１．Package Outline Drawings 1 3 . 8 ±0.3 109 ±1 95 ±0.3 66.44 1 0 ±0.2 3 . 2 2 ±0.3 ±0.15 10 6 ±0.15 ±0.2 1 0 ±0.2 1 2 ±0.25 6 ±0.15 2 ±0.1 4-φ5.5 2 ±0.3 6 ±0.3 10 74 P 20 88 ±1 20 B N V U 0.5 17 W 0.5 24 26 26 19-□0.5 2-φ2.5 25A 2 ±0.1 2 ±0.1 3.22 ±0.3 2 ±0.1 2 9 +0.6 3 1 -0.3 +1.0 -0.3 1200V JAPAN 2 0.1 max 2 22 17 +1.0 -0.2 7MBP25RJ120 8 17 22 +1.0 -0.3 12.5 7 6-M5 4.5 φ2.5 1 10 □0.5 8 ±0.3 (1∼2) (φ1∼1.5) Details of control terminals Fuji Electric Co.,Ltd. DWG.NO. . NOTES: Dimensions are shown in Millimeter. MS6M0709 3/23 H04-004-03 ２．Pin Descriptions Main circuit Symbol Description P Positive input supply voltage. U Output (U). V Output (V). W Output (W). N Negative input supply voltage. B Collector terminal of Brake IGBT. Control circuit № Symbol ① GNDU High side ground (U). ② ALMU Alarm signal output (U). ③ VinU Logic input for IGBT gate drive (U). ④ VccU High side supply voltage (U). ⑤ GNDV High side ground (V). ⑥ ALMV Alarm signal output (V). ⑦ VinV Logic input for IGBT gate drive (V). ⑧ VccV High side supply voltage (V). ⑨ GNDW High side ground (W). ⑩ ALMW Alarm signal output (W). ⑪ VinW Logic input for IGBT gate drive (W). ⑫ VccW High side supply voltage (W). ⑬ GND Low side ground. ⑭ Vcc Low side supply voltage. ⑮ VinDB ⑯ VinX Logic input for IGBT gate drive (X). ⑰ VinY Logic input for IGBT gate drive (Y). ⑱ VinZ Logic input for IGBT gate drive (Z). ⑲ ALM Low side alarm signal output. Logic input for Brake IGBT gate drive. DWG.NO. . Fuji Electric Co.,Ltd. Description MS6M0709 4/23 H04-004-03 ３．Block Diagram P VccU ④ VinU ③ ALMU ② Pre-Driver RALM 1.5k GNDU ① VccV ⑧ VinV ⑦ ALMV ⑥ GNDV ⑤ VccW ⑫ VinW ⑪ ALMW ⑩ GNDW ⑨ Vcc ⑭ VinX ⑯ Vz U Pre-Driver RALM 1.5k Vz V Pre-Driver RALM 1.5k Vz W Pre-Driver Vz GND VinY ⑬ ⑰ Pre-Driver Vz VinZ ⑱ Pre-Driver Vz B ALM ⑮ ⑲ RALM 1.5k Pre-Driver Vz N Over heating protection circuit Fuji Electric Co.,Ltd. DWG.NO. . VinDB Pre-drivers include following functions 1.Amplifier for driver 2.Short circuit protection 3.Under voltage lockout circuit 4.Over current protection 5.IGBT chip over heating protection MS6M0709 5/23 H04-004-03 ４．Absolute Maximum Ratings Tc＝25℃ unless otherwise specified. Items Symbol Min. Max. Units VDC 0 900 V VDC(surge) 0 1000 V Vsc 200 800 V Vces 0 1200 V DC Ic ― 25 A 1ms Icp ― 50 A DC -Ic ― 25 A Pc ― 198 W DC Ic ― 15 A 1ms Icp ― 30 A IF ― 15 A Pc ― 120 W Supply Voltage of Pre-Driver *4 Vcc -0.5 20 V Input Signal Voltage *5 Vin -0.5 Vcc+0.5 V Input Signal Current Iin ― 3 mA Alarm Signal Voltage *6 VALM -0.5 Vcc V Alarm Signal Current *7 ＩALM ― 20 mA Tj ― 150 ℃ Operating Case Temperature Topr -20 100 ℃ Storage Temperature Tstg -40 125 ℃ Viso ― AC2500 V ― ― 3.5 Nm Bus Voltage (between terminal P and N) DC Surge Short operating Inverter Collector-Emitter Voltage *1 Collector Current Brake Collector Power Dissipation Collector Current One transistor *3 Forward Current of Diode Collector Power Dissipation One transistor *3 Junction Temperature Isolating Voltage (Terminal to base, 50/60Hz sine wave 1min.) Screw Torque Terminal (M5) Mounting (M5) Fuji Electric Co.,Ltd. DWG.NO. . Ｎｏｔｅ *1 ：Vces shall be applied to the input voltage between