PHILIPS BLL6H1214-500

BLL6H1214-500
LDMOS L-band radar power transistor
Rev. 02 — 1 April 2010
Product data sheet
1. Product profile
1.1 General description
500 W LDMOS power transistor intended for L-band radar applications in the 1.2 GHz to
1.4 GHz range.
Table 1.
Test information
Typical RF performance at Tcase = 25 °C; tp = 300 μs; δ = 10 %; IDq = 150 mA; in a class-AB
production test circuit.
Mode of operation
pulsed RF
f
VDS
PL
Gp
ηD
tr
tf
(GHz)
(V)
(W)
(dB)
(%)
(ns)
(ns)
1.2 to 1.4
50
500
17
50
20
6
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
„ Typical pulsed RF performance at a frequency of 1.2 GHz to 1.4 GHz, a supply voltage
of 50 V, an IDq of 150 mA, a tp of 300 μs with δ of 10 %:
‹ Output power = 500 W
‹ Power gain = 17 dB
‹ Efficiency = 50 %
„ Easy power control
„ Integrated ESD protection
„ High flexibility with respect to pulse formats
„ Excellent ruggedness
„ High efficiency
„ Excellent thermal stability
„ Designed for broadband operation (1.2 GHz to 1.4 GHz)
„ Internally matched for ease of use
„ Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances
(RoHS)
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
1.3 Applications
„ L-band power amplifiers for radar applications in the 1.2 GHz to 1.4 GHz frequency
range
2. Pinning information
Table 2.
Pinning
Pin
Description
1
drain1
2
drain2
3
gate1
4
gate2
5
Simplified outline
1
Graphic symbol
2
1
5
3
3
4
5
4
[1]
source
2
sym117
[1]
Connected to flange.
3. Ordering information
Table 3.
Ordering information
Type number
BLL6H1214-500
Package
Name
Description
Version
-
flanged balanced LDMOST ceramic package;
2 mounting holes; 4 leads
SOT539A
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BLL6H1214-500_2
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
-
100
V
VGS
gate-source voltage
−0.5
+13
V
ID
drain current
-
45
A
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
200
°C
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
2 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Zth(j-c)
transient thermal impedance from
junction to case
Tcase = 85 °C; PL = 500 W
tp = 100 μs; δ = 10 %
Typ
Unit
0.07
K/W
tp = 200 μs; δ = 10 %
0.08
K/W
tp = 300 μs; δ = 10 %
0.1
K/W
tp = 100 μs; δ = 20 %
0.1
K/W
6. Characteristics
Table 6.
DC characteristics
Tj = 25 °C; per section unless otherwise specified.
Symbol Parameter
Conditions
V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.7 mA
Min
Typ
Max Unit
100
-
-
V
VGS(th)
gate-source threshold voltage
VDS = 10 V; ID = 270 mA
1.3
1.8
2.2
V
IDSS
drain leakage current
VGS = 0 V; VDS = 50 V
-
-
1.4
μA
IDSX
drain cut-off current
VGS = VGS(th) + 3.75 V;
VDS = 10 V
32
42
-
A
IGSS
gate leakage current
VGS = 11 V; VDS = 0 V
-
-
140
nA
gfs
forward transconductance
VDS = 10 V; ID = 270 mA
1.7
3
-
S
RDS(on)
drain-source on-state resistance VGS = VGS(th) + 3.75 V;
ID = 9.5 A
-
100
164
mΩ
Table 7.
RF characteristics
Mode of operation: pulsed RF; tp = 300 μs; δ = 10 %; RF performance at VDS = 50 V; IDq = 150 mA;
Tcase = 25 °C; unless otherwise specified, in a class-AB production test circuit.
Symbol
Parameter
Conditions
PL
output power
VDS
drain-source voltage
Gp
RLin
PL(1dB)
output power at 1 dB gain compression
ηD
drain efficiency
Pdroop(pulse)
tr
tf
Min Typ Max Unit
500
-
-
W
PL = 500 W
-
-
50
V
power gain
PL = 500 W
15
17
-
dB
input return loss
PL = 500 W
-
10
-
dB
-
600
-
W
PL = 500 W
45
50
-
%
pulse droop power
PL = 500 W
-
0
0.3
dB
rise time
PL = 500 W
-
20
50
ns
fall time
PL = 500 W
-
6
50
ns
6.1 Ruggedness in class-AB operation
The BLL6H1214-500 is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS = 50 V;
IDq = 150 mA; PL = 500 W; tp = 300 μs; δ = 10 %.
