VISHAY AN701

AN701
Vishay Siliconix
Designing High-Frequency DC-to-DC Converters
With the Si9114A Switchmode Controller
INTRODUCTION
Vishay Siliconix’s Si9100 monolithic switchmode PWM
controller established the standard for low-power, highefficiency dc-to-dc converters. This versatile device integrates
a number of useful features, including a power MOSFET,
high-voltage start circuitry, and low power consumption. The
Si9114A controller pushes the limits for high-frequency power
conversion by further reducing delay times and adding
additional features. As a result, dc-to-dc converters can be
designed for frequencies up to 1 MHz with simple PWM
topologies instead of the complex resonant ones.
The Si9114A uses constant frequency current mode control.
By increasing the conversion frequency, power supply
designers will be able to:
FB
5
COMP
6
S reduce the size of energy storage components
S increase reliability by using ceramic capacitors
S produce an all-surface-mount assembly solution
S lower system costs
S simplify the implementation of a distributed power
architecture.
Traditionally, distributed power has been regarded as costly
and impractical to implement due to the high cost of local
power conversion and the perceived complexity of resonant
power supplies. But these decision criteria are now being
changed by the availability of small-outline control ICs,
LITTLE FOOTr MOSFETs, ceramic capacitors, and new
magnetic components.
ROSC
SYNC
CURRENT SENSE
13
10
Error
Amplifier
4
NI
COSC
8
B2
–
+
Enable
OSC
Out
9
OSC
2V
3
VREF
+
Ref
Gen
–
–
R
+
Q
S
4.6 V
+
20 mA
12 DRIVER
–
OUTPUT
7
SS
11
1.25 V
–VIN
VCC
Substrate
–VIN
20 mA
VCC
2
14
S
SHUTDOWN
Q
R
1
+VIN
–
+
–
–
+
0.2 V
+
Undervoltage
Lockout
9.2 V
Figure 1 Si9114A Block Diagram
Document Number: 70575
16-Jan-01
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FUNCTIONAL DESCRIPTION OF THE
SI9114A BID/CMOS PWM CONTROLLER
depletion mode MOSFET. The 9.2-V threshold has a
hysteresis of 300 mV to prevent oscillations when the
transition voltage is not clearly defined or when high-line
supply impedance is encountered.
The Si9114A controller is similar in configuration to the Si9110.
It uses a traditional constant frequency current mode control,
the most commonly used architecture. The duty cycle is limited
to less than 50% to avoid problems with core reset.
For applications where the input dc voltage is not high, and the
chip power consumption is not excessive, the feedback
winding can be eliminated. In such cases, the pre-regulator
circuit will behave just like a linear regulator with 9.2-V output
and 10-kW series resistance. In this case, the parameters to be
considered are the dropout voltage at lowest line condition and
the power dissipation at highest voltage. The high-voltage
depletion mode MOSFET contains an internal body diode, and
in situations where the VCC is being powered from a laboratory
supply, care must be taken to avoid loading the +VIN rail
beyond the current rating of this device. Typically, the reverse
characteristics of the device will generate a voltage of 3.4 V on
Pin 1 with 10-kW load when powering VCC from a lab supply.
Current mode control is presently the de-facto standard for
PWM control circuits. Indeed, it is the only candidate that
should be considered, given its many advantages:
S Cycle by cycle current limit protection
S Simple loop compensation, eliminating effect of output
inductor
S Excellent fast transient response due to inner control loop
S Automatic input voltage feed-forward compensation
In some applications it is necessary to inhibit the start of a
converter until a high enough voltage is present on the supply
bus. This is the case for the following reasons:
PIN 1 Ć HIGH VOLTAGE PREĆREGULATOR
All switchmode power supplies face a start-up problem caused
by the large difference between dc bus voltage and the VCC
power rail for supplying the control circuit. The traditional
technique has been to keep the control circuit in “sleep mode,”
while a small amount of energy is used to “top up” a large
enough electrolytic capacitor to get the circuit started. When
the circuit starts operating, a winding on the transformer is then
used to power the control circuit. Disadvantages with this type
of circuit include delayed start-up and large required
capacitances for guaranteed operation over the full voltage
range. The Si9114A overcomes these problems by using low
power consumption, BiC/DMOS circuitry, and a unique
high-voltage depletion mode MOSFET. (See 2)
S Circuitry fed from a high line impedance such as a
telephone line will have difficulty starting, since the
converter will behave like a negative impedance. As the dc
voltage decreases, the input current increases because
constant power is drawn. This causes severe oscillations,
and can in some instances have a destructive effect on the
converter. [4]
S During start-up, the Si9114A will begin operation as soon
as the UVLO threshold is reached. Since the converter is
designed to operate over a much higher range—for
example, from 36 to 72 V—then between 10- and 36-V
input the output voltage will be out of regulation and
undefined. In some cases, digital circuitry will not accept
this mode of operation, and system faults will be
encountered without a RESET watchdog circuit.
When power is first applied, the depletion transistor is on, and
current flows from the input capacitor CIN into the VCC
capacitor CVCC until VCC reaches 9.2 V. The converter
transformer will then supply the VCC through a bias winding,
which will raise VCC to a level higher than 9.2 V. Ideally this will
be between 11 and 13 V, thus turning off the high-voltage
To overcome these problems, a Zener diode of suitable value
VZ can be placed in series with the +Vin pin, preventing start-up
until VZ + 9.2 V is reached.
To Internal Circuits
VCC
Transformer Winding
+VIN
300 mV
–
CIN
+
–
0.2 V
9.2 V
UVLO
+
CVCC
–VIN
Figure 2 Start Circuit
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Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
VCC
+OP
Vout
20 mA
SHUTDOWN
–OP
S
Q
R
6
1
5
2
4
UV-Low
NC
3
TL431
Si9114A
Figure 3 Shutdown
PIN 2: SHUTDOWN
The shutdown pin is configured to allow fast latched
termination of the output pulse. The delay from shutdown to
output is typically 300 ns. This delay is short enough to allow
this pin to be used for over-voltage applications where fast
orderly shutdown is desirable: for example, when control of the
feedback loop is lost.
Using an opto-coupler and a TL431, interface is easy. (See 3)
Once latched, the shutdown can only be reset from the UVLO
circuit by re-cycling the power. In the event of an over-voltage,
the latch can be reset by momentarily pulling the VCC to a value
lower than the UVLO threshold.
