BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package Configuration NXP JEITA 1PS76SB70 SOD323 SC-76 single diode 1PS79SB70 SOD523 SC-79 single diode BAS70 SOT23 - single diode BAS70H SOD123F - single diode BAS70L SOD882 - single diode BAS70W SOT323 SC-70 single diode BAS70-04 SOT23 - dual series BAS70-04W SOT323 SC-70 dual series BAS70-05 SOT23 - dual common cathode BAS70-05W SOT323 SC-70 dual common cathode BAS70-06 SOT23 - dual common anode BAS70-06W SOT323 SC-70 dual common anode BAS70-07 SOT143B - dual isolated BAS70-07S SOT363 SC-88 dual isolated BAS70-07V SOT666 - dual isolated BAS70VV SOT666 - triple isolated BAS70XY SOT363 SC-88 quadruple; 2 series 1.2 Features High switching speed High breakdown voltage Low leakage current Low capacitance 1.3 Applications Ultra high-speed switching Voltage clamping BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 70 mA Per diode forward current IF VF forward voltage VR reverse voltage [1] [1] IF = 1 mA - - 410 mV - - 70 V Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2. Pinning information Table 3. Pin Pinning Description Simplified outline Symbol BAS70H; 1PS76SB70; 1PS79SB70 1 cathode 2 anode [1] 1 1 2 2 sym001 001aab540 BAS70L 1 cathode 2 anode [1] 1 1 2 2 sym001 Transparent top view BAS70; BAS70W 1 anode 2 not connected 3 cathode 3 3 2 n.c. 1 006aaa436 1 2 006aaa144 BAS70-04; BAS70-04W 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 3 3 1 2 006aaa437 1 2 006aaa144 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 2 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Table 3. Pin Pinning …continued Description Simplified outline Symbol BAS70-05; BAS70-05W 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1), cathode (diode 2) 3 3 1 2 006aaa438 1 2 006aaa144 BAS70-06; BAS70-06W 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1), anode (diode 2) 3 3 1 2 006aaa439 1 2 006aaa144 BAS70-07 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1) 4 1 3 4 2 1 3 2 006aaa434 BAS70-07S; BAS70-07V 1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1) 6 5 4 1 2 3 6 5 4 1 2 3 006aaa440 001aab555 BAS70VV 1 anode (diode 1) 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode 2) 6 cathode (diode 1) BAS70_1PS7XSB70_SER_9 Product data sheet 6 1 5 2 4 3 6 5 1 2 4 3 sym046 © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 3 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes Table 3. Pinning …continued Pin Description Simplified outline Symbol BAS70XY 1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1), anode (diode 2) [1] 6 5 4 1 2 3 6 5 4 1 2 3 006aaa256 The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Type number 1PS76SB70 Package Name Description Version SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB70 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS70 - plastic surface-mounted package; 3 leads SOT23 BAS70H - plastic surface-mounted package; 2 leads SOD123F BAS70L - leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm SOD882 BAS70W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-04 - plastic surface-mounted package; 3 leads SOT23 BAS70-04W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-05 - plastic surface-mounted package; 3 leads SOT23 BAS70-05W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-06 - plastic surface-mounted package; 3 leads SOT23 BAS70-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-07 - plastic surface-mounted package; 4 leads SOT143B BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT363 BAS70-07V - plastic surface-mounted package; 6 leads SOT666 BAS70VV - plastic surface-mounted package; 6 leads SOT666 BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT363 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 4 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 4. Marking Table 5. Marking codes Type number Marking code[1] Type number Marking code[1] 1PS76SB70 S2 BAS70-05W 75* 1PS79SB70 G