VISHAY SI2315BDS

Si2315BDS
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V)
- 12
rDS(on) (W)
ID (A)
0.050 @ VGS = - 4.5 V
- 3.85
0.065 @ VGS = - 2.5 V
- 3.4
0.100 @ VGS = - 1.8 V
- 2.7
TO-236
(SOT-23)
G
1
3
S
D
Ordering Information: Si2315BDS-T1
2
Top View
Si2315BDS *(M5)
*Marking Code
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 sec
Steady State
Drain-Source Voltage
VDS
- 12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA= 25_C
TA= 70_C
Pulsed Drain Currenta
ID
Continuous Source Current (Diode Conduction)a
IS
TA= 25_C
Power Dissipationa
TA= 70_C
Operating Junction and Storage Temperature Range
PD
V
- 3.85
- 3.0
- 3.0
IDM
- 2.45
A
- 12
- 1.0
- 0.62
1.19
0.75
0.76
0.48
TJ, Tstg
Unit
W
- 55 to 150
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t 5 sec.
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
85
105
130
166
60
75
Unit
_C/W
Notes
a. Surface Mounted on FR4 Board.
b. t v5 sec.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 72014
S-31990—Rev. D, 13-Oct-03
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Si2315BDS
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Limits
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
V(BR)DSS
VGS = 0 V, ID = - 10 mA
- 12
VGS(th)
VDS = VGS, ID = - 250 mA
- 0.45
IGSS
Zero Gate Voltage Drain Current
IDSS
On State Drain Currenta
On-State
ID(on)
D( )
Drain-Source On-Resistancea
Forward Transconductancea
Diode Forward Voltage
rDS(on)
( )
- 0.90
VDS = 0 V, VGS = "8 V
"100
VDS = - 12 V, VGS = 0 V
-1
VDS = - 12 V, VGS = 0 V, TJ = 55_C
- 10
VDS v - 5 V, VGS = - 4.5 V
-6
VDS v - 5 V, VGS = - 2.5 V
-3
V
nA
mA
A
VGS = - 4.5 V, ID = - 3.85 A
0.040
0.050
VGS = - 2.5 V, ID = - 3.4 A
0.050
0.065
0.100
VGS = - 1.8 V, ID = - 2.7 A
0.071
gfs
VDS = - 5 V, ID = - 3.85 A
7
VSD
IS = - 1.6 A, VGS = 0 V
W
S
- 1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
8
VDS = - 6 V, VGS = - 4.5 V
ID ^ - 3.85 A
15
1.1
nC
2.3
715
VDS = - 6 V, VGS = 0, f = 1 MHz
275
pF
200
Switchingb
Turn On Time
Turn-On
Turn-Off Time
td(on)
tr
td(off)
VDD = - 6 V, RL = 6 W
ID ^ - 1.0
10A
A, VGEN = - 4.5
45V
RG = 6 W
tf
15
20
35
50
50
70
50
75
ns
Notes
a.
b.
c.
For DESIGN AID ONLY, not subject to production testing.
Pulse test: PW v300 ms duty cycle v2%.
Switching time is essentially independent of operating temperature.
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Document Number: 72014
S-31990—Rev. D, 13-Oct-03
Si2315BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
12
10
VGS = 4.5 thru 2 V
8
I D - Drain Current (A)
I D - Drain Current (A)
10
Transfer Characteristics
12
6
1.5 V
4
8
6
4
TC = 125_C
2
2
0
0
0.0
25_C
- 55_C
0
1
2
3
4
5
6
0.5
VDS - Drain-to-Source Voltage (V)
2.0
2.5
Capacitance
1200
0.25
1000
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
1.5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.30
1.0
0.20
0.15
VGS = 1.8 V
0.10
VGS = 2.5 V
0.05
Ciss
800
600
400
Coss
Crss
200
VGS = 4.5 V
0.00
0
0
2
4
6
8
10
12
0
2
6
8
10
12
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Gate Charge
On-Resistance vs. Junction Temperature
5
1.6
VDS = 6 V
ID = 3.5 A
4
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
4
3
2
1
0
0
2
4
6
Qg - Total Gate Charge (nC)
Document Number: 72014
S-31990—Rev. D, 13-Oct-03
8
10
1.4
VGS = 4.5 V
ID = 3.5 A
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si2315BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
10
TJ = 150_C
TJ = 25_C
0.3
0.2
ID = 3.5 A
0.1
0.0
1
0.0
On-Resistance vs. Gate-to-Source Voltage
0.4
20
0.2
0.4
0.6
0.8
1.0
0
1.2
1
VSD - Source-to-Drain Voltage (V)
3
4
5
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.6
12
ID = 250 mA
0.4
10
8
0.2
Power (W)
V GS(th) Variance (V)
2
- 0.0
6
- 0.2
4
- 0.4
2
TA = 25_C
- 0.6
- 50
- 25
0
25
50
75
100
125
0
150
0.01
0.1
TJ - Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
Limited
by rDS(on)
1 ms, 100 ms
I D - Drain Current (A)
10
10 ms
100 ms
1s
1
10 s
0.1
dc, 100 s
TA = 25_C
Single Pulse
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
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Document Number: 72014
S-31990—Rev. D, 13-Oct-03
Si2315BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (sec)
Document Number: 72014
S-31990—Rev. D, 13-Oct-03
www.vishay.com
5