FBK
+
–
This approach will generally be acceptable, since the
feedback winding will not be supplying power, and the only
power maintaining the latch will be supplied by the depletion
start transistor. Note, however, that this action will still be
subject to the power dissipation limits of the Si9114A package
and should ideally be applied as a short fast pulse.
An internal 20-mA current source pull-up on SHUTDOWN pin
is provided. However, if the Si9114A is used in a potentially
noisy environment, a 10-kW pull-up is recommended from
SHUTDOWN to VCC to prevent fault triggering, and to prevent
a start-up problem when a fast slew rate power supply (dv/dt
> 100 V/ms) is used for +VIN (pin 1).
PIN 3: REFERENCE
The reference voltage is a fully buffered band gap type which
can source 5 mA over the specified voltage tolerance range.
The reference should be well de-coupled to prevent instability
and jitter. A ceramic 100 nF or small tantalum is recommended,
depending on the de-coupling present on the supply pins.
Document Number: 70575
16-Jan-01
1.5 kW
NINV
Comp
Soft
Star
t
Figure 4 Operational Amplifier
PINS 4, 5 AND 6: ERROR AMPLIFIER
The error amplifier consists of a PMOS input folded cascade
gain stage followed by a class AB unity gain amplifier.
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Typical open loop voltage gain is 77 dB, and unity gain
bandwidth is typically 2.7 MHz. The soft-start circuit (see Pin 7
description) forces the output to within 0.7 V above ground,
and additional clamp diodes limit the positive output excursion
to within 2xVBE above VREF . Operation at high frequency
allows high closed loop bandwidths and permits excellent
transient response to both input and output changes. Under
normal operation, a small 100 pF bypass capacitor is
recommended from NINV to Comp to increase high-frequency
noise rejection. This should be calculated, however, in
conjunction with the loop dynamics.
PIN 7: SOFTĆSTART
The soft-start circuit is designed to help dc-to-dc converters
start in an orderly manner and reduce component stress. The
output of the error amplifier is clamped by a PNP transistor.
The external capacitor CSS is supplied by a 20-mA current
source and will charge linearly to 4.6 V. In the event of an
under-voltage lockout (or during start-up), this capacitor is held
low.
oscillations may occur. These can be prevented with the use
of long soft-start times. The soft-start pin can also be used as
a non-latching shutdown pin by connecting it to –VIN. This
approach allows a shutdown with soft re-start.
PINS 8 AND 9 - OSCILLATOR
The oscillator circuit uses external timing components RT and
CT. An internal divide-by-two prevents pulses with greater than
50% duty cycle, so that core saturation can be avoided. When
the RT terminal is connected to VCC, comparator C2
disconnects the oscillator output from the SYNC terminal using
SW1, and allows an external oscillator circuit to take control of
the current mode comparator circuit.
The current programmed by RT defines the charging current of
CT and the on and off times with the following design
equations:
tON +
1.025 x RT x CT
(1)
8
where Rql = 25 W
tOFF + 5 x Rql x CT
Feedback
(2)
1
1
fOSC + 2 x ǒt
)
tOFFǓ
ON
Error Amp
(3)
Actual values taken from a prototype board have been
plotted (Figure 6), and are a close match (except for 47 pF,
where stray parasitics have more significant effect).
VREF
Comparator
4.6 V
20 mA
1000
47 pF
100 pF
150 pF
200 pF
UV-low
f OUT (kHz)
CSS
100
Note: These curves were measured in
a board with 3.5 pF of
external parasitic capacitance.
Figure 5 Soft-Start
Soft-start is a very important feature and has many beneficial
effects, especially in applications connecting to telecom lines
where source impedances are high. In such cases, there is an
initial start-up current caused by the input capacitor, followed
by a secondary peak caused by the converter running at
maximum duty cycle while trying to reach regulation. Where
large output capacitances and peak loads are encountered,
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10
10
100
1000
ROSC (kW)
Figure 6 Oscillator Frequency Selection
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
I1
C1
VREF
Q2
U1
C2
B1
B2
D
B3
SW1
CLK
Q
Q1
RT
SYNC
Q
I2
CT
Figure 7 Oscillator
IC1
1
2
3
4
5
6
7
+VIN
SHD
VREF
NI
FB
COMP
SS
IC2
VCC
Sense
Out
–VIN
SYNC
COSC
ROSC
Si9114A
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Rt
+VIN
SHD
VREF
NI
FB
COMP
SS
IC3
VCC
Sense
Out
–VIN
SYNC
COSC
ROSC
14
13
12
11
10
9
8
Si9114A
Ct
1
2
3
4
5
6
7
+VIN
SHD
VREF
NI
FB
COMP
SS
VCC
Sense
Out
–VIN
SYNC
COSC
ROSC
14
13
12
11
10
9
8
Si9114A
Figure 8 Oscillator Synchronization
VCC
R1
120 k
Rt
CVCC
1 mF
D1
SW1
Ct
CT
The current in RT is set by V = IR where V = 4 V and R = RT.
Using a diode, and some type of switch, the frequency can be
easily changed: when SW1 is closed, D1 is reverse biased, and
has no effect on RT. When SW1 is open, current flows through
R1 and D1 into RT and removes some of the current supplied
by the internal emitter follower.
RT
68 k
PIN 10 Ć SYNCHRONIZATION
–VIN
SW1 Closed = Frequency High
SW1 Open = Frequency Low
S The voltage at the RT terminal is 4 V, as supplied by an
internal emitter follower from the reference.
The SYNC input allows operation from a master clock as the
connection is made after the divide-by-two. As a result,
synchronization in both frequency and phase is possible. This
unique feature is important to systems designers who use
multiple converters, where noise caused by an
unsynchronized “beating” effect is present and causes difficult
EMI/EMC problems. If an external clock is used, duty cycles of
>50% are possible due to the position of the SYNC pin , after
the divide-by-two. Where >50% conduction is used, core reset
must be allowed, in order to prevent core saturation.
Synchronization is in master/slave mode, with one device (the
“master”) setting the switching frequency and others (the
“slaves”) with disabled oscillators locked to it. Alternatively, all
devices can be clocked using a master oscillator.
The frequency can be changed easily by supplying some of
the current into RT from the VCC rail, thus “starving” the
internal current source, and slowing the frequency down.
During slave mode, the unused CT pin should be connected to
ground, and the RT to VCC.