terminal P and U or Ｖ or W or DB, N and U or V or W or DB *3 ：Pc(Inverter) =125℃/IGBT Rth(j-c)=125/0.63=198W Pc(Break) =125℃/IGBT Rth(j-c)=125/1.04=120W *4 ：Vcc shall be applied to the input voltage between terminal No.4 and 1, No.8 and 5, No.12 and 9, No.14 and 13 *5 ：Vｉｎ shall be applied to the input voltage between terminal No.3 and 1, No.7 and 5, No.11 and 9, No.15,16,17,18 and 13． *6 ：ＶＡＬＭ shall be applied to the voltage between terminal No.2 and 1, No.6 and 5, No.10 and 9, No.19 and 13． *7 ：ＩＡＬＭ shall be applied to the input current to terminal No.2,6,10 and 19． MS6M0709 6/23 H04-004-03 ５．Electrical Characteristics Tj＝25℃，Vcc＝15V unless otherwise specified. 5.1 Main circuit Item Collector Symbol Current Inverter at off signal input Collector-Emitter saturation voltage Forward voltage of FWD Collector Current Brake at off signal input Collector-Emitter Conditions Min. Typ. Max. Units - - 1.0 mA Terminal - - 2.6 Ｖ Chip - 2.0 - V Terminal - - 3.0 Ｖ Chip - 2.4 - V - - 1.0 mA ＶＣＥ＝1200V ICES Vin terminal open. VCE（ｓａ ｔ ） Ｉ ｃ＝25A -Ｉｃ＝25A VF ＶＣＥ＝1200V ICES Vin terminal open. Ｉ ｃ＝15A Terminal - - 2.6 Ｖ VF -Ｉｃ＝15A Terminal - - 3.3 Ｖ Turn-on time ton VDC＝600V、Tj=125℃ 0.3 - - Turn-off time toff Ic＝25A Fig.1，Fig.6 - - 3.6 saturation voltage Forward voltage of Diode Reverse recovery time ＶCE（ｓａ ｔ ） us VDC＝600V trr - - 0.3 Min. Typ. Max. Units - - 18 mA - - 65 mA ON 1.00 1.35 1.70 OFF 1.25 1.60 1.95 - 8.0 - V Tc＝-20℃ Fig.2 1.1 - - ms Tc＝25℃ Fig.2 - 2.0 - ms Tc＝125℃ Fig.2 - - 4.0 ms 1425 1500 1575 Ω IF＝25A Fig.1，Fig.6 5.2 Control circuit Supply current Symbol of P-side Iccp pre-driver (one unit) Supply current of Switching Frequency: 0∼15kHz Tc＝-20∼125℃ N-side Iccn pre-driver Input signal threshold voltage Conditions Vin(th) Input Zener Voltage Alarm Signal Hold Time Limiting Resistor for Alarm Fuji Electric Co.,Ltd. Vz tALM Fig.7 Rin＝20kΩ RALM DWG.NO. . Item MS6M0709 V 7/23 H04-004-03 5.3 Protection Section （Vcc＝１５Ｖ） Item Symbol Over Current Protection Level of Inverter circuit Conditions Min. Typ. Max. Units Tj=125℃ 38 - - A Tj=125℃ 23 - - A Ioc Over Current Protection Level of Brake circuit Over Current Protection Delay time tdoc Tj=125℃ - 10 - us SC Protection Delay time tsc Tj=125℃ Fig.4 - - 12 us 150 - - ℃ - 20 - ℃ 110 - 125 ℃ IGBT Chips Over Heating TjOH Protection Temperature Level Over Heating Protection Hysteresis Surface of IGBT Chips TjH Over Heating Protection TｃOH Temperature Level VDC=0V,IC=0A CaseTemperature Over Heating Protection Hysteresis TcH - 20 - Under Voltage Protection Level VUV 11.0 - 12.5 VH 0.2 0.5 - Under Voltage Protection Hysteresis V ６．Thermal Characteristics （Ｔｃ＝２５℃） Item Symbol Min. Typ. Max. IGBT Rth(j-c) - - 0.63 FWD Rth(j-c) - - 1.33 IGBT Rth(j-c) - - 1.04 Rth(c-f) - 0.05 - Min. Typ. Max. Units ±2.0 - - kV ±5.0 - - kV Symbol Min. Typ. Max. Units DC Bus Voltage VDC - - 800 V Power Supply Voltage of Pre-Driver Vcc 13.5 15.0 16.5 V - 2.5 - 3.0 Nm Symbol Min. Typ. Max. Units Wt - 450 - g Inverter Junction to Case Thermal Resistance *8 Brake Case to Fin Thermal Resistance with Compound Units ℃/W *8：( For one device ，Case is under the device ) ７．