FAIRCHILD 74LVTH574WM_08

74LVT574, 74LVTH574
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Features
General Description
■ Input and output interface capability to systems at
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented
applications. A buffered Clock (CP) and Output Enable
(OE) are common to all flip-flops.
■
■
■
■
■
■
■
5V VCC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32mA/+64mA
Functionally compatible with the 74 series 574
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model > 2000V
– Machine model > 200V
– Charged-device model > 1000V
The LVTH574 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT574 and
LVTH574 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Ordering Information
Order Number
Package
Number
Package Description
74LVT574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LVT574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LVTH574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
January 2008
Logic Symbols
IEEE/IEC
Pin Description
Pin Names
Description
D0–D7
Data Inputs
CP
Clock Pulse Input
OE
3-STATE Output Enable Input
O0–O7
3-STATE Outputs
Functional Description
Truth Table
The LVT574 and LVTH574 consist of eight edgetriggered flip-flops with individual D-type inputs and
3-STATE true outputs. The buffered clock and buffered
Output Enable are common to all flip-flops. The eight
flip-flops will store the state of their individual D-type
inputs that meet the setup and hold time requirements
on the LOW-to-HIGH Clock (CP) transition. With the Output Enable (OE) LOW, the contents of the eight flip-flops
are available at the outputs. When the OE is HIGH, the
outputs go to the high impedance state. Operation of the
OE input does not affect the state of the flip-flops.
Inputs
Dn
CP
Outputs
OE
On
L
H
H
L
L
X
L
L
L
Oo
X
X
H
Z
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
= LOW-to-HIGH Transition
Oo = Previous Oo before HIGH to LOW of CP
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
2
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Connection Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to
estimate propagation delays.
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
3
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Logic Diagram
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Rating
Supply Voltage
–0.5V to +4.6V
VI
DC Input Voltage
–0.5V to +7.0V
VO
DC Output Voltage
Output in 3-STATE
–0.5V to +7.0V
State(1)
Output in HIGH or LOW
–0.5V to +7.0V
DC Input Diode Current, VI < GND
–50mA
IOK
DC Output Diode Current, VO < GND
–50mA
IO
DC Output Current, VO > VCC
IIK
Output at HIGH State
64mA
Output at LOW State
128mA
ICC
DC Supply Current per Supply Pin
±64mA
IGND
DC Ground Current per Ground Pin
±128mA
TSTG
Storage Temperature
–65°C to +150°C
Note:
1. IO Absolute Maximum Rating must be observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
VI
Parameter
Min
Max
Units
Supply Voltage
2.7
3.6
V
Input Voltage
0
5.5
V
IOH
HIGH-Level Output Current
–32
mA
IOL
LOW-Level Output Current
64
mA
TA
Free-Air Operating Temperature
–40
85
°C
0
10
ns/V
∆t / ∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
4
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Absolute Maximum Ratings
T A = –40°C to +85°C
Symbol
Parameter
VCC (V)
2.7
Conditions
II = –18mA
VIK
Input Clamp Diode Voltage
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VO ≤ 0.1V or
VO ≥ VCC – 0.1V
VOH
Output HIGH Voltage
2.7–3.6
IOH = –100µA
Output LOW Voltage
II(HOLD)
II(OD)(3)
II
Max. Units
–1.2
2.0
0.8
VCC – 0.2
3.0
IOH = –32mA
2.0
IOL = 100µA
0.2
IOL = 24mA
0.5
IOL = 16mA
0.4
IOL = 32mA
0.5
IOL = 64mA
0.55
75
VI = 2.0V
–75
Bushold Input Minimum
Drive
3.0
Bushold Input Over-Drive
Current to Change State
3.0
Input Current
3.6
VI = 5.5V
10
Control Pins
3.6
VI = 0V or VCC
±1
Data Pins
3.6
VI = 0V
–5
VI = VCC
1
(4)
500
(5)
–500
V
V
2.7
VI = 0.8V
V
V
2.4
3.0
(3)
Typ.(2)
IOH = –8mA
2.7
VOL
Min.