Figure 9 Frequency Shifting Using Rt Current Change
In certain circumstances, such as current limiting, it may be
desirable to change the frequency of the converter for a period
of time to overcome current tails (see Figure 16 for further
explanation). With the Si9114A, this is easily done by adding
or subtracting some current into the RT terminal:
S The charging current in CT is set by 8
Document Number: 70575
16-Jan-01
RT.
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PIN 11 & PIN 14 -VIN & VDD
These pins are used for powering the Si9114A and should
consequently be well de-coupled. In selecting the right
de-coupling, the MOSFET gate drive requirements should be
considered, as the de-coupling capacitor will also have to
supply the required peak current. Generally speaking, the best
combination would be a 1- to 10-mF electrolytic for bulk energy
and a 100-nF ceramic for high-frequency bypass. The VCC rail
should be carefully observed at the switch on and off
occurrences using ac de-coupling, and the peak voltage
spikes should be measured. These should be less than
200 mV. Excessive noise on the VCC will appear on other pins
and may cause instability or jitter on the control waveforms.
considered. In practice, most manufacturers are unable to
publish this data for all voltages, so designers should use the
curve nearest to the actual voltage applied.
The Si9420DY LITTLE FOOT MOSFET is designed
specifically for converters in the 5- to 25-W power range. It has
a 200-V VDS rating with 1-W rDS(on). Using the Gate charge
curve, for a gate drive of 12 V from the Si9114A, the total gate
charge for 100-V VDS will be 10 nC. From Q = i x t, it is easy
to deduce that with 400 mA gate drive, a time of 50 ns will be
obtained—which is more than adequate for this size MOSFET.
To supply 400 mA, the gate drive circuit resistor will need to be
12 V/400 mA = 30 W (Figure 11).
Ą
PIN 13 Ć CURRENT SENSE
PIN 12 Ć OUTPUT DRIVER
The output driver uses complementary n- and p-channel
output stages, with break-before-make capability, preventing
shoot-through conduction. The output is typically capable of
sourcing 400 mA and sinking 700 mA. When driving power
MOSFETs, remember that the relevant parameter for sizing
the drive requirements is the total gate charge for the applied
voltage, not the commonly used input capacitance, CISS.
When driving a MOSFET in common source mode, the Miller
effect will significantly affect the drive waveform applied to the
gate: in particular, when the driving source impedance is high
enough (Figure 10).
As the voltage is applied to the gate, the previously charged
Cgd will need to discharge, and will thus oppose the application
of any voltage to Vgs. Many designers commonly overestimate
the drive requirements of the MOSFET and cause excessive
noise in the converter by overdriving the MOSFET. To prevent
this, designs typically require snubbers or other additional
noise attenuation devices. The voltage that will be applied to
the drain just prior to driving of the gate will need to be
The current sense comparator performs the current mode
control function by comparing the output of the error amplifier
(VC) with the current in the output inductor.
It is impractical to measure the output inductor current, but the
rising slope of the current can supply all the necessary
information if sampled in the MOSFET as a scaled equivalent.
Certain precautions are necessary, however, due to data
distortion, noise, and the rarity of ideal operating conditions.
Sensed current waveforms often have leading-edge spikes or
noise caused by reverse recovery of rectifiers, equivalent
capacitive loading on the secondary, and inductive circuit
effects. Inductive sense resistors must not be used, as they
cause large damaging spikes and distort the sensed
waveforms. These spikes can confuse the PWM comparator
into believing that an overload condition is present. In addition,
the Si9114A uses a single pin (–Vin) for all the return current
requirements, including the output driver. As a result, the
current pulse from the gate charge transfer into the MOSFET
will appear on the sense pin and be filtered out.
20
Drain
Cgd
Rgate
CDS
Drive
Cgs
Gate-to-Source Voltage (V)
VDS = 100 V
16
12
8
4
0
Source
0
4
8
12
16
Total Gate Charge (Qg)
Figure 10
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Figure 11 Si9420DY Gate Charge
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
L
VOUT
iL
OSC
1
VC
3
2
iL
iDC
ID
VC
RSENSE
ID
Figure 12. Constant Frequency Current Mode Control
Waveform A has an ideal textbook appearance, but is in fact
rarely encountered. Waveforms B and C are typical yet close
to the threshold limit, and thus could lead to instability. The
addition of a simple RC network on the sensed waveform
suppresses this leading-edge spike. The low pass filter should
be selected so that only the leading-edge spike is suppressed
and the overall waveform is not distorted. The waveform must
contain a clean rising slope for the error amplifier to intersect.
If the RC time constant is too long, then the waveform will be
distorted and lead to falling-edge jitter on the turn-off edge.
Slope compensation can also be used to eliminate noise or
jitter. A sample of the oscillator voltage is superimposed on the
error amplifier to produce a clean crossing of the thresholds
and to avoid any hunting.
The Si9114A has built-in leading-edge blanking/ suppression
to eliminate some of the effects of these spikes. The two
comparators used to operate the circuit have different delay
times as follows:
A
B
Figure 13 Current Waveforms
Document Number: 70575
16-Jan-01
S The current mode comparator needs more noise immunity,
and therefore has a deliberately slower delay time to block
out noise and spikes which are present on the leading
edge. Typical delay times should be around 100 ns.
S The peak current limiting comparator has the fastest
response time, since it is used only to protect the circuit in
the event of an overload. The delay times for this
comparator should be around 70 ns.
HIGHĆFREQUENCY DESIGN
REQUIREMENTS
When designing converters for high switching frequency, a
certain discipline is required to determine the right choice of
components. This process should be an iterative choice and
the board layout should be properly planned before CAD
layout is undertaken.
C
Figure 14 Current Sense Filtering Network
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AN701
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Tx1
+
Volts
Si9114ADY
1
2
3
4
5
6
7
VCC
SHUTDOWN Sense
Vref
Output
NI
–Vin
FB
SYNC
COMP
COSC
SS
ROSC
14
13
12
11
10
Q1
Rfilt
Current
Tail
9
8
Cfilt
Rsense
Cref Css
100%
Figure 15
LAYOUT CONSIDERATIONS
The main current loop flows from the input capacitor—through
the transformer, MOSFET, and sense resistor—and returns to
the capacitor. This current will have high rates of change and
associated fast voltage and current edges. It is essential to
avoid the injection of noise into the other circuitry.
To prevent this result, a “fishbone” type arrangement is
recommended (Figure 15). Designers are encouraged to
separate different grounds with “imaginary” dummy resistors.
