Dual 12-/14-/16-Bit 800 MSPS DAC with Low Power 32-Bit Complex NCO AD9785/AD9787/AD9788 FEATURES GENERAL DESCRIPTION Analog output: adjustable 8.7 mA to 31.7 mA, RL = 25 Ω to 50 Ω Low power, fine complex NCO allows carrier placement anywhere in DAC bandwidth while adding <300 mW power Auxiliary DACs allow I and Q gain matching and offset control Includes programmable I and Q phase compensation Internal digital upconversion capability Multiple chip synchronization interface High performance, low noise PLL clock multiplier Digital inverse sinc filter 100-lead, exposed paddle TQFP package The AD9785/AD9787/AD9788 are 12-bit, 14-bit, and 16-bit, high dynamic range TxDAC® devices, respectively, that provide a sample rate of 800 MSPS, permitting multicarrier generation up to the Nyquist frequency. Features are included for optimizing direct conversion transmit applications, including complex digital modulation, as well as gain, phase, and offset compensation. The DAC outputs are optimized to interface seamlessly with analog quadrature modulators, such as the ADL537x family from Analog Devices, Inc. A serial peripheral interface (SPI) provides for programming and readback of many internal parameters. Full-scale output current can be programmed over a range of 10 mA to 30 mA. The AD978x family is manufactured on a 0.18 μm CMOS process and operates from 1.8 V and 3.3 V supplies. It is enclosed in a 100-lead TQFP package. APPLICATIONS Wireless infrastructure WCDMA, CDMA2000, TD-SCDMA, WiMAX, GSM Digital high or low IF synthesis Transmit diversity Wideband communications LMDS/MMDS, point-to-point PRODUCT HIGHLIGHTS 1. Low noise and intermodulation distortion (IMD) enable high quality synthesis of wideband signals from baseband to high intermediate frequencies. 2. Proprietary DAC output switching technique enhances dynamic performance. 3. CMOS data input interface with adjustable setup and hold. 4. Low power complex 32-bit numerically controlled oscillators (NCOs). TYPICAL SIGNAL CHAIN QUADRATURE MODULATOR/ MIXER/ AMPLIFIER COMPLEX I AND Q DC LO DC DIGITAL INTERPOLATION FILTERS I DAC POST DAC ANALOG FILTER FPGA/ASIC/DSP A 07098-001 Q DAC Figure 1. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. AD9785/AD9787/AD9788 TABLE OF CONTENTS Features .............................................................................................. 1 Input Data RAM......................................................................... 37 Applications....................................................................................... 1 Digital Datapath ............................................................................. 38 General Description ......................................................................... 1 Interpolation Filters ................................................................... 38 Product Highlights ........................................................................... 1 Quadrature Modulator .............................................................. 40 Typical Signal Chain......................................................................... 1 Numerically Controlled Oscillator .......................................... 40 Revision History ............................................................................... 2 Inverse Sinc Filter ....................................................................... 40 Specifications..................................................................................... 3 Digital Amplitude and Offset Control .................................... 41 DC Specifications ......................................................................... 3 Digital Phase Correction........................................................... 41 Digital Specifications ................................................................... 4 Device Synchronization................................................................. 42 AC Specifications.......................................................................... 5 Synchronization Logic Overview............................................. 42 Absolute Maximum Ratings............................................................ 6 Synchronizing Devices to a System Clock .............................. 44 Thermal Resistance ...................................................................... 6 Synchronizing Multiple Devices to Each Other..................... 45 ESD Caution.................................................................................. 6 Interrupt Request Operation .................................................... 46 Pin Configurations and Function Descriptions ........................... 7 Driving the REFCLK Input ........................................................... 47 Typical Performance Characteristics ........................................... 13 DAC REFCLK Configuration................................................... 47 Terminology .................................................................................... 20 Analog Outputs............................................................................... 50 Theory of Operation ...................................................................... 21 Digital Amplitude Scaling......................................................... 50 Serial Port Interface.................................................................... 21 Power Dissipation........................................................................... 52 SPI Register Map............................................................................. 24 AD9785/AD9787/AD9788 Evaluation Boards........................... 54 SPI Register Descriptions .......................................................... 25 Output Configuration................................................................ 54 Input Data Ports.............................................................................. 33 Digital Picture of Evaluation Board......................................... 54 Single-Port Mode........................................................................ 33 Evaluation Board Software........................................................ 55 Dual-Port Mode.......................................................................... 33 Evaluation Board Schematics ................................................... 56 Input Data Referenced to DATACLK ...................................... 33 Outline Dimensions ....................................................................... 62 Input Data Referenced to REFCLK.......................................... 35 Ordering Guide .......................................................................... 62 Optimizing the Data Input Timing.......................................... 36 REVISION HISTORY 1/08—Revision 0: Initial Version Rev. 0 | Page 2 of 64 AD9785/AD9787/AD9788 SPECIFICATIONS DC SPECIFICATIONS TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. LVDS driver and receiver are compliant to the IEEE 1596 reduced range link, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY Differential Nonlinearity (DNL) Integral Nonlinearity (INL) MAIN DAC OUTPUTS Offset Error Gain Error (with Internal Reference) Full-Scale Output Current Output Compliance Range Output Resistance Gain DAC Monotonicity Guaranteed MAIN DAC TEMPERATURE DRIFT Offset Gain Reference Voltage AUX DAC OUTPUTS Resolution Full-Scale Output Current 1 Output Compliance Range (Source) Output Compliance Range (Sink) Output Resistance Aux DAC Monotonicity Guaranteed REFERENCE Internal Reference Voltage Output Resistance ANALOG SUPPLY VOLTAGES AVDD33 CVDD18 DIGITAL SUPPLY VOLTAGES DVDD33 DVDD18 POWER CONSUMPTION 1× Mode, fDATA = 100 MSPS, PLL Off, IF = 2 MHz 2× Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off 4× Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off 8× Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off Power-Down Mode OPERATING RANGE 1 Min AD9785 Typ Max 12 Min ±0.2 ±0.3 –0.001 8.66 –1.0 0 ±2 20.2 AD9787 Typ Max 14 Min ±0.5 ±1.0 +0.001 −0.001 31.66 +1.0 8.66 –1.0 +0.001 −0.001 31.66 +1.0 8.66 –1.0 Unit Bits ±2.1 ±3.7 LSB LSB 10 10 10 10 10 10 % FSR % FSR mA V MΩ Bits 0.04 100 30 0.04 100 30 0.04 100 30 ppm/°C ppm/°C ppm/°C 10 0 ±2 20.2 AD9788 Typ Max 16 +0.001 31.66 +1.0 1 10 1 10 1 10 Bits mA V V MΩ Bits 1.2 5 1.2 5 1.2 5 V kΩ –1.998 0 0.8 10 0 ±2 20.2 +1.998 1.6 1.6 –1.998 0 0.8 10 +1.998 1.6 1.6 –1.998 0 0.8 +1.998 1.6 1.6 3.13 1.70 3.3 1.8 3.47 1.90 3.13 1.70 3.3 1.8 3.47 1.90 3.13 1.70 3.3 1.8 3.47 1.90 V V 3.13 1.70 3.3 1.8 3.47 1.90 3.13 1.70 3.3 1.8 3.47 1.90 3.13 1.70 3.3 1.8 3.47 1.90 V V 375 450 375 450 375 450 mW –40 533 533 533 mW 754 754 754 mW 1054 1054 1054 mW 2.5 +25 9.0 +85 –40 Based on a 10 Ω external resistor. Rev. 0 | Page 3 of 64 2.5 +25 9.0 +85 –40 2.5 +25 9.0 +85 mW °C AD9785/AD9787/AD9788 DIGITAL SPECIFICATIONS TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 2. Parameter CMOS INPUT LOGIC LEVEL Input VIN Logic High Input VIN Logic Low LVDS INPUT (SYNC_I+, SYNC_I−) Input Voltage Range, VIA or VIB Input Differential Threshold, VIDTH Input Differential Hysteresis, VIDTHH − VIDTHL Receiver Differential Input Impedance, RIN LVDS Input Rate (fSYNC_I = fDATA) Setup Time, SYNC_I to DAC Clock Hold Time, SYNC _I to DAC Clock LVDS DRIVER OUTPUTS (SYNC_O+, SYNC_O−) Output Voltage High, VOA or VOB Output Voltage Low, VOA or VOB Output Differential Voltage, |VOD| Output Offset Voltage, VOS Output Impedance, Single-Ended, RO DAC CLOCK INPUT (REFCLK+, REFCLK–) Differential Peak-to-Peak Voltage Common-Mode Voltage Maximum Clock Rate DVDD18 = 1.8 V ± 5% DVDD18 = 1.9 V ± 5% MAXIMUM INPUT DATA RATE 1× Interpolation 2× Interpolation 4× Interpolation DVDD18 = 1.8 V ± 5% DVDD18 = 1.9 V ± 5% 8× Interpolation DVDD18 = 1.8 V ±5% DVDD18 = 1.9 V ± 5% SERIAL PERIPHERAL INTERFACE Maximum Clock Rate (SCLK) Minimum Pulse Width High Minimum Pulse Width Low Setup Time, SPI_SDIO to SCLK Hold Time, SPI_SDIO to SCLK Setup Time, SPI_CSB to SCLK Data Valid, SPI_SDO to SCLK INPUT DATA Setup Time, Input Data to DATACLK Hold Time, Input Data to DATACLK Setup Time, Input Data to REFCLK Hold Time, Input Data to REFCLK Test Conditions/Comments Min Typ Max Unit 0.8 V V 2.0 SYNC_I+ = V1A, SYNC_I− = V1B 825 –100 1575 +100 20 80 30 0.45 0.25 120 825 1025 150 1150 80 1575 200 400 300 mV mV mV Ω MHz ns ns SYNC_O+ = VOA, SYNC_O− = VOB, 100 Ω termination 100 250 1250 120 mV mV mV mV Ω 800 400 1600 500 mV mV 800 900 MHz MHz 250 250 MSPS MSPS 200 225 MSPS MSPS 100 112.5 MSPS MSPS 40 12.5 12.5 2.8 0.0 3.0 10.0 MHz ns ns ns ns ns ns 460 −1.5 −0.25 2.4 ns ns ns ns All modes, −40°C to +85°C 1 Rev. 0 | Page 4 of 64 AD9785/AD9787/AD9788 Parameter LATENCY (DACCLK CYCLES) 1× Interpolation 2× Interpolation 4× Interpolation 8× Interpolation Inverse Sinc POWER-UP TIME 2 DAC Wake-Up Time 3 DAC Sleep Time 4 Test Conditions/Comments Min With or without modulation With or without modulation With or without modulation With or without modulation Typ Max 40 83 155 294 18 260 22 22 IOUT current settling to 1% IOUT current to less than 1% of full scale Unit Cycles Cycles Cycles Cycles Cycles ms ms ms 1 Timing vs. temperature and data valid windows are delineated in Table 25. Measured from SPI_CSB rising edge on Register 0x00; toggle Bit 4 from 0 to 1. VREF decoupling capacitor = 0.1 μF. 3 Measured from SPI_CSB rising edge on Register 0x05 or Register 0x07; toggle Bit 15 or Bit 14 from 0 to 1. 4 Measured from SPI_CSB rising edge on Register 0x05 or Register 0x07; toggle Bit 15 or Bit 14 from 1 to 0. 2 AC SPECIFICATIONS TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 3. Parameter SPURIOUS-FREE DYNAMIC RANGE (IN-BAND SFDR) fDACCLK = 200 MSPS, fOUT = 70 MHz 1× Interpolation fDACCLK = 200 MSPS, fOUT = 70 MHz 2× Interpolation fDACCLK = 200 MSPS, fOUT = 70 MHz 4× Interpolation fDACCLK = 800 MSPS, fOUT = 40 MHz 8× Interpolation TWO-TONE INTERMODULATION DISTORTION (IMD) fDATA = 200 MSPS, fOUT = 50 MHz 1× Interpolation fDATA = 200 MSPS, fOUT = 50 MHz 2× Interpolation fDATA = 200 MSPS, fOUT = 100 MHz 4× Interpolation fDATA = 100 MSPS, fOUT = 100 MHz 8× Interpolation NOISE SPECTRAL DENSITY (NSD), EIGHT TONE, 500 kHz TONE SPACING fDACCLK = 200 MSPS, fOUT = 80 MHz fDACCLK = 400 MSPS, fOUT = 80 MHz fDACCLK = 800 MSPS, fOUT = 80 MHz WCDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER fDACCLK = 491.52 MSPS, fOUT = 100 MHz 4× Interpolation fDACCLK = 491.52 MSPS, fOUT = 200 MHz 4× Interpolation WCDMA SECOND ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER fDACCLK = 491.52 MSPS, fOUT = 100 MHz 4× Interpolation fDACCLK = 491.52 MSPS, fOUT = 200 MHz 4× Interpolation AD9785 Min Typ Max AD9787 Min Typ Max AD9788 Min Typ Max Unit 80 80 78 85 82 82 80 87 83 83 81 90 dBc dBc dBc dBc 80 78 78 70 82 79 79 70 83 80 80 70 dBc dBc dBc dBc −154 −154 −154 −157 −158 −159 −158 −161 −162 dBm/Hz dBm/Hz dBm/Hz 78 72 80 74 82 76 dBc dBc 80 78 82 80 88 82 dBc dBc Rev. 0 | Page 5 of 64 AD9785/AD9787/AD9788 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter AVDD33 to AGND, DGND, CGND DVDD33, DVDD18, CVDD18 to AGND, DGND, CGND AGND to DGND, CGND DGND to AGND, CGND CGND to AGND, DGND I120, VREF, IPTAT to AGND OUT1_P, OUT1_N, OUT2_P, OUT2_N, AUX1_P, AUX1_N, AUX2_P, AUX2_N to AGND P1D[15] to P1D[0], P2D[15] to P2D[0] to DGND DATACLK, TXENABLE to DGND REFCLK+, REFCLK−, RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O−, SYNC_I+, SYNC_I− to CGND RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O−, SYNC_I+, SYNC_I−, SPI_CSB, SCLK, SPI_SDIO, SPI_SDO to DGND Junction Temperature Storage Temperature Range THERMAL RESISTANCE Rating −0.3 V to +3.6 V −0.3 V to +2.1 V −0.3 V to +0.3 V −0.3 V to +0.3 V −0.3 V to +0.3 V −0.3 V to AVDD33 + 0.3 V −1.0 V to AVDD33 + 0.3 V For this 100-lead, thermally enhanced TQFP, the exposed paddle (EPAD) must be soldered to the ground plane. Note that these specifications are valid with no airflow movement. Table 5. Thermal Resistance Resistance θJA θJB θJC Unit 19.1°C/W 12.4°C/W 7.1°C/W −0.3 V to DVDD33 + 0.3 V −0.3 V to DVDD33 + 0.3 V −0.3 V to CVDD18 + 0.3 V ESD CAUTION −0.3 V to DVDD33 + 0.3 V 125°C −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 6 of 64 Conditions EPAD soldered. No airflow. EPAD soldered. No airflow. EPAD soldered. No airflow. AD9785/AD9787/AD9788 AVDD33 AGND AVDD33 AGND AVDD33 AGND AGND OUT2_P OUT2_N AGND AUX2_P AUX2_N AGND AUX1_N AUX1_P AGND OUT1_N OUT1_P AGND AGND AVDD33 AGND AVDD33 AGND AVDD33 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 I120 74 VREF 73 IPTAT 4 72 AGND REFCLK+ 5 71 IRQ REFCLK– 6 70 RESET CGND 7 69 SPI_CSB CGND 8 68 SCLK CVDD18 9 67 SPI_SDIO 66 SPI_SDO 65 PLL_LOCK AGND 12 64 DGND SYNC_I+ 13 63 SYNC_O+ SYNC_I– 14 62 SYNC_O– DGND 15 61 DVDD33 DVDD18 16 60 DVDD18 P1D[11] 17 59 NC P1D[10] 18 58 NC P1D[9] 19 57 NC P1D[8] 20 56 NC P1D[7] 21 55 P2D[0] DGND 22 54 DGND DVDD18 23 53 DVDD18 P1D[6] 24 52 P2D[1] P1D[5] 25 51 P2D[2] DIGITAL DOMAIN AD9785 CVDD18 10 TOP VIEW (Not to Scale) CGND 11 Figure 2. AD9785 Pin Configuration Table 6. AD9785 Pin Function Descriptions Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 Mnemonic CVDD18 CGND REFCLK+ REFCLK− AGND Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. SYNC_I+ SYNC_I− DGND DVDD18 P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] P1D[3] P1D[2] Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D11 (MSB). Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4. Port 1, Data Input D3. Port 1, Data Input D2. Rev. 0 | Page 7 of 64 07098-005 P2D[3] P2D[4] P2D[5] P2D[6] P2D[7] P2D[8] DGND DVDD18 P2D[9] NC NC DVDD18 DGND NC P1D[0] P1D[1] P1D[2] P1D[3] 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P1D[4] NC = NO CONNECT P2D[10] CGND ANALOG DOMAIN P2D[11] 3 TXENABLE CGND PIN 1 INDICATOR DVDD33 2 DATACLK 1 CVDD18 NC CVDD18 AD9785/AD9787/AD9788 Pin No. 29 30 31, 34 to 36, 56 to 59 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 62 63 65 66 67 68 69 70 71 73 Mnemonic P1D[1] P1D[0] NC DATACLK DVDD33 TXENABLE P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O− SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D1. Port 1, Data Input D0 (LSB). No Connection Necessary. Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D11 (MSB). Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 μA at 25°C with approximately 20 nA/°C slope. This pin should remain floating. Voltage Reference Output. 