BAS70-06 76* BAS70 73* BAS70-06W 76* BAS70H AH BAS70-07 77* BAS70L S8 BAS70-07S 77* BAS70W 73* BAS70-07V 77 BAS70-04 74* BAS70VV N1 BAS70-04W 74* BAS70XY 70* BAS70-05 75* - - [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit - 70 V - 70 mA - 70 mA - 100 mA Per diode VR reverse voltage IF forward current IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 IFSM non-repetitive peak forward current tp ≤ 10 ms Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Tj = 25 °C prior to surge. BAS70_1PS7XSB70_SER_9 Product data sheet [1] © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 5 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit SOT23 - - 500 K/W SOT143B - - 500 K/W Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] SOT363 (BAS70-07S) - - 416 K/W SOT666 (BAS70VV) [2] - - 700 K/W SOT666 (BAS70-07V) [2] - - 416 K/W SOD123F [2] - - 330 K/W SOD323 - - 450 K/W SOD523 [2] - - 450 K/W SOD882 [2] - - 500 K/W - - 625 K/W - - 260 K/W SOT323 Rth(j-sp) thermal resistance from junction to solder point [3] SOT363 (BAS70XY) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 1 mA - - 410 mV IF = 10 mA - - 750 mV IF = 15 mA - - 1 V VR = 50 V - - 100 nA VR = 70 V - - 10 μA VR = 0 V; f = 1 MHz - - 2 pF Per diode VF IR Cd [1] [1] forward voltage reverse current diode capacitance Pulse test: tp ≤ 300 μs; δ ≤ 0.02. BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 6 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes mra803 102 IF (mA) mra805 102 IR (μA) (1) 10 10 (2) 1 1 10−1 10−1 10−2 (1) 10−2 (2) 0 (3) (3) (4) 0.2 0.4 0.6 0.8 1 10−3 0 20 40 60 80 VR (V) VF (V) (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. mra802 103 Reverse current as a function of reverse voltage; typical values mra804 2 Cd (pF) rdif (Ω) 1.5 102 1 10 0.5 1 10−1 1 10 IF (mA) 0 102 0 60 80 Tamb = 25 °C; f = 1 MHz Differential forward resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS70_1PS7XSB70_SER_9 Product data sheet 40 VR (V) f = 10 kHz Fig 3. 20 © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 7 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 8. Package outline 1.35 1.15 0.45 0.15 1 2.7 2.3 0.85 0.75 1.1 0.8 1 1.65 1.25 1.55 1.15 1.8 1.6 2 2 0.40 0.25 0.25 0.10 0.34 0.26 Dimensions in mm Fig 5. 0.65 0.58 03-12-17 Package outline SOD323 (SC-76) 3.0 2.8 0.17 0.11 Dimensions in mm Fig 6. 02-12-13 Package outline SOD523 (SC-79) 1.7 1.5 1.1 0.9 1.2 1.0 1 3 0.55 0.35 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 1 2 0.48 0.38 1.9 2 0.15 0.09 Dimensions in mm Fig 7. 2.7 2.5 04-11-04 Package outline SOT23 (TO-236AB) Dimensions in mm Fig 8. 04-11-29 Package outline SOD123F 2.2 1.8 0.50 0.46 0.62 0.55 0.25 0.10 0.70 0.55 1.1 0.8 0.45 0.15 3 2 0.30 0.22 0.65 0.30 0.22 2.2 1.35 2.0 1.15 1 0.55 0.47 1 Package outline SOD882 0.4 0.3 0.25 0.10 1.3 03-04-17 Dimensions in mm 04-11-04 Fig 10. Package outline SOT323 (SC-70) BAS70_1PS7XSB70_SER_9 Product data sheet 2 cathode marking on top side Dimensions in mm Fig 9. 1.02 0.95 © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 8 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 3.0 2.8 2.2 1.8 1.1 0.9 1.9 6 4 2.5 2.1 1.1 0.8 5 4 2 3 0.45 0.15 3 0.45 0.15 1.4 1.2 1 2.2 1.35 2.0 1.15 pin 1 index 2 0.88 0.78 1 0.48 0.38 0.15 0.09 0.25 0.10 0.3 0.2 0.65 1.3 1.7 Dimensions in mm 04-11-16 Fig 11. Package outline SOT143B Dimensions in mm 06-03-16 Fig 12. Package outline SOT363 (SC-88) 1.7 1.5 6 0.6 0.5 5 4 0.3 0.1 1.7 1.5 1.3 1.1 pin 1 index 1 2 3 0.27 0.17 0.5 0.18 0.08 1 Dimensions in mm 04-11-08 Fig 13. Package outline SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 9 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 4000 8000 10000 1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel -115 - - -135 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70 SOT23 BAS70H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS70W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - 2 