output tolerant; 3-state
NOTES
1999 Sep 30
15
74LVC2244A
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Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 68
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 1999
Sep 30
Document order number:
9397 750 05623