120 μA Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND). Rev. 0 | Page 8 of 64 AVDD33 AGND AVDD33 AGND AVDD33 AGND AGND OUT2_P OUT2_N AGND AUX2_P AUX2_N AGND AUX1_N AUX1_P AGND OUT1_N OUT1_P AGND AGND AVDD33 AGND AVDD33 AGND AVDD33 AD9785/AD9787/AD9788 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 I120 74 VREF 73 IPTAT 4 72 AGND REFCLK+ 5 71 IRQ REFCLK– 6 70 RESET CGND 7 69 SPI_CSB CGND 8 68 SCLK CVDD18 9 AD9787 67 SPI_SDIO TOP VIEW (Not to Scale) 66 SPI_SDO 65 PLL_LOCK AGND 12 64 DGND SYNC_I+ 13 63 SYNC_O+ SYNC_I– 14 62 SYNC_O– DGND 15 61 DVDD33 DVDD18 16 60 DVDD18 P1D[13] 17 59 NC P1D[12] 18 58 NC P1D[11] 19 57 P2D[0] P1D[10] 20 56 P2D[1] P1D[9] 21 55 P2D[2] DGND 22 54 DGND DVDD18 23 53 DVDD18 P1D[8] 24 52 P2D[3] P1D[7] 25 51 P2D[4] DIGITAL DOMAIN CVDD18 10 CGND 11 Figure 3. AD9787 Pin Configuration Table 7. AD9787 Pin Function Descriptions Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 29 30 Mnemonic CVDD18 CGND REFCLK+ REFCLK− AGND Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. SYNC_I+ SYNC_I− DGND DVDD18 P1D[13] P1D[12] P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] P1D[3] P1D[2] Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D13 (MSB). Port 1, Data Input D12. Port 1, Data Input D11. Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4. Port 1, Data Input D3. Port 1, Data Input D2. Rev. 0 | Page 9 of 64 07098-004 P2D[5] P2D[6] P2D[7] P2D[8] P2D[9] P2D[10] DGND DVDD18 P2D[11] NC P1D[0] DVDD18 DGND P1D[1] P1D[2] P1D[3] P1D[4] P1D[5] 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P1D[6] NC = NO CONNECT P2D[12] CGND ANALOG DOMAIN P2D[13] 3 TXENABLE CGND PIN 1 INDICATOR DVDD33 2 DATACLK 1 CVDD18 NC CVDD18 AD9785/AD9787/AD9788 Pin No. 31 34 35, 36, 58, 59 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 56 57 62 63 65 66 67 68 69 70 71 73 Mnemonic P1D[1] P1D[0] NC DATACLK DVDD33 TXENABLE P2D[13] P2D[12] P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O− SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D1. Port 1, Data Input D0 (LSB). No Connection Necessary. Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D13 (MSB). Port 2, Data Input D12. Port 2, Data Input D11. Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 μA at 25°C with approximately 20 nA/°C slope. This pin should remain floating. Voltage Reference Output. 120 μA Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND). Rev. 0 | Page 10 of 64 AVDD33 AGND AVDD33 AGND AVDD33 AGND AGND OUT2_P OUT2_N AGND AUX2_P AUX2_N AGND AUX1_N AUX1_P AGND OUT1_N OUT1_P AGND AGND AVDD33 AGND AVDD33 AGND AVDD33 AD9785/AD9787/AD9788 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 CVDD18 1 CVDD18 2 75 I120 74 CGND 3 VREF 73 CGND IPTAT 4 72 AGND REFCLK+ 5 71 IRQ REFCLK– 6 70 RESET CGND 7 69 SPI_CSB CGND 8 68 SCLK CVDD18 9 AD9788 67 SPI_SDIO TOP VIEW (Not to Scale) 66 SPI_SDO 65 PLL_LOCK AGND 12 64 DGND SYNC_I+ 13 63 SYNC_O+ SYNC_I– 14 62 SYNC_O– DGND 15 61 DVDD33 DVDD18 16 60 DVDD18 P1D[15] 17 59 P2D[0] P1D[14] 18 58 P2D[1] P1D[13] 19 57 P2D[2] P1D[12] 20 56 P2D[3] P1D[11] 21 55 P2D[4] DGND 22 54 DGND DVDD18 23 53 DVDD18 P1D[10] 24 52 P2D[5] P1D[9] 25 51 P2D[6] PIN 1 INDICATOR ANALOG DOMAIN DIGITAL DOMAIN CVDD18 10 CGND 11 Figure 4. AD9788 Pin Configuration Table 8. AD9788 Pin Function Descriptions Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 29 30 Mnemonic CVDD18 CGND REFCLK+ REFCLK− AGND Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. SYNC_I+ SYNC_I− DGND DVDD18 P1D[15] P1D[14] P1D[13] P1D[12] P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D15 (MSB). Port 1, Data Input D14. Port 1, Data Input D13. Port 1, Data Input D12. Port 1, Data Input D11. Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4. Rev. 0 | Page 11 of 64 07098-003 P2D[7] P2D[8] P2D[9] P2D[10] P2D[11] P2D[12] DGND DVDD18 P2D[13] P2D[14] P2D[15] TXENABLE DVDD33 DATACLK P1D[0] P1D[1] P1D[2] DVDD18 DGND P1D[3] P1D[4] P1D[5] P1D[6] P1D[7] P1D[8] 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 AD9785/AD9787/AD9788 Pin No. 31 34 35 36 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 56 57 58 59 62 63 65 66 67 68 69 70 71 73 Mnemonic P1D[3] P1D[2] P1D[1] P1D[0] DATACLK DVDD33 TXENABLE P2D[15] P2D[14] P2D[13] P2D[12] P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O− SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D3. Port 1, Data Input D2. Port 1, Data Input D1. Port 1, Data Input D0 (LSB). Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D15 (MSB). Port 2, Data Input D14. Port 2, Data Input D13. Port 2, Data Input D12. Port 2, Data Input D11. Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 μA at 25°C with approximately 20 nA/°C slope. This pin should remain floating. Voltage Reference Output. 120 μA Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND). Rev. 0 | Page 12 of 64 AD9785/AD9787/AD9788 TYPICAL PERFORMANCE CHARACTERISTICS –142 100 95 –146 250 MSPS 85 2× SFDR (dB) NSD (dBm/Hz) –150 –154 1× –158 200 MSPS 90 4× 160 MSPS 80 75 70 65 –162 60 –166 0 20 40 60 80 100 fOUT (MHz) 50 0 20 40 60 100 80 fOUT (MHz) Figure 5. AD9785 Noise Spectral Density vs. fOUT, Multitone Input, fDATA = 200 MSPS 07098-067 55 07098-064 –170 Figure 8. AD9785 In-Band SFDR vs. fOUT, 2× Interpolation –142 100 –146 90 2× 150 MSPS 4× IMD (dBc) NSD (dBm/Hz) –150 –154 –158 1× 80 70 –162 100 MSPS 60 200 MSPS 20 40 60 80 100 fOUT (MHz) 50 0 80 400 80 100 120 140 160 180 200 220 240 260 120 160 200 240 280 320 360 fOUT (MHz) Figure 6. AD9785 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 200 MSPS Figure 9. AD9785 IMD vs. fOUT, 4× Interpolation –55 –55 –60 –60 –65 –65 ACLR (dBc) FIRST ADJ CHAN –70 –75 –70 FIRST ADJ CHAN –75 SECOND ADJ CHAN –85 –90 SECOND ADJ CHAN –80 –80 –85 THIRD ADJ CHAN 0 20 40 60 80 100 120 140 160 180 200 220 240 260 fOUT (MHz) –90 07098-066 ACLR (dBc) 40 07098-068 0 07098-065 –170 07098-069 –166 THIRD ADJ CHAN 0 20 40 60 fOUT (MHz) Figure 10. AD9787 ACLR, 4× Interpolation, fDATA = 122.88 MSPS Figure 7. AD9785 ACLR, 4× Interpolation, fDATA = 122.88 MSPS Rev. 0 | Page 13 of 64 –142 –60 –146 –65 –150 NSD (dBm/Hz) –55 –70 FIRST ADJ CHAN –75 SECOND ADJ CHAN –85 –90 20 40 60 –158 1× 2× 4× –162 –166 THIRD ADJ CHAN 0 –154 80 100 120 140 160 180 200 220 240 260 fOUT (MHz) –170 0 20 40 60 80 100 07098-073 –80 07098-070 ACLR (dBc) AD9785/AD9787/AD9788 fOUT (MHz) Figure 14. AD9787 Noise Spectral Density vs. fOUT over Output Frequency of Multitone Input, fDATA = 200 MSPS Figure 11. AD9787 ACLR, 4× Interpolation, fDATA = 122.88 MSPS, Amplitude = −3 dB –142 100 –146 90 NSD (dBm/Hz) IMD (dBc) –150 80 200MSPS 100MSPS 70 –154 1× –158 2× 4× –162 150MSPS 60 0 40 80 120 160 200 240 280 320 360 400 fOUT (MHz) –170 07098-071 50 20 40 60 80 100 fOUT (MHz) Figure 15. AD9787 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 200 MSPS Figure 12. AD9787 IMD vs. fOUT, 4× Interpolation –55 100 95 –60 90 0 dBFS PLL ON 160MSPS –65 85 ACLR (dBc) 250MSPS 80 200MSPS 75 70 65 –70 0 dBFS PLL OFF –3 dBFS PLL OFF –75 –80 60 –85 50 0 20 40 60 80 fOUT (MHz) Figure 13. AD9787 In-Band SFDR vs. fOUT, 2× Interpolation 100 –90 –6 dBFS PLL OFF 0 20 40 60 80 100 120 140 160 180 200 220 240 260 fOUT (MHz) 07098-076 55 07098-072 SFDR (dB) 0 07098-074 –166 Figure 16. AD9788 ACLR for First Adjacent Band WCDMA, 4× Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF Rev. 0 | Page 14 of 64 AD9785/AD9787/AD9788 –55 100 –60 200MSPS 90 0 dBFS PLL ON –70 IMD (dBc) ACLR (dBc) –65 –6 dBFS PLL OFF –75 80 160MSPS 250MSPS 70 –80 60 –85 –3 dBFS PLL OFF 20 40 60 80 100 120 140 160 180 200 220 240 260 fOUT (MHz) 50 0 50 100 150 200 07098-080 0 0 dBFS PLL OFF 07098-077 –90 fOUT (MHz) Figure 17. AD9788 ACLR for Second Adjacent Band WCDMA, 4× Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF Figure 20. AD9788 IMD vs. fOUT, 2× Interpolation –70 100 90 –75 40 60 70 200MSPS 60 0 dBFS PLL OFF 80 100 120 140 160 180 200 220 240 260 fOUT (MHz) 50 0 120 160 200 240 280 320 360 400 200 Figure 21. AD9788 IMD vs. fOUT, 4× Interpolation 100 100 160MSPS 90 90 250MSPS IMD (dBc) 80 200MSPS 70 80 PLL ON 70 PLL OFF 60 60 0 20 40 60 80 100 fOUT (MHz) 120 07098-079 IMD (dBc) 80 fOUT (MHz) Figure 18. AD9788 ACLR for Third Adjacent Band WCDMA, 4× Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF 50 40 07098-081 20 150MSPS 100MSPS –3 dBFS PLL OFF 0 80 07098-082 –85 –90 IMD (dBc) –6 dBFS PLL OFF –80 07098-078 ACLR (dBc) 0 dBFS PLL ON 50 0 20 40 60 80 100 120 140 160 180 fOUT (MHz) Figure 22. AD9788 IMD vs. fOUT, 8× Interpolation, fDATA = 100 MSPS, PLL On/PLL Off Figure 19. AD9788 IMD vs. fOUT, 1× Interpolation Rev. 0 | Page 15 of 64 AD9785/AD9787/AD9788 100 100 95 90 90 80 80 IMD (dBc) IMD (dBc) 85 75MSPS 70 50MSPS 75 70 100MSPS 65 60 60 55 50 100 150 200 250 300 350 400 450 fOUT (MHz) 50 0 40 80 120 160 200 240 280 320 360 400 07098-086 0 07098-083 50 fOUT (MHz) Figure 23. AD9788 IMD vs. fOUT, 8× Interpolation Figure 26. AD9788 IMD vs. fOUT, over 50 Parts, 4× Interpolation, fDATA = 200 MSPS –142 100 –146 90 80 NSD (dBm/Hz) IMD (dBc) –150 –6dBFS 0dBFS –3dBFS 70 –154 –3dBFS –158 0dBFS –162 –6dBFS 60 0 40 80 120 160 200 240 280 320 360 400 fOUT (MHz) –170 07098-084 50 0 20 40 60 80 100 fOUT (MHz) 07098-087 –166 Figure 27. AD9788 Noise Spectral Density vs. Digital Full-Scale Single-Tone Input, fDATA = 200 MSPS, 2× Interpolation Figure 24. AD9788 IMD Performance vs. Digital Full-Scale Input, 4× Interpolation, fDATA = 200 MSPS –142 100 –146 90 –150 NSD (dBm/Hz) IMD (dBc) 20mA 80 30mA 70 –154 –158 2× –162 10mA 4× 8× 60 0 40 80 120 160 200 240 280 320 360 400 fOUT (MHz) –170 0 10 20 30 40 50 fOUT (MHz) Figure 28. AD9788 Noise Spectral Density vs. fOUT, Multitone Input, fDATA = 100 MSPS Figure 25. AD9788 IMD Performance vs. Full-Scale Output Current, 4× Interpolation, fDATA = 200 MSPS Rev. 0 | Page 16 of 64 07098-088 50 07098-085 –166 AD9785/AD9787/AD9788 –142 90 –146 85 160MSPS 75 SFDR (dB) –154 –158 2× 250MSPS 65 4× –162 60 8× –166 55 0 10 20 30 40 50 07098-089 –170 70 50 fOUT (MHz) 0 20 40 60 80 100 fOUT (MHz) Figure 29. AD9788 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 100 MSPS 07098-092 NSD (dBm/Hz) –150 Figure 32. AD9788 In-Band SFDR vs. fOUT, 1× Interpolation 80 –142 –146 75 –150 250MSPS 200MSPS 70 SFDR (dB) NSD (dBm/Hz) 200MSPS 80 –154 –158 1× 2× 160MSPS 65 60 –162 4× 0 20 40 60 80 50 07098-090 –170 100 fOUT (MHz) 0 10 20 30 40 50 60 70 80 90 100 fOUT (MHz) Figure 30. AD9788 Noise Spectral Density vs. fDAC, Eight-Tone Input with 500 kHz Spacing, fDATA = 200 MSPS 07098-093 55 –166 Figure 33. AD9788 Out-of-Band SFDR vs. fOUT, 2× Interpolation –142 95 90 –146 10mA 85 20mA –150 SFDR (dB) NSD (dBm/Hz) 80 –154 1× –158 2× 75 30mA 70 65 –162 4× 60 –166 20 40 60 fOUT (MHz) 80 100 Figure 31. AD9788 Noise Spectral Density vs. fDAC, Full-Scale Single-Tone Input at −6 dB, fDATA = 200 MSPS Rev. 0 | Page 17 of 64 50 0 10 20 30 40 50 60 70 80 fOUT (MHz) Figure 34. AD9788 In-Band SFDR vs. Full-Scale Output Current, 2× Interpolation, fDATA = 200 MSPS 07098-094 0 07098-091 –170 55 AD9785/AD9787/AD9788 110 100 100MSPS 95 100 150MSPS 250MSPS 85 90 200MSPS SFDR (dB) SFDR (dB) 160MSPS 90 80 70 200MSPS 80 75 70 65 60 60 10 20 30 40 50 60 70 80 90 fOUT (MHz) 50 07098-095 0 100MSPS 80 100 50MSPS 150MSPS 90 80 60 70 55 60 20 30 40 50 60 70 80 90 fOUT (MHz) 50 07098-096 10 20 30 40 50 45 Figure 39. AD9788 In-Band SFDR vs. fOUT, 8× Interpolation 90 –3dBFS 0dBFS 10 fOUT (MHz) Figure 36. AD9788 Out-of-Band SFDR vs. fOUT, 4× Interpolation 90 0 07098-099 65 07098-100 SFDR (dB) 200MSPS 0 100MSPS 100 70 SFDR (dB) 60 110 75 50MSPS 85 85 80 80 –6dBFS 75 100MSPS SFDR (dB) 75 70 65 70 65 60 60 55 55 0 10 20 30 40 50 60 70 80 fOUT (MHz) 07098-097 SFDR (dB) 40 Figure 38. AD9788 In-Band SFDR vs. fOUT, 2× Interpolation 80 50 20 fOUT (MHz) Figure 35. AD9788 In-Band SFDR vs. fOUT, 4× Interpolation 50 0 07098-098 55 50 50 0 5 10 15 20 25 30 35 40 fOUT (MHz) Figure 40. AD9788 Out-of-Band SFDR vs. fOUT, 8× Interpolation Figure 37. AD9788 In-Band SFDR vs. Digital Full-Scale Input, 2× Interpolation, fDATA = 200 MSPS Rev. 0 | Page 18 of 64 AD9785/AD9787/AD9788 110 PLL OFF 100 PLL ON SFDR (dB) 90 80 70 50 0 10 20 30 fOUT (MHz) 40 50 07098-101 60 Figure 41. AD9788 In-Band SFDR vs. fOUT, 4× Interpolation, fDATA = 100 MSPS, PLL On/PLL Off Rev. 0 | Page 19 of 64 AD9785/AD9787/AD9788 TERMINOLOGY Integral Nonlinearity (INL) INL is defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale. Differential Nonlinearity (DNL) DNL is the measure of the variation in analog value, normalized to full scale, associated with a 1 LSB change in digital input code. Monotonicity A DAC is monotonic if the output either increases or remains constant as the digital input increases. Offset Error The deviation of the output current from the ideal of zero is called offset error. For IOUTA, 0 mA output is expected when the inputs are all 0s. For IOUTB, 0 mA output is expected when all inputs are set to 1. Gain Error The difference between the actual and ideal output span is called gain error. The actual span is determined by the difference between the output when all inputs are set to 1 and the output when all inputs are set to 0. Output Compliance Range The output compliance range is the range of allowable voltage at the output of a current output DAC. Operation beyond the maximum compliance limits can cause either output stage saturation or breakdown, resulting in nonlinear performance. Temperature Drift Temperature drift is specified as the maximum change from the ambient (25°C) value to the value at either TMIN or TMAX. For offset and gain drift, the drift is reported in ppm of full-scale range (FSR) per degree Celsius. For reference drift, the drift is reported in ppm per degree Celsius. Power Supply Rejection (PSR) PSR is the maximum change in the full-scale output as the supplies are varied from minimum to maximum specified voltages. Spurious-Free Dynamic Range (SFDR) Spurious-free dynamic range is the difference, in decibels, between the peak amplitude of the output signal and the peak amplitude of the largest spurious signal in a given frequency band from the signal. For out-of-band SFDR, the frequency band is 0 to one half the DAC sample rate. For in-band SFDR, the frequency band is 0 to one half the input data rate. