16 V Rail-to-Rail Operational Amplifiers AD8565/AD8566/AD8567 APPLICATIONS LCD reference drivers Portable electronics Communications equipment PIN CONFIGURATIONS AD8565 OUT 1 5 V– V+ 2 +IN 3 TOP VIEW (Not to Scale) 4 –IN 01909-001 Single-supply operation: 4.5 V to 16 V Input capability beyond the rails Rail-to-rail output swing Continuous output current: 35 mA Peak output current: 250 mA Offset voltage: 10 mV Slew rate: 6 V/μs Unity gain stable with large capacitive loads Supply current: 700 μA per amplifier Figure 1. 5-Lead SC70 Pin Configuration AD8566 OUT A 1 8 V+ –IN A 2 7 OUT B +IN A 3 6 –IN B V– 4 TOP VIEW (Not to Scale) 5 +IN B 01909-002 FEATURES Figure 2. 8-Lead MSOP Pin Configuration GENERAL DESCRIPTION 14 OUT D –IN A 2 +IN A 13 –IN D 3 12 +IN D AD8567 TOP VIEW (Not to Scale) V+ 4 +IN B 5 9 –IN C 6 OUT B 7 01909-003 –IN B 11 V– 10 +IN C 8 OUT C OUT D NC 16 15 14 13 12 –IN D 11 +IN D –IN A 1 +IN A 2 V+ 3 TOP VIEW (Not to Scale) 10 +IN B 4 9 5 6 7 8 OUT C –IN C AD8567 NC = NO CONNECT V– +IN C 01909-004 OUT A Figure 3. 14-Lead TSSOP Pin Configuration NC The AD8565, AD8566, and AD8567 are specified over the −40°C to +85°C temperature range. The AD8565 single is available in a 5-lead SC70 package. The AD8566 dual is available in an 8-lead MSOP package. The AD8567 quad is available in a 14-lead TSSOP package and a 16-lead LFCSP package. 1 –IN B These LCD op amps have high slew rates, 35 mA continuous output drive, 250 mA peak output drive, and a high capacitive load drive capability. They have a wide supply range and offset voltages below 10 mV. The AD8565, AD8566, and AD8567 are ideal for LCD grayscale reference buffer and VCOM applications. OUT A OUT B The AD8565, AD8566, and AD8567 are low cost, single-supply, rail-to-rail input and output operational amplifiers optimized for LCD monitor applications. They are built on an advanced high voltage CBCMOS process. The AD8565 contains a single amplifier, the AD8566 has two amplifiers, and the AD8567 has four amplifiers. Figure 4. 16-Lead LFCSP Pin Configuration Rev. D Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. AD8565/AD8566/AD8567 TABLE OF CONTENTS Features .............................................................................................. 1 Input Overvoltage Protection ......................................................9 Applications....................................................................................... 1 Output Phase Reversal............................................................... 10 General Description ......................................................................... 1 Power Dissipation....................................................................... 10 Pin Configurations ........................................................................... 1 Thermal Pad—AD8567............................................................. 10 Revision History ............................................................................... 2 Total Harmonic Distortion + Noise (THD+N)...................... 11 Specifications..................................................................................... 3 Short-Circuit Output Conditions............................................. 11 Electrical Characteristics............................................................. 3 LCD Panel Applications ............................................................ 11 Absolute Maximum Ratings............................................................ 