DIODES AP2111

AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Description
Features
•
•
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•
•
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•
•
•
•
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Single USB port power switches with auto-discharge
Short-circuit current and thermal protection
2.45A accurate current limiting
Fast transient response time: 5μs
90mΩ on-resistance
Reverse Current Blocking
Input voltage range: 2.7V – 5.5V
0.6ms typical rise time
Very low shutdown current: 1μA (max)
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 4KV HBM, 300V MM
Active low (AP2101) or active high (AP2111) enable
Ambient temperature range: -35°C to 85°C
SOP-8L and MSOP-8L-EP (Exposed Pad): Available in
“Green” Molding Compound (No Br, Sb)
Lead Free Finish / RoHS Compliant (Note 1)
UL Recognized, File Number E322375 (pending)
IEC60950-1 CB Scheme Certified
The AP2101 and AP2111 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current
and thermal limiting and short circuit protection as well as
controlled rise time, under-voltage lockout and auto-discharge
functionalities. A 7ms deglitch capability on the open-drain Flag
output prevents false over-current reporting and does not require
any external components.
All devices are available in SOP-8L and MSOP-8L-EP packages.
Applications
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Consumer electronics – LCD TV & Monitor, Game Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB
Typical Application Circuit
AP2111 Enable Active High
IN
Power Supply
2.7V to 5.5V
10k
10uF
Load
OUT
0.1uF
0.1uF
120uF
FLG
EN
ON
GND
OFF
Available Options
Part Number
Channel
Enable pin (EN)
AP2101
AP2111
1
1
Active Low
Active High
AP2101/AP2111 Rev. 1
Current limit
(typical)
2.45A
2.45A
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Recommended maximum
continuous load current
2.0A
2.0A
NOVEMBER 2009
© Diodes Incorporated
AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Ordering Information
AP 21 X 1 XX G - X
Enable
0 : Active Low
1 : Active High
1 : 1 Channel
Package
Code
S
MP
Device
AP21X1SG-13
AP21X1MPG-13
Notes:
Package
Green
Packing
S : SOP-8L
MP : MSOP-8L-EP
G : Green
13 : Tape & Reel
Channel
13” Tape and Reel
Quantity
Part Number Suffix
2500/Tape & Reel
-13
2500/Tape & Reel
-13
Packaging
(Note 2)
SOP-8L
MSOP-8L-EP
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Pin Assignment
( Top View )
GND 1
( Top View )
8 NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
FLG
MSOP-8L-EP
SOP-8L
Pin Descriptions
Pin Name
Pin Number
GND
1
IN
2, 3
EN
4
Enable input, active low (AP2101) or active high (AP2111)
FLG
5
Over-current and over-temperature fault report; open-drain flag is active low when
triggered
OUT
6, 7
NC
8
AP2101/AP2111 Rev. 1
Descriptions
Ground
Voltage input pin (all IN pins must be tied together externally)
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Functional Block Diagram
Current
Sense
IN
Discharge
Control
UVLO
Driver
EN
OUT
Current
Limit
Thermal
Sense
FLG
Deglitch
GND
Absolute Maximum Ratings
Symbol
ESD HBM
ESD MM
VIN
VOUT
VEN , VFLG
Iload
TJmax
TST
Notes:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Output Voltage
Enable Voltage
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 3)
Ratings
4
300
6.5
VIN + 0.3
6.5
Internal Limited
150
-65 to 150
Units
KV
V
V
V
V
A
°C
°C
3. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C)
Recommended Operating Conditions
Symbol
VIN
IOUT
TA
Parameter
Input voltage
Output Current
Operating Ambient Temperature
AP2101/AP2111 Rev. 1
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Min
2.7
0
-35
Max
5.5
2.0
85
Units
V
A
°C
NOVEMBER 2009
© Diodes Incorporated
AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Electrical Characteristics
(TA = 25°C, VIN = +5.0V, unless otherwise stated)
Symbol
Parameter
Min
Typ.