BLL6H1214-500_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
3 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7. Application information
7.1 Impedance information
Table 8.
Typical impedance
Typical values per section unless otherwise specified.
f
ZS
ZL
GHz
Ω
Ω
1.2
1.268 − j2.623
2.987 − j1.664
1.3
2.193 − j2.457
2.162 − j1.326
1.4
2.359 − j2.052
1.604 − j1.887
drain
ZL
gate
ZS
001aaf059
Fig 1.
BLL6H1214-500_2
Product data sheet
Definition of transistor impedance
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
4 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2 RF performance
7.2.1 Performance curves measured with δ = 10 %, tp = 300 μs and Ths = 25 °C
001aak751
700
PL
(W)
600
001aak752
20
Gp
(dB)
(1)
(2)
(3)
(4)
(5)
15
500
400
10
(1)
(2)
(3)
(4)
(5)
300
200
5
100
0
0
0
4
8
12
16
0
100
200
Pi (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1250 MHz
(2) f = 1250 MHz
(3) f = 1300 MHz
(3) f = 1300 MHz
(4) f = 1350 MHz
(4) f = 1350 MHz
(5) f = 1400 MHz
(5) f = 1400 MHz
Output power as a function of input power;
typical values
BLL6H1214-500_2
Product data sheet
400
500
600
700
PL (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA.
(1) f = 1200 MHz
Fig 2.
300
Fig 3.
Power gain as a function of load power;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
5 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
001aak753
60
001aak754
20
Gp
(dB)
ηD
(%)
40
ηD
(%)
ηD
18
(1)
(2)
(3)
(4)
(5)
60
50
Gp
16
40
14
30
12
20
20
10
1175
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA.
1225
1275
1325
10
1375
1425
f (MHz)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1250 MHz
(3) f = 1300 MHz
(4) f = 1350 MHz
(5) f = 1400 MHz
Fig 4.
Drain efficiency as a function of load power;
typical values
Fig 5.
Power gain and drain efficiency as function of
frequency; typical values
001aak755
0
RLin
(dB)
−5
−10
−15
−20
−25
1175
1225
1275
1325
1375
1425
f (MHz)
PL = 500 W; VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA.
Fig 6.
BLL6H1214-500_2
Product data sheet
Input return loss as a function of frequency; typical value
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
6 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.2 Performance curves measured with δ = 10 %, tp = 300 μs and Ths = 65 °C
001aak756
700
PL
(W)
600
001aak757
18
Gp
(dB)
(1)
(2)
(3)
(1)
(2)
(3)
500
12
400
300
6
200
100
0
0
0
6
12
18
0
100
200
300
400
500
Pi (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 100 mA.
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 100 mA.
(1) f = 1200 MHz
(1) f = 1200 MHz
(2) f = 1300 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
(3) f = 1400 MHz
Fig 7.
Output power as a function of input power;
typical values
001aak758
60
Fig 8.
Power gain as a function of load power;
typical values
001aak759
20
ηD
(%)
18
40
55
ηD
Gp
(dB)
ηD
(%)
600
700
PL (W)
45
Gp
(1)
(2)
(3)
16
35
14
25
12
15
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 100 mA.
(1) f = 1200 MHz
10
1.15
1.25
5
1.45
1.35
f (GHz)
PL = 250 W; VDS = 50 V; tp = 300 μs; δ = 10 %;
IDq = 100 mA.
(2) f = 1300 MHz
(3) f = 1400 MHz
Fig 9.
Drain efficiency as a function of load power;
typical values
BLL6H1214-500_2
Product data sheet
Fig 10. Power gain and drain efficiency as function of
frequency; typical values
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
7 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.3 Performance curves measured with δ = 10 %, tp = 300 μs and f = 1300 MHz
001aal688
700
001aal689
20
PL
(W)
Gp
(dB)
600
18
(1)
500
(2)
(3)
16
400
(1)
(2)
(3)
300
14
200
12
100
0
10
0
5
10
15
20
25
0
100
200
300
400
Pi (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA;
f = 1300 MHz.