Noise Immunity Item Common mode rectangular noise （Vdc=300V、Vcc=15V、Test Circuit Fig 5.） Conditions Pulse width 1us,polarity ±,10 minuets Judge：no over-current, no miss operating Rise time 1.2us, Fall time 50us Common mode Interval 20s, 10 times lightning surge Judge：no over-current, no miss operating ８．Recommended Operating Conditions Item Screw Torque (M5) ９．Weight Item Fuji Electric Co.,Ltd. DWG.NO. . Weight MS6M0709 8/23 H04-004-03 ｎ（ ｔ ｈ） Ｖｉ ｎ Ｖｉ Ｏｎ Ｖｉ ｎ（ ｔ ｈ） ｔ ｒ ｒ ９０％ ５０％ Ｉ ｃ ９０％ 1０％ ｔ ｏｎ ｔ ｏff Figure 1. Switching Time Waveform Definitions off /Vin Vge (Inside IPM) Fault (Inside IPM) off on Gate On on Gate Off normal alarm /ALM tALM＞Max. tALM 2ms(typ.) ③ tALM＞Max. ① ② Fault：Over-current,Over-heat or Under-voltage Figure 2. Input/Output Timing Diagram Necessary conditions for alarm reset (refer to ① to ③ in figure2.) ① This represents the case when a failure-causing Fault lasts for a period more than tALM. The alarm resets when the input Vin is OFF and the Fault has disappeared. ② This represents the case when the ON condition of the input Vin lasts for a period more than tALM. The alarm resets when the Vin turns OFF under no Fault conditions. ③ This represents the case when the Fault disappears and the Vin turns OFF within tALM. The alarm resets after lasting for a period of the specified time tALM. /Vin Ic off on on Ioc /ALM ① ② ＜tdoc alarm tdoc Figure 3. Over-current Protection Timing Diagram Period ①: When a collector current over the OC level flows and the OFF command is input within a period less than the trip delay time tdoc, the current is hard-interrupted and no alarm is output. Period ②: When a collector current over the OC level flows for a period more than the trip delay time tdoc, the current is soft-interrupted. If this is detected at the lower Fuji Electric Co.,Ltd. DWG.NO. . arm IGBTs, an alarm is output. MS6M0709 9/23 H04-004-03 t SC Ic Ic IALM Ic IALM IALM Figure.4 Definition of tsc 20k DC 15V VinU CT P VccU IPM U AC400V AC200V SW1 GNDU Vcc V VinX W + 20k DC 15V 4700p SW2 Noise N GND Earth Cooling Fin Figure 5. Noise Test Circuit Vcc 20k DC 15V P L IPM + Vin DC 300V 600V HCPL4504 GND N Ic Figure 6. Switching Characteristics Test Circuit Icc A Vcc P IPM DC 15V P.G +8V fsw Vin U V W GND N Fuji Electric Co.,Ltd. DWG.NO. . Figure 7. Icc Test Circuit MS6M0709 10/23 H04-004-03 １０． Truth table 10.1 IGBT Control The following table shows the IGBT ON/OFF status with respect to the input signal Vin. The IGBT turn-on when Vin is at “Low” level under no alarm condition. Input (Vin) Output (IGBT) Low ON High OFF 10.2 Fault Detection (1) When a fault is detected at the high side, only the detected arm stops its output. At that time the IPM outputs detected arm’s alarm. (2) When a fault is detected at the low side, all the lower arms stop their outputs and the IPM outputs an alarm of the low side. Fault High side Uphase High side Vphase High side Wphase Low side Case IGBT Alarm Output U-phase V-phase W-phase Low side ALM-U ALM-V ALM-W ALM OC OFF * * * L H H H UV OFF * * * L H H H TjOH OFF * * * L H H H OC * OFF * * H L H H UV * OFF * * H L H H TjOH * OFF * * H L H H OC * * OFF * H H L H UV * * OFF * H H L H TjOH * * OFF * H H L H OC * * * OFF H H H L UV * * * OFF H H H L TjOH * * * OFF H H H L TcOH * * * OFF H H H L Temperature Fuji Electric Co.,Ltd. DWG.NO. . *：Depend on input logic. MS6M0709 11/23 H04-004-03 １１. Cautions for design and application 1. Trace routing layout should be designed with particular attention to least stray capacity between the primary and secondary sides of optical isolators by minimizing the wiring length between the optical isolators and the IPM input terminals as possible. フォトカプラとＩＰＭの入力端子間の配線は極力短くし、フォトカプラの一次側と二次側の浮遊容量を小さくした パターンレイアウトにして下さい。 2. Mount a capacitor between Vcc and GND of each high-speed optical isolator as close to as possible. 高速フォトカプラの Vcc-GND 間に、コンデンサを出来るだけ近接して取り付けて下さい。 3. For the high-speed optical isolator, use high-CMR type one with tpHL, tpLH ≦ 0.8µs. 高速フォトカプラは、tpHL,tpLH≦0.8us、高 CMR タイプをご使用ください。 4. For the alarm output circuit, use low-speed type optical isolators with CTR ≧ 100%. アラーム出力回路は、低速フォトカプラ CTR≧100%のタイプをご使用ください。 5. For the control power Vcc, use four power supplies isolated each. And they should be designed to reduce the voltage variations. 制御電源 Vcc は、絶縁された４電源を使用してください。また、電圧変動を抑えた設計として下さい。 6. Suppress surge voltages as possible by reducing the inductance between the DC bus P and N, and connecting some capacitors between the P and N terminals P-N 間の直流母線は出来るだけ低インダクタンス化し、P-N 端子間にコンデンサを接続するなどしてサージ 電圧を低減して下さい。 7. To prevent noise intrusion from the AC lines, connect a capacitor of some 4700pF between the three-phase lines each and the ground. AC ラインからのノイズ侵入を防ぐために、３相各線−アース間に４７００ｐＦ程のコンデンサを接続して下さい 8. At the external circuit, never connect the control terminal ① GNDU to the main terminal U-phase, ⑤GNDV to V-phase, ⑨GNDW to W-phase, and ⑬GND to N-phase. Otherwise, malfunctions may be caused. 制御端子①ＧＮＤＵと主端子Ｕ相、制御端子⑤ＧＮＤVと主端子 V 相、制御端子⑨ＧＮＤWと主端子 W 相、 制御端子⑬ＧＮＤと主端子 N を外部回路で接続しないで下さい。誤動作の原因になります。 9. Take note that an optical isolator’s response to the primary input signal becomes slow if a capacitor is connected between the input terminal and GND. 入力端子-GND 間にコンデンサを接続すると、フォトカプラ一次側入力信号に対する応答時間が長くなりま Fuji Electric Co.,Ltd. DWG.NO. . すのでご注意ください。 MS6M0709 12/23 H04-004-03 10. Taking the used isolator’s CTR into account, design with a sufficient allowance to decide the primary forward current of the optical isolator. フォトカプラの一次側電流は、お使いのフォトカプラの CTR を考慮し十分に余裕をもった設計にして下さい。 11. Apply thermal compound to the surfaces between the IPM and its heat sink to reduce the thermal contact resistance. 接触熱抵抗を小さくするために、ＩＰＭとヒートシンクの間にサーマルコンパウンドを塗布して下さい。 12. Finish the heat sink surface within roughness of 10µm and flatness (camber) between screw positions of 0 to +100µm. If the flatness is minus, the heat radiation becomes worse due to a gap between the heat sink and the IPM. And, if the flatness is over +100µm, there is a danger that the IPM copper base may be deformed and this may cause a +100μm 0 dielectric breakdown. ヒートシンク表面の仕上げは、粗さ 10um 以下、ネジ位置間 Heat sink での平坦度（反り）は、0∼100um として下さい。平坦度がマ Mounting holes イナスの場合、ヒートシンクと IPM の間に隙間ができ放熱が 悪化します。また、平坦度が＋100um 以上の場合ＩＰＭの銅 ﾍﾞｰｽが変形し絶縁破壊を起こす危険性があります。 