4 Outline Dimensions ....................................................................... 12 ESD Caution.................................................................................. 4 Ordering Guide .......................................................................... 13 Typical Performance Characteristics ............................................. 5 Theory of Operation ........................................................................ 9 REVISION HISTORY 2/06—Rev C to Rev. D Updated Format..................................................................Universal Changes to Figure 6 and Figure 8................................................... 5 Added the Thermal Pad—AD8567 Section................................ 10 Changes to Ordering Guide .......................................................... 13 3/04—Rev B to Rev. C Changes to Specifications ................................................................ 2 Changes to TPC 4 ............................................................................. 4 Changes to TPC 10........................................................................... 5 Changes to TPC 14........................................................................... 6 Changes to TPC 20........................................................................... 7 12/03—Rev. A to Rev. B Updated Ordering Guide................................................................. 3 Updated Outline Dimensions ....................................................... 11 10/01—Rev. 0 to Rev. A Edit to 16-Lead CSP and 5-Lead SC70 Pin Configuration ......... 1 Edit to Ordering Guide.................................................................... 3 7/01—Revision 0: Initial Version Rev. D | Page 2 of 16 AD8565/AD8566/AD8567 SPECIFICATIONS ELECTRICAL CHARACTERISTICS 4.5 V ≤ VS ≤ 16 V, VCM = VS/2, TA = 25°C, unless otherwise noted. Table 1. Parameter INPUT CHARACTERISTICS Offset Voltage Offset Voltage Drift Input Bias Current Symbol Conditions VOS ΔVOS/ΔT IB −40°C ≤ TA ≤ +85°C Min Typ Max Unit 2 5 80 10 mV μV/°C nA nA nA nA V dB V/mV kΩ pF −40°C ≤ TA ≤ +85°C Input Offset Current Input Voltage Range Common-Mode Rejection Ratio Large Signal Voltage Gain Input Impedance Input Capacitance OUTPUT CHARACTERISTICS Output Voltage High Output Voltage Low Continuous Output Current Peak Output Current POWER SUPPLY Supply Voltage Power Supply Rejection Ratio Supply Current/Amplifier DYNAMIC PERFORMANCE Slew Rate Gain Bandwidth Product Phase Margin Channel Separation NOISE PERFORMANCE Voltage Noise Density Current Noise Density IOS CMRR AVO ZIN CIN VOH VOL IOUT IPK VS PSRR ISY 1 −40°C ≤ TA ≤ +85°C Common-mode input VCM = 0 to VS, −40°C ≤ TA ≤ +85°C RL = 10 kΩ, VO = 0.5 V to (VS − 0.5 V) IL = 100 μA VS = 16 V, IL = 5 mA −40°C ≤ TA ≤ +85°C VS = 4.5 V, IL = 5 mA −40°C ≤ TA ≤ +85°C IL = 100 μA VS = 16 V, IL = 5 mA −40°C ≤ TA ≤ +85°C VS = 4.5 V, IL = 5 mA −40°C ≤ TA ≤ +85°C −0.5 54 3 15.85 15.75 4.2 4.1 SR GBP Øo RL = 10 kΩ, CL = 200 pF RL = 10 kΩ, CL = 10 pF RL = 10 kΩ, CL = 10 pF en en in f = 1 kHz f = 10 kHz f = 10 kHz Rev. D | Page 3 of 16 95 10 400 1 VS − 0.005 15.95 4.38 5 42 95 150 250 300 400 35 250 VS = 16 V VS = 4 V to 17 V, −40°C ≤ TA ≤ +85°C VO = VS/2, no load −40°C ≤ TA ≤ +85°C 600 800 80 130 VS + 0.5 4.5 70 4 16 90 700 850 1 V V V V V mV mV mV mV mV mA mA V dB μA mA 6 5 65 75 V/μs MHz Degrees dB 26 25 0.8 nV/√Hz nV/√Hz pA/√Hz AD8565/AD8566/AD8567 