ASM3P1819N February 2007 rev 0.3 Low Power Mobile VGA EMI Reduction IC Features The ASM3P1819N reduces electromagnetic interference • FCC approved method of EMI attenuation (EMI) at the clock source, allowing a system wide EMI • Provides up to 15dB EMI reduction reduction for all the down stream clocks and data • Generates a low EMI spread spectrum clock dependent signals. The ASM3P1819N allows significant and a non-spread Reference Clock of the input system cost savings by reducing the number of circuit frequency board layers, ferrite beads, shielding, and other passive • Optimized for frequency range from 20MHz to • components that are traditionally required to pass EMI 40MHz regulations. Internal loop filter minimizes external components The ASM3P1819N modulates the output of a single PLL in and board space order to “spread” the bandwidth of a synthesized clock, • Down Spread Deviation: -1.25% thereby decreasing the peak amplitude of its harmonics. • Low inherent Cycle-to-Cycle jitter This result in significantly lower system EMI compared to • 3.3V Operating Voltage the typical narrow band signal produced by oscillators and • CMOS/TTL compatible inputs and outputs most clock generators. • Low power CMOS design • Supports notebook VGA and other LCD timing Lowering EMI by increasing a signal’s bandwidth is called “spread spectrum clock generation”. The ASM3P1819N controller applications uses the most efficient and optimized modulation profile • Power Down function for mobile application • Products are available for industrial temperature range. • Available in 8 pin SOIC and TSSOP Packages ASM3P1819N is a proprietary all digital method Applications Functional Description The approved by the FCC and is implemented by using a The ASM3P1819N is targeted towards EMI management versatile spread spectrum for memory and LVDS interfaces in mobile graphic chipsets frequency modulator designed specifically for a wide range and high-speed digital applications such as PC peripheral of input clock frequencies from 20 to 40MHz. The devices, consumer electronics and embedded controller ASM3P1819N can generate an EMI reduced clock from system. crystal, ceramic resonator, or system clock. PD# VDD Block Diagram Crystal Oscillator XOUT PLL Modulation XIN Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT REF VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P1819N February 2007 rev 0.3 Pin Configuration 8 XOUT 7 VDD 3 6 PD# 4 5 REF XIN 1 VSS 2 NC ModOUT ASM3P1819N Pin Description Pin# Pin Name Type Description 1 XIN I Connect to externally generated Clock signal or Crystal. 2 VSS P Ground Connection. Connect to system ground. 3 NC - No Connect. 4 ModOUT O Spread spectrum clock output. 5 REF O Non-modulated Reference clock output of the input frequency. 6 PD# I Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. 7 VDD P Connect to +3.3V. 8 XOUT I Connect to crystal. No connect if externally generated clock signal is used. Absolute Maximum Ratings Symbol Rating Unit Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV VDD, VIN TSTG TDV Parameter Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Output Frequency and Modulation Rate Input Frequency Range (MHz) Output Frequency Range (MHz) Modulation Rate Spread Deviation (%) 20 to 40 20 to 40 Input Frequency / 512 -1.25 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 ASM3P1819N February 2007 rev 0.3 DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Parameter Min Typ Max Unit VIL Input Low voltage VSS – 0.3 - 0.8 V VIH Input High voltage 2.0 - VDD + 0.3 V IIL Input Low current - - -20.0 µA IIH Input High current - - 1.0 µA IXOL XOUT Output low current @ 0.4V, VDD = 3.3V - 3 - mA IXOH XOUT Output high current @ 2.5V, VDD = 3.3V - 3 - mA VOL Output Low voltage VDD = 3.3V, IOL = 20mA - - 0.4 V VOH Output High voltage VDD = 3.3V, IOH = 20mA 2.5 - - V ICC Dynamic Supply current 3.3V and 10pF probe loading 7.1 fIN - min - 26.9 fIN - max mA IDD Static Supply current - 4.5 - mA Operating Voltage - 3.3 - V Power up time (First locked clock cycle after power up) - 0.18 - mS Clock Output impedance - 50 - Ω VDD tON ZOUT AC Electrical Characteristics Symbol Min Typ Max Unit Input Frequency 20 - 40 MHz fOUT Output Frequency 20 - 40 MHz tLH1 Output Rise time ( Measured from 0.8V to 2.0V ) - 0.69 - nS tHL1 Output Fall time ( Measured from 2.0V to 0.8V ) - 0.66 - nS tJC Jitter (Cycle to Cycle) -200 - 200 pS tD Output Duty cycle 45 50 55 % fIN Parameter Note:1. tLH and tHL are measured into a capacitive load of 15pF Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 ASM3P1819N February 2007 rev 0.3 Package Information 8-Pin (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 ASM3P1819N February 2007 rev 0.3 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 ASM3P1819N February 2007 rev 0.3 Ordering Information Part Number Marking Package Type Temperature ASM3P1819NF-08-ST 3P1819NF 8-Pin SOIC, Tube, Pb Free Commercial ASM3P1819NF-08-SR 3P1819NF 8-Pin SOIC, Tape and Reel, Pb Free Commercial ASM3P1819NG-08-ST 3P1819NG 8-Pin SOIC, Tube, Green Commercial Commercial ASM3P1819NG-08-SR 3P1819NG 8-Pin SOIC, Tape and Reel, Green ASM3I1819NF-08-ST 3I1819NF 8-Pin SOIC, Tube, Pb Free Industrial ASM3I1819NF-08-SR 3I1819NF 8-Pin SOIC, Tape and Reel, Pb Free Industrial ASM3I1819NG-08-ST 3I1819NG 8-Pin SOIC, Tube, Green Industrial ASM3I1819NG-08-SR 3I1819NG 8-Pin SOIC, Tape and Reel, Green Industrial ASM3P1819NF-08-TT 3P1819NF 8-Pin TSSOP, Tube, Pb Free Commercial ASM3P1819NF-08-TR 3P1819NF 8-Pin TSSOP, Tape and Reel, Pb Free Commercial ASM3P1819NG-08-TT 3P1819NG 8-Pin TSSOP, Tube, Green Commercial ASM3P1819NG-08-TR 3P1819NG 8-Pin TSSOP, Tape and Reel, Green Commercial ASM3I1819NF-08-TT 3I1819NF 8-Pin TSSOP, Tube, Pb Free ASM3I1819NF-08-TR 3I1819NF 8-Pin TSSOP, Tape and Reel, Pb Free Industrial ASM3I1819NG-08-TT 3I1819NG 8-Pin TSSOP, Tube, Green Industrial ASM3I1819NG-08-TR 3I1819NG 8-Pin TSSOP, Tape and Reel, Green Industrial Industrial Device Ordering Information A S M 3 P 1 8 1 9 N F - 0 8 - S R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 ASM3P1819N February 2007 rev 0.3 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P1819N Document Version: 0.3 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7