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured fundamental. It is expressed as a percentage or in decibels. Noise Spectral Density (NSD) NSD is the noise power at the analog output measured in a 1 Hz bandwidth. Interpolation Filter If the digital inputs to the DAC are sampled at a multiple rate of fDATA (interpolation rate), a digital filter can be constructed that has a sharp transition band near fDATA/2. Images that typically appear around fDAC (output data rate) can be greatly suppressed. Adjacent Channel Leakage Ratio (ACLR) ACLR is the ratio in dBc between the measured power within a channel relative to its adjacent channel. Complex Image Rejection In a traditional two-part upconversion, two images are created around the second intermediate frequency (IF). These images have the effect of wasting transmitter power and system bandwidth. By placing the real part of a second complex modulator in series with the first complex modulator, either the upper or lower frequency image near the second IF can be rejected. Sinc Sinc is shorthand for the mathematical function sinc(x) = sin(x)/x This function is a useful tool for digital signal processing. The normalized sinc function is used here and is defined as follows: sinc(x) = sin(π × x)/(π × x) Settling Time Settling time is the time required for the output to reach and remain within a specified error band around its final value, measured from the start of the output transition. Rev. 0 | Page 20 of 64 AD9785/AD9787/AD9788 THEORY OF OPERATION The AD9785/AD9787/AD9788 devices combine many features that make them very attractive DACs for wired and wireless communications systems. The dual digital signal path and dual DAC structure allow an easy interface to common quadrature modulators when designing single sideband transmitters. The speed and performance of the AD9785/AD9787/AD9788 allow wider bandwidths and more carriers to be synthesized than in previously available DACs. In addition, these devices include an innovative low power, 32-bit complex NCO that greatly increases the ease of frequency placement. SERIAL PORT INTERFACE The AD9785/AD9787/AD9788 serial port is a flexible, synchronous serial communications port allowing easy interface to many industry-standard microcontrollers and microprocessors. The serial I/O is compatible with most synchronous transfer formats, including both the Motorola® 6905/11 SPI and the Intel® 8051 SSR protocols. The serial interface allows read/write access to all registers that configure the AD9785/AD9787/AD9788. MSB first and LSB first transfer formats are supported. In addition, the serial interface port can be configured as a single-pin I/O (SDIO), which allows a 3-wire interface, or two unidirectional pins for input/output (SDIO/SDO), which enables a 4-wire interface. One optional pin, SPI_CSB (chip select), allows enabling of multiple devices on a single bus. The AD9785/AD9787/AD9788 offer features that allow simplified synchronization with incoming data and between multiple parts, as well as the capability to phase synchronize NCOs on multiple devices. Auxiliary DACs are also provided on chip for output dc offset compensation (for LO compensation in SSB transmitters) and for gain matching (for image rejection optimization in SSB transmitters). Another innovative feature in the devices is the digitally programmable output phase compensation, which increases the amount of image cancellation capability in SSB (single sideband) transmitters. With the AD9785/AD9787/AD9788, the instruction byte specifies read/write operation and the register address. Serial operations on the AD9785/AD9787/AD9788 occur only at the register level, not at the byte level, due to the lack of byte address space in the instruction byte. + × SIN(×) + FREQUENCY 16-BIT DAC2 OUT2_P 16 1 PHASE CORRECTION 10 AUX1 INTERNAL CLOCK TIMING AND CONTROL LOGIC 1 0 LVDS DELAY LINE DELAY LINE MULTICHIP SYNCHRONIZATION PROGRAMMING REGISTERS SERIAL I/O PORT POWER-ON RESET Figure 42. Functional Block Diagram Rev. 0 | Page 21 of 64 DAC_CLK AUX2 OUT2_N VREF RESET AUX1_P AUX1_N AUX2_P AUX2_N 0 1 CLOCK MULTIPLIER (2× – 16×) PLL_LOCK SYNC_I LVDS IRQ RESET SYNC_O 10 PLL CONTROL DELAY LINE SPI_SDO SPI_SDIO SCLK SPI_CSB DATACLK OUT1_N CLK RCVR REFCLK+ REFCLK– 07098-002 0 Q-OFFSET REFERENCE AND BIAS Q-SCALE GAIN2 2 1 0 OUT1_P 10 32 GAIN1 3 16 θ NCO ω 10 16 SIN 10 16 COS 3 16-BIT DAC1 I-OFFSET I-SCALE INV_SINC_EN QUAD HB FILTER (2×) 16 0 1 PHASE QUAD HB FILTER (2×) × SIN(×) + INTERPOLATION FACTOR 16 HB1_CLK P2D[15:0] QUAD HB FILTER (2×) HB3_CLK 16 P1D[15:0] HB2_CLK TXENABLE DATA ASSEMBLER + 0 1 2 AD9785/AD9787/AD9788 For example, when accessing the frequency tuning word (FTW) register, which is four bytes wide, Phase 2 requires that four bytes be transferred. If accessing the amplitude scale factor (ASF) register, which is three bytes wide, Phase 2 requires that three bytes be transferred. After transferring all data bytes per the instruction byte, the communication cycle is completed. At the completion of any communication cycle, the AD9785/ AD9787/AD9788 serial port controller expects the next eight rising SCLK edges to be the instruction byte of the next communication cycle. All data input is registered on the rising edge of SCLK. All data is driven out of the AD9785/AD9787/AD9788 on the falling edge of SCLK. INSTRUCTION CYCLE DATA TRANSFER CYCLE SPI_CSB SPI_SDIO R/W N1 N0 A4 A3 A2 A1 A0 SPI_SDO D7 D6N D5N D3 0 D20 D10 D00 D7 D6N D5 N D3 0 D20 D10 D00 07098-006 SCLK Figure 43. Serial Register Interface Timing, MSB First INSTRUCTION CYCLE DATA TRANSFER CYCLE SPI_CSB SCLK SPI_SDIO A0 A1 A2 A3 A4 N0 N1 R/W D00 D10 D20 D4N D5N D6N D7 N D00 D10 D20 D4N D5 N D6N D7N SPI_SDO 07098-007 The first eight SCLK rising edges of each communication cycle are used to write the instruction byte into the AD9785/AD9787/ AD9788. The remaining SCLK edges are for Phase 2 of the communication cycle. Phase 2 is the actual data transfer between the AD9785/AD9787/AD9788 and the system controller. The number of bytes transferred during Phase 2 of the communication cycle is a function of the register being accessed. Figure 43 through Figure 46 are useful in understanding the general operation of the AD9785/AD9787/AD9788 serial port. Figure 44. Serial Register Interface Timing, LSB First tDS tSCLK SPI_CSB tPWH tPWL SCLK tDS SPI_SDIO tDH INSTRUCTION BIT 7 INSTRUCTION BIT 6 07098-008 There are two phases to a communication cycle with the AD9785/AD9787/AD9788. Phase 1 is the instruction cycle, which is the writing of an instruction byte into the AD9785/ AD9787/AD9788, coincident with the first eight SCLK rising edges. The instruction byte provides the AD9785/AD9787/ AD9788 serial port controller with information regarding the data transfer cycle, which is Phase 2 of the communication cycle. The instruction byte defines whether the upcoming data transfer is read or write and the serial address of the register being accessed. Figure 45. SPI Register Write Timing SPI_CSB tDV SPI_SDIO SPI_SDO DATA BIT n DATA BIT n–1 Figure 46. SPI Register Read Timing Instruction Byte Rev. 0 | Page 22 of 64 07098-009 SCLK AD9785/AD9787/AD9788 Instruction Byte SPI_SDO—Serial Data Output The instruction byte contains the following information as shown in the instruction byte bit map. Instruction Byte Information Bit Map MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 R/W X X A4 A3 A2 A1 A0 R/W—Bit 7 of the instruction byte determines whether a read or write data transfer occurs after the instruction byte write. Logic 1 indicates a read operation. Logic 0 indicates a write operation. X, X —Bit 6 and Bit 5 of the instruction byte are don’t care. In previous TxDACs, such as the AD9779, these bits define the number of registers written to or read from in an SPI read/write operation. In the AD9785/AD9787/AD9788, the register itself now defines how many bytes are written to or read from. A4, A3, A2, A1, A0—Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0 of the instruction byte determine which register is accessed during the data transfer portion of the communication cycle. Serial Interface Port Pin Description SCLK—Serial Clock The serial clock pin is used to synchronize data to and from the AD9785/AD9787/AD9788 and to run the internal state machines. SCLK maximum frequency is 40 MHz. SPI_CSB—Chip Select Active low input that allows more than one device on the same serial communications line. The SPI_SDO and SPI_SDIO pins go to a high impedance state when this input is high. If driven high during any communication cycle, that cycle is suspended until SPI_CSB is reactivated low. Chip select can be tied low in systems that maintain control of SCLK. Data is read from this pin for protocols that use separate lines for transmitting and receiving data. In the case where the AD9785/AD9787/AD9788 operate in a single bidirectional I/O mode, this pin does not output data and is set to a high impedance state. MSB/LSB Transfers The AD9785/AD9787/AD9788 serial port can support both most significant bit (MSB) first or least significant bit (LSB) first data formats. This functionality is controlled by Bit 6 of the communication (COMM) register. The default value of COMM Register Bit 6 is low (MSB first). When COMM Register Bit 6 is set high, the serial port is in LSB first format. The instruction byte must be written in the format indicated by COMM Register Bit 6. That is, if the device is in LSB first mode, the instruction byte must be written from least significant bit to most significant bit. For MSB first operation, the serial port controller generates the most significant byte (of the specified register) address first, followed by the next lesser significant byte addresses until the I/O operation is complete. All data written to or read from the AD9785/AD9787/AD9788 must be in MSB first order. If the LSB mode is active, the serial port controller generates the least significant byte address first, followed by the next greater significant byte addresses until the I/O operation is complete. All data written to or read from the AD9785/AD9787/AD9788 must be in LSB first order. SPI Resynchronization Capability If the SPI port becomes unsynchronized at any time, toggling SCLK for eight or more cycles with SPI_CSB held high resets the SPI port state machine. The device is then ready for the next register read or write access. SPI_SDIO—Serial Data I/O Data is always written into the AD9785/AD9787/AD9788 on this pin. However, this pin can be used as a bidirectional data line. Bit 7 of Register 0x00 controls the configuration of this pin. The default is Logic 0, which configures the SPI_SDIO pin as bidirectional. Rev. 0 | Page 23 of 64 AD9785/AD9787/AD9788 SPI REGISTER MAP When reading Table 9, note that the AD9785/AD9787/AD9788 is a 32-bit part and, therefore, the 4th through the 11th columns (beginning with the MSB and ending with the LSB) represent a set of eight bits. Refer to the Bit Range column for the actual bits being described. Table 9. Address 0x00 0x01 Register Name Comm. (COMM) Register Bit Range [7:0] Digital Control Register 0x02 Data Sync Control Register 0x03 Multichip Sync Control Register MSB − 2 Software reset MSB − 3 Powerdown mode [7:0] MSB MSB − 1 SPI_SDIO LSB first bidirectional (active high, 3-wire) Interpolation Factor [1:0] Data format [15:8] Reserved Clear phase accumulator [7:0] Data Timing Margin [0] LVDS data clock enable PN code sync enable DATACLK invert Singleport mode Sync mode select DATACLK delay enable [15:8] [7:0] [15:8] [23:16] [31:24] 0x04 PLL Control Register [7:0] [15:8] [23:16] [7:0] [15:8] 0x05 I DAC Control Register 0x06 Auxiliary DAC 1 Control Register [7:0] [15:8] 0x07 Q DAC Control Register [7:0] [15:8] 0x08 Auxiliary DAC 2 Control Register [7:0] [15:8] 0x09 Interrupt Control Register [7:0] [15:8] 0x0A Frequency Tuning Word Register [31:0] DATACLK Delay [4:0] Clock State [3:0] SYNC _O Delay [4:0] MSB − 4 Auto powerdown enable Real mode MSB − 5 I/O transfer (selfreset) IQ select invert MSB − 6 Automatic I/O transfer enable Q first Pulse sync enable Data timing mode Spectral inversion Inverse sinc enable Data sync polarity Set low LSB Open Default 0x02 Modulator gain control DATACLK output enable Reserved 0x00 Data Timing Margin [3:1] Sync Timing Margin [3:0] SYNC_O Sync Set high polarity loopback enable Set low DATACLK SYNC_I Delay [4:0] Sync input error check mode Correlate Threshold [4:0] SYNC _I SYNC _O Set low enable enable PLL Band Select [5:0] PLL VCO Drive [1:0] PLL enable PLL VCO Divisor [1:0] PLL Loop Divisor [1:0] PLL Bias [2:0] VCO Control Voltage [2:0] PLL Loop Bandwidth [4:0] I DAC Gain Adjustment [7:0] I DAC sleep I DAC Reserved I DAC Gain Adjustment power-down [9:8] Auxiliary DAC 1 Data [7:0] Reserved Auxiliary DAC 1 Data Auxiliary Auxiliary Auxiliary [9:8] DAC 1 DAC 1 sign DAC 1 powercurrent down direction Q DAC Gain Adjustment [7:0] Q DAC sleep Q DAC Reserved Q DAC Gain Adjustment power-down [9:8] Auxiliary DAC 2 Data [7:0] Reserved Auxiliary DAC 2 Data Auxiliary Auxiliary Auxiliary [9:8] DAC 2 DAC 2 sign DAC 2 powercurrent down direction PLL lock Reserved Data port Sync port Sync Data timing Sync timing Data indicator IRQ enable IRQ timing error IRQ error IRQ timing enable error error type type Sync lock Reserved Reserved Clear lock Sync status lock indicator lost (selfstatus reset) Frequency Tuning Word [31:0] Rev. 0 | Page 24 of 64 0x31 0x00 0x00 0x00 0x00 0x00 0x80 0xCF 0x37 0x38 0xF9 0x01 0x00 0x00 0xF9 0x01 0x00 0x00 0x00 0x00 0x00 AD9785/AD9787/AD9788 Address 0x0B Register Name Phase Control Register Bit Range [15:0] [23:16] MSB MSB − 1 [31:24] 0x0C Amplitude Scale Factor Register Reserved [7:0] [15:8] 0x0E 1 0x1D1 0x1E 1 Output Offset Register Version Register RAM Test Register MSB − 5 MSB − 6 LSB Phase Correction Word [9:8] I DAC Amplitude Scale Factor [7:0] Q DAC Amplitude Scale Factor [6:0] [23:16] 0x0D MSB − 2 MSB − 3 MSB − 4 NCO Phase Offset Word [15:0] Phase Correction Word [7:0] Reserved [15:0] [31:16] I DAC Offset [15:0] Q DAC Offset [15:0] [7:0] [15:8] [31:0] [31:0] Version ID Reserved RAM Test I DAC Amplitude Scale Factor [8] Q DAC Amplitude Scale Factor [8:7] Default 0x00 0x00 0x00 0x80 0x00 0x01 0x00 0x00 Address space between Address 0x0E and Address 0x1D is intentionally left open. SPI REGISTER DESCRIPTIONS The communication (COMM) register comprises one byte located at Address 0x00. Table 10. Communication (COMM) Register Address 0x00 Bit [7] Name SPI_SDIO bidirectional [6] LSB first [5] Software reset [4] Power-down mode [3] Auto power-down enable [2] I/O transfer (self-reset) [1] Automatic I/O transfer enable Description 0: Default. Use the SPI_SDIO pin for input data only, 4-wire serial mode. 1: Use SPI_SDIO as a read/write pin, 3-wire serial mode. 0: Default. MSB first format is active. 1: Serial interface accepts serial data in LSB first format. 0: Default. Bit is in the inactive state. 1: In the AD9785/AD9787/AD9788, all programmable bits return to their power-up state except for the COMM register bits, which are unaffected by the software reset. The software reset remains in effect until this bit is set to 0 (inactive state). 0: Default. The full chip power-down is not active. 1: The AD9785/AD9787/AD9788 enter a power-down mode in which all functions are powered down. This power-down puts the part into its lowest possible power dissipation state. The part remains in this low power state until the user sets this bit to a Logic 0. The analog circuitry requires 250 ms to become operational. 0: Default. Inactive state, automatic power-down feature is not enabled. 1: The device automatically switches into its low power mode whenever TXENABLE is deasserted for a sufficiently long period of time. 0: Default. Inactive state. 1: The contents of the frequency tuning word memory buffer, phase control memory buffer, amplitude scale factor memory buffer, and the output offset memory buffer are moved to a memory location that affects operation of the device. The one-word memory buffer is employed to simultaneously update the NCO frequency, phase, amplitude, and offset control. Note that this bit automatically clears itself after the I/O transfer occurs. For this reason, unless the reference clock is stopped, it is difficult to read back a Logic 1 on this bit. 0: Automatic I/O transfer disabled. The I/O transfer bit (Bit 2) must be set to update the device in the event that changes have been made to Register 0x0A, Register 0x0B, Register 0x0C, or Register 0x0D. This allows the user to change important operating modes of the device all at once, rather than one at a time with individual SPI writes. 1: Default. Automatic I/O transfer enabled. The device updates its operation immediately when SPI writes are completed to Register 0x0A, Register 0x0B, Register 0x0C, or Register 0x0D. Rev. 0 | Page 25 of 64 AD9785/AD9787/AD9788 The digital control (DCTL) register comprises two bytes located at Address 0x01. Table 11. Digital Control (DCTL) Register Address 0x01 Bit [15] [14] Name Reserved Clear phase accumulator [13] PN code sync enable [12] Sync mode select [11] Pulse sync enable [10] Spectral inversion [9] Inverse sinc enable [8] DATACLK output enable [7:6] Interpolation Factor [1:0] [5] Data format [4] Single-port mode [3] Real mode [2] IQ select invert [1] Q first (data pairing) [0] Modulator gain control Description Reserved for future use. 0: Default. The feature that clears the NCO phase accumulator is inactive. The phase accumulator operates as normal. 1: The NCO phase accumulator is held in the reset state until this bit is cleared. 0: PN code synchronization mode is disabled. 1: PN code synchronization mode is enabled. See the Device Synchronization section for details. 0: Selects pulse mode synchronization. 1: Selects PN code synchronization. See the Device Synchronization section for details. 0: Pulse mode synchronization is disabled. 1: Pulse mode synchronization is enabled. See the Device Synchronization section for details. 0: The modulator outputs high-side image. 1: The modulator outputs low-side image. The image is spectrally inverted compared to the input data. 0: Default. The inverse sinc filter is bypassed. 1: The inverse sinc filter is enabled and operational. 0: Data clock pin is disabled. 1: Default. The output data clock pin is active (configured as an output). Specifies the filter interpolation rate where: 00: 1× interpolation 01: 2× interpolation 10: 4× interpolation 11: 8× interpolation 0: Default. The incoming data is expected to be twos complement. 