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage (VS) Input Voltage Differential Input Voltage Storage Temperature Range Operating Temperature Range Junction Temperature Range Lead Temperature (Soldering, 60 sec) Table 3. Ratings 18 V −0.5 V to VS + 0.5 V VS −65°C to +150°C −40°C to +85°C −65°C to +150°C 300°C Package Type 5-Lead SC70 (KS-5) 8-Lead MSOP (RM-8) 14-Lead TSSOP (RU-14) 16-Lead LFCSP (CP-16-4) 1 2 θJA 1 376 210 180 38 2 θJC 126 45 35 302 Unit °C/W °C/W °C/W °C/W θJA is specified for worst-case conditions, that is, θJA is specified for a device soldered onto a circuit board for surface-mount packages. DAP is soldered down to PCB. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. D | Page 4 of 16 AD8565/AD8566/AD8567 TYPICAL PERFORMANCE CHARACTERISTICS 1000 4.5V ≤ VS ≤ 16V TA = 25°C VOLTAGE NOISE DENSITY (nV/√Hz) –0.25 –0.50 VS = 16V –0.75 VS = 4.5V –1.00 –1.25 –40 25 TEMPERATURE (°C) 85 10 1 10 01909-005 –1.50 100 100 10k Figure 8. Voltage Noise Density vs. Frequency Figure 5. Input Offset Voltage vs. Temperature 1.0 SUPPLY CURRENT/AMPLIFIER (mA) 4.5V ≤ VS ≤ 16V TA = 25°C 0.1 10 100 1k FREQUENCY (Hz) 10k 0.8 0.6 0.4 0.2 0 01909-006 1 VO = VS/2 AV = +1 TA = 25°C 0 2 4 6 8 10 12 SUPPLY VOLTAGE (V) 14 16 18 01909-009 10 CURRENT NOISE DENSITY (pA/√Hz) 1k FREQUENCY (Hz) Figure 9. Supply Current/Amplifier vs. Supply Voltage Figure 6. Current Noise Density vs. Frequency 0.80 VS = 16V RL = 10kΩ CL = 100pF AV = +1 TA = 25°C FREQUENCY (1µs/DIV) 01909-007 TIME (50mV/DIV) SUPPLY CURRENT/AMPLIFIER (mA) VCM = VS/2 0.75 VS = 16V 0.70 0.65 0.60 0.50 Figure 7. Small Signal Transient Response VS = 4.5V 0.55 –40 25 TEMPERATURE (°C) 85 Figure 10. Supply Current/Amplifier vs. Temperature Rev. D | Page 5 of 16 01909-010 INPUT OFFSET VOLTAGE (mV) VCM = VS/2 01909-008 0 AD8565/AD8566/AD8567 VS = 16V VIN = 100mV p-p RL = 10kΩ AV = +1 TA = 25°C 80 OVERSHOOT (%) 70 VS = 16V RL = 10kΩ CL = 40pF TA = 25°C 100 80 60 GAIN (dB) 90 –OS 50 40 0 60 45 40 90 20 135 0 180 +OS 225 30 PHASE SHIFT (Degrees) 100 270 20 100 LOAD CAPACITANCE (pF) 1k 1k 10k 100k 1M 10M 01909-014 0 10 01909-011 10 100M FREQUENCY (Hz) Figure 14. Open-Loop Gain and Phase Shift vs. Frequency Figure 11. Small Signal Overshoot vs. Load Capacitance 1k 18 TA = 25°C 16 10 8 6 VS = 16V AV = +1 RL = 10kΩ DISTORTION < 1% TA = 25°C 4 2 0 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100 135 1 10 100 ISINK = 5mA OUTPUT VOLTAGE (mV) 120 AVCL = –10 10 0 0.1 150 30 20 0.01 Figure 15. Output Voltage to Supply Rail vs. Load Current AVCL = +1 VS = 4.5V 105 90 75 60 VS = 16V 45 30 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 0 –40 25 85 TEMPERATURE (°C) Figure 13. Closed-Loop Gain vs. Frequency Figure 16. Output Voltage Swing to Rail vs. Temperature Rev. D | Page 6 of 16 01909-016 15 01909-013 CLOSED-LOOP GAIN (dB) 40 AVCL = –100 1 LOAD CURRENT (mA) 4.5V ≤ VS ≤ 16V RL = 10kΩ CL = 40pF TA = 25°C 50 VS = 16V 10 0.1 0.001 Figure 12. Closed-Loop Output Swing vs. Frequency 60 VS = 4.5V 01909-015 ∆OUTPUT VOLTAGE (mV) 12 01909-012 OUTPUT SWING (V p-p) 14 AD8565/AD8566/AD8567 150 105 90 75 VS = 16V 60 45 30 0 –40 25 85 TEMPERATURE (°C) 120 100 80 +PSRR 60 40 –PSRR 20 0 –20 –40 100 01909-017 15 VS = 16V TA = 25°C 140 1k 10k 100k 1M Figure 17. Output Voltage Swing to Rail vs. Temperature Figure 20. Power Supply Rejection Ratio vs. Frequency 500 VS = 16V RL = 10kΩ AV = +1 TA = 25°C AV = +1 TA = 25°C 450 400 VOLTAGE (3V/DIV) 350 IMPEDANCE (Ω) 10M