GDU 9X-XXXXX Series GDU 9X-XXXXX Series GTO Gate Drive Units Application Note Replaces March 1998 version, AN4571 - 5.1 AN4571-6.0 January 2000 This application note should be used in conjunction with individual Gate Drive Unit datasheets which contain electrical, timing and outline information. GTO GATE DRIVE UNITS A range of Gate Drive Units (GDU) is available to control Dynex Semiconductor Gate Turn-Off Thyristors (GTO). These units provide the recommended waveforms for reliable switching of GTOs and have the following features:■ Input signal to the GDU (to turn the GDU ON and OFF) or output signal (that indicates the presence of GTO gate to cathode negative voltage) can be specified for either opto-couplers or fibre optics. ■ An output signal that monitors the GTO gate to cathode negative voltage. This voltage is monitored at the GDU GTO gate output connections or the GTO gate sense leads if they are wired to the GDU. ■ At initial switch-on a safe start up is achieved by incorporating an inhibit of GTO gate pulses until the power supplies stabilise. ■ Each power supply voltage is continuously monitored, if it falls below a preset level an OFF signal is sent to the GTO and further ON pulses are inhibited until the power supply recovers. ■ Adjustable inhibit of short ON pulses. This prevents the GTO switching ON from signals that may be false. ■ Adjustable minimum ON pulse width. This ensures that when the GTO is turned ON it is ON for a time that fully discharges the snubber capacitor. ■ Adjustable minimum OFF pulse width. This ensures that the GTO is turned OFF for longer than its' turn-off time. GTO/GATE DRIVE RECOMMENDATIONS Recommended Gate Drive Conditions GTO ITCM (A) IGQM (A) QGQM (µC) IFG (A) dIFG/dt (A/µs) IG(ON) (A) tw1(min) (µs) dIGQ/dt (A/µs) VRG(min) (V) VRG(max) (V) Recommended Gate Drive DGT304SE 700 120 700 20 20 2 4.5 15 2 16 GDU 91-202XX DG306AE 600 190 1300 20 20 2 10 15 2 16 GDU 91-202XX DG406BP 1000 420 3000 30 30 4 10 30 2 16 GDU 91-202XX DG408BP 1000 420 3000 30 30 4 20 30 2 16 GDU 91-202XX DGT409BCA 800 350 3600 30 30 4 20 30 2 15 GDU 91-202XX DG646BH 2000 650 6600 30 30 7 20 40 2 16 GDU 90-204XX DG648BH 2000 690 6000 30 30 7 20 40 2 16 GDU 90-204XX DG758BX 3000 830 10000 40 40 8 10 40 2 16 GDU 90-203XX DG856BW 3000 850 10500 40 40 10 20 40 2 16 GDU 90-207XX DG858BW 3000 850 12000 40 40 10 20 40 2 16 GDU 90-207XX DG858DW 3000 950 12500 40 40 10 20 40 2 18 GDU 90-207XX 1/9 GDU 9X-XXXXX Series POWER CIRCUIT AND BLOCK DIAGRAM Control card connector V2 P.S.U. Terminals R2 R1 V1 C1 C3 T1 GTO T2 Gate D1 0V Cathode L1 T3 ACR C2 V3 R1 Adjusts On-state gate current - IG(ON) R2 Adjusts Peak forward gate current - IFGM L1 (When fitted) Adjusts Rate of rise of negative gate current - dIGQ/dt Fig.1 GTO gate drive - GDU9X-2XXXX - simplified power circuit Power supply unit 1. If L1 is fitted. V3 Input Contains adjustments for:No response pulse width Minimum on-time Minimum off-time V2 V1 0V Contains adjustments for:Turn-on IFG(MAX) Turn-off dIGQ/dt1 IG(ON) Gate Fibre optics Output Terminal block for GTO sense leads. (If fitted). Cathode \V Output on when gate voltage | -8 | Volts Control Card Power Circuits Gate Drive Unit Fig.2 Gate drive block diagram 2/9 GTO GDU 9X-XXXXX Series GATE DRIVE INTERFACES Customer Interface Gate Drive Unit +5V I1 Plugs 1 2 3 4 Transmitter 0V +10V 4 3 2 1 1mm Polymer fibre optic cable Receiver 0V +5V Plugs 4 3 2 1 Receiver 0V 1 2 3 4 1mm Polymer fibre optic cable Transmitter 0V Transmitter - Hewlett Packard HFBR 1524 Receiver - Hewlett Packard HFBR 2524 Fig.3 Hewlett Packard versatile link interface Customer Interface Gate Drive Unit +10V Housings Plugs 1 2 3 1 2 3 I1 1mm Polymer fibre optic cable Emitter 0V Receiver 0V +5V Housings Plugs 1 2 3 1 2 3 0V Receiver 1mm Polymer fibre optic cable Emitter 0V Emitter - HFE 