1: The incoming data is expected to be offset binary. 0: Default. When the single-port bit is cleared, I/Q data is sampled simultaneously on the P1D and P2D input ports. Specifically, I data is registered from the P1D[15:0] pins and Q data is registered from the P2D[15:0] pins. 1: When the single-port bit is set, I/Q data is sampled in a serial word fashion on the P1D input port. In this mode, the I/Q data is sampled into the part at twice the I/Q sample rate. 0: Default. Logic 0 is the inactive state for this bit. 1: When the real mode bit is set, the Q path logic after modulation and phase compensation is disabled. 0: Default. When the IQ Select Invert bit is cleared, a Logic 1 on the TXENABLE pin indicates I data, and a Logic 0 on the TXENABLE pin indicates Q data, if the user is employing a continuous timing style on the TXENABLE pin. 1: When the IQ Select Invert bit is set, a Logic 1 on the TXENABLE pin indicates Q data, and a Logic 0 on the TXENABLE pin indicates I data, if the user is employing a continuous timing style on the TXENABLE pin. 0: Default. When the Q first bit is cleared, the I/Q data pairing is nominal, that is, the I data precedes the Q data in the assembly of the I/Q data pair. As such, data input to the device as I0, Q0, I1, Q1 . . . In, Qn is paired as follows: (I0/Q0), (I1/Q1) … (In/Qn). 1: When the Q first bit is set, the I/Q data pairing is altered such that the I data is paired with the previous Q data. As such, data input to the device as I0, Q0, I1, Q1, I2, Q2, I3, Q3 . . . In, Qn is paired as follows: (I1/Q0), (I2/Q1), (I3/Q2) … (In + 1/Qn). 0: Default. No gain scaling is applied to the NCO input to the internal digital modulator. 1: Gain scaling of 0.5 is applied to the NCO input to the modulator. This can eliminate saturation of the modulator output for some combinations of data inputs and NCO signals. Rev. 0 | Page 26 of 64 AD9785/AD9787/AD9788 The data synchronization control register (DSCR) comprises two bytes located at Address 0x02. Table 12. Data Synchronization Control Register (DSCR) Address 0x02 Bit [15:11] Name DATACLK Delay [4:0] [10:7] Data Timing Margin [3:0] [6] LVDS data clock enable [5] DATACLK invert [4] DATACLK delay enable [3] Data timing mode [2] [1] Set low Data sync polarity [0] Reserved Description Controls the amount of delay applied to the output data clock signal. The minimum delay corresponds to the 00000 state, and the maximum delay corresponds to the 11111 state. The minimum delay is 0.7 ns and the maximum delay is 6.5 ns. The incremental delay is 190 ps and corresponds to an incremental change in the data clock delay bits. The data timing margin bits control the amount of delay applied to the data and clock signals used for checking setup and hold times, respectively, on the input data ports, with respect to the internal data assembler clock. The minimum delay corresponds to the 0000 state, and the maximum delay corresponds to the 1111 state. The delays are 190 ps. 0: Default. When the LVDS data clock enable bit is cleared, the SYNC_O+ and SYNC_O− LVDS pad cells are driven by the multichip synchronization logic. 1: When the LVDS data clock enable bit is set, the SYNC_O+ and SYNC_O− LVDS pad cells are driven by the signal that drives the CMOS DATACLK output pad. 0: Default. When the data clock invert bit is cleared, the DATACLK signal is in phase with the clock that samples the data into the part. 1: When the DATACLK invert bit is set, the DATACLK signal is inverted from the clock that samples the data into the part. 0: Default. When the DATACLK delay enable bit is cleared, the data port input synchronization function is effectively inactive and the delay is bypassed. 1: When the DATACLK delay enable bit is set, the data port input synchronization function is active and controlled by the data delay mode bits. The data output clock is routed through the delay cell. Determines the timing optimization mode. See the Optimizing the Data Input Timing section for details. 0: Manual timing optimization mode 1: Automatic timing optimization mode This bit should always be set low. 0: Default. The digital input data sampling edge is aligned with the falling edge of DCI. 1: The digital input data sampling edge is aligned with the rising edge of DCI. Used only in slave mode (see the MSCR register, Address 0x03, Bit 16). Reserved for future use. Rev. 0 | Page 27 of 64 AD9785/AD9787/AD9788 The multichip synchronization register (MSCR) comprises four bytes located at Address 0x03. Table 13. Multichip Synchronization Register (MSCR) Address 0x03 Bit [31:27] Name Correlate Threshold [4:0] [26] SYNC_I enable [25] SYNC_O enable [24] [23:19] Set low SYNC_I Delay [4:0] [18] Sync error check mode [17] [16] Set low DATACLK input [15:11] SYNC_O Delay [4:0] [10] [9] Set high SYNC_O polarity [8] Sync loopback enable [7:4] Clock State [3:0] [3:0] Sync Timing Margin [3:0] Description Sets the threshold for determining if the received synchronization data can be demodulated accurately. A smaller threshold value makes the demodulator more noise immune; however, the system becomes more susceptible to false locks (or demodulation errors). 0: Default. The synchronization receive logic is disabled. 1: The synchronization receive logic is enabled. 0: Default. The output synchronization pulse generation logic is disabled. 1: The output synchronization pulse generation logic is enabled. This bit should always be set low. These bits are the input synchronization pulse delay word. These bits are don’t care if the synchronization driver enable bit is cleared. Specifies the synchronization pulse error check mode. 0: Manual error check 1: Automatic continuous error check This bit should always be set low. 0: Default. Slave mode is disabled. 1: Slave mode is enabled. Pin 37 functions as an input for the DATACLK signal, called DCI (DATACLK input) in this mode. Depending on the state of Bit 1 in the DSCR register (Address 0x02), the sampling edge (where the data is latched into the AD9785/AD9787/AD9788) can be programmed to be aligned with either the rising or falling edge of DCI. This mode can only be used with 4× or 8× interpolation. These bits are the output synchronization pulse delay word. These bits control the DAC sample rate clock to output the delay time of the synchronization pulse. These bits are don’t care if the synchronization driver enable bit is cleared. This bit should always be set high. 0: Default. SYNC_O changes state on the rising edge of DACCLK. 1: SYNC_O is generated on the falling edge of DACCLK. 0: Default. The AD9785/AD9787/AD9788 are not operating in internal loopback mode. 1: If the SYNC_O enable and Sync loopback enable bits are set, the AD9785/AD9787/AD9788 are operating in a mode in which the internal synchronization pulse of the device is used at the multichip receiver logic and the SYNC_I+ and SYNC_I− input pins are ignored. For proper operation of the loopback synchronization mode, the synchronization driver enable and sync enable bits must be set. This value determines the state of the internal clock generation state machine upon synchronization. These bits are the synchronization window delay word. These bits are don’t care if the synchronization driver enable bit is cleared. Rev. 0 | Page 28 of 64 AD9785/AD9787/AD9788 The PLL control (PLLCTL) register comprises three bytes located at Address 0x04. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 14. PLL Control (PLLCTL) Register Address 0x04 Bit [23:21] [15] Name VCO Control Voltage [2:0] PLL Loop Bandwidth [4:0] PLL enable [14:13] PLL VCO Divisor [1:0] [12:11] PLL Loop Divisor [1:0] [10:8] [7:2] [1:0] PLL Bias [2:0] PLL Band Select [5:0] PLL VCO Drive [1:0] [20:16] Description 000 to 111, proportional to voltage at VCO, control voltage input (readback only). A value of 011 indicates that the VCO control voltage is centered. These bits control the bandwidth of the PLL filter. Increasing the value lowers the loop bandwidth. Set to 01111 for optimal performance. 0: Default. With PLL off, the DAC sample clock is sourced directly by the REFCLK input. 1: With PLL on, the DAC clock is synthesized internally from the REFCLK input via the PLL clock multiplier. See the Clock Multiplication section for details. Sets the value of the VCO output divider, which determines the ratio of the VCO output frequency to the DAC sample clock frequency, fVCO/fDACCLK. 00: fVCO/fDACCLK = 1 01: fVCO/fDACCLK = 2 10: fVCO/fDACCLK = 4 11: fVCO/fDACCLK = 8 Sets the value of the DACCLK divider, which determines the ratio of the DAC sample clock frequency to the REFCLK frequency, fDACCLK/fREFCLK. 00: fDACCLK/fREFCLK = 2 01: fDACCLK/fREFCLK = 4 10: fDACCLK/fREFCLK = 8 11: fDACCLK/fREFCLK = 16 These bits control the VCO bias current. Set to 011 for optimal performance. These bits set the operating frequency of the VCO. For further details, refer to Table 35. These bits control the signal strength of the VCO output. Set to 11 for optimal performance. The I DAC control register comprises two bytes located at Address 0x05. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 15. I DAC Control Register Address 0x05 Bit [15] Name I DAC sleep [14] I DAC power-down [13:10] [9:0] Reserved I DAC gain adjustment Description 0: Default. If the I DAC sleep bit is cleared, the I DAC is active. 1: If the I DAC sleep bit is set, the I DAC is inactive and enters a low power state. 0: Default. If the I DAC power-down bit is cleared, the I DAC is active. 1: If the I DAC power-down bit is set, the I DAC is inactive and enters a low power state. Reserved for future use. These bits are the I DAC gain adjustment bits. Rev. 0 | Page 29 of 64 AD9785/AD9787/AD9788 The Auxiliary DAC 1 control register comprises two bytes located at Address 0x06. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 16. Auxiliary DAC 1 Control Register Address 0x06 Bit [15] Name Auxiliary DAC 1 sign [14] Auxiliary DAC 1 current direction [13] Auxiliary DAC 1 power-down [12:10] [9:0] Reserved Auxiliary DAC 1 data Description 0: Default. If the Auxiliary DAC 1 sign bit is cleared, the Aux DAC 1 sign is positive. Pin 90 is the active pin. 1: If the Auxiliary DAC 1 sign bit is set, the Aux DAC 1 sign is negative. Pin 89 is the active pin. 0: Default. If the Auxiliary DAC 1 current direction bit is cleared, the Aux DAC 1 sources current. 1: If the Auxiliary DAC 1 current direction bit is set, the Aux DAC 1 sinks current. 0: Default. If the Auxiliary DAC 1 power-down bit is cleared, the Aux DAC 1 is active. 1: If the Auxiliary DAC 1 power-down bit is set, the Aux DAC 1 is inactive and enters a low power state. Reserved for future use. These bits are the Auxiliary DAC 1 gain adjustment bits. The Q DAC control register comprises two bytes located at Address 0x07. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 17. Q DAC Control Register Address 0x07 Bit [15] Name Q DAC sleep [14] Q DAC power-down [13:10] [9:0] Reserved Q DAC gain adjustment Description 0: Default. If the Q DAC sleep bit is cleared, the Q DAC is active. 1: If the Q DAC sleep bit is set, the Q DAC is inactive and enters a low power state. 0: Default. If the Q DAC power-down bit is cleared, the Q DAC is active. 1: If the Q DAC power-down bit is set, the Q DAC is inactive and enters a low power state. Reserved for future use. These bits are the Q DAC gain adjustment bits. The Auxiliary DAC 2 control register comprises two bytes located at Address 0x08. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 18. Auxiliary DAC 2 Control Register Address 0x08 Bit [15] Name Auxiliary DAC 2 sign [14] Auxiliary DAC 2 current direction [13] Auxiliary DAC 2 power-down [12:10] [9:0] Reserved Auxiliary DAC 2 data Description 0: Default. If the Auxiliary DAC 2 sign bit is cleared, the Aux DAC 2 sign is positive. Pin 86 is the active pin. 1: If the Auxiliary DAC 2 sign bit is set, the Aux DAC 2 sign is negative. Pin 87 is the active pin. 0: Default. If the Auxiliary DAC 2 current direction bit is cleared, the Aux DAC 2 sources current. 1: If the Auxiliary DAC 2 current direction bit is set, the Aux DAC 2 sinks current. 0: Default. If the Auxiliary DAC 2 power-down bit is cleared, the Aux DAC 2 is active. 1: If the Auxiliary DAC 2 power-down bit is set, the Aux DAC 2 is inactive and enters a low power state. Reserved for future use. These bits are the Auxiliary DAC 2 gain adjustment bits. Rev. 0 | Page 30 of 64 AD9785/AD9787/AD9788 The interrupt control register comprises two bytes located at Address 0x09. Bits [11:10] and Bits [7:3] are read-only bits that indicate the current status of a specific event that may cause an interrupt request (IRQ pin active low). These bits are controlled via the digital logic and are read only via the serial port. Bits [1:0] are the IRQ mask (or enable) bits, which are writable by the user and can also be read back. Table 19. Interrupt Control Register Address 0x09 Bit [15:13] [12] Name Reserved Clear lock indicator [11] Sync lock lost status [10] Sync lock status [9:8] [7] Reserved Data timing error IRQ [6] Sync timing error IRQ [5] Data timing error type [4] Sync timing error type [3] PLL lock indicator [2] [1] Reserved Data port IRQ enable [0] Sync port IRQ enable Description Reserved for future use. Writing a 1 to this bit clears the sync lock lost status bit. This bit does not automatically reset itself to 0 when the reset is complete. When high, this bit indicates that the device has lost synchronization. This bit is latched and does not reset automatically after the device regains synchronization. To reset this bit to 0, a 1 must be written to the clear lock indicator bit. When this bit is low, the device is not synchronized. When this bit is high, the device is synchronized. Reserved for future use. 0: Default. No setup or hold time error has been detected via the input data port setup/hold error checking logic. 1: A setup or hold time error has been detected via the input data port setup/hold error checking logic. 0: Default. No setup or hold time error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. 1: A setup or hold time error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. 0: Default. A hold error has been detected via the input data port setup/hold error checking logic. This bit is valid only if the data timing error IRQ bit (Bit 7) is set. 1: A setup error has been detected via the input data port setup/hold error checking logic. This bit is valid only if the data timing error IRQ bit (Bit 7) bit is set. 0: Default. A hold error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. This bit is valid only if the sync timing error IRQ bit (Bit 6) is set. 1: A setup error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. This bit is valid only if the sync timing error IRQ bit (Bit 6) is set. 0: Default. The PLL clock multiplier is not locked to the input reference clock. 1: The PLL clock multiplier is locked to the input reference clock. Reserved for future use. 0: Default. The data IRQ bit (and the IRQ pin) are not enabled (masked) for any errors that may be detected via the input data port setup/hold error checking logic. 1: The data IRQ bit (and the IRQ pin) are enabled and go active if a setup or hold error is detected via the input data port setup/hold error checking logic. 0: Default. The sync IRQ bit (and the IRQ pin) are not enabled (masked) for any errors that may be detected via the multichip synchronization receive pulse setup/hold error checking logic. 