mm pitch, 8 mm tape and reel - - -315 - BAS70-07S BAS70-07V BAS70VV SOT363 SOT666 SOT666 4 mm pitch, 8 mm tape and reel BAS70XY SOT363 - -115 - - 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 [1] For further information and the availability of packing methods, see Section 13. [2] T1: normal taping [3] T2: reverse taping BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 10 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) 2.15 0.50 0.60 1.20 solder lands solder paste 0.30 0.40 solder resist occupied area 1.80 1.90 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reflow soldering footprint SOD523 (SC-79) BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 11 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 18. Wave soldering footprint SOT23 (TO-236AB) BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 12 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist R = 0.05 (8×) 0.30 (2×) 0.40 (2×) 0.50 (2×) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD882 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 13 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 0.50 (3×) 1.90 3 solder resist occupied area 1 Dimensions in mm 0.55 (3×) 2.40 msa429 Dimensions in mm Fig 21. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 3 2.10 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Dimensions in mm Fig 22. Wave soldering footprint SOT323 (SC-70) BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 14 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) solder resist 4 3 2.70 occupied area 1.30 3.00 1 2 solder paste msa441 0.90 1.00 2.50 Dimensions in mm Fig 23. Reflow soldering footprint SOT143B 4.45 1.20 (3×) 4 3 1.15 4.00 4.60 solder lands 1 solder resist 2 occupied area Dimensions in mm 1.00 3.40 preferred transport direction during soldering msa422 Dimensions in mm Fig 24. Wave soldering footprint SOT143B BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 15 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.65 0.60 (2×) 0.40 0.90 2.10 (2×) 2.35 0.50 (4×) solder paste solder lands 0.50 (4×) solder resist 1.20 2.40 occupied area MSA432 Dimensions in mm Fig 25. Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 1.3 preferred transport direction during soldering 2.45 5.3 sot363_fw Fig 26. Wave soldering footprint SOT363 (SC-88) BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 16 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.538 2 1.7 1.075 0.3 (2×) 0.55 (2×) placement area solder paste occupied area 0.325 0.375 (4×) (4×) Dimensions in mm 1.7 0.45 (4×) 0.6 (2×) 0.5 (4×) 0.65 (2×) sot666_fr Reflow soldering is the only recommended soldering method. Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 17 of 20 BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 11. Revision history Table 10. Revision history Document ID Release date BAS70_1PS7XSB70_SER_9 20100113 Modifications: • Data sheet status Change notice Supersedes Product data sheet - BAS70_1PS7XSB70_SER_8 This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. BAS70_1PS7XSB70_SER_8 20060504 Product data sheet - BAS70_1PS7XSB70_SER_7 BAS70_1PS7XSB70_SER_7 20050718 Product data sheet - 1PS76SB70_2 1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6 1PS76SB70_2 20040126 Product specification - 1PS76SB70_1 1PS79SB70_1 19980716 Product specification - - BAS70H_1 20050425 Product data sheet - - BAS70L_1 20030520 Product specification - - BAS70-07V_1 20020117 Product specification - - BAS70VV_1 20040910 Product data sheet - - BAS70W_3 19990326 Product specification - BAS70W_2 BAS70-07S_4 20030411 Product specification - BAS70_07S_3 BAS70_SERIES_6 20011011 Product specification - BAS70_5 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 18 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 09 — 13 January 2010 19 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 January 2010 Document identifier: BAS70_1PS7XSB70_SER_9