FREQUENCY (Hz) 01909-020 VS = 4.5V 120 OUTPUT VOLTAGE (mV) POWER SUPPLY REJECTION RATIO (dB) 135 160 ISOURCE = 5mA VS = 4.5V 300 250 200 150 100 50 10k 100k 1M 10M FREQUENCY (Hz) 01909-021 1k 01909-018 VS = 16V 0 100 TIME (40µs/DIV) Figure 21. No Phase Reversal Figure 18. Closed-Loop Output Impedance vs. Frequency 1.8k 140 VS = 16V TA = 25°C 1.6k 1.4k QUANTITY (Amplifiers) 120 100 80 60 40 20 1.2k 1.0k 800 600 400 0 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) 0 –10 –8 –6 –4 –2 0 2 4 6 INPUT OFFSET VOLTAGE (mV) Figure 22. Input Offset Voltage Distribution Figure 19. Common-Mode Rejection Ratio (CMRR) vs. Frequency Rev. D | Page 7 of 16 8 10 01909-022 200 01909-019 CMRR (dB) VS = 16V TA = 25°C AD8565/AD8566/AD8567 7 5 6 3 1 VS = 4.5V 0 VS = 16V –1 –2 5 4 3 2 VS = 16V AV = +1 RL = x TA = 25°C –3 1 –4 –40 25 0 01909-023 –5 85 TEMPERATURE (°C) 0 2 4 6 8 10 12 COMMON-MODE VOLTAGE (V) 6 0 VS = 5V AV = +1 RL = 10kΩ TA = 25°C VCM = VS/2 –50 5 VS = 16V –100 BANDWIDTH (MHz) –150 VS = 4.5V –200 4 3 2 –250 1 –300 –40 25 0 01909-024 –350 85 TEMPERATURE (°C) –20 –40 –60 –80 4.5V –120 16V –140 –180 100 1k FREQUENCY (Hz) 10k 60k 01909-025 –160 50 1 2 3 COMMON-MODE VOLTAGE (V) 4 5 Figure 27. Frequency vs. Common-Mode Voltage (VS = 5 V) Figure 24. Input Bias Current vs. Temperature –100 0 Figure 25. Channel A vs. Channel B Crosstalk Rev. D | Page 8 of 16 01909-027 INPUT BIAS CURRENT (nA) 16 Figure 26. Frequency vs. Common-Mode Voltage (VS = 16 V) Figure 23. Input Offset Current vs. Temperature CROSSTALK (dB) 14 01909-026 2 BANDWIDTH (MHz) INPUT OFFSET CURRENT (nA) 4 AD8565/AD8566/AD8567 THEORY OF OPERATION VPOS R1 Q3 D1 D2 R3 R4 Q6 V+ BIAS LINE Q4 Q4 600 400 200 0 –200 –400 –600 –800 –1000 0 2 4 6 8 10 12 INPUT COMMON-MODE VOLTAGE (V) 14 16 Figure 29. AD856x Input Bias Current vs. Common-Mode Voltage To achieve rail-to-rail output performance, the AD856x design uses a complementary common-source (or gmRL) output. This configuration allows output voltages to approach the power supply rails, particularly if the output transistors are allowed to enter the triode region on extremes of signal swing, which are limited by VGS, the transistor sizes, and output load current. In addition, this type of output stage exhibits voltage gain in an open-loop gain configuration. The amount of gain depends on the total load resistance at the output of the AD856x. R6 C2 INPUT OVERVOLTAGE PROTECTION V– Q5 Q10 As with any semiconductor device, whenever the input exceeds either supply voltages, attention needs to be paid to the input overvoltage characteristics. As an overvoltage occurs, the amplifier could be damaged, depending on the voltage level and the magnitude of the fault current. When the input voltage exceeds either supply by more than 0.6 V, internal pn junctions allow current to flow from the input to the supplies. D4 Q11 D5 I1 VS = 16V TA = 25°C 800 Q8 C1 R5 D3 1000 01909-029 Figure 28 illustrates a simplified equivalent circuit for the AD856x. The rail-to-rail bipolar input stage is composed of two PNP differential pairs, Q4 to Q5 and Q10 to Q11, operating in series with diode protection networks, D1 to D2. Diode network D1 to D2 serves as protection against large transients for Q4 to Q5 to accommodate rail-to-rail input swing. D5 to D6 protect Q10 to Q11 against Zenering. In normal operation, Q10 to Q11 are off and their input stage is buffered from the operational amplifier inputs by Q6 to D3 and Q8 to D4. Operation of the