4020 - 013 Receiver - HFD 3029 - 002 Fig.4 Honeywell sweetspot interface 3/9 GDU 9X-XXXXX Series GTO GATE DRIVE V1 P.S.U. CURRENTS 12 A: GDU90-207XX B: GDU90-203XX C: GDU90-204XX D: GDU91-202XX 11 A 10 9 B V1 PSU current - (A) 8 C 7 6 5 D 4 3 2 1 0 0 20 40 60 Duty cycle (%) Fig.5 V1 P.S.U. current vs duty cycle 4/9 80 100 GDU 9X-XXXXX Series GTO GATE DRIVE V2 P.S.U. CURRENTS 1.4 A: GDU90-207XX B: GDU91-202XX B: GDU90-204XX C: GDU90-203XX D: GDU91-202XX 1.3 1.2 A 1.1 1.0 B V2 PSU current - (A) 0.9 C 0.8 0.7 D 0.6 0.5 0.4 0.3 0.2 0.1 0 0 200 400 600 Frequency - (Hz) 800 1000 Fig.6 V2 P.S.U. current vs frequency 5/9 GDU 9X-XXXXX Series GTO GATE DRIVE V3 P.S.U. CURRENTS AB C 14 D E 13 F 12 11 V3 PSU current - (A) Note 1 10 9 8 G 7 6 H 5 4 3 2 I J 1 0 0 200 400 600 Frequency - (Hz) 800 Note 1: V3 current is that required for operation of the GTO at max. ITCM and Tj. Fig.7 V3 P.S.U. current vs frequency 6/9 1000 A: DG858DW B: DG858BW C: DG856BW D: DG758BX E: DG646BH F: DG648BH G: DGT409BCA H: DG406BP H: DG408BP I: DG306AE J: DGT304SE GDU 9X-XXXXX Series GATE DRIVE QGQT LIMITS VS FREQUENCY 26000 A: GDU91-202XX B: GDU90-204XX C: GDU90-203XX D: GDU90-206XX E: GDU90-207XX 24000 22000 20000 Total turn-off gate charge QGQT - (µC) 18000 16000 14000 12000 10000 E D 8000 C 6000 B 4000 A 2000 0 0 2 4 6 8 10 12 14 16 18 20 22 24 Frequency - (100Hz) Fig.8 7/9 GDU 9X-XXXXX Series GUIDANCE FOR SELECTION OF GATE DRIVE UNIT 1. 2. 3. Choose GTO Thyristor. Select the appropriate GDU from the GTO/GDU recommendations, (see page 1). Decide on input signal method and tw1 period, and enter the last two digits in the Gate Drive code: 01 HP Versatile link fibre optics: 02 Honeywell sweetspot fibre optics: 04 HP opto-coupler. (tw1 = 10µs) (tw1 = 10µs) (tw1 = 10µs) 21 HP Versatile link fibre optics: 22 Honeywell sweetspot fibre optics: 24 HP opto-coupler. (tw1 = 20µs) (tw1 = 20µs) (tw1 = 20µs) GUIDANCE FOR POWER SUPPLY SPECIFICATION 1. From GTO datasheet recommendations for IG(ON) add 10% to calculate the maximum current required from the V1 supply. The average value of current could be lower for reduced duty cycle operation. (See Fig.5, page 4). 2. Read the V2 supply current from Fig.6 (See page 5). 3. Read the maximum V3 supply current from Fig.7 (See page 6). If the GTO is to be operated at lower current than the ITCM and/ or Tvj(max) then the V3 power supply current can be calculated as follows:- a. From the GTO turn-off gate charge vs rate of rise of reverse gate current graph read QGQ for worst case requirements. b. GDU QGQT is 2x GTO QGQ per pulse. c. V3 power supply current is 2x GTO QGQ x Max. Frequency (Hz) of operation. 4. The Power Supply Unit must have satisfactory isolation between its' input and output in order to withstand the GTO cathode voltage. GENERAL NOTES 1. The drive unit mounting holes 4xØ4.4mm have a generous clearance for mounting nuts or bolts and can be opened out by end users to suit individual requirements. 2. The GDU circuits are referenced to the GTO cathode and hence operate near to the GTO cathode voltage. Suitable spacing around the GDU, and in the mounting method, should be provided for the electrical isolation of the worst case GTO cathode voltage. 3. The preferred mounting is with the heatsink fins vertical - to improve cooling from the unit. 8/9 4. The GDU has two CMOS compatible inputs that are referenced to the unit 0V line (connected to the GTO cathode). Connecting these to 0V will turn the GTO OFF and inhibit further GTO ON pulses. These could be used, for example, to turn the GTO OFF if the GTO cathode heatsink temperature rise operated a thermostat that shorted one of the inputs to 0V. 5. Fibre optic interface cables/components are also available to suit Dynex Semiconductor Gate Drive Units. POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com