Max
1.6
1.9
2.5
V
Disabled, IOUT= 0
0.5
1
μA
Input Quiescent Current
Enabled, IOUT= 0
45
70
μA
Input Leakage Current
Disabled, OUT grounded
Reverse Leakage Current
Disabled, VIN= 0V, VOUT= 5V, IREV at VIN
VIN = 5V, IOUT= 1.5A TA = 25°C MSOP8-EP
VUVLO
Input UVLO
Rload=1kΩ
ISHDN
IQ
Input Shutdown Current
ILEAK
IREV
RDS(ON)
Test Conditions (Note 4)
1
SOP-8L
Switch on-resistance
95
-40°C ≤ TA ≤ 85°C
115
-40°C ≤ TA ≤ 85°C
ILIMIT
Over-Load Current Limit
VIN= 5V, VOUT= 4.5V, CL=120μF
115
115
140
VIN = 3.3V, IOUT= 1.5A TA = 25°C
μA
μA
0.05
90
Unit
mΩ
140
170
2.1
2.45
2.8
A
Output Current Slew rate (<100A/s) , CL=100μF
2.5
A
ISHORT
TSHORT
VIL
VIH
ISINK
Current limiting trigger
threshold
Short-Circuit Current Limit
Short-circuit Response Time
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input leakage
Enabled into short circuit, CL=100μF
VOUT = 0V to IOUT = ILIMIT (short applied to output)
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V
VEN = 5V
2.5
5
A
μs
V
V
TD(ON)
Output turn-on delay time
CL=1μF, Rload=10Ω
50
ITrig
TR
TD(OFF)
TF
RFLG
μA
1.5
μs
ms
μs
ms
Output turn-on rise time
CL=1μF, Rload=10Ω
0.6
CL=1μF, Rload=10Ω
4
Output turn-off fall time
CL=1μF, Rload=10Ω
0.03
0.1
20
40
Ω
7
290
140
15
ms
Ω
°C
FLG output FET on-resistance IFLG =10mA, CL=100μF
FLG blanking time
CIN=10μF, CL=100μF
Discharge resistance (Note 5) VIN = 5V, disabled, IOUT= 1mA
Thermal Shutdown Threshold Enabled, Rload=1kΩ
THYS
Thermal Shutdown Hysteresis
Notes:
1
Output turn-off delay time
TBlank
RDIS
TSHDN
θJA
0.8
2
Thermal Resistance
Junction-to-Ambient
4
25
°C
SOP-8L (Note 6)
110
°C/W
MSOP-8L-EP (Note 7)
60
°C/W
4. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge
path for the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state
currents greater than 8mA.
6. Test condition for SOP-8L: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
7. Test condition for MSOP-8L-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top
layer and thermal vias to bottom layer ground plane.
AP2101/AP2111 Rev. 1
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Typical Performance Characteristics
VEN
50%
TD(ON)
TD(ON)
90%
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
VOUT
10%
TF
90%
10%
90%
10%
Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right)
All Enable Plots are for AP2111 Active High
Turn-Off Delay and Fall Time
Turn-On Delay and Rise Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL=1uF
CL=1uF
TA=25°C
TA=25°C
RL=5Ω
RL=5Ω
400us/div
400us/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL=100uF
TA=25°C
CL=100uF
RL=5Ω
TA=25°C
RL=5Ω
400us/div
400us/div
AP2101/AP2111 Rev. 1
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Typical Performance Characteristics
(Continued)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
Ven
5V/div
Ven
5V/div
CL=100uF
CL=470uF
VIN=5V
Iout
500mA/div
Iout
500mA/div
CL=220uF
VIN=5V
TA=25°C
RL=2.5Ω
TA=25°C
CL=100uF
1ms/div
500us/div
0.6 Ω Load Connected to Enabled Device
Short Circuit with Blanking Time and Recovery
VIN=5V
VIN=5V
TA=25°C
CL=100uF
Vflag
5V/div
TA=25°C
Vout
5V/div
CL=100uF
Vflag
5V/div
Iout
1A/div
Iout
2A/div
2ms/div
50ms/div
Power On
Power Off
TA=25°C
Vflag
5V/div
CL=100uF
Vflag
5V/div
RL=2.5Ω
Iout
1A/div
Iout
1A/div
Vin
5V/div
Vin
5V/div
Vout
5V/div
TA=25°C