input stage is best understood as a function of applied common-mode voltage: when the inputs of the AD856x are biased midway between the supplies, the differential signal path gain is controlled by resistive loads (via R9, R10) Q4 to Q5. As the input common-mode level is reduced toward the negative supply (VNEG or GND), the input transistor current sources, I1 and I2, are forced into saturation, thereby forcing the Q6 to D3 and Q8 to D4 networks into cutoff. However, Q4 to Q5 remain active, providing input stage gain. Inversely, when commonmode input voltage is increased toward the positive supply, Q4 to Q5 are driven into cutoff, Q3 is driven into saturation, and Q4 becomes active, providing bias to the Q10 to Q11 differential pair. The point at which Q10 to Q11 differential pair becomes active is approximately equal to (VPOS − 1 V). The benefit of this type of input stage is low bias current. The input bias current is the sum of base currents of Q4 to Q5 and Q6 to Q8 over the range from (VNEG + 1 V) to (VPOS − 1 V). Outside of this range, input bias current is dominated by the sum of base currents of Q10 to Q11 for input signals close to VNEG and of Q6 to Q8 (Q10 to Q11) for signals close to VPOS. From this type of design, the input bias current of AD856x not only exhibits different amplitude but also exhibits different polarities. Figure 29 provides the characteristics of the input bias current vs. the common-mode voltage. It is important to keep in mind that the source impedances driving the AD856x inputs are balanced for optimum dc and ac performance. INPUT BIAS CURRENT (nA) The AD856x family is designed to drive large capacitive loads in LCD applications. It has high output current drive, rail-to-rail input/output operation, and is powered from a single 16 V supply. It is also intended for other applications where low distortion and high output current drive are needed. I2 D6 FOLDED CASCADE R10 VNEG 01909-028 R9 Figure 28. AD856x Equivalent Input Circuit Rev. D | Page 9 of 16 AD8565/AD8566/AD8567 This input current is not inherently damaging to the device as long as it is limited to 5 mA or less. If a condition exists using the AD856x where the input exceeds the supply more than 0.6 V, an external series resistor should be added. The size of the resistor can be calculated by using the maximum overvoltage divided by 5 mA. This resistance should be placed in series with either input exposed to an overvoltage. VOUT is the output voltage. OUTPUT PHASE REVERSAL ILOAD is the output load current. The AD856x family is immune to phase reversal. Although the device’s output does not change phase, large currents due to input overvoltage could damage the device. In applications where the possibility of an input voltage exceeding the supply voltage exists, overvoltage protection should be used as described in the Input Overvoltage Protection section. Figure 30 shows the maximum power dissipation vs. temperature. To achieve proper operation, use the previous equation to calculate PDISS for a specific package at any given temperature or use Figure 30. The power dissipated by the device can be calculated as PDISS = (VS − VOUT) × ILOAD where: VS is the supply voltage. 1.25 The maximum safe junction temperature, TJMAX, is 150°C. Using the following formula, the maximum power that an AD856x device can safely dissipate as a function of temperature can be obtained: PDISS = TJMAX − TA/θJA where: PDISS is the AD856x power dissipation. TJMAX is the AD856x maximum allowable junction temperature (150°C). TA is the ambient temperature of the circuit. θJA is the AD856x package thermal resistance, junction-to-ambient. 