1: The sync IRQ bit (and the IRQ pin) are enabled and go active if a setup or hold error is detected via the multichip synchronization receive pulse setup/hold error checking logic. Rev. 0 | Page 31 of 64 AD9785/AD9787/AD9788 The frequency tuning word (FTW) register comprises four bytes located at Address 0x0A. Table 20. Frequency Tuning Word (FTW) Register Address 0x0A Bit [31:0] Name Frequency Tuning Word [31:0] Description These bits make up the frequency tuning word applied to the NCO phase accumulator. See the Numerically Controlled Oscillator section for details. The phase control register (PCR) comprises four bytes located at Address 0x0B. Table 21. Phase Control Register (PCR) Address 0x0B Bit [31:26] [25:16] [15:0] Name Reserved Phase Correction Word [9:0] NCO Phase Offset Word [15:0] Description Reserved for future use. These bits are the 10-bit phase correction word. These bits are the 16-bit NCO phase offset word. See the Numerically Controlled Oscillator section for details. The amplitude scale factor (ASF) register comprises three bytes located at Address 0x0C. Table 22. Amplitude Scale Factor (ASF) Register Address 0x0C Bit [23:18] [17:9] [8:0] Name Reserved Q DAC Amplitude Scale Factor [8:0] I DAC Amplitude Scale Factor [8:0] Description Reserved for future use. These bits are the 9-bit Q DAC amplitude scale factor. The bit weighting is MSB = 21, LSB = 2−7, which yields a multiplier range of 0 to 3.9921875. These bits are the 9-bit I DAC amplitude scale factor. The bit weighting is MSB = 21, LSB = 2−7, which yields a multiplier range of 0 to 3.9921875. The output offset (OOF) register comprises four bytes located at Address 0x0D. Table 23. Output Offset (OOF) Register Address 0x0D Bit [31:16] [15:0] Name Q DAC Offset [15:0] I DAC Offset [15:0] Description These bits are the 16-bit Q DAC offset factor. The LSB bit weight is 20. These bits are the 16-bit I DAC offset factor. The LSB bit weight is 20. The version register (VR) comprises two bytes located at Address 0x0E and is read only. Table 24. Version Register (VR) Address 0x0E Bit [15:8] [7:0] Name Reserved Version ID Description Reserved for future use. These bits read back the current version of the product. Rev. 0 | Page 32 of 64 AD9785/AD9787/AD9788 INPUT DATA PORTS The AD9785/AD9787/AD9788 can operate in two data input modes: dual-port mode and single-port mode. In the default dual-port mode (single-port mode = 0), each DAC receives data from a dedicated input port. In single-port mode (single-port mode = 1), both DACs receive data from Port 1. In single-port mode, DAC 1 and DAC 2 data is interleaved and the TXENABLE input is used to steer data to the intended DAC. In dual-port mode, the TXENABLE input is used to power down the digital datapath. In dual-port mode, the data must be delivered at the input data rate. In single-port mode, data must be delivered at twice the input data rate of each DAC. Because the data inputs function up to a maximum of 300 MSPS, it is only practical to operate with input data rates up to 150 MHz per DAC in single-port mode. In both dual-port and single-port modes, a data clock output (DATACLK) signal is available as a fixed-time base with which to drive data from an FPGA (field programmable gate array) or from another data source. This output signal operates at the input data rate. The DATACLK pin can operate as either an input or an output. SINGLE-PORT MODE In single-port mode, data for both DACs is received on the Port 1 input bus (P1D[15:0]). I and Q data samples are interleaved and are latched on the rising edges of DATACLK. Accompanying the data is the TXENABLE (Pin 39) input signal, which steers incoming data to its respective DAC. When TXENABLE is high, the corresponding data-word is sent to the I DAC and, when TXENABLE is low, the corresponding data is sent to the Q DAC. The timing of the digital interface in interleaved mode is shown in Figure 48. The Q first bit (Register 0x01, Bit 1) controls the pairing order of the input data. With the Q first bit set to the default of 0, the I/Q pairing sent to the DACs is the two input datawords corresponding to TXENABLE low followed by TXENABLE high. With the Q first bit set to 1, the I/Q pairing sent to the DACs is the two input data-words corresponding to TXENABLE high followed by TXENABLE low. Note that with Q first set, the I data still corresponds to the TXENABLE high word and the Q data corresponds to the TXENABLE low word and only the pairing order changes. DUAL-PORT MODE In dual-port mode, data for each DAC is received on the respective input bus (P1D[15:0] or P2D[15:0]). I and Q data arrive simultaneously and are sampled on the rising edge of an internal sampling clock (SMP_CLK) that is synchronous with DATACLK. INPUT DATA REFERENCED TO DATACLK The simplest method of interfacing to the AD9785/AD9787/ AD9788 is when the input data is referenced to the DATACLK output. The DATACLK output is phase-locked (with some offset) to the internal clock that is used to latch the input data. Therefore, if the setup and hold times of the input data with respect to DATACLK are met, the interface timing latches in the data correctly. Table 25 shows the setup and hold time requirements for the input data over the operating temperature range of the device. Table 25 also shows the data valid window (DVW). The data valid window is the sum of the setup and hold times of the interface. This is the minimum amount of time valid data must be presented to the device in order to ensure proper sampling. Rev. 0 | Page 33 of 64 AD9785/AD9787/AD9788 DATACLK tSDATACLK 07098-112 tHDATACLK INPUT DATA Figure 47. DATACLK Timing DATACLK P1D[15:0] P1D(1) P1D(2) P1D(3) P1D(4) P1D(5) P1D(6) P1D(7) P1D(8) TXENABLE SMP_CLK P1D_SMP[15:0] P1D(1) P1D(2) P1D(3) P1D(4) P1D(5) P1D(6) P1D(7) P1D(8) QFIRST = 0 QFIRST = 1 I DAC[15:0] P1D(1) P1D(3) P1D(5) Q DAC[15:0] P1D(2) P1D(4) P1D(6) I DAC[15:0] P1D(1) Q DAC[15:0] P1D(3) P1D(5) P1D(4) P1D(6) 07098-110 IQSEL_SMP Figure 48. Single-Port (Interleaved) Mode Digital Interface Timing Table 25. Data Timing Specifications vs. Temperature Timing Parameter Data with respect to REFCLK Data with respect to DATACLK SYNC_I with respect to REFCLK Temperature −40°C +25°C +85°C −40°C to +85°C −40°C +25°C +85°C −40°C to +85°C −40°C +25°C +85°C −40°C to +85°C Min tS (ns) −0.25 −0.45 −0.6 −0.25 3.7 4.2 4.6 4.6 0.45 0.3 0.2 0.45 Rev. 0 | Page 34 of 64 Min tH (ns) 1.7 2.1 2.4 2.4 −1.5 −1.8 −2.0 −1.5 −0.1 0.1 0.25 0.25 Min DVW (ns) 1.45 1.65 1.8 2.15 2.2 2.4 2.6 3.1 0.35 0.4 0.45 0.7 AD9785/AD9787/AD9788 Setting the Frequency of DATACLK INPUT DATA REFERENCED TO REFCLK The DATACLK signal is derived from the internal DAC sample clock, DACCLK. The frequency of DATACLK output depends on several programmable settings. The relationship between the frequency of DACCLK and DATACLK is In some systems, it may be more convenient to use the REFCLK input instead of the DATACLK output as the input data timing reference. If the frequency of DACCLK is equal to the frequency of the data input (PLL is bypassed and no interpolation is used), the timing parameter “Data with respect to REFCLK” shown in Table 25 applies directly without further considerations. If the frequency of DACCLK is greater than the frequency of the data input, a divider is used to generate the internal data sampling clock (DCLK_SMP). This divider creates a phase ambiguity between REFCLK and DCLK_SMP, which, in turn, causes a sampling time uncertainty. To establish fixed setup and hold times for the data interface, this phase ambiguity must be eliminated. f DATACLK = f DACCLK IF × P where the variables have the values shown in Table 26. Table 26. DACCLK to DATACLK Divisor Values Value Interpolation factor 0.5 (if single port is enabled) 1 (if dual port is selected) Address Register Bits 0x01 [7:6] 0x01 [4] To eliminate the phase ambiguity, the SYNC_I input pins (Pin 13 and Pin 14) must be used to synchronize the data to a specific DCLK_SMP phase. The specific steps for accomplishing this are detailed in the Device Synchronization section. The timing relationships between SYNC_I, DACCLK, REFCLK, and the input data are shown in Figure 49 through Figure 51. SYNC_I tH_SYNC tS_SYNC DACCLK REFCLK tHREFCLK 07098-113 tSREFCLK INPUT DATA Figure 49. REFCLK 2× SYNC_I tH_SYNC tS_SYNC DACCLK REFCLK tSREFCLK tHREFCLK 07098-114 Variable IF P INPUT DATA Figure 50. REFCLK 4× Rev. 0 | Page 35 of 64 AD9785/AD9787/AD9788 SYNC_I tH_SYNC tS_SYNC DACCLK REFCLK tSREFCLK 07098-111 tHREFCLK INPUT DATA Figure 51. REFCLK 8× OPTIMIZING THE DATA INPUT TIMING The AD9785/AD9787/AD9788 have on-chip circuitry that enables the user to optimize the input data timing by adjusting the relationship between the DATACLK output and DCLK_SMP, the internal clock that samples the input data. This optimization is made by a sequence of SPI register read and write operations. The timing optimization can be done under strict control of the user, or the device can be programmed to maintain a configurable timing margin automatically. Figure 52 shows the circuitry that detects sample timing errors and adjusts the data interface timing. The DCLK_SMP signal is the internal clock used to latch the input data. Ultimately, it is the rising edge of this signal that must be centered in the valid sampling period of the input data. This is accomplished by adjusting the time delay, tD, which changes the DATACLK timing and, as a result, the arrival time of the input data with respect to DCLK_SMP. ΔtM DATA TIMING MARGIN[3:0] D PD1[0] D Δ tM In addition to setting the data timing error IRQ, the data timing error type bit (Register 0x09, Bit 5) is set when an error occurs. The data timing error bit is set low to indicate a hold error and high to indicate a setup error. Figure 53 shows a timing diagram of the data interface and the status of the data timing error type bit. DATA TIMING ERROR = 0 TIMING ERROR IRQ Q CLK The Data Timing Margin [3:0] variable (Register 0x02, Bits [10:7]) determines the amount of time before and after the actual data sampling point the margin test data are latched. That is, the Data Timing Margin [3:0] variable determines how much setup and hold margin the interface needs for the data timing error IRQ to remain inactive (to show error-free operation). Therefore, the data timing error IRQ is set whenever the setup and hold margins drop below the Data Timing Margin [3:0] value. This does not necessarily indicate that the data latched into the device is incorrect. TIMING ERROR DETECTION TIMING ERROR TYPE DATA TIMING ERROR = 1, DATA TIMING ERROR TYPE = 1 Q CLK DATA DATACLK DELAY[4:0] Δ tM DELAYED DATA SAMPLING Figure 52. Timing Error Detection and Optimization Circuitry The error detection circuitry works by creating two sets of sampled data (referred to as the margin test data) in addition to the actual sampled data used in the device datapath. One set of sampled data is latched before the actual data sampling point. The other set of sampled data is latched after the actual data sampling point. If the margin test data matches the actual data, the sampling is considered valid and no error is declared. If there is a mismatch between the actual data and the margin test data, an error is declared. Δ tM ACTUAL SAMPLING INSTANT DATA TIMING ERROR = 1, DATA TIMING ERROR TYPE = 0 DELAYED CLOCK SAMPLING 07098-062 ΔtD DATACLK 07098-061 DCLK_SMP Figure 53. Timing Diagram of Margin Test Data Automatic Timing Optimization Mode When the automatic timing optimization mode is enabled (Register 0x02, Bit 3 = 1), the device continuously monitors the timing error IRQ and timing error type bits. The DATACLK Delay [4:0] value (Register 0x02, Bits [4:0]) increases if a setup error is detected and decreases if a hold error is detected. The value of the DATACLK Delay [4:0] setting currently in use can be read back by the user. Rev. 0 | Page 36 of 64 AD9785/AD9787/AD9788 Manual Timing Optimization Mode When the device is operating in manual timing optimization mode (Register 0x02, Bit 3 = 0), the device does not alter the DATACLK Delay [4:0] value that is programmed by the user. By default, the DATACLK delay enable is inactive. This bit must be set high for the DATACLK Delay [4:0] value to be realized. The delay (in absolute time) when programming the DATACLK delay from 00000 to 11111 varies from about 700 ps to about 6.5 ns. Typical delays per increment over temperature are shown in Table 27. Table 27. Data Delay Line Typical Delays over Temperature Delay Zero code delay (delay upon enabling delay line) Average unit delay −40°C 630 +25°C 700 +85°C 740 Unit ps 175 190 210 ps In manual mode, the error checking logic is activated and generates an interrupt if a setup/hold violation is detected. One error check operation is performed per device configuration. Any change to the Data Timing Margin [3:0] or DATACLK Delay [4:0] values triggers a new error check operation. The data can be written to the RAM in either LSB first or MSB first format. To write to the RAM in MSB first format, complete the following steps: 1. 2. After the instruction byte (a write to Register 0x1D) is received, the device automatically generates the addresses required to write the RAM, starting at the most significant address. The 32 rising SCLK edges following the instruction byte write the first RAM word. At this time, the internal address generator decrements and the next 32 rising edges of SCLK write the second RAM word. This cycle of decrementing the RAM address and writing 32-bit words continues until the last word is written. After the 64th word is written, the communication cycle is complete. To write to the RAM in LSB first format, complete the following steps: 1. 2. INPUT DATA RAM The AD9785/AD9787/AD9788 feature on-chip RAM that can be used as an alternative input data source to the input data pins. The input data RAM is loaded through the SPI port. After the input data is stored in memory, the device can be configured to transmit the stored data instead of receiving data through the input data pins. This can be a useful test mode for factory or in-system testing. The RAM is 64 words long and 32 bits wide. The 16 MSBs drive the I datapath, and the 16 LSBs drive the Q datapath. The RAM configuration is shown in Figure 54. 64 WORDS To begin using the RAM as an internal data generator, set Register 0x1E (test register) to a value of 0x0C0. After these 24 bits are written, the DAC starts to output the waveform stored in memory. Q-SIDE 16 BITS 32 BITS 07098-060 0x1D 16 BITS Set Bit 6 of Register 0x00 to 1. Apply an instruction byte of 0xEE followed by the data to be stored. All memory elements must be accessed to complete a communication cycle. Note that the RAM is not a dual-port memory element; therefore, if an I/O operation is begun while the RAM is being used to drive data into the signal processing path, the I/O operation has priority. RAM I-SIDE Set Bit 6 of Register 0x00 to 0. Apply an instruction byte of 0xEE followed by the data to be stored. Figure 54. Input Data RAM Configuration Rev. 0 | Page 37 of 64 AD9785/AD9787/AD9788 DIGITAL DATAPATH 10 The AD9785/AD9787/AD9788 digital datapath consists of three 2× half-band interpolation filters, a quadrature modulator, and an inverse sinc filter. A 32-bit NCO provides the sine and cosine carrier signals required for the quadrature modulator. 0 –10 ATTENUATION (dB) –20 INTERPOLATION FILTERS The AD9785/AD9787/AD9788 contain three half-band filters that can be bypassed. This allows the device to operate with 2×, 4×, or 8× interpolation rates, or without interpolation. The interpolation filters have a linear phase response. The coefficients of the low-pass filters are given in Table 28, Table 29, and Table 30. Spectral plots for the filter responses are shown in Figure 55, Figure 56, and Figure 57. –60 –3 –2 –1 0 1 2 3 4 fOUT (× Input Data Rate) 07098-011 –90 –100 –4 Figure 56. 4× Interpolation, Low-Pass Response to ±4× Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off) 10 0 –10 –20 0 –10 –30 –40 –50 –60 –70 –20 –80 –30 –90 –40 –100 –4 –50 –3 –2 –1 0 1 fOUT (× Input Data Rate) –60 2 3 4 07098-012 ATTENUATION (dB) –50 –80 10 Figure 57. 8× Interpolation, Low-Pass Response to ±4× Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off) –70 –80 –3 –2 –1 0 1 fOUT (× Input Data Rate) 2 3 4 07098-010 –90 –100 –4 –40 –70 ATTENUATION (dB) In 2×, 4×, or 8× interpolation mode, the usable bandwidth of the interpolation filter is 80% of the complex input data rate. The usable bandwidth has a pass-band ripple of less than 0.0005 dB and a stop-band attenuation of greater than 85 dB. The center frequency of the interpolation filter is set by the NCO frequency tuning word (Register 0x0A, Bits [31:0]), so baseband input signals are always centered in the interpolation filter pass band. –30 Figure 55. 