ROHM BD6736FV

System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras
1 to 2ch Lens Drivers
for Single-Lens Reflex Cameras
BD6735FV, BD6736FV
No.09014EAT03
●Description
The BD6735FV motor driver provides 2 Full-ON Drive H-bridge channels, while BD6736FV provides 1 Full-ON Drive H-bridge
channel. ROHM’s lens driver series features high voltage resistance and large current output in a compact surface mount
package, making it ideally suited for smaller systems such as Single-Lens Reflex with Interchangeable Lenses.
●Features
1) Low ON-Resistance Power MOS output: Full-ON Drive block with 1.0Ω Typ. (BD6735FV)
Full-ON Drive block with 0.35Ω Typ. (BD6736FV)
2) DMOS output allowing a range power supply: 2.0V to 8.0V (BD6735FV), 2.0V to 9.0V (BD6736FV)
3) Built-in step-up circuit for the DMOS gate voltage drive
4) Drive mode switching function
5) H bridge maximum output current: DC maximum 1.0A (BD6735FV and BD6736FV), Peak maximum 3.2A (BD6736FV)
6) UVLO (Under Voltage Lockout Protection) function
7) Built-in TSD (Thermal Shut Down) circuit
8) Standby current consumption: 0μA Typ.
●Absolute Maximum Ratings
Parameter
Power supply voltage
Motor power supply voltage
Charge pump step-up power supply voltage
Limit
Symbol
BD6735FV
BD6736FV
Unit
VCC
-0.5 to +10.0
-0.5 to +10.0
V
VM
-0.5 to +10.0
-0.5 to +10.0
V
VBST
-0.5 to +15.0
-0.5 to +15.0
V
Control input voltage
VIN
-0.5 to VCC+0.5
-0.5 to VCC+0.5
V
Power dissipation
Pd
810※1
810※1
mW
Topr
-30 to +75
-30 to +75
℃
Tjmax
+150
+150
℃
Operating temperature range
Junction temperature
Storage temperature range
Tstg
-55 to +150
-55 to +150
℃
H-bridge output current (DC)
Iout
-1000 to +1000※2
-1000 to +1000※2
mA/ch
Ipeak
-
-3200 to +3200※3
mA/ch
H-bridge output current (Peak)
※1 Reduced by 6.48mW/°C over 25℃, when mounted on a glass epoxy board (70mm  70mm  1.6mm).
※2 Must not exceed Pd, ASO, or Tjmax of 150℃
※3 Peak=100msec
●Operating Conditions (Ta=-30 to +75℃)
Parameter
Limit
Symbol
Unit
BD6735FV
BD6736FV
VCC
2.0 to 8.0
2.0 to 9.0
V
Motor power supply voltage
VM
2.0 to 8.0
2.0 to 9.0
V
Control input voltage
VIN
0 to VCC
0 to VCC
V
Logic input frequency
FIN
0 to 100
0 to 100
kHz
Min. logic input pulse width
TIN
0.5
0.5
μs
Power supply voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
1/8
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
●Electrical Characteristics
1) BD6735FV and BD6736FV Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=5.0V, VM=5.0V)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Overall
Circuit current
ICCST
0
1
μA
PS=0V
during standby operation
Circuit current (BD6735FV)
ICC
0.5
2.0
4.0
mA
PS=H, FIN=100kHz
Circuit current (BD6736FV)
ICC
0.5
1.5
4.0
mA
PS=H, FIN=100kHz
Power saving (PS)
High-level input voltage
VPSH
2.0
VCC
V
Low-level input voltage
VPSL
-0.3
0.5
V
High-level input current
IPSH
25
50
100
μA
VPSH=5V
Low-level input current
IPSL
-1
0
1
μA
VPSL=0V
Control input (BD6735FV; INxA, INxB, PWMEN, and BD6736FV; INA, INB, PWM)
High-level input voltage
VINH
2.0
VCC
V
Low-level input voltage
VINL
-0.3
0.7
V
High-level input current
IINH
25
50
100
μA
VINH=5V
Low-level input current
IINL
-1
0
1
μA
VINL=0V
UVLO
UVLO voltage
VUVLO
1.5
1.9
V
BD6735FV Full-ON Drive block (ch1 and ch2)
Output ON-Resistance
RON
1.0
1.35
Ω
Io=700mA on high and low sides in total
BD6736FV Full-ON Drive block (ch1)
Output ON-Resistance
RON
0.35
0.5
Ω
Io=500mA on high and low sides in total
●Electrical Characteristics
BD6735FV, BD6736FV
BD6735FV, BD6736FV
5.0
600
486mW
400
200
75°C
25
50
75
BD6735FV Op. range
3.0
(2.0V to 8.0V)
2.0
Top 75°C
Mid 25°C
Low -30°C
1.0
0.0
2.0
Ambient temperature : Ta [°C]
400
200
0
6.0
8.0
200
400
600
800
1000
Output current : IOUT [mA]
Fig.4 Output ON-Voltage on Low-Side
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© 2009 ROHM Co., Ltd. All rights reserved.
