ADS58C20 ADS58C23 SLAS780 – JULY 2011 www.ti.com 3G+ Dual IF Receivers with SNRBoost Signal Processing Check for Samples: ADS58C20 , ADS58C23 FEATURES APPLICATIONS • • 1 2 • • • • Differential Analog IF Input, DDR LVDS Digital IF Output Up to 125-MHz Signal Bandwidth Per Receiver – With 40- and 75-MHz Optimized Bands High Dynamic Performance High Impedance Input 80-Pin TQFP Package with PowerPAD™ • ADS58C20: Multi-Carrier GSM/3G/LTE/TDS-CDMA Cellular Base-Station Receiver ADS58C23: Multi-Carrier 3G/LTE/TDS-CDMA Cellular Base-Station Receiver DESCRIPTION The ADS58C20 and ADS58C23 are dual IF receivers for wideband, multi-mode cellular infrastructure base stations. Each channel provides high dynamic performance up to 125 MHz of bandwidth, with optimized bands of 40- and 75-MHz. The IF receiver architecture eases front end filter design for wide bandwidth receivers. The receivers have integrated buffers at the analog inputs with benefits of uniform performance and input impedance across a wide frequency range. The ADS58C20 is a high performance part with superior specifications for single/multi-mode cellular base-station receivers that include multi-carrier GSM. It can also process other cellular protocols such as TDS-CDMA/3G/LTE and prior generation systems. The ADS58C23 offers the same functionality and pinout as ADS58C20 but with reduced minimum performance specifications for lower cost and performance systems, such as TDS-CDMA/3G/LTE single/multi-mode receivers (when GSM is not required). It can also process prior generation protocols. The devices are available in an 80-pin TQFP package and are specified over the full industrial temperature range (–40°C to 85°C). 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 6-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ADS58C20IPFP ACTIVE HTQFP PFP 80 96 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS58C20IPFPR ACTIVE HTQFP PFP 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS58C23IPFP ACTIVE HTQFP PFP 80 96 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS58C23IPFPR ACTIVE HTQFP PFP 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS58C20IPFPR HTQFP PFP 80 1000 330.0 24.4 15.0 15.0 1.5 20.0 24.0 Q2 ADS58C23IPFPR HTQFP PFP 80 1000 330.0 24.4 15.0 15.0 1.5 20.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS58C20IPFPR HTQFP PFP 80 1000 346.0 346.0 41.0 ADS58C23IPFPR HTQFP PFP 80 1000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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