These can be removed at a later stage. Main current loops
must be designed to be as short as possible: from CIN to the
transformer, through the MOSFET and Sense resistor, and
back into CIN. It is obvious that signals switching 50 V or 1 A
in 25 ns should not be mixed with signals that are controlling
a closed-loop, high-gain feedback system which is capable
of regulating the output voltage to less than 1 mV.
CHOOSING THE SWITCHING FREQUENCY
When selecting the switching frequency, it is usually best to
choose the lowest possible frequency that the design solution
will accept. In PWM control topologies, the maximum switching
frequency will be strongly governed by short circuit behavior.
When a short circuit is applied to the output, the control circuit
is required to reduce the duty cycle to the smallest possible
value to maintain constant current operation (Figure 16).
Ideally, the converter should deliver 105% of the output current
within regulation and no more than 115% under short circuit. At
500 kHz, the period of conversion is 2 ms and the maximum on
time is 1 ms.
High minimum duty ratios will result in current tails and require
rectifier oversizing to avoid destructive currents under
overload conditions.
The Si9114A has a sync-to-output delay of less than 70 ns,
so the minimum duty cycle for operation at 500 kHz would
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8
115%
Amps
–
105%
Cin
+Vin
Figure 16
be 70 ns/2 ms = 3.5%. This minimum should be considered
when the short circuit current is determined. Designers
should note that a shunt placed across the output of the
converter is probably not a realistic load in the event of a failure,
and the real circuit impedance will probably be substantially
lower. In such circumstances, it may be necessary to shift the
frequency of the converter to a lower value during overload.
Frequency shifting can be accomplished by altering the steady
state values of the oscillator programming components (see
oscillator section, Figure 8).
SHORT CIRCUIT BEHAVIOR
Short circuit behavior is different for both common topologies,
and must be paid special attention.
S In flyback converters, all windings appear in “parallel” with
each other. When one winding is shorted, all other flyback
windings are also shorted though it. In multiple output
converters, therefore, any single winding without a
separate secondary current-limiting protection will “drag
down” all the other windings. As a result, if a bias winding
is used to power the control circuit, it will stop delivering
power. When this occurs, the Si9114A depletion device will
turn on and regulate the supply rail to 9.2 V, as in its normal
starting mode. In this event, designers should calculate the
worst-case power dissipation caused by the voltage drop
across the depletion transistor at the highest applied
voltage across it and with the current flowing through it.
S In forward converters, traditionally the bias winding is also
taken in forward conduction mode, but without any series
inductance. In the event of a short circuit, the pulse width
is reduced to minimum, but it is sufficient to supply enough
power to the control circuit. This is an advantage, and
avoids the problems encountered with flyback converters.
Power may also be taken in flyback mode, however, when
the duty cycle is low. There will be very little flyback voltage
present, since the applied volt/microseconds is low and the
core need not, therefore, fly back very far to reset.
Document Number: 70575
16-Jan-01
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CHOOSING THE TOPOLOGY
The choice of topology is usually based on the designer’s
previous experience. The two best candidates for the Si9114A
are the forward and flyback types, although other types, such
as Cuk, are also possible.
In general, forward converters are best for higher-power
applications, and flyback converters are best for lower-power
applications. Both topologies have their merits, and the
designer will have to select the one most suited to his or her
own application. See appendices A and B for brief descriptions
of topologies and magnetic design equations.
SELECTING THE SEMICONDUCTORS
For power switching, the recommended device is the
Si9420DY. The Si9420DY is a 200-V, 1-W MOSFET housed in
an industry-standard SO-8 package. Since the die is mounted
on a copper header, cooling can be accomplished using the
PCB area directly below the Drain pins. The combined
performance of the Si9420DY’s features makes it the best
low-profile device available on the market. It is suitable for
designing power supplies ranging from 10 to 25 W. Other such
single and dual LITTLE FOOT devices are available in both nand p-channel versions with voltages starting from 12 V.
Rectification for low-voltage outputs (< 5 V) is accomplished
using Schottky diodes. In this case, the rectifier selected
exhibited forward voltage drops of 0.4 V at 4 A. A 5-V output will
require a rectifier with a 40-V reverse voltage rating. Where
lower voltages, such as 3 V, are required, devices with lower
reverse blocking should be used, since these will have lower
forward voltage drops. Designers should avoid using an
oversized Schottky diode, since all such devices have
parasitic capacitances that need to be charged and
discharged to the applied voltages. Driving and commutating
oversize devices will not necessarily yield better efficiency,
especially at higher frequencies.
Rectification for voltages above 12 V is generally
accomplished using fast or ultra-fast rectifiers. Look for
devices that have recovery times below 50 ns. An excellent
example is Telefunken Semiconductors’ BYG22B rated for
100 V and 2 A with 25 ns recovery, and Forward voltage of
0.7 V for 0.5 A current. This device is available in a DO-214
surface-mount package.
Opto-isolators are now available in SO-8 packages with
3000 Vrms isolation rating. These are by far the least
expensive and simplest isolated feedback devices now
available. Their reliability, once considered questionable, has
been greatly improved, and manufacturers now have quality
data demonstrating their suitability under the correct operating
conditions. A typical device would be the Telefunken
Semiconductors’ TCMT1020.
the Philips 3F3 and 3F4, designed for operation up to 500 kHz
and 2 MHz respectively. Many different geometries and good
supporting data are now available. Appropriate choices for
low-profile and surface-mount capability include devices in the
EFD series, which have been extended down to 10 mm. It is
better to choose core geometries with shallow and wide
bobbins, since these permit good coupling from winding to
winding when using high frequencies.
CHOOSING CERAMIC CAPACITORS
High-frequency operation allows the use of very low-value
capacitances not generally associated with switchmode
power supply output stages. As substantially lower energy
storage is required, multilayer ceramic capacitors can be used,
and suppliers have made good advances in quality and
manufacturing to supply low-cost, high-performance designs.
In the sub-25-mF area, a number of good dielectric devices are
now available, such as X7R, Z5U, and Y5T.
From manufacturers’ data sheets, the following observations
were made:
S Z5U has the lowest cost, highest unit capacity, and worst
dynamic variations
S X7R has the highest cost, lowest unit capacity, and best
dynamic stability
S Y5T has an average of each of the above.