V
µA
µA
µA
0V ≤ VI or VO ≤ 5.5V
±100
µA
VO = 0.5V to 3.0V,
VI = GND or VCC
±100
µA
VO = 0.5V
–5
µA
3.6
VO = 3.0V
5
µA
3-STATE Output Leakage
Current
3.6
VCC < VO ≤ 5.5V
10
µA
ICCH
Power Supply Current
3.6
Outputs HIGH
0.19
mA
ICCL
Power Supply Current
3.6
Outputs LOW
5
mA
IOFF
Power Off Leakage Current
0
IPU/PD
Power up/down 3-STATE
Output Current
0–1.5
IOZL
3-STATE Output Leakage
Current
3.6
IOZH
3-STATE Output Leakage
Current
IOZH+
ICCZ
Power Supply Current
3.6
Outputs Disabled
0.19
mA
ICCZ+
Power Supply Current
3.6
VCC ≤ VO ≤ 5.5V,
Outputs Disabled
0.19
mA
∆ICC
Increase in Power Supply
Current(6)
3.6
One Input at VCC – 0.6V,
Other Inputs at VCC or
GND
0.2
mA
Notes:
2. All typical values are at VCC = 3.3V, TA = 25°C.
3. Applies to bushold versions only (74LVTH574).
4. An external driver must source at least the specified current to switch from LOW-to-HIGH.
5. An external driver must sink at least the specified current to switch from HIGH-to-LOW.
6. This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
5
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
DC Electrical Characteristics
TA = 25°C
Conditions
Symbol
Parameter
VCC (V)
CL = 50pF, RL = 500Ω
VOLP
Quiet Output Maximum
Dynamic VOL
3.3
(8)
VOLV
Quiet Output Minimum
Dynamic VOL
3.3
(8)
Min.
Typ.
Max.
Units
0.8
V
–0.8
V
Notes:
7. Characterized in SOIC package. Guaranteed parameter, but not tested.
8. Max number of outputs defined as (n). n–1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
TA = –40°C to +85°C
CL = 50pF, RL = 500Ω
VCC = 3.3V ± 0.3V
Symbol
Parameter
Min.
Typ.(9)
Max.
VCC = 2.7V
Min.
Max.
fMAX
Maximum Clock Frequency
150
tPHL
Propagation Delay, CP to On
1.8
4.6
1.8
5.3
1.8
4.5
1.8
5.3
1.5
5.2
1.5
6.1
1.5
4.8
1.5
5.9
2.0
4.4
2.0
4.4
2.0
4.8
2.0
5.1
tPLH
tPZL
Output Enable Time
tPZH
tPLZ
Output Disable Time
tPHZ
150
MHz
2.4
ns
ns
ns
tS
Setup Time
tH
Hold Time
0.3
0.0
ns
tW
Pulse Width
3.3
3.3
ns
tOSHL, tOSLH
2.0
Units
Output to Output Skew(10)
ns
1.0
1.0
ns
Notes:
9. All typical values are at VCC = 3.3V, TA = 25°C.
10. Skew is defined as the absolute value of the difference between the actual propagation delay for any two
separate outputs of the same device. The specification applies to any outputs switching in the same direction,
either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance(11)
Symbol
CIN
COUT
Parameter
Conditions
Typical
Units
Input Capacitance
VCC = Open, VI = 0V or VCC
4
pF
Output Capacitance
VCC = 3.0V, VO = 0V or VCC
6
pF
Note:
11. Capacitance is measured at frequency f = 1MHz, per MIL-STD-883, Method 3012.
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
6
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Dynamic Switching Characteristics(7)
13.00
12.60
A
11.43
20
11
B
9.50
10.65 7.60
10.00 7.40
2.25
1
10
0.51
0.35
PIN ONE
INDICATOR
0.25
M
0.65
1.27
1.27
C B A
LAND PATTERN RECOMMENDATION
2.65 MAX
SEE DETAIL A
0.33
0.20
C
0.75
0.25
X 45°
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
GAGE PLANE
(R0.10)
0.10 C
0.30
0.10
0.25
8°
0°
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) CONFORMS TO ASME Y14.5M-1994
1.27
0.40
SEATING PLANE
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
(1.40)
DETAIL A
F) DRAWING FILENAME: MKT-M20BREV3
SCALE: 2:1
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
7
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions (Continued)
Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
8
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions (Continued)
Figure 3. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
9
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions (Continued)
Figure 4. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
10
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
the design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I33
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com
11
74LVT574, 74LVTH574 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
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