13. This product is designed on the assumption that it applies to an inverter use. Sufficient examination is required when applying to a converter use. Please contact Fuji Electric Co.,Ltd if you would like to applying to converter use. 本製品は、インバータ用途への適用を前提に設計されております。コンバータ用途へ適用される場合は、十分な 検討が必要です。もし、コンバータへ適用される場合は御連絡ください。 14. Please see the 『Fuji IGBT-IPM R SERIES APPLICATION MANUAL』 and 『Fuji IGBT MODULES N SERIES APPLICATION MANUAL』. 『富士 IGBT-IPM R シリーズ アプリケーションマニュアル』及び『IGBT ﾓｼﾞｭｰﾙ N シリーズ アプリケーションマニュ Fuji Electric Co.,Ltd. DWG.NO. . アル』を御参照ください。 MS6M0709 13/23 H04-004-03 １２．Example of applied circuit 応用回路例 P 20kΩ 0 .1 u F R ③ Vcc U ① 5V A C 2 0 0 V ④ +1 0 u F IF V 1k ② W ⑧ B ⑦ N Ｍ + 20kΩ IF 0 .1 u F +1 0 u F Vcc ⑤ 5V 1k ⑥ 20kΩ ⑫ IF 0 .1 u F +1 0 u F Vcc ⑪ ⑨ 5V 1k ⑩ ⑭ I P M Vcc ⑬ IF IF IF 5V 10uF 20kΩ 0 .1 u F 10uF 20kΩ 0 .1 u F 10uF 20kΩ 0 .1 u F 10uF ⑯ ⑰ ⑱ ⑮ 1k ⑲ The alarm signals should be connected to Vcc when it is not used. 不使用のアラーム端子は、制御電源 Vcc に接続して下さい。 １３．Package and Marking 梱包仕様 Please see the MT6M4140 which is packing specification of P610 & P611& P621 package． Ｐ６１０，６１１，６２１ 梱包仕様書 ＭＴ６Ｍ４１４０ を御参照ください。 １４．Cautions for storage and transportation 保管、運搬上の注意 ・ Store the modules at the normal temperature and humidity (5 to 35°C, 45 to 75%). 常温常湿(5∼35℃、45∼75%)で保存して下さい。 ・ Avoid a sudden change in ambient temperature to prevent condensation on the module surfaces. モジュールの表面が結露しないよう、急激な温度変化を避けて下さい。 ・ Avoid places where corrosive gas generates or much dust exists. 腐食性ガスの発生場所、粉塵の多い場所は避けて下さい。 ・ Store the module terminals under unprocessed conditions モジュールの端子は未加工の状態で保管すること。. ・ Avoid physical shock or falls during the transportation. 運搬時に衝撃を与えたり落下させないで下さい。 １５．Scope of application 適用範囲 This specification is applied to the IGBT-IPM (type: 7MBP25RJ120). 本仕様書は、IGBT-IPM (型式：7MBP25RJ120)に適用する。 １６．Based safety standards 準拠安全規格 UL1557 Fuji Electric Co.,Ltd. DWG.NO. . This material and the information herein is the property of Fuji Electric Co.,Ltd.They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party,nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. IF 20kΩ 0 .1 u F MS6M0709 14/23 H04-004-03 １８-１．Reliability Test Items Test categories Test items 4 5 6 1 2 3 Environment Tests 4 5 Pull force : 40Nm(main terminal) 10Nm(control terminal) Test time : 10±1 sec. Screw torque : 2.5 ~ 3.5 N･m (M5) Test time : 10±1 sec. Range of frequency : 10 ~ 500Hz Sweeping time : 15 min. Acceleration : 100m/s2 Sweeping direction : Each X,Y,Z axis Test time : 6 hr. (2hr./direction) Shock Maximum acceleration : 10000m/s2 0.5m/s 衝撃 Direction : Each X,Y,Z axis Test time : 3 times/direction Solderabitlity Solder temp. : 230±5 ℃ はんだ付け性 Immersion time : 5±1sec. Test time : 1 time Each terminal should be Immersed in solder within 1~1.5mm from the body. Resistance to Solder temp. : 260±5 ℃ Soldering Heat Immersion time : 10±1sec. はんだ耐熱性 Test time : 1 time Each terminal should be Immersed in solder within 1~1.5mm from the body. High Temperature Storage temp. : 125±5 ℃ Storage 高温保存 Test duration : 1000hr. Low Temperature Storage temp. : -40±5 ℃ Storage 低温保存 Test duration : 1000hr. Temperature Storage temp. : 85±3 ℃ Humidity Storage Relative humidity : 85±5% Test duration : 1000hr. 