500
600
700
PL (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA;
f = 1300 MHz.
(1) Ths = −40 °C
(1) Ths = −40 °C
(2) Ths = 25 °C
(2) Ths = 25 °C
(3) Ths = 65°C
(3) Ths = 65°C
Fig 11. Output power as a function of input power;
typical values
Fig 12. Power gain as a function of load power;
typical values
001aal690
60
(1)
(2)
ηD
(%)
(3)
40
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 300 μs; δ = 10 %; IDq = 150 mA; f = 1300 MHz.
(1) Ths = −40 °C
(2) Ths = 25 °C
(3) Ths = 65°C
Fig 13. Drain efficiency as a function of load power; typical values
BLL6H1214-500_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
8 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.4 Performance curves measured with δ = 20 %, tp = 500 μs and Ths = 25 °C
001aal691
700
001aal692
20
PL
(W)
Gp
(dB)
600
16
(1)
500
(1)
(2)
(2)
(3)
(3)
12
400
300
8
200
4
100
0
0
0
5
10
15
20
25
0
100
200
300
400
500
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(1) f = 1200 MHz
(2) f = 1300 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
(3) f = 1400 MHz
Fig 14. Output power as a function of input power;
typical values
001aal693
60
Fig 15. Power gain as a function of load power;
typical values
001aal694
20
Gp
(dB)
(1)
ηD
(%)
55
ηD
(%)
ηD
18
(2)
45
Gp
(3)
40
600
700
PL (W)
16
35
14
25
12
15
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
10
1.15
1.25
5
1.45
1.35
f (GHz)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
Fig 16. Drain efficiency as a function of load power;
typical values
BLL6H1214-500_2
Product data sheet
Fig 17. Power gain and drain efficiency as function of
frequency; typical values
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
9 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.5 Performance curves measured with δ = 20 %, tp = 500 μs and Ths = 65 °C
001aal695
700
001aal696
20
PL
(W)
Gp
(dB)
600
18
(1)
500
(2)
16
(3)
400
(1)
(2)
300
(3)
14
200
12
100
0
10
0
5
10
15
20
25
0
100
200
300
400
500
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(1) f = 1200 MHz
(2) f = 1300 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
(3) f = 1400 MHz
Fig 18. Output power as a function of input power;
typical values
001aal697
60
Fig 19. Power gain as a function of load power;
typical values
001aal698
20
Gp
(dB)
ηD
(%)
600
700
PL (W)
55
ηD
(%)
18
ηD
45
16
Gp
35
(1)
40
(3) (2)
14
25
12
15
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
10
1.15
1.25
5
1.45
1.35
f (GHz)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
Fig 20. Drain efficiency as a function of load power;
typical values
BLL6H1214-500_2
Product data sheet
Fig 21. Power gain and drain efficiency as function of
frequency; typical values
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
10 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.6 Performance curves measured with δ = 20 %, tp = 500 μs and f = 1300 MHz
001aal699
700
001aal700
20
PL
(W)
Gp
(dB)
600
16
(1)
(1)
500
(2)
(2)
(3)
(3)
12
400
300
8
200
4
100
0
0
0
5
10
15
20
25
0
100
200
300
400
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA;
f = 1300 MHz.
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA;
f = 1300 MHz.
(1) Ths = −40 °C
(1) Ths = −40 °C
(2) Ths = 25 °C
(2) Ths = 25 °C
(3) Ths = 65°C
(3) Ths = 65°C
Fig 22. Output power as a function of input power;
typical values
Fig 23. Power gain as a function of load power;
typical values
001aal701
60
ηD
(%)
(1)
(2)
40
(3)
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA; f = 1300 MHz.