The recently introduced Marcon TCCR series uses the Y5T
dielectric, which offers good all-around volumetric, cost, and
high-frequency impedance performance, and is available in a
surface-mount package with values such as 10 mF at 25 V and
3.3 mF at 100 V. For input and output energy storage, two of
each of these devices were selected with the following
considerations:
S Realistic market price.
S Voltage variation with applied dc voltage and temperature.
Most ceramic capacitors suffer from a drop of capacitance
with applied voltage and with temperature. The device
needs to be selected so that at the extremes of operation
the minimum energy storage is present.
S Equivalent Series Resistance (ESR). ESR will determine
the output ripple voltage, and the heating of the device.
This should be selected on the basis of the value of output
choke, insofar as its design sets the ripple current present
in the output capacitor.
The following data was obtained from commercially obtained
samples:
At 70oC, the 10-mF device has dropped to 75% of its nominal
value. With 5 V applied, the same device has retained 110%
of its nominal value.
CHOOSING FERRITE MATERIALS
Ferrites suitable for operation at high frequencies have
recently been introduced to the market. Two such offerings are
Document Number: 70575
16-Jan-01
Care should be taken in selecting these devices to consider
worst case requirements and minimum/ maximum operating
conditions.
www.vishay.com
9
AN701
11
12
10
11
Capacitance ( m F)
Capacitance ( m F)
Vishay Siliconix
9
10
8
9
7
8
25
35
45
55
65
75
0
1
2
3
Temperature (_C)
4
5
6
7
8
9
10
11
Voltage (V)
Figure 17. Marcon 10 mF 25 V, Capacitance Versus
Temperature
Figure 18. Marcon 10 mF 25 V, Capacitance Change
with Voltage
DESIGN EXAMPLE: A 15ĆW, 500ĆKHZ, 48ĆV/5ĆV DCĆTOĆDC CONVERTER
Resonant Reset Forward Converter
Most forward converters are designed using a clamp circuit.
While at low frequencies this technique may be acceptable, at
high frequencies it becomes unnecessary: the parasitic
elements of the circuit will reset the transformer flux
automatically, provided a few precautions are taken.
It has been shown that [1] the resonant reset concept is
dominated by the parasitic capacitance of the MOSFET and
the magnetizing inductance of the transformer. Yet the
capacitance of the output diode should also be considered.
The correct equivalent circuit of the converter the
approximates to Figure 19.
During the off time, D2 is conducting and CD1 appears
connected across the primary of the transformer, in parallel
with LMAG. The leakage inductance has a small and
insignificant effect on the waveform—as the primary current
has ceased flowing—and the only remaining current is the
current that is charging COUT .
Ą
Component Selection
The following information is supplied in order to help designer
select correct components for use with the Si9114A.
Vishay Siliconix does not necessarily recommend or approve
these components for specific applications. Designers should
contact manufacturers directly to obtain correct and current
data sheets.
Capacitor Selection
As stated previously, ceramic capacitors are a good choice
when operating at high frequency, due to the extremely low
ESR, and high reliability, and long operating lifetimes.
In the design example, the required size of capacitors was
defined as follows:
CD1
Lout
N=1
Lmag
at a frequency determined by the parasitic elements. The reset
period needs to be short enough to allow full reset of the core,
before the next switching interval occurs. This will be governed
by the selection of the MOSFET and the Schottky diode.
Input capacitor:
D1
D2
Cout
Cin
CAP
Q1
Cout
Vds
A 15-W output converter with 85% efficiency will require
15/0@85 = 17.65 W of input power. Assuming that operation
at nominal conditions is 48 V, with duty cycle of δ =0.376
(measured), the switching current will be governed by the
size of the output inductor (Figure 20).
lA
Figure 19 Resonant Reset Forward Converter
In effect, the magnetizing inductance of the transformer forms
a parallel tuned circuit across the transformer and resonates
www.vishay.com
10
lDC
Figure 20
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
The average input current will be determined by:
Pin
17.65
IDC + V + 48 + 0.358 A
in
Pin
17.65
IA + V x d + 48 x 0.376 + 0.98 A
in
From this equation the RMS value can also be calculated to be
approximately 0.475 A.
The Marcon TCCR70E2A335 3.3-mF, 100-Vdc capacitor has an
ESR rating of 20 mΩ at 500 kHz. This type will therefore dissipate
P = 0.4752 x 0.020 = 4.5 mW due to the switching current. The
ripple produced across this device will be governed by the
discharging current of the capacitor less the input dc voltage
in accordance with:
Q=ixt=CxV
NVripple +
NVripple +
IC x t
C
order to guarantee the ESR over temperature or age, it might
have been necessary to use a radial 1000-mF, 6.3-V Aluminum
Electrolytic in a 10x16 mm case (1257 mm2) to get an ESR
value below 100 mW. It would also be necessary to check the
ESR with frequency at 500 kHz, as this data is seldom offered
for electrolytics. By comparison, the Marcon TCCR70E1E106
10-mF, 25-Vdc is available in 7.5 x 6.3 x 2.75 (130 mm2) and
has an ESR of less than 15 mW at 500 kHz. This will be ideal
for low output ripple an noise. Recently introduced organic
semiconductor electrolytics offer substantial improvements
and could also be considered. In this example, it was decided
to use 2 x 10-mF capacitors in order to obtain low output ripple.
OUTPUT INDUCTOR DESIGN
The output inductor limits the rate at which the current flows
into the output capacitor when the voltage is applied from the
primary through the transformer (Figure 21).
Lout
where t + tsw x d and I C + IA–I DC
0.612 A x 2 ms x 0.376
+ 0.14 V
3.3 mF
140 mV of ripple is probably acceptable as a first stage of
filtering. If lower ripple is required at the input, then a two stage
filter will yield better results.
Output capacitor:
DIout
Cout + 8fDV whereDIout + 0.1 x I out
out
DVout
f
Cout
= maximum output ripple voltage
= operating frequency
0.3 A
+ 8 x 500 kHz x 50 mV + 1.5 mF
The required ESR for obtaining 50 mV of ripple would be
defined by:
DVout
ESRmax + DI
out
50 mV
ESRmax + 0.3 A + 167 mW
In practice, it is impossible to precisely match the value of a
capacitor with the required ESR, and the values of the
capacitors must often be selected to cover all operating
conditions including voltage and temperature.
