TI TPS658622AZQZR

TPS658622A
www.ti.com
SLVSAJ7 – SEPTEMBER 2010
Advanced Power Management Unit
Check for Samples: TPS658622A
1 Introduction
1.1
Main Features
1
• BATTERY CHARGER
– Complete Charge Management Solution for a
Single-Cell Li-Ion/Li-Pol Cell With Dynamic
Power Management and Thermal Foldback
– Maximum 1-A Charge Current
– Programmable Adapter and USB Charge
Operation
• INTEGRATED POWER SUPPLIES
– 3 Programmable Step-Down Converters
• Software-Controlled Enable/Forced PWM
Mode
• Automatic Power-Saving Mode
• Maximum 1.5-A Outputs (SM0, SM2)
• Maximum 2-A Output (SM1)
– 11 Programmable General-Purpose LDOs
• 7 With Output Voltages of 1.25 V to 3.3 V
• 2 With Output Voltages of 0.725 V to 1.5 V
or 1.25 V to 2.586 V (Factory
Configurable)
• 1 Always On With Output Voltages of
1.25 V to 3.3 V
• 1 With Output Voltage of 1.7 V to 2.475 V
• DISPLAY SUPPORT FUNCTIONS
– 4 PWM Outputs With Programmable
Frequency and Duty Cycle
– Dual RGB LED Drivers
– Constant-Current WLED Driver
• 26.5 V (Max.) at 25 mA
• Overvoltage Protection
• Programmable Current-Level and
Brightness Control
• HOST INTERFACE
– Interrupt Controller With Maskable Interrupts
– External ADC Triggering and Step-Down
1.3
Converter Mode Control
• SYSTEM MANAGEMENT
– Dual-Input Power Path
• USB Current Limiting
• Max. 18-V Overvoltage Protection
– Power-Good Monitoring on All Supply
Outputs
– Software Reset Function
– Hardware On/Off and Reboot Control
– 11-Channel ADC With 3 Operating Modes
• Single Conversion
• Peak Detection
• Averaging
1.2
•
•
•
Applications
Smart Phones
Portable Navigation Devices
Portable Media Players
Overview
The TPS658622A provides an easy-to-use, fully integrated solution for handheld devices, integrating
charge management, multiple regulated power supplies, system management, and display functions in a
small 6-mm × 6-mm package. The I2C interface enables control of a wide range of subsystem parameters.
Internal registers have a complete set of status information, enabling easy diagnostics and host-controlled
handling of fault conditions.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
To request a full data sheet, please send an email to:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
17-Sep-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS658622AZQZR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Purchase Samples
TPS658622AZQZT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
250
Green (RoHS
& no Sb/Br)
Call TI
Level-3-260C-168 HR
Contact TI Distributor
or Sales Office
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Sep-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS658622AZQZR
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
TPS658622AZQZT
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Sep-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS658622AZQZR
BGA MICROSTAR
JUNIOR
ZQZ
120
2500
333.2
345.9
28.6
TPS658622AZQZT
BGA MICROSTAR
JUNIOR
ZQZ
120
250
333.2
345.9
28.6
Pack Materials-Page 2
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