Top 75°C
Mid 25°C
Low -30°C
0
400
600
800
1000
Fig.3 Output ON-Voltage on High-Side
200
150
100
Top 75°C
Mid 25°C
Low -30°C
50
200
Output current : IOUT [mA]
0
0
200
10.0
BD6736FV
250
Output VDS : VDSH [mV]
Output VDS : VDSL [mV]
600
4.0
Fig.2 Circuit current
BD6735FV
Top 75°C
Mid 25°C
Low -30°C
400
Supply voltage : VCC [V]
Fig.1 Power Dissipation Reduction
800
600
0
0.0
100 125 150
BD6736FV
250
Output VDS : VDSH [mV]
0
(2.0V to 9.0V)
4.0
Output VDS : VDSL [mV]
810mW
800
0
BD6735FV
800
BD6736FV Op. range
Circuit current : ICC [mA]
Power dissipation : Pd [mW]
1000
Top 75°C
Mid 25°C
Low -30°C
200
150
100
50
0
0
200
400
600
800
1000
Output current : IOUT [mA]
Fig.5 Output ON-Voltage on High-Side
2/8
0
200
400
600
800
1000
Output current : IOUT [mA]
Fig.6 Output ON-Voltage on Low-Side
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
●Application Circuit Diagram, Pin Function, and Pin Arrangement
Bypass filter Capacitor for
power supply input. (p.7/8)
Power-saving (p.5/8)
H : Active
L : Standby
1~100uF
1
Power Save
PS 20
TSD & UVLO
Motor control input
(p.5/8)
Bypass filter Capacitor for
power supply input. (p.7/8)
VCC
BandGap
1~100uF
5
BST
6
H bridge
IN1A 19
Level Shift
IN1B 18
Logic
IN2A 17
Full ON
7
&
Pre Driver
4
H bridge
IN2B 16
Full ON
3
PWMEN 15
2
Power Save
Drive mode selection
(p.5/8)
H : EN/IN
L : IN/IN
OSC
10
8
Charge Pump
14
GND
13
CPL1
0.1μF
OUT1
OUT2
M
OUT3
OUT4
MGND2
MGND1
Charge Pump
12
CPL2
VM
11
CPH1
0.1μF
9
CPH2
BST
1.0μF
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND pins generate a
BST voltage. Use caution to ensure that the voltage differential between BST and VM is 3.0V or higher, and that
the BST voltage does not exceed the absolute maximum rating of 15V, especially set the BST voltage direct
input.(p.5/8)
Fig.7 BD6735FV Application Circuit Diagram
PS
20
MGND2
IN1A
19
3
OUT4
IN1B
18
4
OUT3
IN2A
17
5
VM
IN2B
16
6
OUT1
PWMEN
15
7
OUT2
CPL1
14
8
MGND1
CPL2
13
9
BST
CPH1
12
10
GND
CPH2
11
1
VCC
2
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
BD6735FV Pin Function Table
Pin Name
Function
VCC
Power supply pin
MGND2
Motor ground pin 2
OUT4
H-bridge output pin 4
OUT3
H-bridge output pin 3
VM
Motor power supply pin
OUT1
H-bridge output pin 1
OUT2
H-bridge output pin 2
MGND1
Motor ground pin 1
BST
Charge pump step-up power supply pin
GND
Ground pin
CPH2
Capacitor connection pin for second charge 2
CPH1
Capacitor connection pin for second charge 1
CPL2
Capacitor connection pin for first charge 2
CPL1
Capacitor connection pin for first charge 1
PWMEN Drive mode selection pin
IN2B
Control input pin ch2 B
IN2A
Control input pin ch2 A
IN1B
Control input pin ch1 B
IN1A
Control input pin ch1 A
PS
Power-saving pin
Fig.8 BD6735FV Pin Arrangement (Top View)
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© 2009 ROHM Co., Ltd. All rights reserved.