(1) Ths = −40 °C
(2) Ths = 25 °C
(3) Ths = 65°C
Fig 24. Drain efficiency as a function of load power; typical values
BLL6H1214-500_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
11 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.7 Performance curves measured with δ = 10 %, tp = 1 ms and Ths = 25 °C
001aal702
700
001aal703
20
PL
(W)
Gp
(dB)
600
16
(1)
500
(1)
(2)
(2)
(3)
(3)
12
400
300
8
200
4
100
0
0
0
5
10
15
20
25
0
100
200
300
400
500
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(1) f = 1200 MHz
(2) f = 1300 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
(3) f = 1400 MHz
Fig 25. Output power as a function of input power;
typical values
001aal704
60
ηD
(%)
Fig 26. Power gain as a function of load power;
typical values
001aal705
20
(1)
Gp
(dB)
(2)
600
700
PL (W)
55
ηD
(%)
ηD
18
45
Gp
(3)
40
16
35
14
25
12
15
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
10
1.15
1.25
5
1.45
1.35
f (GHz)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
Fig 27. Drain efficiency as a function of load power;
typical values
BLL6H1214-500_2
Product data sheet
Fig 28. Power gain and drain efficiency as function of
frequency; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
12 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.8 Performance curves measured with δ = 10 %, tp = 1 ms and Ths = 65 °C
001aal706
700
001aal707
20
PL
(W)
Gp
(dB)
600
16
(1)
500
(1)
(2)
(2)
(3)
(3)
12
400
300
8
200
4
100
0
0
0
5
10
15
20
25
0
100
200
300
400
500
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(1) f = 1200 MHz
(2) f = 1300 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
(3) f = 1400 MHz
Fig 29. Output power as a function of input power;
typical values
001aal708
60
Fig 30. Power gain as a function of load power;
typical values
001aal709
20
Gp
(dB)
ηD
(%)
(1)
600
700
PL (W)
55
ηD
(%)
ηD
18
45
(2)
40
Gp
16
35
(3)
14
25
12
15
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
10
1.15
1.25
5
1.45
1.35
f (GHz)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA.
(1) f = 1200 MHz
(2) f = 1300 MHz
(3) f = 1400 MHz
Fig 31. Drain efficiency as a function of load power;
typical values
BLL6H1214-500_2
Product data sheet
Fig 32. Power gain and drain efficiency as function of
frequency; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
13 of 20
BLL6H1214-500
NXP Semiconductors
LDMOS L-band radar power transistor
7.2.9 Performance curves measured with δ = 10 %, tp = 1 ms and f = 1300 MHz
001aal710
700
001aal711
20
PL
(W)
Gp
(dB)
600
16
(1)
(1)
500
(2)
(2)
(3)
(3)
12
400
300
8
200
4
100
0
0
0
5
10
15
20
25
0
100
200
300
400
Pi (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA;
f = 1300 MHz.
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA;
f = 1300 MHz.
(1) Ths = −40 °C
(1) Ths = −40 °C
(2) Ths = 25 °C
(2) Ths = 25 °C
(3) Ths = 65°C
(3) Ths = 65°C
Fig 33. Output power as a function of input power;
typical values
Fig 34. Power gain as a function of load power;
typical values
001aal712
60
(1)
ηD
(%)
(2)
(3)
40
20
0
0
100
200
300
400
500
600
700
PL (W)
VDS = 50 V; tp = 500 μs; δ = 20 %; IDq = 150 mA; f = 1300 MHz.
(1) Ths = −40 °C
(2) Ths = 25 °C
(3) Ths = 65°C
Fig 35. Drain efficiency as a function of load power; typical values
BLL6H1214-500_2
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8. Test information
Table 9.
List of components
For test circuit see Figure 36.
Component
Description
Value
C1
multilayer ceramic chip capacitor
22 μF; 35 V
C2
multilayer ceramic chip capacitor
51 pF
[1]
C3, C4
multilayer ceramic chip capacitor
100 pF
[1]
C5, C11, C12
multilayer ceramic chip capacitor
1 nf
[2]
C6
multilayer ceramic chip capacitor
47 pF
[1]
C7, C8, C10
multilayer ceramic chip capacitor
51 pF
[3]
C9
multilayer ceramic chip capacitor
100 pF
[3]
C13
electrolytic capacitor
10 μF; 63 V
R1
SMD resistor
56 Ω
R2
metal film resistor
51 Ω
[1]
American Technical Ceramics type 100A or capacitor of same quality.
[2]
American Technical Ceramics type 100B or capacitor of same quality.
[3]
American Technical Ceramics type 800B or capacitor of same quality.
Remarks
0603
C12
C10
C1
C3
C2
C4
C5
C8
C9
C11
C13
R1
R2
C6
C7
001aaj490
Printed-Circuit Board (PCB): Duroid 6006; εr = 6.15 F/m; thickness = 0.64 mm; thickness copper plating = 35 μm.