The above equations and calculations are meant to help the
designer select the approximate size of the components
required, with the final selection based on practical values that
meet the minimum required. In designs operating below
500 kHz, the choice of the capacitor is dictated by the ESR,
and the best high-frequency electrolytics often require
large-size and micro-farad values to meet these
requirements. When operating at 500 kHz, the choice
becomes more based on the practical value closest to the size
and voltage rating required. For example, with electrolytics, in
Document Number: 70575
16-Jan-01
Eout
Ein
iL
Cout
Figure 21
From simple circuit theory, the voltage applied across an
inductor is:
di
VL + L dt
VL + Ein–Eout
where
and di + DI L then L +
ǒEin–E outǓxDt
DIL
In forward converters, at maximum duty cycle,
Ein = 2xEout, and:
1
toff + 2 x F
SW
In this case, substituting gives:
toff + 1mS and L +
Eout x t off
DI L
Therefore
L+
5 V x 1 mS
+ 16.7 mH
0.3 A
In practice, an inductor between 5 and 10 mH would be an
acceptable choice, allowing for manufacturing tolerances and
variations.
The core selected is the EF12.6, which is identical to the core
selected for the transformer design. The EF12.6 is a cheap,
low-profile design available from many suppliers in all parts of
the world. A surface-mounted version of this bobbin was
selected for a design that could be entirely machine wound and
terminated. This implies that larger wire sizes are not possible,
due to automated winding restrictions.
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11
AN701
Vishay Siliconix
L1
EF12.6
9.7 mH
TX1
PL-25
D5SC4M
+
+
D1
36–72 V
DC
35 T
C2
3.3 mF
100 V
C1
3.3 mF
100 V
5V
4A
D5SC4M
IC1
Si9420DY
11 T
11 T
R1, 1 W
C11
10 mF
25 V
C10
10 mF
25 V
D2
–
–
C8
22 pF
R2, 1 W
R3
220 W
C5
2.2 mF
25 V
R4
10 W
R7
390 k
D3
TCMT1020
IC2
6
1
5
47 W
2
4
NC
3
SHUTDOWN
Si9114A
C3
220 pF
14
13
12
11
10
SYNC
9
C4
100 pF
8
R5
68 kW
VCC
+VIN
SENSE
SHD
OUT
–VIN
VREF
NI
SYNC
FB
COSC
COMP
ROSC
SS
C7
100 nF
R11
1 kW
1
C12
2.2 nF
2
3
4
R12
1 kW
1 kW
5
6
7
R6
1 kW
IC4
TL431
C6
100 nF
R10
1 kW
D3, D4 LS4148
Figure 22 DC-to-DC Converter Block Diagram
Since this choke must carry the full output current, the
minimum number of turns required on this core is given by:
Lchoke x IChoke
Nmin + B
max x A min
where Bmax is the maximum flux density used, and Amin is
the minimum core area. In this case Bmax = 200 mT and
Amin = 13 mm2 . Substituting in this equation yields:
Nmin +
8 mH x 3 A
200 mT x 13 mm2
+ 9.2 T
In this case it was decided to wind 3 layers of 12 turns of
0.315 mm in one layer each across the bobbin. This allowed
the best fill factor of the bobbin, maximizing copper area.
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12
The result yields a choke having a dc resistance of 22 mW and
therefore a dc copper loss of P = I2RDC = 9 x 0.022 = 200 mW
with 3 A dc. Using a core set with an AL value of 45, a
transformer of L = Nmin2 x AL = 122 x 45 x 10-9 = 6.48mH was
calculated. Measured value was 9.73 mH: slightly higher, but
acceptable.
TRANSFORMER DESIGN
See appendix A for a design using these specifications.
PERFORMANCE RESULTS
The switching waveforms in Figure 23 show that the resonant
reset is limiting the peak voltage to 120 V, well below the
maximum rating of 200 V. Note the leading edge spike caused
mainly by the peak gate current.
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
➀
➁
➂
➀
➁
➀ VDS of MOSFET 50 V/div
➁ Voltage across sense resistor 1 V/div
➂ Voltage across gate 5 V/div
➀ VDS of MOSFET 50 V/div
➁ Output ripple 10 mV/div
Figure 23 Time Base 500 ns/div.
Figure 24 Time Base 500 ns/div.
➀
➀
➀ Output transient response for 1.5 to 3 A.
➀ Output transient response for 1.5 to 3 A.
Figure 26 Time Base 5 ms/div.
Figure 25 Time Base 200 ms/div.
In Figure 24, the low output ripple (<20 mV) is obtained with two
10-mF capacitors.1 In Figure 26, note the excellent recovery
time of <25 ms to within 1% of output for a 50% load step with
total excursion of <300 mV. The efficiency of the converter is
measured in Figure 27.
100
Efficiency (%)
90
BENEFITS OF USING SI9114A
80
Low power consumption
70
60
0
2
4
6
8
10
12
14
16
18
Output Power (W)
Figure 27 Si9114A 15-W, 500-kHz Converter Efficiency
Document Number: 70575
16-Jan-01
at 500 kHz, the Si9114A consumes only 8 mA from the 12-V
supply. This amounts to a total of 96 mW or 5.6% of the losses.
It is important to remember that this figure represents both the
power MOSFET losses as well as the control circuit. The
control circuit was measured to consume only 3.2 mA or 2% of
the total losses. In comparison, typical bipolar circuits would
consume 35 mA, or 21% of the losses.
Short delay times:
with typical delay time approaching 65 ns, short circuit current
can be lowered, and operation at higher frequencies is
possible.
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13
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Vishay Siliconix
Integrated high-voltage start circuit:
the depletion transistor circuit allows fast turn-on and
eliminates the need for extra components. At lower
frequencies and power levels, it is possible to omit the bias
winding completely, since circuit consumption is low, and the
depletion circuit behaves as a linear regulator.
Synchronization in phase and frequency:
is a necessary benefit for distributed power systems where
multiple converters are operated.
CONCLUSIONS
Operation at 500 kHz is possible using BiC/DMOS PWM
control circuits. Significant power savings are possible,
yielding high efficiencies and lower parts count due to the
integrated high-voltage start circuitry. Operation at high
frequencies allows the use of small, efficient, low-profile
energy storage components, with higher reliability and
calculated MTBFs. Surface mounted power MOSFETs are
easily assembled using conventional assembly techniques.
1
REFERENCES
1. Murakami, Noaki and Yamasaki, Mikio. “Analysis of a
Resonant Rest Condition for a Single Ended Forward
Converter.”