3/8
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
Bypass filter Capacitor for
power supply input. (p.7/8)
Power-saving (p.5/8)
H : Active
L : Standby
1~100uF
20
PS 19
Power Save
VCC
TSD & UVLO
Motor control input
(p.5/8)
Bypass filter Capacitor for
power supply input. (p.7/8)
BandGap
BST
INA 18
1~100uF
Level Shift
Logic
H bridge
&
INB 17
Full ON
Pre Driver
1
9
3
4
7
8
5
6
VM
OUTA
OUTB
MGND
PWM 16
Power Save
Drive mode selection
(p.5/8)
H : EN/IN
L : IN/IN
OSC
Charge Pump
10
15
GND
14
CPL1
Charge Pump
13
CPL2
0.1μF
12
CPH1
0.1μF
11
BST
CPH2
1.0μF
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND pins generate a
BST voltage. Use caution to ensure that the voltage differential between BST and VM is 3.0V or higher, and that
the BST voltage does not exceed the absolute maximum rating of 15V, especially set the BST voltage direct
input. (p.5/8)
Fig.9 BD6736FV Application Circuit Diagram
VCC
20
PS
19
OUTA
INA
18
4
OUTA
INB
17
5
MGND
PWM
16
6
MGND
CPL1
15
7
OUTB
CPL2
14
8
OUTB
CPH1
13
9
VM
CPH2
12
BST
11
1
VM
2
N.C.
3
10
GND
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pin Name
VM
N.C.
OUTA
OUTA
MGND
MGND
OUTB
OUTB
VM
GND
BST
CPH2
CPH1
CPL2
CPL1
PWM
INB
INA
PS
VCC
BD6736FV Pin Function Table
Function
Motor power supply pin
H-bridge output pin A
H-bridge output pin A
Motor ground pin
Motor ground pin
H-bridge output pin B
H-bridge output pin B
Motor power supply pin
Ground pin
Charge pump step-up power supply pin
Capacitor connection pin for second charge 2
Capacitor connection pin for second charge 1
Capacitor connection pin for first charge 2
Capacitor connection pin for first charge 1
Drive mode selection pin
Control input pin ch1 B
Control input pin ch1 A
Power-saving pin
Power supply pin
Fig.10 BD6736FV Pin Arrangement (Top View)
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© 2009 ROHM Co., Ltd. All rights reserved.
4/8
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
●Function Explanation
1) Power-saving function
When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0μA (Typ.).
During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/8)
2) Motor Control input
(1) INxA and INxB pins (BD6735FV), INA and INB pins (BD6736FV)
These pins are used to program and control the motor drive modes. (See the Electrical Characteristics; p.2/8, and I/O
Truth Table; p.5/8)
(2) PWMEN pin (BD6735FV), PWM pin (BD6736FV)
When the High-level voltage is applied to the PWMEN pin (PWM pin), the I/O logic can be set to EN/IN mode.
However, when the Low-level voltage is applied, the I/O logic can be set to IN/IN mode. (See the Electrical
Characteristics; p.2/8, and I/O Truth Table; p.5/8)
3) H-bridge
The 2-channel H-bridges can be controlled independently. For this reason, it is possible to drive the H-bridges
simultaneously, as long as the package thermal tolerances are not exceeded.
The H-bridge output transistors consist of Power DMOS with the charge pump step-up power supply BST.
The total H-bridge ON-Resistance on the high and low sides varies with the BST voltages.
4) Charge pump
Each output H-bridge on the high and low sides consists of Nch DMOS. Therefore, the gate voltage BST should be
higher than the VM voltage to drive the Nch DMOS on the high side.
The BD6735FV and BD6736FV have a built-in charge pump circuit that generates BST voltage by connecting an external
capacitor, between CPL1 and CPL2, CPH1 and CPH2, BST and GND.
In order to ensure better performance, the voltage differential between BST and VM must be 3.0V or higher, and the BST
voltage must not exceed the absolute maximum rating of 15.0V.