See Table 9 for a list of components.
Fig 36. Component layout for class-AB production test circuit
BLL6H1214-500_2
Product data sheet
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LDMOS L-band radar power transistor
9. Package outline
Flanged balanced LDMOST ceramic package; 2 mounting holes; 4 leads
SOT539A
D
A
F
D1
U1
B
q
C
w2 M C M
H1
1
c
2
E1
p
H U2
5
L
3
A
E
w1 M A M B M
4
w3 M
b
Q
e
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
mm
4.7
4.2
inches
b
c
D
D1
e
E
E1
11.81 0.18 31.55 31.52
9.50
13.72
11.56 0.10 30.94 30.96
9.30
9.53
9.27
F
H
H1
L
1.75 17.12 25.53 3.48
1.50 16.10 25.27 2.97
p
Q
q
3.30
3.05
2.26
2.01
35.56
U1
U2
w1
41.28 10.29
0.25
41.02 10.03
w2
w3
0.51
0.25
0.185 0.465 0.007 1.242 1.241
0.374 0.375 0.069 0.674 1.005 0.137 0.130 0.089
1.625 0.405
1.400
0.010 0.020 0.010
0.540
0.165 0.455 0.004 1.218 1.219
0.366 0.365 0.059 0.634 0.995 0.117 0.120 0.079
1.615 0.395
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
00-03-03
10-02-02
SOT539A
Fig 37. Package outline SOT539A
BLL6H1214-500_2
Product data sheet
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Rev. 02 — 1 April 2010
© NXP B.V. 2010. All rights reserved.
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LDMOS L-band radar power transistor
10. Abbreviations
Table 10.
Abbreviations
Acronym
Description
LDMOS
Laterally Diffused Metal-Oxide Semiconductor
LDMOST
Laterally Diffused Metal-Oxide Semiconductor Transistor
RF
Radio Frequency
SMD
Surface Mounted Device
L-band
Long wave Band
VSWR
Voltage Standing-Wave Ratio
11. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLL6H1214-500_2
20100401
Product data sheet
-
BLL6H1214-500_1
Modifications:
BLL6H1214-500_1
BLL6H1214-500_2
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
The status of this data sheet has been changed to “Product data sheet”
Added Section 7.2.3 on page 8.
Added Section 7.2.4 on page 9.
Added Section 7.2.5 on page 10.
Added Section 7.2.6 on page 11.
Added Section 7.2.7 on page 12.
Added Section 7.2.8 on page 13.
Added Section 7.2.9 on page 14.
20090120
Objective data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 1 April 2010
-
© NXP B.V. 2010. All rights reserved.
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12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
BLL6H1214-500_2
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BLL6H1214-500
NXP Semiconductors
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product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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14. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ruggedness in class-AB operation . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Impedance information . . . . . . . . . . . . . . . . . . . 4
RF performance . . . . . . . . . . . . . . . . . . . . . . . . 5
Performance curves measured with δ = 10 %,
tp = 300 μs and Ths = 25 °C . . . . . . . . . . . . . . . 5
Performance curves measured with δ = 10 %,
tp = 300 μs and Ths = 65 °C . . . . . . . . . . . . . . . 7
Performance curves measured with δ = 10 %,
tp = 300 μs and f = 1300 MHz. . . . . . . . . . . . . . 8
Performance curves measured with δ = 20 %,
tp = 500 μs and Ths = 25 °C . . . . . . . . . . . . . . . 9
Performance curves measured with δ = 20 %,
tp = 500 μs and Ths = 65 °C . . . . . . . . . . . . . . 10
Performance curves measured with δ = 20 %,
tp = 500 μs and f = 1300 MHz. . . . . . . . . . . . . 11
Performance curves measured with δ = 10 %,
tp = 1 ms and Ths = 25 °C . . . . . . . . . . . . . . . . 12
Performance curves measured with δ = 10 %,
tp = 1 ms and Ths = 65 °C . . . . . . . . . . . . . . . . 13
Performance curves measured with δ = 10 %,
tp = 1 ms and f = 1300 MHz . . . . . . . . . . . . . . 14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 1 April 2010
Document identifier: BLL6H1214-500_2