PESC88
Record
(April
1988)
CH
2523-9/88/0000-1018 $1.00 1988 IEEE.
2. Chryssis, George C. High Frequency Switching Power
Supplies: Theory and Design. 2nd. ed. New York: McGraw Hill.
3. “Designing DC/DC converters with the Si9110 Switched
Controller.” AN703. Vishay Siliconix Power Integrated Circuits
Data Book, 1999.
4. “Efficient ISDN Power Converters Using the Si9100.”
AN702. Vishay Siliconix Power Integrated Circuits Data Book,
1999.
The strange shape of the ripple needs to be further analyzed but could be explained as follows:
S The step voltage that appears at the same time as the voltage switching edges is caused entirely by the ESR, as it is the only possible cause
for a rapid step voltage across a capacitor. In this case, the measured value is on the order of 8 mV, thus predicting an ESR value of 6/0.3 = 20 mW
for both devices. This is slightly higher than predicted, but of the same order of magnitude.
S The sinusoidal waveform must be caused by the equivalent capacitance that appears across the inductor, causing a capacitive coupling directly
into the output.
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14
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
Appendix A
FORWARD CONVERTER TRANSFORMER
DESIGN
The forward converter transformer is operated as a voltage
transformer. An ac source applies voltage across the primary,
which is then transformed (up or down) by the turns ratio. For
correct operation, the transformer must be correctly sized (in
order to avoid core saturation) and large enough to accept the
number of turns required. Since these two requirements may
often compete with one another, compromise may be
necessary to complete a design.
In operation, the transformer is driven through the magnetic
B/H loop. In a forward converter, the core is only driven in
quadrant 1. Care must be taken not to saturate it, since only a
“minor loop” is used. The core is driven in the +H direction, and
when the MOSFET turns off, the core is allowed to “float back”
to the H = 0 position. As there is no negative drive, the core
cannot be driven into quadrant 3 (as in the case of a push-pull
converter), and so the core always returns to the BREM
(remnant) position.
be reduced. once this is done, the problem becomes
insignificant, very small core excursions are used.
In selecting the core type and size, the transformer losses
need to be divided more or less evenly between core and
copper losses. Most manufacturers will now supply formulas
extracted from core loss tables that allow precise core loss
calculations to be made. It is important to remember that most
ferrite manufacturers use peak-to-peak flux for their
calculations, while for single quadrant converters, the core
losses will be halved compared to the data published. Most
ferrite manufacturers will likewise recommend levels no higher
than 200 mT for the highest flux swing, to cover the complete
temperature and operating conditions. Most ferrites have the
lowest core losses at between 75 and 95_C. As the
temperature in the transformer gradually rises, the efficiency of
the transformer will increase.
To design a forward converter transformer, the following data
is necessary:
FSW
Operating Switching Frequency, usually 20 to
500 kHz
dmax
Maximum duty cycle, usually 50% in
Vishay Siliconix products
h
Target efficiency, usually 0.75 to 0.85
Brem1
Vinmin
Minimum input voltage used
Brem2
Pout
Total output power
Vout
Output Voltage(s) required
B
1
4
Bsat
H
3
2
Figure 28
In some cases, a small air gap is placed in the core, which
causes the B/H curve to be skewed out. The remnant position
can thus be lowered from the Brem1 to the Brem2 position,
allowing a larger area of operation. In all joined cores (such as
RM or EE), this small gap actually exists in the form of the
interface between the two cores and causes the BH curve to
skew over. In high-frequency applications, this gap has a
significant beneficial effect on the operation of the transformer.
The number of turns is already low, and the gap prevents core
saturation.
Other converters (such as half-bridge and push-pull) use all
four quadrants and make better use of the whole core. These,
however, require additional power switching devices and
windings and are therefore not used. At high frequencies, the
core losses of ferrite materials are high, so the used flux must
Document Number: 70575
16-Jan-01
In this case, a design for a 48-V (38- to 60-V), 5-V, 4-A (20-W)
device operating at 50% duty cycle with 500-kHz switching
frequency will be demonstrated. The period of conversion will be
2 ms, and the maximum on-time thus Tonmax = 1 ms.
The EF12.6, or the EPC13, which have similar characteristics,
will be used as the core. The core operating flux has been
selected to 85 mT as a first pass design. The loss in Philips 3F4
material is calculated from (source Philips Components):
Pv = 12x10–2@ƒ1.75@B29@(0.95x10–4@T2–1.1x10–2@T + 1.15)
Where:
PV = power loss in W/m3
B = operating flux density in Tesla
ƒ = operating frequency in Hertz
T = core temperature in _C
With 500 kHz, 85 mT, and 50_C, the core loss can be
calculated as:
Pv = 742.5 x 103 W/m3 or 0.742 W/cm3
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15
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Vishay Siliconix
The volume of the EF12.6 core is specified as 384 mm3 or
0.384 cm3.
Therefore the core loss will be:
P = 0.742
0.384
P = 0.285 W [ 1/4 W
which represents less than 2% of the total converter losses.
The converter transformer can be calculated by using the
following adapted version of Faraday’s equation:
N+
V in min x ton max
B max x Aeff
Where:
Vinmax = minimum input voltage (V)
SKIN DEPTH
Conductors carrying high-frequency ac current are subject to
a “skin effect” in which the current has a tendency to flow
predominantly on the surface of the conductor instead through
the whole cross section. The value at which the current falls to
1/e (37%) is called the “skin depth.” Below this depth, very little
usage of copper is made, and multiple strands are required for
applications where higher current is required. In some
instances, it may be necessary to use larger wire than
indicated, due to mechanical assembly constraints and ease
of manufacture. The skin depth can be calculated from:
66
XD + Ǹ mm
f
Operation at 500 kHz means that the skin depth will be 0.093
mm (or approximately 0.1 mm). Ideally, a conductor with a
diameter just over twice the skin depth is recommended. In this
case, therefore, 0.2 mm or thereabouts will suffice.
N = number of turns (Integer)
Bmax = maximum peak flux (Tesla)
Aef = effective area of core (m2)
In the case of the EF12.6, the minimum number of turns will be:
N+
36 V x 1 ms
85 mT x 12.2 mm 2
N = 36.64 Turns [ 37 Turns
This is the calculated minimum number of turns that should be
applied. To determine the turns for a given output voltage, first
determine the output voltage (5 V). Then determine all the other
losses that will exist in series with the output: including the
choke, transformer dc losses, and rectifier forward drop.