2× Interpolation, Low-Pass Response to ±4× Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off) Rev. 0 | Page 38 of 64 AD9785/AD9787/AD9788 Table 28. Half-Band Filter 1 Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) H(16) H(17) H(18) H(19) H(20) H(21) H(22) H(23) H(24) H(25) H(26) H(27) H(28) Upper Coefficient H(55) H(54) H(53) H(52) H(51) H(50) H(49) H(48) H(47) H(46) H(45) H(44) H(43) H(42) H(41) H(40) H(39) H(38) H(37) H(36) H(35) H(34) H(33) H(32) H(31) H(30) H(29) Table 29. Half-Band Filter 2 Integer Value −4 0 +13 0 −34 0 +72 0 −138 0 +245 0 −408 0 +650 0 −1003 0 +1521 0 −2315 0 +3671 0 −6642 0 +20,755 +32,768 Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) Upper Coefficient H(23) H(22) H(21) H(20) H(19) H(18) H(17) H(16) H(15) H(14) H(13) Integer Value −2 0 +17 0 −75 0 +238 0 −660 0 +2530 +4096 Table 30. Half-Band Filter 3 Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) Rev. 0 | Page 39 of 64 Upper Coefficient H(15) H(14) H(13) H(12) H(11) H(10) H(9) Integer Value −39 0 +273 0 −1102 0 +4964 +8192 AD9785/AD9787/AD9788 results in an output signal that is offset by a constant angle relative to the nominal signal. This allows the user to phase align the NCO output with some external signal, if necessary. This can be especially useful when NCOs of multiple AD9785/ AD9787/AD9788 devices are programmed for synchronization. The phase offset allows for the adjustment of the output timing between the devices. The static phase adjustment is sourced from the NCO Phase Offset Word [15:0] value located in Register 0x0B. QUADRATURE MODULATOR The quadrature modulator is used to mix the carrier signal generated by the NCO with the upsampled I and Q data provided by the user at the 16-bit parallel input port of the device. Figure 58 shows a detailed block diagram of the quadrature modulator. The NCO provides a quadrature carrier signal with a frequency determined by the 32-bit frequency tuning word (FTW) set in Register 0x0A, Bits [31:0]. The NCO operates at the rate equal to the upsampled I data and Q data. The generated carrier signal is mixed via multipliers with the I data and Q data. The quadrature products are then summed. By default, when an SPI write is completed for the frequency tuning word, phase control, DAC gain scaling, or DAC offset registers (Register 0x0A through Register 0x0D), the operation of the AD9785/AD9787/AD9788 is immediately updated to reflect these changes. However, in many applications it may be more useful to update these registers without changing the device operation until all these functions can be updated at once. With the automatic I/O transfer enable bit set low in the COMM register (Register 0x00, Bit 1), the value of all these functions is stored in a buffer after the initial SPI write. To update all these functions simultaneously, Bit 2 of the COMM register should be set. This bit is self-resetting and thus does not require another reset in a later SPI write. Note that the sine output of the NCO contains a mux that allows negating of the data. The mux is controlled with a spectral inversion bit that the user stores in an I/O register (Register 0x01, Bit 10). The default condition is to select negated sine data. NUMERICALLY CONTROLLED OSCILLATOR The NCO generates a complex carrier signal to translate the input signal to a new center frequency. A complex carrier signal is a pair of sinusoidal waveforms of the same frequency, offset 90° from each other. The frequency of the complex carrier signal is set via the Frequency Tuning Word [31:0] value in Register 0x0A. The frequency of the complex carrier signal is calculated as follows: INVERSE SINC FILTER The inverse sinc filter is implemented as a nine-tap FIR filter. It is designed to provide greater than ±0.05 dB pass-band ripple up to a frequency of 0.4 × fDACCLK. To provide the necessary peaking at the upper end of the pass band, the inverse sinc filter has an intrinsic insertion loss of 3.4 dB. The tap coefficients are given in Table 31. If {0 ≤ FTW ≤ 231}, use fCENTER = (FTW) (fDACCLK)/232 If {231 < FTW < 232 − 1}, use fCENTER = fDACCLK × (1 − (FTW/232)) A 16-bit phase offset may be added to the output of the phase accumulator via the serial port. This static phase adjustment I DATA INTERPOLATION COSINE FTW [31:0] NCO NCO PHASE OFFSET WORD [15:0] OUT_I SINE – OUT_Q + –1 SPECTRAL INVERSION 1 INTERPOLATION 07098-107 Q DATA 0 Figure 58. Quadrature Modulator Block Diagram Rev. 0 | Page 40 of 64 AD9785/AD9787/AD9788 Upper Coefficient H(9) H(8) H(7) H(6) – Integer Value +2 −4 +10 −35 +401 IOUTx_P (mA) Lower Coefficient H(1) H(2) H(3) H(4) H(5) The inverse sinc filter is disabled by default. It can be enabled by setting the inverse sinc enable bit (Bit 9) in Register 0x01. 20 0 15 5 10 10 5 15 IOUTx_N (mA) Table 31. Inverse Sinc Filter The gain of the I datapath and the Q datapath can be independently scaled by adjusting the I DAC Amplitude Scale Factor [8:0] or Q DAC Amplitude Scale Factor [8:0] value in Register 0x0C. These values control the input to a digital multiplier. The value of the scale factor ranges from 0 to 3.9921875 and can be calculated as follows: Scale Factor Value = Scale Factor [8 : 0] 128 The digital scale factor can be used to compensate for the attenuation incurred by the digital modulator and the inverse sinc filter, as well as other factors. The dc value of the I datapath and the Q datapath can also be independently controlled. This is accomplished by adjusting the I DAC Offset [15:0] and Q DAC Offset [15:0] values in Register 0x0D. These values are added directly to the datapath values. Care should be taken not to overrange the transmitted values. Figure 59 shows how the DAC offset current varies as a function of the I DAC Offset [15:0] and Q DAC Offset [15:0] values. With the digital inputs fixed at midscale (0x0000, twos complement data format), the figure shows the nominal IOUTx_P and IOUTx_N currents as the DAC offset value is swept from 0 to 65535. Because IOUTx_P and IOUTx_N are complementary current outputs, the sum of IOUTx_P and IOUTx_N is always 20 mA. 0 0x0000 0x4000 0x8000 0xC000 20 0xFFFF DAC OFFSET VALUE 07098-108 DIGITAL AMPLITUDE AND OFFSET CONTROL Figure 59. DAC Output Currents vs. DAC Offset Value The offset currents generated by the DAC offset parameter increase from 0 mA to 10 mA as the offset is swept from 0 to 0x7FFF. The offset currents increase from −10 mA to 0 mA as the offset is swept from 0x8000 to 0xFFFF. DIGITAL PHASE CORRECTION The purpose of the phase correction block is to enable compensation of the phase imbalance of the analog quadrature modulator following the DAC. If the quadrature modulator has a phase imbalance, the unwanted sideband appears with significant energy. Adjusting the phase correction word can optimize image rejection in single sideband radios. Ordinarily the I and Q channels have an angle of precisely 90° between them. The Phase Correction Word [9:0] (Register 0x0B) is used to change the angle between the I and Q channels. When the Phase Correction Word [9:0] is set to 1000000000b, the Q DAC output moves approximately 14° away from the I DAC output, creating an angle of 104° between the channels. When the Phase Correction Word [9:0] is set to 0111111111b, the Q DAC output moves approximately 14° towards the I DAC output, creating an angle of 76° between the channels. Based on these two endpoints, the resolution of the phase compensation register is approximately 28°/1024 or 0.027° per code. Rev. 0 | Page 41 of 64 AD9785/AD9787/AD9788 DEVICE SYNCHRONIZATION System demands may impose two different requirements for synchronization. Some systems require multiple DACs to be synchronized to each other, for example, a system that supports transmit diversity or beamforming, where multiple antennas are used to transmit a correlated signal. In this case, the DAC outputs need to be phase aligned with each other, but there may not be a requirement for the DAC outputs to be aligned with a systemlevel reference clock. In systems with a time division multiplexing transmit chain, one or more DACs may be required to be synchronized with a system-level reference clock. Multiple devices are considered synchronized to each other when the state of the clock generation state machines is identical for all parts and the NCO phase accumulator is identical for all parts. Devices are considered synchronized to a system clock when there is a fixed and known relationship between the clock generation state machine and the NCO phase accumulator of the device to a particular clock edge of the system clock. The AD9785/AD9787/AD9788 support two modes of operation, pulse mode and PN code mode, for synchronizing devices under these two conditions. SYNCHRONIZATION LOGIC OVERVIEW Figure 60 shows a block diagram of the on-chip synchronization receive logic. There are two different modes of operation for the multichip synchronization feature: pulse mode and pseudorandom noise code (PN code) modulation/demodulation mode. The basic function of these two modes is to initialize the internal clock generation state machine and the NCO phase accumulator upon the application of external signals to the device. The receive logic responsible for initializing the clock generation state machine generates a single DACCLK cycle-wide initialization pulse that sets the clock generation state machine logic to a known state. In pulse mode, this pulse is generated at every rising edge of the SYNC_I inputs. In PN code mode, the pulse is generated every time the correct code sequence is received on the SYNC_I inputs. This initialization pulse loads the clock generation state machine with the Clock State [3:0] value (Register 0x03, Bits [7:4]) as its next state. If the initialization pulse from the synchronization logic is generated properly, it is active for one DAC clock cycle, every 32 (or multiple of 32) DAC clock cycles. Because the clock generation state machine has 32 states operating at the DACCLK rate, every initialization pulse received after the first pulse loads the current state (the state to which the state machine is already set), maintaining the proper clock operation of the device. The Clock State [3:0] value is the state to which the clock generation state machine resets upon initialization. By varying this value, the timing of the internal clocks, with respect to the SYNC_I signal, can be adjusted. Every increment of the Clock State [3:0] value advances the internal clocks by one DACCLK period. The NCO phase accumulators can be initialized in pulse mode or PN code mode. In pulse mode, a simultaneous strobe signal must be sent to the TXENABLE pin of all devices that is synchronous to the DATACLK signal. This signal resets the phase accumulator of the NCOs across all devices, effectively synchronizing the NCOs. In PN code mode, the phase information of the master device is sent to the slave devices by the SYNC_I signal. The slave devices decode this phase information and automatically initialize their NCO phase accumulators to match the master device. Rev. 0 | Page 42 of 64 AD9785/AD9787/AD9788 DACCLK CLOCK GENERATION NCO PHASE ACCUMULATOR STATE RESET • • • INTERNAL CLOCKS LD-STATE CLOCK STATE [3:0] NCO RESET GENERATOR TXENABLE (PIN 39) TRANSMIT PATH PULSE MODE ENABLE 0 1 SYNC MODE SELECT EDGE DETECTOR Δt CODE DEMODULATOR SYNC_I DELAY [4:0] SYNC_I ENABLE SYNC ERROR DETECTOR PN CODE MODE ENABLE CORRELATE THRESHOLD [4:0] SYNC TIMING ERROR IRQ 07098-104 SYNC_I (PIN 13, PIN 14) Figure 60. Synchronization Receive Circuitry Block Diagram MATCHED LENGTH TRACES REFCLK TXENABLE OUT SYNC_I SYSTEM CLOCK LOW SKEW CLOCK DRIVER REFCLK TXENABLE PULSE GENERATOR OUT LOW SKEW CLOCK DRIVER MATCHED LENGTH TRACES Figure 61. Multichip Synchronization in Pulse Mode Rev. 0 | Page 43 of 64 07098-102 SYNC_I AD9785/AD9787/AD9788 high logic level pin, the strobe signal should be a low logic level pulse unless the TXENABLE invert bit is set in the SPI. SYNCHRONIZING DEVICES TO A SYSTEM CLOCK The AD9785/AD9787/AD9788 offer a pulse mode synchronization scheme (see Figure 61) to align the DAC outputs of multiple devices within a system to the same DAC clock edge. The pulse mode synchronization scheme is a two-part operation. First, the internal clocks are synchronized by providing either a one-time pulse or periodic signal to the SYNC_I (SYNC_I+/SYNC_I−) inputs. The SYNC_I signal is sampled by the internal DACCLK sample rate clock. For this synchronization scheme, all devices are slave devices, while the system clock generation/distribution chip serves as the master. The external LVDS signal should be connected to the SYNC_I inputs of all the slave devices following the constraints. The DAC clock inputs and the SYNC_I inputs must be matched in length across all devices. It is vital that the SYNC_I signal be distributed between the DACs with low skew. Likewise, the REFCLK signals must be distributed with low skew. Any skew on these signals between the DACs must be accounted for in the timing budget. The SYNC_I signal is sampled at the DACCLK rate, thus the data valid window of the SYNC_I pulse must be presented to all the DACs within the same DACCLK period. The SYNC_I input frequency has the following two constraints: f SYNC _ IN ≤ f DATACLK f SYNC _ IN = f DAC 16 × N where N is an integer. Figure 62 shows the timing of the SYNC_I input with respect to the REFCLK input. Note that although the timing is relative to the REFCLK signal, SYNC_I is sampled at the DACCLK rate. This means that the rising edge of the SYNC_I signal must occur after the hold time of the preceding DACCLK rising edge and not the preceding REFCLK rising edge. Figure 63 shows a timing diagram of the TXENABLE input. When the internal clocks are synchronized, the data sampling clocks between all devices are phase aligned. The next step requires a simultaneous strobe signal to the TXENABLE pin of all devices that is synchronous to the DATACLK signal. This resets the phase accumulator of the NCOs across all devices, effectively synchronizing the NCOs. The strobe signal is sampled by fDATACLK and must meet the same setup and hold times as the input data. Because the TXENABLE pin is an active SYNC_I tH_SYNC tS_SYNC 07098-106 REFCLK DACCLK Figure 62. Timing Diagram of SYNC_I with Respect to REFCLK REFCLK DATACLK tSREFCLK tSDATACLK tHREFCLK tHDATACLK 07098-105 TXENABLE Figure 63. Timing Diagram of TXENABLE vs. DATACLK and REFCLK Rev. 0 | Page 44 of 64 AD9785/AD9787/AD9788 Table 32 shows the register settings required to enable the pulse mode synchronization feature. 6. Table 32. Register Settings for Enabling Pulse Sync Mode Register 0x01 0x03 Bit [13] [12] [11] [26] [25] [10] Parameter PN code sync enable Sync mode select Pulse sync enable SYNC_I enable SYNC_O enable Set high Value 0 0 1 1 0 1 7. SYNCHRONIZING MULTIPLE DEVICES TO EACH OTHER Synchronization Timing Error Detection The synchronization logic has error detection circuitry similar to the input data timing. The Sync Timing Margin [3:0] variable (Register 0x03) determines the setup and hold margin that the synchronization interface needs for the SYNC timing error IRQ to remain inactive (show error-free operation). Thus, the SYNC timing error IRQ is set whenever the setup and hold margins drop below the Sync Timing Margin [3:0] value and does not necessarily indicate that the SYNC_I input was latched incorrectly. When a SYNC timing error IRQ is set, corrective action can restore the timing margin. The device can be configured for manual mode sync error monitoring and error correction. Follow these steps to monitor SYNC_I setup and hold timing margins in manual mode: 2. 3. 4. 