●I/O Truth Table
BD6735FV I/O Truth Table
INPUT
Drive mode
PS
EN/IN
PWM
EN
IN1A/2A
IN1B/2B
OUT1/3
OUT2/4
L
H
H
L
H
L
H
X
X
L
H
L
L
H
H
X
L
H
L
Z
H
L
L
Z
L
L
H
Z
L
H
L
Z
H
H
IN/IN
-
L
L
OUTPUT
X
Output mode
Brake
CW
CCW
Standby
CW
CCW
Brake
Standby
L: Low, H: High, X: Don’t care, Z: High Impedance
At CW, current flows from OUT1(3) to OUT2(4). At CCW, current flows from OUT2(4) to OUT1(3).
BD6736FV I/O Truth Table
Drive mode
PS
EN/IN
PWM
H
H
IN/IN
-
L
L
X
INPUT
INA
L
H
H
L
H
L
H
X
INB
X
L
H
L
L
H
H
X
OUTPUT
OUTA
OUTB
L
L
H
L
L
H
Z
Z
H
L
L
H
L
L
Z
Z
Output mode
Brake
CW
CCW
Standby
CW
CCW
Brake
Standby
L: Low, H: High, X: Don’t care, Z: High Impedance
At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA.
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© 2009 ROHM Co., Ltd. All rights reserved.
5/8
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
●I/O Circuit Diagram
INxA, INxB, PWMEN (BD6735FV)
INA, INB, PWM (BD6736FV)
PS
VCC
VCC
VM, MGND, OUT1~4 (BD6735FV)
VCC
VM, MGND, OUTA, B (BD6736FV)
VM
VM
OUT1, 3
OUTA
OUT2, 4
VCC
OUTB
VM
70kΩ
10kΩ
100kΩ
100kΩ
275kΩ
3.33kΩ
MGND
CPH1, CPL1
Inside REG
MGND
BST, CPH2, CPL2
BST
VM
CPH2
CPL2
VM
Fig.11 I/O Circuit Diagram (Resistance values are typical ones)
●Notes for use
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such
damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of
the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
2) Storage temperature range
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply pins and lines
None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control
logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be
connected to a common power supply, do not open the power supply pin but connect it to the power supply externally.
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power
supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all
the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low
temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will
cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed
the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a
voltage clamp diode between the power supply and ground pins.
For this IC with 2 power supplies and a part consists of the CMOS block, it is possible that rush current may flow
instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore,
give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring.
4) Ground pins and lines
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND
wiring pattern of any external components, either.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
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6/8
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.
9) Thermal shutdown circuit
If the junction temperature (Tjmax) reaches 175°C (BD6735FV Typ.) and 160°C (BD6736FV Typ.), the TSD circuit will
operate, and the coil output circuit of the motor will open. There is a temperature hysteresis of approximately 20°C. The
TSD circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to protect
the IC or guarantee its operation. The performance of the IC’s characteristics is not guaranteed and it is recommended that
the device is replaced after the TSD is activated.
10) Testing on application board
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or
removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting and storing the IC.
11) Application example
The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using the
circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components
including static and transitional characteristics as well as dispersion of the IC.
12) Regarding input pin of the IC
+
This monolithic IC contains P isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor
Pin A
Pin B
C
Transistor (NPN)
B
Pin A
N
P+
N
P+
P
N
N
Parasitic
element
P+
GND
www.rohm.com
P+
P
C
N
E
Parasitic
element
P substrate
Parasitic element
Fig.12 Example of Simple IC Architecture
© 2009 ROHM Co., Ltd. All rights reserved.
B
N
P substrate
Parasitic element
Pin B
E
7/8
GND
GND
Other adjacent
elements
GND
2009.06 - Rev.A
Technical Note
BD6735FV, BD6736FV
●Ordering part number
B
D
6
Part No.
7
3
5
F
Part No.
6735 : 8.0V power supply voltage
6736 : 9.0V power supply voltage
3.2A peak current
V
-
Package
FV : SSOP-B20
E
2
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B20
<Tape and Reel information>
6.5 ± 0.2
11
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
20
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
10
0.1± 0.1
1.15 ± 0.1
0.15 ± 0.1
0.1
0.65
0.22 ± 0.1
1pin
Reel
(Unit : mm)
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8/8
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.06 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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