VISHAY SI2301ADS

Si2301ADS
New Product
Vishay Siliconix
P-Channel 2.5-V (G-S) MOSFET
PRODUCT SUMMARY
rDS(on) (W)
ID (A)b
0.130 @ VGS = –4.5 V
–2.0
0.190 @ VGS = –2.5 V
–1.6
VDS (V)
–20
TO-236
(SOT-23)
G
1
3
S
D
2
Top View
Si2301DS (1A)*
*Marking Code
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 sec
Steady State
Drain-Source Voltage
VDS
–20
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ b
TA= 25_C
TA= 70_C
Pulsed Drain Currenta
IS
TA= 25_C
Power Dissipationb
TA= 70_C
Operating Junction and Storage Temperature Range
PD
–1.75
–1.6
IDM
Continuous Source Current (Diode Conduction)b
V
–2.0
ID
–1.4
A
–10
–0.75
–0.6
0.9
0.7
0.57
0.45
TJ, Tstg
Unit
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Maximum Junction-to-Ambientb
Maximum Junction-to-Ambientc
RthJA
Typical
Maximum
115
140
140
175
Unit
_
_C/W
Notes
a. Pulse width limited by maximum junction temperature.
b. Surface Mounted on FR4 Board, t v 5 sec.
c. Surface Mounted on FR4 Board.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 71835
S-20617—Rev. B, 29-Apr-02
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Si2301ADS
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Limits
Parameter
Symbol
Test Conditions
Min
V(BR)DSS
VGS = 0 V, ID = –250 mA
–20
VGS(th)
VDS = VGS, ID = –250 mA
–0.45
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "8 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Drain-Source On-Resistancea
Forward Transconductancea
Diode Forward Voltage
–0.95
"100
VDS = –16 V, VGS = 0 V
–1
VDS = –16 V, VGS = 0 V, TJ = 55_C
–10
VDS v –5 V, VGS = –4.5 V
–6
VDS v –5 V, VGS = –2.5 V
–3
nA
m
mA
A
VGS = –4.5 V, ID = –2.8 A
0.093
0.130
VGS = –2.5 V, ID = –2.0 A
0.140
0.190
gfs
VDS = –5 V, ID = –2.8 A
6.5
VSD
IS = –0.75 A, VGS = 0 V
–0.80
–1.2
4.2
10
rDS(on)
V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
VDS = –6 V, VGS = –4.5 V
ID ^ –2.8 A
0.8
Gate-Drain Charge
Qgd
0.8
Input Capacitance
Ciss
500
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = –6 V, VGS = 0, f = 1 MHz
nC
115
pF
62
Switchingc
td(on)
Turn-On Time
Turn-Off Time
tr
td(off)
VDD = –6 V, RL = 6 W
ID ^ –1.0 A, VGEN = –4.5 V
RG = 6 W
tf
6
25
30
60
25
70
10
60
ns
Notes
a. Pulse test: PW v300 ms duty cycle v2%.
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature. S FaxBack 408-970-5600
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Document Number: 71835
S-20617—Rev. B, 29-Apr-02
Si2301ADS
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
10
Transfer Characteristics
10
VGS = 5, 4.5, 4, 3.5, 3 V
2.5 V
6
2V
4
2
2
125_C
4
1.5 V
0
1
25_C
6
2
0, 0.5, 1 V
0
TC = –55_C
8
I D – Drain Current (A)
I D – Drain Current (A)
8
3
4
0
0.0
5
0.5
VDS – Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
3.0
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.6
800
C – Capacitance (pF)
r DS(on)– On-Resistance ( W )
0.5
0.4
0.3
VGS = 2.5 V
0.2
VGS = 4.5 V
600
Ciss
400
200
Coss
0.1
Crss
0.0
0
0
2
4
6
8
0
10
4
Gate Charge
1.6
VDS = 10 V
ID = 3.6 A
16
20
On-Resistance vs. Junction Temperature
VGS = 4.5 V
ID = 3.6 A
4
1.4
r DS(on)– On-Resistance ( W )
(Normalized)
V GS – Gate-to-Source Voltage (V)
12
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
5
8
3
2
1
0
0
1
2
3
Qg – Total Gate Charge (nC)
Document Number: 71835
S-20617—Rev. B, 29-Apr-02
4
5
1.2
1.0
0.8
0.6
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
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Si2301ADS
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
10
0.6
r DS(on)– On-Resistance ( W )
0.5
I S – Source Current (A)
1
TJ = 150_C
0.1
TJ = 25_C
0.01
0.4
ID = 3.6 A
0.3
0.2
0.1
0.0
0.001
0
0.2
0.4
0.6
0.8
1.0
0
1.2
VSD – Source-to-Drain Voltage (V)
2
6
8
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
10
0.4
0.3
8
0.2
6
Power (W)
V GS(th) Variance (V)
4
ID = 250 mA
0.1
4
0.0
2
–0.1
–0.2
–50
–25
0
25
50
75
100
125
0
0.01
150
0.10
1.00
TJ – Temperature (_C)
10.00
100.00
1000.00
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 62.5_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 71835
S-20617—Rev. B, 29-Apr-02