1.00 0.75 14-LEAD TSSOP 8-LEAD MSOP 0.50 5-LEAD SOT-23 0.25 0 –35 –15 5 25 45 AMBIENT TEMPERATURE (°C) 65 85 01909-030 The maximum allowable internal junction temperature of 150°C limits the AD856x family’s maximum power dissipation of AD856x devices. As the ambient temperature increases, the maximum power dissipated by AD856x devices must decrease linearly to maintain the maximum junction temperature. If this maximum junction temperature is exceeded momentarily, the device still operates properly once the junction temperature is reduced below 150°C. If the maximum junction temperature is exceeded for an extended period, overheating could lead to permanent damage of the device. MAXIMUM POWER DISSIPATION (W) 14-LEAD SOIC POWER DISSIPATION Figure 30. Maximum Power Dissipation vs. Temperature for 5-Lead SC70, 8-Lead MSOP, and 14-Lead TSSOP/SOIC Packages THERMAL PAD—AD8567 The AD8567 LFCSP comes with a thermal pad that is attached to the substrate. This substrate is connected to VDD. To be electrically safe, the thermal pad should be soldered to an area on the board that is electrically isolated or connected to VDD. Attaching the thermal pad to ground adversely affects the performance of the part. Soldering down this thermal pad dramatically improves the heat dissipation of the package. It is necessary to attach vias that connect the soldered thermal pad to another layer on the board. This provides an avenue to dissipate the heat away from the part. Without vias, the heat is isolated directly under the part. Rev. D | Page 10 of 16 AD8565/AD8566/AD8567 TOTAL HARMONIC DISTORTION + NOISE (THD+N) LCD PANEL APPLICATIONS The AD856x family features low total harmonic distortion. Figure 31 shows THD+N vs. frequency. The THD+N for the AD856x over the entire supply range is below 0.008%. When the device is powered from a 16 V supply, the THD+N stays below 0.003%. Figure 31 shows the AD8566 in a unity noninverting configuration. The AD856x amplifier is designed for LCD panel applications or applications where large capacitive load drive is required. It can instantaneously source/sink greater than 250 mA of current. At unity gain, it can drive 1 μF without compensation. This makes the AD856x ideal for LCD VCOM driver applications. 10 Figure 32 shows the test circuit. Series capacitors and resistors connected to the output of the op amp represent the load of the LCD panel. The 300 Ω and 3 kΩ feedback resistors are used to improve settling time. This test circuit simulates the worst-case scenario for a VCOM. It drives a represented load that is connected to a signal switched symmetrically around VCOM. Figure 33 shows a scope photo of the instantaneous output peak current capability of the AD856x family. VS = ±2.5V 100 1k FREQUENCY (Hz) 10k 30k 300Ω INPUT 0V TO 8V SQUARE WAVE WITH 15.6µs PULSE WIDTH Figure 31. THD+N vs. Frequency 8V 3kΩ SHORT-CIRCUIT OUTPUT CONDITIONS 10Ω The AD856x family does not have internal short-circuit protection circuitry. As a precautionary measure, it is recommended not to short the output directly to the positive power supply or to ground. 