ADS62PF49 SLAS779 – JUNE 2011 www.ti.com Dual-Channel, 250-MSPS Feedback Receiver IC Check for Samples: ADS62PF49 FEATURES DESCRIPTION • • • The ADS62PF49 is a dual-channel feedback reciever IC with sampling rates up to 250 MSPS. It allows a high-resolution, 14-bit output for a limited time followed by a low-resolution mode with a minimum of 8x longer time. It is pin-compatible to the ADS62P49 and ADS62C17 dual ADCs. 1 • • • • • Maximum Output Sample Rate: 250 MSPS Pin-Compatible with ADS62P49 Variable Output Resolution – High Resolution Burst Mode with 14-Bit Output: 73 dB SNR at Low IF, 70.5 dB SNR at 170 MHz – Low Resolution with 9-Bit 250 MSPS or 11-Bit 125 MSPS Double Data Rate (DDR) LVDS Output Programmable Gain up to 6 dB for SNR/SFDR Trade-off 90-dB Cross-Talk Power Consumption of 1.25 W 64-Pin QFN Package (9 mm × 9 mm) The ADS62PF49 has gain options that can be used to improve SFDR performance at lower full-scale input ranges. It includes a dc offset correction loop that can be used to cancel the analog-to-digital conversion (ADC) offset. It includes internal references while the traditional reference pins and associated decoupling capacitors have been eliminated. The device is specified over the industrial temperature range (–40°C to 85°C). Table 1. Performance Summary APPLICATIONS • PERFORMANCE IN HIGHRESOLUTION MODE AT 170-MHz INPUT Feedpath Path for Multi-Carrier, Multi-Mode Cellular Infrastructure Base Stations 0-dB gain 75 SFDR, dBc 6-dB gain 82 0-dB gain 69.8 6-dB gain 66.5 SINAD, dBFS ADS62PF49 Block Diagram DA0P/M DA2P/M INP_A Sample & Hold ADC INM_A Resolution/ Mode control + DDR Serializer DA4P/M DA6P/M DA8P/M DA10P/M DA12P/M CLKP CLKOUTP/M Clockgen CLKM DB0P/M DB2P/M INP_B Sample & Hold ADC INM_B Resolution/ Mode control + DDR Serializer DB4P/M DB6P/M DB8P/M DB10P/M DB12P/M Reference Control Interface SDOUT RESET SCLK SEN SDATA CTRL1 CTRL2 CTRL3 VCM 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ADS62PF49IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS62PF49IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS62PF49IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS62PF49IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS62PF49IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS62PF49IRGCT VQFN RGC 64 250 336.6 336.6 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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