TI ADS62PF49IRGCR

ADS62PF49
SLAS779 – JUNE 2011
www.ti.com
Dual-Channel, 250-MSPS Feedback Receiver IC
Check for Samples: ADS62PF49
FEATURES
DESCRIPTION
•
•
•
The ADS62PF49 is a dual-channel feedback reciever
IC with sampling rates up to 250 MSPS. It allows a
high-resolution, 14-bit output for a limited time
followed by a low-resolution mode with a minimum of
8x longer time. It is pin-compatible to the ADS62P49
and ADS62C17 dual ADCs.
1
•
•
•
•
•
Maximum Output Sample Rate: 250 MSPS
Pin-Compatible with ADS62P49
Variable Output Resolution
– High Resolution Burst Mode with 14-Bit
Output: 73 dB SNR at Low IF,
70.5 dB SNR at 170 MHz
– Low Resolution with 9-Bit 250 MSPS or
11-Bit 125 MSPS
Double Data Rate (DDR) LVDS Output
Programmable Gain up to 6 dB for SNR/SFDR
Trade-off
90-dB Cross-Talk
Power Consumption of 1.25 W
64-Pin QFN Package (9 mm × 9 mm)
The ADS62PF49 has gain options that can be used
to improve SFDR performance at lower full-scale
input ranges. It includes a dc offset correction loop
that can be used to cancel the analog-to-digital
conversion (ADC) offset.
It includes internal references while the traditional
reference pins and associated decoupling capacitors
have been eliminated. The device is specified over
the industrial temperature range (–40°C to 85°C).
Table 1. Performance Summary
APPLICATIONS
•
PERFORMANCE IN HIGHRESOLUTION MODE
AT 170-MHz INPUT
Feedpath Path for Multi-Carrier, Multi-Mode
Cellular Infrastructure Base Stations
0-dB gain
75
SFDR, dBc
6-dB gain
82
0-dB gain
69.8
6-dB gain
66.5
SINAD, dBFS
ADS62PF49 Block Diagram
DA0P/M
DA2P/M
INP_A
Sample &
Hold
ADC
INM_A
Resolution/
Mode control
+
DDR
Serializer
DA4P/M
DA6P/M
DA8P/M
DA10P/M
DA12P/M
CLKP
CLKOUTP/M
Clockgen
CLKM
DB0P/M
DB2P/M
INP_B
Sample &
Hold
ADC
INM_B
Resolution/
Mode control
+
DDR
Serializer
DB4P/M
DB6P/M
DB8P/M
DB10P/M
DB12P/M
Reference
Control
Interface
SDOUT
RESET
SCLK
SEN
SDATA
CTRL1
CTRL2
CTRL3
VCM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
ADS62PF49IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS62PF49IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS62PF49IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS62PF49IRGCT
VQFN
RGC
64
250
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS62PF49IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS62PF49IRGCT
VQFN
RGC
64
250
336.6
336.6
28.6
Pack Materials-Page 2
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