4V MEASURE CURRENT 10nF 10Ω 10nF 10Ω 10nF 10Ω 10nF 10Ω TO 20Ω Figure 32. VCOM Test Circuit with Supply Voltage at 16 V It is not recommended to operate the AD856x with more than 35 mA of continuous output current. The output current can be limited by placing a series resistor at the output of the amplifier whose value can be derived using 100 90 VS RX ≥ 35 mA CH 2 = 100mA/DIV For a 5 V single-supply operation, RX should have a minimum value of 143 Ω. CH 1 = 5V/DIV 10 0% TIME (2µs/DIV) 01909-033 0.01 20 01909-031 VS = ±8V 01909-032 THD+N (%) 1 0.1 To evaluate the performance of the AD856x family, a test circuit was developed to simulate the VCOM driver application for an LCD panel. Figure 33. Scope Photo of the VCOM Instantaneous Peak Current Rev. D | Page 11 of 16 AD8565/AD8566/AD8567 OUTLINE DIMENSIONS 3.20 3.00 2.80 8 3.20 3.00 2.80 1 5 2.20 2.00 1.80 5.15 4.90 4.65 1.35 1.25 1.15 4 5 1 2.40 2.10 1.80 4 2 3 PIN 1 PIN 1 0.65 BSC 0.95 0.85 0.75 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.80 0.60 0.40 8° 0° 0.23 0.08 0.65 BSC 1.00 0.90 0.70 1.10 0.80 0.30 0.15 0.10 MAX SEATING PLANE SEATING PLANE 0.40 0.10 0.22 0.08 0.46 0.36 0.26 0.10 COPLANARITY COMPLIANT TO JEDEC STANDARDS MO-187-AA COMPLIANT TO JEDEC STANDARDS MO-203-AA Figure 34. 8-Lead Micro Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters Figure 35. 5-Lead Thin Shrink Small Outline Transistor Package [SC70] (KS-5) Dimensions shown in millimeters 5.10 5.00 4.90 14 8 4.50 4.40 4.30 6.40 BSC 1 7 PIN 1 1.05 1.00 0.80 0.65 BSC 1.20 MAX 0.15 0.05 0.30 0.19 0.20 0.09 SEATING COPLANARITY PLANE 0.10 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 Figure 36. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters Rev. D | Page 12 of 16 0.75 0.60 0.45 AD8565/AD8566/AD8567 4.00 BSC SQ PIN 1 INDICATOR 0.65 BSC TOP VIEW 12° MAX 1.00 0.85 0.80 0.60 MAX PIN 1 INDICATOR 0.60 MAX 13 12 16 1 EXPOSED PAD 3.75 BSC SQ 0.75 0.60 0.50 (BOTTOM VIEW) 9 4 8 2.25 2.10 SQ 1.95 5 0.25 MIN 1.95 BSC 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM SEATING PLANE 0.30 0.23 0.18 0.20 REF COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VGGC Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-16-4) Dimensions shown in millimeters ORDERING GUIDE Model AD8565AKS-R2 AD8565AKS-REEL7 AD8565AKSZ-REEL7 1 AD8566ARM-R2 AD8566ARM-REEL AD8566ARMZ-R21 AD8566ARMZ-REEL1 AD8567ARU AD8567ARU-REEL AD8567ARUZ1 AD8567ARUZ-REEL1 AD8567ACP-R2 AD8567ACP-REEL AD8567ACP-REEL7 AD8567ACPZ-R21 AD8567ACPZ-REEL1 AD8567ACPZ-REEL71 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 5-Lead Thin Shrink Small Outline Transistor Package (SC70) 5-Lead Thin Shrink Small Outline Transistor Package (SC70) 5-Lead Thin Shrink Small Outline Transistor Package (SC70) 8-Lead Micro Small Outline Package (MSOP) 8-Lead Micro Small Outline Package (MSOP) 8-Lead Micro Small Outline Package (MSOP) 8-Lead Micro Small Outline Package (MSOP) 14-Lead Thin Shrink Small Outline Package (TSSOP) 14-Lead Thin Shrink Small Outline Package (TSSOP) 14-Lead Thin Shrink Small Outline Package (TSSOP) 14-Lead Thin Shrink Small Outline Package (TSSOP) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) Z = Pb-free part, # denotes lead-free product may be top or bottom marked. Rev. D | Page 13 of 16 Package Option KS-5 KS-5 KS-5 RM-8 RM-8 RM-8 RM-8 RU-14 RU-14 RU-14 RU-14 CP-16-4 CP-16-4 CP-16-4 CP-16-4 CP-16-4 CP-16-4 Branding ASA ASA A0N ATA ATA ATA# ATA# AD8565/AD8566/AD8567 NOTES Rev. D | Page 14 of 16 AD8565/AD8566/AD8567 NOTES Rev. D | Page 15 of 16 AD8565/AD8566/AD8567 NOTES ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C01909-0-2/06(D) Rev. D | Page 16 of 16