高温高湿保存 Unsaturated Test temp. : 121 ℃ Pressure Cooker Atmospheric pressure : 2.03×105 Pa (Reference value) プレッシャークッカー Test duration : 20hr. +3 Temperature Cycle Test temp. : Low temp. -40 -5 ℃ 温度サイクル +5 A - 112 Method 2 A - 121 5 (1:0) 5 (1:0) A - 122 5 (1:0) A - 131 5 (1:0) A - 132 5 (1:0) B - 111 5 (1:0) B - 112 5 (1:0) B - 121 5 (1:0) B - 123 5 (1:0) B - 131 5 (1:0) B - 141 5 (1:0) High temp. 125 -0 ℃ Number of cycles RT 5 ~ 35 ℃ : High ~ RT ~ Low ~ RT 1hr. 0.5hr. 1hr. 0.5hr. : 100 cycles Test temp. : Dwell time 6 Thermal Shock 熱衝撃 +0 High temp. 100 -5 ℃ +5 Low temp. 0 -0 ℃ Used liquid : Water with ice and bolding water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles Fuji Electric Co.,Ltd. DWG.NO. . Mechanical Tests 1 Terminal Strength 端子強度 (Pull test) 2 Mounting Strength 締め付け強度 3 Vibration 振動 Test methods and conditions Reference Number Acceptnorms ance of EIAJ sample number ED-4071 A - 111 5 (1:0) Method 1 MS6M0709 20/23 H04-004-03 １８-２．Reliability Test Items Reliability Test Items Test categories Test items Test methods and conditions Endurance Tests 1 High temperature Reverse Bias 高温逆バイアス Test tepm. Bias Voltage Bias Method 2 Intermitted Operating Life (Power cycle) 断続動作 Reference AcceptNumber norms ance of sample EIAJ number ED-4071 D - 313 5 (1:0) Test duration ON time OFF time Test tepm. Number of cycles +0 -5 : Ta = 125 ℃ (Tj ≦ 150 ℃) : VC = 0.8×VCES : Applied DC voltage to C-E Vcc = 15V : 1000hr. : 2 sec. : 18 sec. : ∆ Tj=100±5 deg Tj ≦ 150 ℃, Ta=25±5 ℃ D - 322 5 (1:0) : 15000 cycles １９．Failure Criteria Item Characteristic Electrical characteristic Visual inspection Leakage current Saturation voltage Forward voltage Thermal IGBT resistance FWD Over Current Protection Alarm signal hold time Over heating Protection Isolation voltage Visual inspection Peeling Plating and the others Symbol Failure criteria Lower limit Upper limit Unit ICES VCE(sat) VF Ｒth(j-c) Ｒth(j-c) Ioc tALM TcOH mA V V ℃/W ℃/W Ａ ms ℃ Viso USL×2 USL×1.2 USL×1.2 USL×1.2 USL×1.2 LSL×0.8 USL×1.2 LSL×0.8 USL×1.2 LSL×0.8 USL×1.2 Broken insulation - The visual sample - Note - LSL : Lower specified limit. USL : Upper specified limit. Fuji Electric Co.,Ltd. DWG.NO. . Note : Each parameter measurement read-outs shall be made after stabilizing the components at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests. And in case of the wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry completely before the measurement. MS6M0709 21/23 H04-004-03 Warnings 1. This product shall be used within its absolute maximum rating (voltage, current, and temperature). This product may be broken in case of using beyond the ratings. 製品の絶対最大定格（電圧，電流，温度等）の範囲内で御使用下さい。絶対最大定格を超えて使用すると、素 子が破壊する場合があります。 2. Connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment from causing secondary destruction. 万 一 の 不 慮 の 事 故で素子が破壊した場合を考慮し、商用電 源と本製品の間に適切な容量のヒューズ 又はブレーカーを必ず付けて２次破壊を防いでください。 3. When studying the device at a normal turn-off action, make sure that working paths of the turn-off voltage and current are within the RBSOA specification. 通 常 のターンオフ動作における素子責務の検討の際には、ターンオフ電圧・電流の動作軌跡が RBSOA 仕 様 内にあることを確認して下さい。 