Vout
5V/div
CL=100uF
RL=2.5Ω
1ms/div
AP2101/AP2111 Rev. 1
10ms/div
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Typical Performance Characteristics
(Continued)
Device Disabled
Device Enabled
Vflag
5V/div
Vflag
5V/div
VIN=5V
TA=25°C
VIN=5V
Iout
1A/div
Iout
1A/div
TA=25°C
CL=100uF
RL=2.5Ω
CL=100uF
RL=2.5Ω
Ven
5V/div
Ven
5V/div
Vout
5V/div
Vout
5V/div
1ms/div
1ms/div
UVLO Increasing
UVLO Decreasing
TA=25°C
CL=100uF
RL=2.5Ω
Vin
2V/div
Vin
2V/div
Iout
500mA/div
Iout
500mA/div
TA=25°C
CL=100uF
1ms/div
10ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
850
55
750
50
Turn-Off Time (us)
Turn-On Time (us)
RL=2.5Ω
650
550
450
CL=1uF
RL=10Ω
350
CL=1uF
RL=10Ω
45
TA=25°C
40
35
30
TA=25°C
250
25
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
AP2101/AP2111 Rev. 1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Typical Performance Characteristics
(Continued)
Fall Time vs Input Voltage
Rise Time vs Input Voltage
25
650
600
24
Fall Time (us)
Rise Time (us)
550
500
450
CL=1uF
400
23
22
CL=1uF
21
RL=10Ω
RL=10Ω
20
TA=25°C
350
TA=25°C
19
300
2
2.5
3
3.5
4
4.5
5
5.5
2
6
2.5
3
3.5
4.5
5
5.5
6
Supply Current, Output Disabled vs Ambient Temperature
Supply Current, Output Enabled vs Ambient Temperature
0.9
Supply Current, Output Disabled (uA)
52
Supply Current, Output Enabled (uA)
4
Input Voltage (V)
Input Voltage (V)
47
Vin=5.5V
42
37
32
Vin=5.0V
Vin=3.3V
Vin=5.5V
0.8
Vin=5.0V
0.7
0.6
Vin=3.3V
0.5
0.4
0.3
0.2
0.1
0.0
27
-60
-40
-20
0
20
40
60
80
-60
100
-40
-20
0
20
40
60
80
100
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Short-Circuit Output Current vs Ambient Temperature
Static Drain-Source On-State Resistance vs Ambient
Temperature
2.70
Short-Circuit Output Current (A)
140
Static Drain-Source On-State
Resistance (mΩ)
Vin=3.3V
130
120
110
100
90
80
Vin=5.0V
2.65
CL=120uF
Vin=3.3V
2.60
2.55
2.50
Vin=5.0V
2.45
2.40
2.35
2.30
70
-60
-40
-20
0
20
40
60
80
100
AP2101/AP2111 Rev. 1
-60
-40
-20
0
20
40
60
Ambient Temperature (°C)
Ambient Temperature (°C)
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Typical Performance Characteristics
(Continued)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
2.15
3.24
Threshold Trip Current (A)
Undervoltage Lockout (V)
3.22
2.10
UVLO Rising
2.05
2.00
UVLO Falling
1.95
3.20
3.18
3.16
TA=25°C
3.14
CL=68uF
3.12
3.10
3.08
1.90
-60
-40
-20
0
20
40
60
80
100
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
Current Limit Response vs Peak Current
Current Limit Response (us)
45
40
VIN=5V
35
TA=25°C
30
25
20
15
10
5
0
0
2
4
6
8
10
12
Peak Current (A)
AP2101/AP2111 Rev. 1
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Application Note
Power Supply Considerations
A 0.1-μF to 1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is
recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is
recommended when the output load is heavy. This precaution reduces power-supply transients that may
cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor
improves the immunity of the device to short-circuit transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors,
sense FETs do not increase the series resistance of the current path. When an overcurrent condition is
detected, the device maintains a constant output current and reduces the output voltage accordingly.
Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to
GND before the device is enabled or before VIN has been applied. The AP2101/AP2111 senses the short
circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance
the overload occurs, higher current may flow for a very short period of time before the current limit function
can react. After the current limit function has tripped (reached the over-current trip threshold), the device
switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current.
The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of
the device is exceeded. The AP2101/AP2111 is capable of delivering current up to the current-limit threshold
without damaging the device. Once the threshold has been reached, the device switches into its current
limiting mode and is set at ILIMIT.
To protect against short circuit to GND at extremely low temperature (< -30oC), a minimum 120-μF
electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage
rating and temperature characteristics must be properly chosen so that capacitance value does not drop too
low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp.
Our recommended aluminum electrolytic capacitor type is Panasonic FC series.
At low input voltage condition (VIN < 3V), the short circuit protection current may rise as high as twice the
typical value.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output
goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current
and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the
device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms
deglitch timeout. The AP2101/AP2111 is designed to eliminate false over-current reporting without the need
of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large
current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be
calculated by:
2
PD = RDS(ON)× I
AP2101/AP2111 Rev. 1
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Application Note
(Continued)
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for
extended periods of time. The AP2101/AP2111 implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C
due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into
the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back
on. The switch continues to cycle in this manner until the load fault or input power is removed. The
FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms
deglitch.
Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power
supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below
approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems
where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the
downstream ports. This power supply must provide from 5.25V to 4.75V to the board side of the downstream
connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit
protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs,
monitors, printers, and stand-alone hubs.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still
operating. These are considered hot-plug applications. Such implementations require the control of current
surges seen by the main power supply and the card being inserted. The most effective way to control these
surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in
which a power supply normally turns on. Due to the controlled rise times and fall times of the
AP2101/AP2111, these devices can be used to provide a softer start-up to devices being hot-plugged into a
powered system. The UVLO feature of the AP2101/AP2111 also ensures that the switch is off after the card
has been removed, and that the switch is off during the next insertion.
By placing the AP2101/AP2111 between the VCC input and the rest of the circuitry, the input power reaches
these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow
voltage ramp at the output of the device. This implementation controls system surge current and provides a
hot-plugging mechanism for any device.
AP2101/AP2111 Rev. 1
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Marking Information
(1) SOP-8L
( Top view )
8
7
6
5
Logo
Part Number
0 : Active Low
1 : Active High
1 : 1 Channel
G : Green
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
AP21X X
YY WW X X
2
1
3
4
(2) MSOP-8L-EP
( Top view )
8
7
Logo
5
YWXE
Part Number
0 : Active Low
1 : Active High
AP21X X
1
AP2101/AP2111 Rev. 1
6
2
3
A~Z : Green
MSOP-8L-EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
1 : 1 Channel
4
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AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH
Package Information
(All Dimensions in mm)
0.254
0.10/0.20
3.85/3.95
5.90/6.10
(1) Package Type: SOP-8L
Gauge Plane
Seating Plane
0.62/0.82
Detail "A"
7°~9°
7°~9°
0.15/0.25
1.30/1.50
1.75max.
0.35max. 45°
Detail "A"
0°/8°
0.3/0.5
1.27typ
4.85/4.95
5.4
8x-0.60
8x-1.55
6x-1.27
Land Pattern Recommendation
(Unit: mm)
(2) Package Type: MSOP-8L-EP
EXPOSED PAD
(BOTTOM)
4.4
4.7/5.1
2.9/3.1
8x-0.45
8x-1.4
6x-0.65
1
Land Pattern Recommendation
(Unit:mm)
"A"
1
0.25
0.05
2.9/3.1
0.05/0.15
1.35/1.65
EXPOSED PAD
(BOTTOM)
Gauge plane
0.4/0.8
0.95Ref.
0°/8
°
0.75/0.95
0.22/0.38
1.10Max.
0.15Typ.
1
0.65Bsc.
DETAIL "A"
1.65/1.95
AP2101/AP2111 Rev. 1
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
AP2101/AP2111 Rev. 1
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www.diodes.com
NOVEMBER 2009
© Diodes Incorporated