Assuming these add up to 0.5 V, with a duty cycle of 50%, the
transformer will be required to supply a peak voltage of
Vsec = (Vout+Vloss)/Dmax
Vsec = (5 V + 0.5 V)/0.5 = 11 V
The transformer turns ratio is thus determined: for 36-V input,
11-V output is required. The turns ratio is therefore TR=36/11
= 3.27.
For the 5-V output, the number of turns required is:
NS=Np/TR = 11.01
Therefore, the number of turns selected is 11. The Si9114A will
require a few miliamps of current to power itself and drive the
power MOSFET. This power can be taken from a winding
which peak charges a capacitor through a diode and does not
require an inductor. In this case, 11 turns can also be taken (as
this was calculated to be sufficient for 11 V).
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16
LEAKAGE INDUCTANCE
In PWM converters, the coupling factor between windings
should be optimized to minimize the leakage inductance.
Leakage inductance is a parasitic element, storing energy that
will need to be dissipated. This leakage is a measure of the
quality of the coupling; the lower it is, the better the transformer
and its performance. The leakage inductance can be
measured by shorting out the 5-V winding and measuring the
primary inductance. Ideally, this should be zero, but in reality
values of less than 10% of the primary inductance are typical.
This value can be minimized by splitting the primary winding in
two halves, and by sandwiching all secondaries in between the
two primary halves.
ÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
In this case, the transformer was wound as follows:
Winding
Order
Winding
Name
#
Turns
Wire Size
Start
Pin
End
Pin
1
Half
Primary
17
1x0.3 mm
1
10
2
Bias
Winding
11
3x0.3 mm
3
9
3
Secondary
11
3x0.3 mm
4,5
7,6
4
Half
Primary
18
1x0.3 mm
10
2
Copper wire of 0.3 mm was used to obtain single layer fill
across the surface of the bobbin.
The wound transformer had the following characteristics:
ÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Winding
Inductance
DC Resistance
Primary
883 µH
151 mW
Secondary
87 µH
25 mW
The leakage inductance was measured at 2.25 mH, which
represents less than 1/4% of the primary inductance.
Document Number: 70575
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Vishay Siliconix
The configuration of the forward converter transformer is as
follows (note the polarity/phasing of the windings):
L1
+
D1
C2
D2
C1
The above equations and calculations are supplied only as a
guide for the designer. In practical terms other factors will must
be considered, including the following:
S Effective required voltage adjustment range of output
S Losses in the primary side of the circuit, including the sense
resistor and the MOSFET voltage drops
S Losses in the secondary side of the circuit, including dc
losses in the output choke
S Forward voltage of the rectifier over load and temperature
S Interconnection losses, including remote sense drops
S OR-ing diode losses, if used in multiple converters.
–
Figure 29
Document Number: 70575
16-Jan-01
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17
AN701
Vishay Siliconix
Appendix B
FLYBACK CONVERTER TRANSFORMER DEĆ
SIGN
The flyback magnetic component is often referred to as a
transformer, but should in fact be viewed as an inductor with
energy storage capability.
Two modes of operation are possible. In discontinuous mode,
all the energy is transferred to the output(s). In continuous
mode, some energy remains in the inductor. Discontinuous
mode provides the advantages of a smaller inductor and the
absence of unexpected or difficult transfer modes in the control
mechanism. As energy transfer is complete, furthermore,
rectifier currents always fall to zero before reverse voltages are
applied. The result is lower rectifier switching losses.
For the sake of simplicity, it is recommended that only highly
experienced designers use continuous mode, further
information on which can be reviewed in some of the
publications listed in the reference section of this application
note. In this appendix, only the discontinuous mode is
explained.
Due to the discontinuous nature of the energy transfer
mechanism, flyback inductors are usually larger than the
transformers encountered in forward and other Buck
topologies, where only voltage transformation—and no
energy storage—is performed.
To design a Flyback Inductor, the following information must be
known:
Fsw
operating switching frequency (usually 20 to
500 kHz)
Dmax
maximum duty cycle (usually 50% in
Vishay Siliconix products)
n
target efficiency (usually 0.75 to 0.85)
VMIN
minimum input voltage used
POUT
total output power
VOUT
output voltage(s) required.
In this case, a design for a 24-V (16- to 30-V), 5-V, 2-A (10 W)
inductor will be demonstrated.
The first step is to determine the minimum primary inductance
from:
www.vishay.com
18
Lpmin +
Lpmin +
ǒVin min x ton maxǓ
2
x fsw x h
2 x Pout
(18 IV x 2 ms)2 x 250 kHz x 0.75
2 x 10 W
Lpmin + 12.2 mH [ 12 mH
The next step is to determine the peak primary current. For a
given inductor, the applied voltage will be:
di
V + L dt
Re-arranging yields:
ipk +
ipk +
Vin min x ton max
Lpmax
18 V x 2 ms
12 mH + 3 A
The R.M.S. value for a triangular waveform can be used to
calculate the power that will be dissipated in the MOSFET:
ims + ipk x
ims + 3 A x
Ǹ
d max
3
Ǹ
0.5
3 + 1.22 A [ 1.2 A
To calculate the number of turns required for the 5-V output the
following quotation can be used:
NS + Np
ǒVO
) VFǓ(1–Dmax)
Vinmin D max
in this case, for Dmax = 0.5 and VF = 0.6 V for a 5 V output, the
secondary turns will be:
NS + Np
(5 V ) 0.6 V)(1–0.5)
16 V x 0.5
Document Number: 70575
16-Jan-01
AN701
Vishay Siliconix
Therefore
For 5 V, the number of turns will then be:
NP
1
N N + 0.35 + 2.86
NS + Npx 0.35 + 14 x 0.35 + 4.9 T ] 5 T
S
The primary turns can be derived from the same equation used
for the forward converter output indicator:
Nmin +
LP x IpK
Bmax x Amin
+
N Nmin + 14 Turns.
Document Number: 70575
16-Jan-01
12 mH x 3 A
200 mT x 13 mm 2
+ 13.85 Turns.
In the flyback converter, all windings appear in parallel with
each other, and will track the voltage of the controlled output.
Small variations will be present due to the differences between
Schottky and bipolar rectifiers. It must also be remembered
that this will also cause the bias winding to collapse under short
circuit conditions with possible overpower dissipation.
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19
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