5. Set sync error check mode (Register 0x03, Bit 18) = 0 (manual check mode). Set Sync Timing Margin [3:0] (Register 0x03, Bits [3:0]) = 0000 (timing margin to minimum value). Set SYNC_I Delay [4:0] (Register 0x03, Bits [23:19]) = 00000 (SYNC_I delay line to minimum value). Set sync port IRQ enable (Register 0x09, Bit 0) = 1. Write 1 to sync timing error IRQ (Register 0x09, Bit 6) to clear. The AD9785/AD9787/AD9788 synchronization engine uses a PN code synchronization scheme to align multiple devices within a system to the same DAC clock edge. The PN code scheme synchronizes all the internal clocks, as well as the phase accumulator of the NCO for all devices. With this scheme, one device functions as the master, and the remainder of the devices are configured as slaves. The master device generates the PN encoded signal and drives the signal out on the SYNC_O (SYNC_O+/SYNC_O−) output pins. This signal is then sent to the SYNC_I (SYNC_I+/ SYNC_I−) inputs of all the slave devices and to itself. The slave devices receive the code from the master and demodulate the signal to produce a synchronization pulse every time a valid code is received. The encoded signal of every device must be sampled on the same DAC clock edge for the devices to be properly synchronized. Therefore, it is extremely important that the REFCLK signals arrive at all the devices with as little skew between them as possible. In addition, the SYNC_I signals must arrive at all the devices with as little skew as possible. At high DACCLK frequencies, this requires using low skew clock distribution devices to deliver the REFCLK and SYNC_I signals and paying careful attention to printed circuit board signal routing to equalize the trace lengths of these signals. MATCHED LENGTH TRACES REFCLK TXENABLE OUT SYNC_I SYSTEM CLOCK LOW SKEW CLOCK DRIVER REFCLK TXENABLE SYNC_I LOW SKEW CLOCK DRIVER OUT SYNC_O MATCHED LENGTH TRACES 07098-103 1. Read back sync timing error IRQ and sync timing error type (Register 0x09, Bit 4). If sync timing error IRQ is high, a sampling error has occurred, and sync timing error type indicates whether the sampling error is due to a setup time violation or a hold time violation. Adjust the SYNC_I Delay [4:0] value until the sync timing error IRQ is no longer present. Figure 64. Multichip Synchronization in PN Code Mode Rev. 0 | Page 45 of 64 AD9785/AD9787/AD9788 Table 33 lists the register settings required to enable the PN code mode synchronization feature. The Correlate Threshold [4:0] value (Register 0x03, Bits [31:27]) indicates how closely the code of the received SYNC_I signal is to the expected code. A high threshold requires a closer match of the encoded signal to set the sync lock status bit; a lower value reduces the matching requirements to set the sync lock status bit. Table 33. Register Settings for Enabling PN Code Mode Register 0x01 0x03 Bit [13] [12] [11] [31:27] [26] [25] Parameter PN code sync enable Sync mode select Pulse sync enable Correlate Threshold [4:0] SYNC_I enable SYNC_O enable [10] Set high Value 1 1 0 10000 1 0 (slave devices) 1 (master device) 1 To verify that the devices have successfully synchronized, read back the sync lock status bit on all devices (Register 0x09, Bit 10). The sync lock status bit should read back as 1 on all devices. Next, read back the sync lock lost status bit on all devices (Register 0x09, Bit 11). The sync lock lost status bit should read back as 0 on all devices. To clear the sync lock lost status bit, set the clear lock indicator bit to 1, followed by a 0 (Register 0x09, Bit 12). Because the SYNC_O signal generated by the master is spread over many bits, this method of synchronization is very robust. Any individual bits that may become corrupted or somehow misread by the slave device usually have no effect on the synchronization of the device. If the devices do not reliably synchronize, there are several options for correcting the situation. The SYNC_O Delay [4:0] value (Register 0x03, Bits [15:11]) on the master device can be used to adjust the timing in 80 ps steps effective across all devices. In addition, the SYNC_O polarity bit (Register 0x03, Bit 9) on the master device can be set to provide a delay of one half the DACCLK period. The SYNC_I Delay [4:0] bits (Register 0x03, Bits [23:19]) can be used to adjust the timing on a single slave device in 80 ps steps. Increasing the Correlate Threshold [4:0] value makes the part more resistant to false synchronization locks but requires a lower bit error rate on the SYNC_I input to maintain locked status. Decreasing the Correlate Threshold [4:0] value makes the part more susceptible to false synchronization locks, but maintains a locked status in the face of a higher bit error rate on the SYNC_I input (that is, it is more noise resistant). The recommended value for Correlate Threshold [4:0] is the default value of 16. INTERRUPT REQUEST OPERATION The IRQ pin (Pin 71) acts as an alert that the device has experienced a timing error and that it should be queried (by reading Register 0x09) to determine the exact fault condition. The IRQ pin is an open-drain, active low output. The IRQ pin should be pulled high external to the device. This pin may be tied to the IRQ pins of other devices with open-drain outputs to wire-OR these pins together. There are two different error flags that can trigger an interrupt request: a data timing error or a sync timing error. By default, when either or both of these error flags are set, the IRQ pin is active low. Either or both of these error flags can be masked to prevent them from activating an interrupt on the IRQ pin. The error flags are latched and remain active until the flag bits are overwritten. Rev. 0 | Page 46 of 64 AD9785/AD9787/AD9788 DRIVING THE REFCLK INPUT The REFCLK input requires a low jitter differential drive signal. REFCLK is a PMOS input differential pair powered from the 1.8 V supply; therefore, it is important to maintain the specified 400 mV input common-mode voltage. Each input pin can safely swing from 200 mV p-p to 1 V p-p about the 400 mV common-mode voltage. Although these input levels are not directly LVDScompatible, REFCLK can be driven by an offset ac-coupled LVDS signal, as shown in Figure 65. 0.1µF LVDS_P_IN REFCLK+ VCM = 400mV REFCLK– 07098-024 50Ω 0.1µF Direct Clocking Figure 65. LVDS REFCLK Drive Circuit If a clean sine clock is available, it can be transformer-coupled to REFCLK, as shown in Figure 66. Use of a CMOS or TTL clock is also acceptable for lower sample rates. It can be routed through a CMOS-to-LVDS translator, then ac-coupled. TTL OR CMOS CLK INPUT 0.1µF 50Ω The second mode bypasses the clock multiplier circuitry and allows DACCLK to be directly sourced through the REFCLK pins. This mode enables the user to source a very high quality clock directly to the DAC core. Sourcing the DACCLK directly through the REFCLK pins may be necessary in demanding applications that require the lowest possible DAC output noise at higher output frequencies. In either case, using the on-chip clock multiplier or sourcing the DACCLK directly through the REFCLK pins, it is necessary that the REFCLK signal have low jitter to maximize the DAC noise performance. 50Ω LVDS_N_IN on-chip clock multiplier removes the burden of generating and distributing the high speed DACCLK. REFCLK+ When the PLL is disabled (Register 0x04, Bit 15 = 0), the REFCLK input is used directly as the DAC sample clock (DACCLK). The output frequency of the DATACLK output pin is fDATACLK = fDACCLK ÷ IF where IF is the interpolation factor, set in Register 0x01, Bits [7:6]. Clock Multiplication VCM = 400mV When the PLL is enabled (Register 0x04, Bit 15 = 1), the clock multiplication circuit generates the DAC sample clock from the lower rate REFCLK input. The functional diagram of the clock multiplier is shown in Figure 68. 07098-025 REFCLK– 50Ω BAV99ZXCT HIGH SPEED DUAL DIODE Figure 66. TTL or CMOS REFCLK Drive Circuit A simple bias network for generating VCM is shown in Figure 67. It is important to use CVDD18 and CGND for the clock bias circuit. Any noise or other signal that is coupled onto the clock is multiplied by the DAC digital input signal and can degrade DAC performance. The clock multiplication circuit operates such that the VCO outputs a frequency, fVCO, equal to the REFCLK input signal frequency multiplied by N1 × N2. fVCO = fREFCLK × (N1 × N2) The DAC sample clock frequency, fDACCLK, is equal to VCM = 400mV fDACCLK = fREFCLK × N2 The values of N1 and N2 must be chosen to keep fVCO in the optimal operating range of 1.0 GHz to 2.0 GHz. When the VCO output frequency is known, the correct PLL band select value (Register 0x04, Bits [7:2]) can be chosen. CVDD18 1nF 287Ω 0.1µF 1nF CGND 07098-026 1kΩ Figure 67. REFCLK VCM Generator Circuit PLL Bias Settings DAC REFCLK CONFIGURATION The AD9785/AD9787/AD9788 offer two modes of sourcing the DAC sample clock (DACCLK). The first mode employs an on-chip clock multiplier that accepts a reference clock operating at the lower input frequency, most commonly the data input frequency. The on-chip phase-locked loop (PLL) then multiplies the reference clock up to a higher frequency, which can then be used to generate all the internal clocks required by the DAC. The clock multiplier provides a high quality clock that meets the performance requirements of most applications. Using the There are three bias settings for the PLL circuitry that should be programmed to their nominal values. The PLL values shown in Table 34 are the recommended settings for these parameters. Table 34. PLL Settings PLL SPI Control PLL Loop Bandwidth PLL VCO Drive PLL Bias Rev. 0 | Page 47 of 64 Address Register Bit 0x04 [20:16] 0x04 [1:0] 0x04 [10:8] Optimal Setting 01111 11 011 AD9785/AD9787/AD9788 REFCLK (PIN 5 AND PIN 6) PHASE DETECTION 0x04 [23:21] VCO CONTROL VOLTAGE ADC PLL_LOCK (PIN 65) 0x09 [3] LOOP FILTER VCO ÷N2 ÷N1 0x04 [12:11] PLL LOOP DIVISOR 0x04 [14:13] PLL VCO DIVISOR ÷IF DAC INTERPOLATION RATE DATACLK (PIN 37) 0x04 [15] PLL ENABLE DAC CLOCK 07098-027 0x01 [7:6] Figure 68. Clock Multiplication Circuit Table 35. Typical VCO Freq Range vs. PLL Band Select Value PLL Lock Ranges over Temperature, −40°C to +85°C VCO Frequency Range in MHz 1 PLL Band Select fLOW fHIGH 111111 (63) Auto mode Auto mode 111110 (62) 1975 2026 111101 (61) 1956 2008 111100 (60) 1938 1992 111011 (59) 1923 1977 111010 (58) 1902 1961 111001 (57) 1883 1942 111000 (56) 1870 1931 110111 (55) 1848 1915 110110 (54) 1830 1897 110101 (53) 1822 1885 110100 (52) 1794 1869 110011 (51) 1779 1853 110010 (50) 1774 1840 110001 (49) 1748 1825 110000 (48) 1729 1810 101111 (47) 1730 1794 101110 (46) 1699 1780 101101 (45) 1685 1766 101100 (44) 1684 1748 101011 (43) 1651 1729 101010 (42) 1640 1702 101001 (41) 1604 1681 101000 (40) 1596 1658 100111 (39) 1564 1639 100110 (38) 1555 1606 100101 (37) 1521 1600 100100 (36) 1514 1575 100011 (35) 1480 1553 100010 (34) 1475 1529 100001 (33) 1439 1505 100000 (32) 1435 1489 PLL Lock Ranges over Temperature, −40°C to +85°C VCO Frequency Range in MHz 1 PLL Band Select fLOW fHIGH 011111 (31) 1402 1468 011110 (30) 1397 1451 011101 (29) 1361 1427 011100 (28) 1356 1412 011011 (27) 1324 1389 011010 (26) 1317 1375 011001 (25) 1287 1352 011000 (24) 1282 1336 010111 (23) 1250 1313 010110 (22) 1245 1299 010101 (21) 1215 1277 010100 (20) 1210 1264 010011 (19) 1182 1242 010010 (18) 1174 1231 010001 (17) 1149 1210 010000 (16) 1141 1198 001111 (15) 1115 1178 001110 (14) 1109 1166 001101 (13) 1086 1145 001100 (12) 1078 1135 001011 (11) 1055 1106 001010 (10) 1047 1103 001001 (9) 1026 1067 001000 (8) 1019 1072 000111 (7) 998 1049 000110 (6) 991 1041 000101 (5) 976 1026 000100 (4) 963 1011 000011 (3) 950 996 000010 (2) 935 981 000001 (1) 922 966 000000 (0) 911 951 1 The lock ranges in this table are typical values. Actual lock ranges will vary from device to device. Rev. 0 | Page 48 of 64 AD9785/AD9787/AD9788 4. Configuring the PLL Band Select Value The PLL VCO has a valid operating range from approximately 1.0 GHz to 2.0 GHz covered in 63 overlapping frequency bands as shown in Table 35. For any desired VCO output frequency, there are multiple valid PLL band select values. Note that the data shown in Table 35 is for a typical device. Device-to-device variations can shift the actual VCO output frequency range by 30 MHz to 40 MHz. Also, the VCO output frequency varies as a function of temperature. Therefore, it is required that the optimal PLL band select value be determined for each individual device at the particular operating temperature. The device has an automatic PLL band select feature on chip. When enabled, the device determines the optimal PLL band setting for the device at the given temperature. This setting holds for a ±60°C temperature swing in ambient temperature. If the device operates in an environment that experiences a larger temperature swing, an offset should be applied to the automatically selected PLL band. The following procedure outlines a method for setting the PLL band select value for a device operating at a particular temperature that holds for a change in ambient temperature over the total −40°C to +85°C operating range of the device without further user intervention. (Note that REFCLK must be applied to the device during this procedure.) Configuring PLL Band Select with Temperature Sensing The values of N1 (Register 0x04, Bits [14:13]) and N2 (Register 0x04, Bits [12:11]) should be programmed along with the PLL settings shown in Table 34. 1. 2. 3. Set the PLL Band Select [5:0] value (Register 0x04, Bits [7:2]) to 63 to enable PLL auto mode. Wait for the PLL_LOCK pin or the PLL lock indicator (Register 0x09, Bit 3) to go high. This should occur within 5 ms. Read back the 6-bit PLL band select value (Register 0x04, Bits [7:2]). Based on the temperature when the PLL auto mode is enabled, set the PLL band indicated in Table 36 or Table 37 by rewriting the readback values into the PLL Band Select [5:0] parameter (Register 0x04, Bits [7:2]). Table 36. Setting Optimal PLL Band for Lower Range (0 to 31) Bands System Start-Up Temperature −40°C to −10°C −10°C to +15°C 15°C to 55°C 55°C to 85°C Set PLL Band to Readback Band + 2 Readback Band + 1 Readback Band Readback Band − 1 Table 37. Setting Optimal PLL Band for Higher Range (32 to 62) Bands System Start-Up Temperature −40°C to −30°C −30°C to −10°C −10°C to +15°C 15°C to 55°C 55°C to 85°C Set PLL Band to Readback Band + 3 Readback Band + 2 Readback Band + 1 Readback Band Readback Band − 1 Known Temperature Calibration with Memory The procedure in the Configuring PLL Band Select with Temperature Sensing section requires temperature sensing upon start-up or reset of the device to choose the optimal PLL band select value to hold over the entire operating temperature range. If temperature sensing is not available in the system, another option is to use the automatic PLL band select to determine the optimal setting for the device when the device is in a factory environment where the temperature is known. The optimal band can then be stored in nonvolatile memory. Whenever the system is powered up or restarted, the optimal value can be loaded back into the device. Rev. 0 | Page 49 of 64 AD9785/AD9787/AD9788 ANALOG OUTPUTS Full-scale current on the I DAC and Q DAC can be set from 8.66 mA to 31.66 mA. Initially, the 1.2 V band gap reference is used to set up a current in an external resistor connected to I120 (Pin 75). A simplified block diagram of the reference circuitry is shown in Figure 69. AD9788 I DAC GAIN 1.2V BAND GAP REFERENCE 5kΩ I DAC CURRENT SCALING I120 0.1µF Gain scaling of the analog DAC output can be achieved by changing the values in Register 0x05 and Register 0x07. However, if this is done, the output common-mode voltage at the analog output also decreases proportionally. This poses a problem when the AD9785/AD9787/AD9788 are dc-coupled to a quadrature modulator. Typical quadrature modulators have tight restrictions on input common-mode variation. 10kΩ DAC FULL-SCALE REFERENCE CURRENT Q DAC 07098-030 VREF DIGITAL AMPLITUDE SCALING Q DAC GAIN Figure 69. Full-Scale Current Generation Circuitry The recommended value for the external resistor is 10 kΩ, which sets up an IREFERENCE in the resistor of 120 μA, which in turn provides a DAC output full-scale current of 20 mA. Because the gain error is a linear function of this resistor, a high precision resistor improves gain matching to the internal matching specification of the devices. Internal current mirrors provide a current-gain scaling, where DAC gain is a 10-bit word in the SPI port register (Register 0x05 and Register 0x07). The default value for the DAC gain registers gives an IFS of approximately 20 mA, where IFS for either I DAC or Q DAC is equal to 1.2 V ⎛ 27 ⎛ 6 ⎞ ×⎜ +⎜ × DAC gain⎞⎟ ⎟ × 32 R ⎠⎠ ⎝ 12 ⎝ 1024 Auxiliary DAC Operation Two auxiliary DACs are provided on the AD9785/AD9787/ AD9788. The full-scale output current on these DACs is derived from the 1.2 V band gap reference and external resistor. The gain scale from the reference amplifier current, IREFERENCE, to the auxiliary DAC reference current is 16.67 with the auxiliary DAC gain set to full scale (10-bit values, Register 0x06, Bits [9:0] and Register 0x08, Bits [9:0]). This gives a full-scale current of approximately 2 mA for Auxiliary DAC 1 and Auxiliary DAC 2. The auxiliary DAC outputs are not differential. Only one side of the auxiliary DAC (P or N) is active at one time. The inactive side goes into a high impedance state (100 kΩ). In addition, the P or N output can act as a current source or a current sink. Control of the P and N sides for both auxiliary DACs is via Register 0x06 and Register 0x08, Bits [15:14]. When sourcing current, the output compliance voltage is 0 V to 1.6 V. When sinking current, the output compliance voltage is 0.8 V to 1.6 V. 35 30 25 20 15 10 5 0 0 200 400 600 800 DAC GAIN CODE 1000 07098-031 IFS (mA) The AD9785/AD9787/AD9788 use a digital gain scaling block to get around this problem. Because the gain scaling is done in the digital processing of the AD9785/AD9787/AD9788, there is no effect on the output full-scale current. This digital gain scaling is done in such a way that the midscale value of the signal is unaffected; the swing of the signal around midscale is the value that is adjusted with the register settings. Digital gain scaling is done using the amplitude scale factor (ASF) register (Register 0x0C). Figure 70. DAC Full-Scale Current vs. DAC Gain Code Rev. 0 | Page 50 of 64 AD9785/AD9787/AD9788 There are two output signals on each auxiliary DAC. One signal is designated P, the other N. The sign bit in each auxiliary DAC control register (Bit 15) controls whether the P side or the N side of the auxiliary DAC is turned on. Only one side of the auxiliary DAC is active at a time. The auxiliary DAC structure is shown in Figure 71. 