4. Use this product after realizing enough working on environment and considering of product's reliability life. This product may be broken before target life of the system in case of using beyond the product's reliability life. 製 品 の 使 用 環 境を十分に把握し、製品の信頼性寿命が満足できるか検討の上、本製品を適用して下さ い。製品の信頼性寿命を超えて使用した場合、装置の目標寿命より前に素子が破壊する場 合 がありま す。 5. If the product had been used in the environment with acid, organic matter, and corrosive gas (For example : hydrogen sulfide, sulfurous acid gas), the product's performance and appearance cannot be ensured easily. 酸・有機物・腐食性ガス（硫化水 素，亜硫酸ガス等）を含む環 境 下で使用された場合、製品 機 能・外観 などの保証は致しかねます。 6. Use the product within the power cycle curve. (Thechnical Rep.No. : MT6M4057) 本 製 品 は、パワーサイクル寿命カーブ以下で使用下さい。(技 術 資 料 No.: MT6M4057) 7. Never add mechanical stress to deform the main or control terminal. The deformed terminal may cause poor contact problem. 主端子及び制御端子に応力を与えて変形させないで下さい。 端子の変形により、接触不良などを引き起こす Fuji Electric Co.,Ltd. DWG.NO. . 場 合 があります。 MS6M0709 22/23 H04-004-03 8. According to the outline drawing, select proper length of screw for main terminal. Longer screws may break the case. 本 製 品に使用する主端子用のネジの長さは、外形図に従い正しく選定下さい。ネジが長いとケースが破 損する場合があります。 9. If excessive static electricity is applied to the control terminals, the devices can be broken. Implement some countermeasures against static electricity. 制御端子に過大な静電気が印加された場合、素子が破壊する場合があります。取り扱い時 は 静 電 気 対 策を実施して下さい。 Caution 1. Fuji Electric is constantly making every endeavor to improve the product quality and reliability. However, semiconductor products may rarely happen to fail or malfunction. To prevent accidents causing injury or death, damage to property like by fire, and other social damage resulted from a failure or malfunction of the Fuji Electric semiconductor products, take some measures to keep safety such as redundant design, spread-fire-preventive design, and malfunction-protective design. 富士電機は絶えず製品の品質と信頼性の向上に努めています。しかし、半導体製品は故障が発生したり、誤 動作する場合があります。富士電機製半導体製品の故障または誤動作が、結果として人身事故・火災等によ る財産に対する損害や社会的な損害を起こさないように冗長設計・延焼防止設計・誤動作防止設計など安全 確保のための手段を講じて下さい。 2. The application examples described in this specification only explain typical ones that used the Fuji Electric products. This specification never ensure to enforce the industrial property and other rights, nor license the enforcement rights. 本仕様書に記載してある応用例は、富士電機製品を使用した代表的な応用例を説明するものであり、本仕様 書によって工業所有権、その他権利の実施に対する保障または実施権の許諾を行うものではありません。 The product described in this specification is not designed nor made for being applied to the equipment or systems used under life-threatening situations. When you consider applying the product of this specification to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems and submarine relay equipment or systems, please apply after Confirmation of this product to be satisfied about system construction and required reliability. 本仕様書に記載された製品は、人命にかかわるような状況下で使用される機器あるいはシステムに用いられ ることを目的として設計・製造されたものではありません。本仕様書の製品を車両機器、船舶、航空宇宙、医 療機器、原子力制御、海底中継機器あるいはシステムなど、特殊用途へのご利用をご検討の際は、システム 構成及び要求品質に満足することをご確認の上、ご利用下さい。 If there is any unclear matter in this specification, please contact Fuji Electric Co.,Ltd. Fuji Electric Co.,Ltd. DWG.NO. . 3. MS6M0709 23/23 H04-004-03