0 TO 2mA (SOURCE) The choice of sinking or sourcing should be made at circuit design time. There is no advantage to switching between sourcing and sinking current after the circuit is in place. The auxiliary DACs can be used for local oscillator (LO) cancellation when the DAC output is followed by a quadrature modulator. This LO feedthrough is caused by the input referred dc offset voltage of the quadrature modulator (and the DAC output offset voltage mismatch) and can degrade system performance. Typical DAC-to-quadrature modulator interfaces are shown in Figure 72 and Figure 73. Often, the input common-mode voltage for the modulator is much higher than the output compliance range of the DAC, so that ac coupling or a dc level shift is necessary. If the required common-mode input voltage on the quadrature modulator matches that of the DAC, then the dc blocking capacitors in Figure 72 can be removed. AUX_P VBIAS 0 TO 2mA (SINK) AUX_N 07098-032 P/N SOURCE/ SINK Figure 71. Auxiliary DAC Structure The magnitude of the auxiliary DAC 1 current is controlled by the auxiliary DAC 1 control register (Register 0x06), and the magnitude of the auxiliary DAC 2 current is controlled by the auxiliary DAC 2 control register (Register 0x08). These auxiliary DACs have the ability to source or sink current. This selection is programmable via Bit 14 in either auxiliary DAC control register. A low-pass or band-pass passive filter is recommended when spurious signals from the DAC (distortion and DAC images) at the quadrature modulator inputs can affect system performance. Placing the filter at the location shown in Figure 72 and Figure 73 allows easy design of the filter, as the source and load impedances can easily be designed close to 50 Ω. QUADRATURE MODULATOR V+ AUX DAC1 QUADRATURE MODULATOR V+ 0.1µF OPTIONAL PASSIVE FILTERING I DAC QUAD MOD I INPUTS AUX DAC2 0.1µF 25Ω TO 50Ω 0.1µF OPTIONAL PASSIVE FILTERING Q DAC QUAD MOD Q INPUTS 07098-033 0.1µF 25Ω TO 50Ω Figure 72. Typical Use of Auxiliary DACs AC Coupling to Quadrature Modulator AUX DAC1 OR DAC2 25Ω TO 50Ω OPTIONAL PASSIVE FILTERING QUAD MOD I AND Q INPUTS 25Ω TO 50Ω 07098-115 I OR Q DAC Figure 73. Typical Use of Auxiliary DACs DC Coupling to Quadrature Modulator with DC Shift Rev. 0 | Page 51 of 64 AD9785/AD9787/AD9788 POWER DISSIPATION Figure 74 through Figure 78 detail the power dissipation of the AD9785/AD9787/AD9788 under a variety of operating conditions. All of the graphs are taken with data being supplied to both the I and Q channels. The power consumption of the device does not vary significantly with changes in the modulation mode or analog output frequency. Graphs of the total power dissipation are shown along with the power dissipation of the DVDD18, DVDD33, and CVDD18 supplies. The power dissipation of the AVDD33 supply rail is independent of the digital operating mode and sample rate. The current drawn from the AVDD33 supply rail is typically 51 mA (182 mW) when the full-scale current of the I and Q DACs is set to the nominal value of 20 mA. Changing the full-scale current directly impacts the supply current drawn from the AVDD33 rail. For example, if the full-scale current of the I DAC and the Q DAC is changed to 10 mA each, the AVDD33 supply current drops to 31 mA. 70 1800 1600 60 4× NCO 8× NCO 4× 2× NCO POWER (mW) 1000 2× 800 600 1× NCO 400 1× 50 100 150 200 250 300 fDATA (MSPS) 0 0 50 100 150 200 250 300 fDATA (MSPS) Figure 76. Power Dissipation, Digital 3.3 V Supply, I and Q Data, Dual DAC Mode Figure 74. Power Dissipation, I and Q Data, Dual DAC Mode 120 1400 4× NCO 1200 100 8× NCO 1000 4× POWER (mW) 80 8× 800 2× NCO 600 2× 60 40 400 1× NCO 200 2× NCO 2× 1× NCO 1× 20 1× 0 0 0 50 100 150 200 250 300 fDATA (MSPS) 07098-036 POWER (mW) 8× NCO 8× 4× NCO 4× 2× NCO 2× 1× NCO 1× 10 07098-035 0 30 20 200 0 40 0 50 100 150 200 8× NCO 8× 4× NCO 4× 250 300 fDATA (MSPS) Figure 77. Power Dissipation, Clock 1.8 V Supply, I and Q Data, Dual DAC Mode Figure 75. Power Dissipation, Digital 1.8 V Supply, I and Q Data, Dual DAC Mode Rev. 0 | Page 52 of 64 07098-038 POWER (mW) 50 8× 1200 07098-037 1400 AD9785/AD9787/AD9788 140 120 POWER (mW) 100 80 60 40 0 0 200 400 600 fDAC (MSPS) 800 1000 07098-039 20 Figure 78. Digital 1.8 V Supply, Power Dissipation of Inverse Sinc Filter Rev. 0 | Page 53 of 64 AD9785/AD9787/AD9788 AD9785/AD9787/AD9788 EVALUATION BOARDS The remainder of this data sheet describes the evaluation boards for testing the AD9785, AD9787, and AD9788 devices. The factory default jumper configuration is as follows: • Jumpers JP2, JP3, JP4, and JP8 are unsoldered. OUTPUT CONFIGURATION • Jumpers JP14, JP15, JP16, and JP17 are soldered. Each evaluation board contains an Analog Devices ADL5372 quadrature modulator. The AD9785/AD9787/AD9788 devices and the ADL5372 provide an easy-to-interface DAC/modulator combination that can be easily characterized on the evaluation board. Solderable jumpers can be configured to evaluate the singleended or differential outputs of the AD9785/AD9787/AD9788. To evaluate the ADL5372 on the evaluation board, reverse the jumper positions as follows: • Jumpers JP2, JP3, JP4, and JP8 are soldered. • Jumpers JP14, JP15, JP16, and JP17 are unsoldered. Note that the ADL5372 also requires its own separate 5 V and GND connection on the evaluation board. DIGITAL PICTURE OF EVALUATION BOARD 5V POWER SYNC INPUTS REFCLK INPUT JP4 JP15 S5 GND +5V DIGITAL DATA INPUTS JP8 JP14 ADL5372 OUTPUT S8 AD9788 S9 ADL5372 JP3 JP16 DATACLK OUTPUT ADL5372 LO INPUT JP2 JP17 S6 RESET SPI PORT Figure 79. Evaluation Board Rev. 0 | Page 54 of 64 07098-058 SYNC OUTPUTS AD9785/AD9787/AD9788 EVALUATION BOARD SOFTWARE A GUI .exe file for Microsoft® Windows® is included on the CD that ships with the evaluation board. This file allows the user to easily program all the functions on the AD9785/AD9787/AD9788. Figure 80 shows this user interface. The most important features for configuring the AD9785/AD9787/AD9788 are called out in the figure. I/Q FULL SCALE OUTPUT CURRENT CONTROL I/Q CHANNEL GAIN MATCHING DIGITAL GAIN SCALING I/Q OFFSET CONTROL I/Q PHASE COMPENSATION Figure 80. AD9788 User Interface Rev. 0 | Page 55 of 64 NCO FREQUENCY AND PHASE OFFSET 07098-059 INTERPOLATION AND FILTER MODE SETTINGS Rev. 0 | Page 56 of 64 C20 C76 C77 Figure 81. Evaluation Board, Power Supply and Decoupling 16V 22UF DVDD33_IN C21 TP6 RED 22UF 16V AVDD33_IN TP5 RED 16V 22UF DVDD18_IN 16V 22UF CVDD18_IN ACASE ACASE ACASE RED TP3 ACASE TP20 RED RED TP19 RED TP18 RED TP17 .1UF C45 CC0603 .1UF LC1812 L4 EXC-CL4532U1 C28 CC0603 .1UF LC1812 L3 EXC-CL4532U1 C71 CC0603 .1UF LC1812 L2 EXC-CL4532U1 C68 CC0603 LC1812 L1 .1UF C42 CC0603 .1UF C26 CC0603 .1UF TP9 C70 CC0603 .1UF C69 CC0603 BLK DVDD33 BLK TP8 AVDD33 TP4 BLK DVDD18 BLK TP2 CVDD18 SPI_SDO SPI_SDIO SCLK SPI_CSB R55 10K BLACK TP15 C46 RED TP14 RC080 5 EXC-CL4532U1 GND VDDM_IN ACASE RC080 5 TP1 RED R52 10K 1 2 5 3 1 74AC14 SO14 U6 SO14 U5 74AC14 6 SO14 U5 74AC14 4 CC0402 SO14 U5 74AC14 2 22UF 16V 13 12 9 11 13 CC0402 74AC14 SO14 U6 SO14 U5 74AC14 8 SO14 U5 74AC14 10 SO14 U5 74AC14 12 C67 .1UF LC1812 L12 EXC-CL4532U1 R54 R53 R51 .1UF C66 TP13 RC0805 9K RC0805 9K RC0805 9K GND RED VDDM RED TP16 5 9 11 3 U6 4 10 8 6 P1 TJAK06RAP FCI-68898 CLASS=IO 6 5 4 3 2 1 74AC14 SO14 U6 74AC14 SO14 U6 74AC14 SO14 U6 74AC14 SO14 AD9785/AD9787/AD9788 EVALUATION BOARD SCHEMATICS 07098-044 AD9785/AD9787/AD9788 IOUT_N IOUT-IOUT_P AUX1_P AUX1_N AUX2_P AUX2_N S8 2 R 12 RC 060 3 R3 RC 060 3 RC 060 3 RC 060 3 RC0603 50 0 RC0603 50 0 RC0603 50 0 RC0603 50 0 1 R 15 R 17 S5 2 250 1 R2 250 R4 250 R14 250 R16 R 20 RC 060 3 R 19 0 RC 060 3 DNP JP1 JP5 JP6 JP11 6 4 1 3 T2B ADTL1-12 P TC1-1T T2A IP IN QP QN S 4 6 3 1 1 2 3 6 4 T1B ADTL1-12 P TC1-1T T1A C62 C61 .1UF C59 C60 S C58 6 CC 040 2 1 CC 040 2 2 3 CC 040 2 4 C57 1NF C56 C55 1NF .1UF C31 .1UF C14 1NF .1UF CVDD18 1NF 1NF 1 1 .1UF 2 S15 S12 2 C6 CC 040 2 AVDD33 CC 040 2 CC 040 2 CC 040 2 CC 040 2 CC 040 2 CC 040 2 ACA S E RC 060 3 RC 060 3 50 50 ACASE VAL CR2 59 P2D0 58 P2D1 3 6 4 P 2 D6 TC1-1T 54 52 T4A P2D4 3 P2D3 55 2 P2D2 56 1 57 1 P 2 D7 TC1-1T GN D ;5 P P 2 D5 T3A 10 K T4B P 2 D8 V O LT ACA S E 6 5 P2D5 51 P2D6 P AD P AD Q Q_ 9779 T QF P U1 R 21 5 6 RC 060 3 22 C2 CC 040 2 QOUT_N C38 1NF .1UF C25 .1UF C10 1NF C29 C12 .1UF CC 040 2 S9 DVDD33 2 S16 74LCX112 CC 040 2 2 DVDD33 1 V O LT RC 060 3 0 1 QOUT-QOUT_P RC0805 ACA S E R 22 S6 DVDD18 2 1 C4 4.7UF P2D15 R59 RC0805 22 R58 DVDD33 DNP CC 040 2 ACA S E CC 040 2 VOLT CC 040 2 V O LT C34 CC 040 2 1NF 11 13 12 J CLK K U10 DVDD18 CC 040 2 ACA S E 4 .7U F 10 14 C5 C35 C3 9 7 C4 0 C3 6 C27 1NF C30 .1UF Q Q_ 4.7UF C13 PRE CLR GND CC 040 2 CC 040 2 CC 040 2 CC 040 2 CC 040 2 CC 040 2 ACA S E .1UF 1NF 1NF C39 C11 .1UF .1UF 4 .7U F 1NF VOLT Figure 82. Evaluation Board, Analog and Digital Interfaces to TxDAC Rev. 0 | Page 57 of 64 07098-045 V O LT ACA S E 4 PRE CLR JP7 4 15 VDDD 18 _ 5 3 JP16 61 53 P 2 D9 0 1 ADTL1-12 V SS D _ 5 4 QN R 63 S P 2 D4 P2D10 2 3 6 62 60 P2D11 4 4 63 P 2 D3 R7 R 65 3 1K 2 RC 120 6 64 1 P 2 D2 R10 0 P 2 D1 V SS D _ 4 4 R8 P 2 D0 VDD 18 _ 4 3 RC0603 P2D13 RC0603 VDDD 18 _ 6 0 P2D12 R9 VDDD 33 _ 6 1 P2D14 SPI_SDO 65 S YN C _O N P2D15 SW1 SPI_SDI 66 S YN C _O P TX RC0603 VDDD 33 _ 3 8 R6 67 V SS D _ 6 4 4 J CLK K 50 P2D7 P LL _ LO CK DC L K SPI_CLK 6 49 P2D8 SP I_ S DO P 1 D0 VAL SPI_CSB 68 SP I_S DI P 1 D1 1K R 64 69 3 48 P2D9 SP I_ C L K RED 1 3 1 2 U10 6PINCONN 47 P2D10 SP I_ C S B VDDD 18 _ 3 3 RC 120 6 70 R ESE T V SS D _ 3 2 P 1 D2 TP 1 1 TP 1 2 CR1 71 DVDD33 1 2 3 74LCX112 46 P2D11 P 1 D3 RED 72 S11 P2D12 IRQ 73 2 45 V SS_ 7 2 P 1 D4 CC 060 3 74 1 44 P 1 D5 75 S14 JP18 43 IPT AT 1 42 P2D13 P 1 D6 2 41 P2D14 VR E F _ 7 4 P 40 P2D15 P 1 D7 T3B 39 I12 0 RC1206 38 76 VDDA 33 _ 7 6 P 1 D8 ADTL1-12 37 77 V SS A _ 7 7 P 1 D9 RC 060 3 S 36 P1D0 RC 080 5 4 C84 35 P1D1 78 VDDA 33 _ 7 8 P1D10 RC 060 3 79 V SS A _ 7 9 VDDD 18 _ 2 3 6 34 P1D2 CC 060 3 80 VDDA 33 _ 8 0 V SS D _ 2 2 0 .1UF 33 81 V SS A _ 8 1 P1D11 IOUT2_P 82 JP17 32 83 QP 31 P1D3 P1D12 IOUT2_N 84 50 R18 100 30 P1D4 V SS A _ 8 2 AUX2_P 85 D2P 29 P1D5 P1D13 AUX2_N 86 6.3V 28 P1D6 IOU T 2 _ P 87 C18 P1D7 IOU T 2 _ N P1D14 AUX1_N 10UF 27 A U X 2_ N A U X 2_ P V SS A _ 8 5 P1D15 AUX1_P 89 88 V SS A _ 8 8 VDDD 33 _ 1 6 IOUT1_N 90 R56 DVDD33 R26 100 RC 060 3 26 P1D8 A U X 1_ N 10K 25 P1D9 A U X 1_ P V SS_ 1 2 91 C8 24 P1D10 RC 060 3 92 V SS C _ 1 1 V SS D _ 1 5 IOUT1_P 93 1NF 23 94 R11 3 2 1 U11 22 V SS A _ 9 1 RC0603 21 P1D11 VDDC 18 _ 1 0 95 JP2 A NC GND SN74LVC1G34 20 P1D12 IOU T 1 _ N S Y N C _1N JP15 VCC 19 P1D13 VDDC 18 _ 9 S Y N C _1P 0 Y 18 P1D14 IOU T 1 _ P JP3 17 P1D15 V SS C _ 8 D1N 4 5 16 V SS A _ 9 4 50 15 V SS C _ 7 R1 14 V SS A _ 9 5 JP8 13 VDDA 33 _ 9 6 CLK_N D2N 25 RC0603 12 R5 11 96 CLK_P JP4 10 CC 040 2 D1P R3 2 9 CC 040 2 4 .7U F 97 V SS A _ 9 7 V SS C _ 4 1NF 8 DVDD33 .1UF C32 7 C37 6 CC 040 2 C33 1 5 C24 2 4 CC 040 2 CC 040 2 98 VDDA 33 _ 9 8 V SS C _ 3 VOLT 99 V SS A _ 9 9 VDDC 18 _ 2 ACA S E 10 0 VDDA 33 _ 10 0 VDDC 18 _ 1 .1UF S7 3 C9 2 1NF C1 C78 C7 CC 040 2 .1UF CLK_P CLK_N 4.7UF 4.7UF 1NF C15 1 IN IP JP14 V O LT 4 .7U F D2P D2N D1N VAL C65 CC0603 VAL C7 4 CC0603 VAL C80 CC0603 VAL L9 VAL LC0805 VAL LC0805 L8 L11 VAL LC0805 VAL C64 CC0603 VAL C7 5 CC0603 VAL C79 CC0603 GND 10UF 10V C43 VDDM GND ACASE JP12 R24 100PF CC0402 RC0603 R23 DNP C50 RC0603 RC0603 C82 DNP CC0402 .1UF C47 10K R25 MOD_QP MOD_QN VDDM MOD_IN J4 6 5 4 3 2 1 MOD_QP MOD_QN Figure 83. Evaluation Board, ADL5372 (FMOD2) Quadrature Modulator CC0402 T4 ETC1-1-13 1 S 2 9 8 7 100PF 3 GND 100PF L10 1 24 LC0805 PAD C53 C81 22 2 23 D1P 21 10 MOD_IP C54 CC0402 GND 20 VAL 19 12 11 CC0603 FMOD 13 14 15 16 17 18 U9 MOD_IP MOD_IN CC0402 100PF Rev. 0 | Page 58 of 64 C73 VAL 1 2 GND CC0402 CC0402 C72 J3 .1UF L17 CC0402 C51 100PF 100PF OUTPUT MODULATED C63 CC0402 L18 VAL LC0805 VAL LC0805 100PF 100PF CC0402 CC0402 C87 C83 .1UF C52 .1UF ACASE GND CC0402 C90 GND ACASE VDDM 10UF 10V C41 VDDM VDDM 10UF 10V C44 07098-046 CC0603 AD9785/AD9787/AD9788 P 4 5 J1 2 1 R13 VAL 5 P 1 2 ETC1-1-13 S 3 .1UF CC040 2 C23 .1UF CC040 2 4 T2 25 R29 25 R28 RC040 2 RC040 2 RC040 2 RC040 2 C19 300 R31 R30 1K CC0402 CC0402 .1UF C17 DNP C16 CVDD18 CLK_N CLK_P AD9785/AD9787/AD9788 Figure 84. Evaluation Board, TxDAC Clock Interface Rev. 0 | Page 59 of 64 07098-047 RC040 2 Rev. 0 | Page 60 of 64 B17 B18 B19 B20 B21 B22 B23 B24 B25 A17 A18 A19 A20 A21 A22 A23 A24 A25 PKG_TYPE=MOLEX110 VAL B16 A16 PKG_TYPE=MOLEX110 VAL B15 A15 B11 B8 A8 A11 C9 B7 A7 B9 B6 A6 B10 B5 A5 A9 B4 A4 A10 C8 B3 A3 Figure 85. Evaluation Board, Digital Input Data Lines BLK GND PKG_TYPE=MOLEX110 VAL C25 C24 C23 C22 C21 C20 C19 C18 C17 C16 C15 C11 C10 C7 C6 C5 C4 C3 C2 B2 P4 C1 A2 P4 B1 P4 TP7 BLK P1D14 P1D12 P1D10 P1D8 P1D6 P1D4 P1D2 P1D0 P2D14 P2D12 P2D10 P2D8 P2D6 P2D4 P2D2 P2D0 P4 PKG_TYPE=MOLEX110 VAL D25 D24 D23 D22 D21 D20 D19 D18 D17 D16 D15 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 P4 PKG_TYPE=MOLEX110 VAL E25 E24 E23 E22 E21 E20 E19 E18 E17 E16 E15 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 E1 P1D15 P1D13 P1D11 P1D9 P1D7 P1D5 P1D3 P1D1 P2D1 P2D15 P2D13 P2D11 P2D9 P2D7 P2D5 P2D3 07098-048 A1 AD9785/AD9787/AD9788 Figure 86. Evaluation Board, On-Board Power Supply Rev. 0 | Page 61 of 64 VAL CNTERM_2P 2 1 P2 2 1 C93 C94 CC0603 1UF 1UF CC0603 C91 CC0603 1UF C88 CC0603 1UF C85 CC0603 1UF C92 CC0603 1UF C89 CC0603 1UF C86 CC0603 1UF 3 2 1 3 2 3 2 1 ADP3339-3-3 4 U4 4 U3 4 U2 ADP3339-3-3 ADP3339-1-8 ADP3339-1-8 1 3 2 1 4 U7 JP22 JP21 JP20 JP19 AVDD33_IN DVDD33_IN DVDD18_IN CVDD18_IN 07098-049 J2 AD9785/AD9787/AD9788 AD9785/AD9787/AD9788 OUTLINE DIMENSIONS 0.75 0.60 0.45 16.00 BSC SQ 1.20 MAX 14.00 BSC SQ 100 1 SEATING PLANE 76 76 75 100 1 75 PIN 1 BOTTOM VIEW (PINS UP) TOP VIEW (PINS DOWN) CONDUCTIVE HEAT SINK 51 25 26 0.20 0.09 51 50 25 50 1.05 1.00 0.95 7° 3.5° 0° 0.50 BSC 0.27 0.22 0.17 0.15 0.05 26 6.50 NOM COPLANARITY 0.08 121207-A COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT NOTES: 1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED. 2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE, WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS. 3. θJA: 27.4°C/W WITH THERMAL PAD UNSOLDERED, 19.1°C/W WITH THERMAL PAD SOLDERED TO PCB. Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] (SV-100-1) Dimensions shown in millimeters ORDERING GUIDE Model AD9785BSVZ 1 AD9785BSVZRL1 −40°C to +85°C −40°C to +85°C Package Description 100-Lead TQFP_EP 100-Lead TQFP_EP Package Option SV-100-1 SV-100-1 AD9787BSVZ1 AD9787BSVZRL1 −40°C to +85°C −40°C to +85°C 100-Lead TQFP_EP 100-Lead TQFP_EP SV-100-1 SV-100-1 AD9788BSVZ1 AD9788BSVZRL1 −40°C to +85°C −40°C to +85°C 100-Lead TQFP_EP 100-Lead TQFP_EP SV-100-1 SV-100-1 AD9785-EBZ1 AD9787-EBZ1 AD9788-EBZ1 1 Temperature Range Evaluation Board Evaluation Board Evaluation Board RoHS Compliant Part. Rev. 0 | Page 62 of 64 AD9785/AD9787/AD9788 NOTES Rev. 0 | Page 63 of 64 AD9785/AD9787/AD9788 NOTES ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07098-0-1/08(0) Rev. 0 | Page 64 of 64