CYPRESS IBIS4-14000-M

IBIS4-14000-M
IBIS4-14000-C
14-Megapixel CMOS Image Sensor
Features
The IBIS4-14000 is a CMOS active pixel image sensor that is
comprised of 14 MegaPixels with 3048 x 4560 active pixels on
an 8m pitch. The sensor has a focal plane array of 36 x 24mm2
and operates in rolling shutter mode. At 15 MHz, 3 fps are
achieved at full resolution. On-chip FPN correction is available
The pixel design is based on the high-fill-factor active pixel
sensor technology of Cypress Semiconductor Corporation
(US patent No. 6,225,670 and others). The sensor is available
in a monochrome version and a Bayer (RGB) patterned color
filter array.
This data sheet allows the user to develop a camera system
based on the described timing and interfacing.
Applications
Table 1. Key Performance Parameters
Parameter
• Digital photography
Typical Value
Active Pixels
3048 (H) x 4560 (V)
Pixel Size
8 µm x 8 µm
Optical format
35 mm
Shutter Type
Rolling Shutter
Master Clock
15 MHz
Frame rate
3 fps at full resolution
Sensitivity (@ 650 nm)
1256 V.m2/W.s
Full Well Charge
65.000 e-
kTC Noise
35 e-
Dark current
223 e-/s
Dynamic Range
65.4 dB
Supply Voltage
3.3V
Power Consumption
< 176 mW
Color Filter Array
Mono and RGB
Packaging
49-pins PGA
Cypress Semiconductor Corporation
Document #: 38-05709 Rev. *A
•
• Document scanning
• Biometrics
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised February 27, 2006
IBIS4-14000-M
IBIS4-14000-C
Table of Contents
1.0 SPECIFICATIONS ............................................................................................................................................ 4
1.1 General Specifications ................................................................................................................................................... 4
1.2 Electro-optical Specifications ......................................................................................................................................... 4
1.2.1 Overview ............................................................................................................................................................. 4
1.2.2 Spectral Response Curve ................................................................................................................................... 5
1.2.3 Electro-voltaic Response Curve .......................................................................................................................... 5
1.3 Electrical Specifications ................................................................................................................................................. 6
1.3.1 Absolute Maximum Ratings ................................................................................................................................. 6
1.3.2 Recommended Operating Specifications ............................................................................................................ 6
1.3.3 Bias Currents and References ............................................................................................................................ 6
2.0 ARCHITECTURE AND OPERATION ............................................................................................................... 7
2.1 Floor Plan ...................................................................................................................................................................... 7
2.2 Pixel specifications ........................................................................................................................................................ 8
2.2.1 Architecture ......................................................................................................................................................... 8
2.2.2 FPN and PRNU ................................................................................................................................................... 9
2.2.3 Color Filter Array (CFA) ....................................................................................................................................... 9
2.2.4 Output Stage ....................................................................................................................................................... 9
2.2.5 Output Amplifier Crossbar Switch (multiplexer) ................................................................................................. 10
2.3 Readout and Subsampling Modes .............................................................................................................................. 11
2.4 Sensor Readout Timing Diagrams ............................................................................................................................... 14
2.4.1 Row Sequencer ................................................................................................................................................. 14
2.4.2 Timing Pulse Pattern for Readout of a Pixel ...................................................................................................... 16
2.4.3 Fast Frame Reset Timing Diagram .................................................................................................................. 16
2.5 SPI Register ............................................................................................................................................................... 18
2.5.1 SPI Interface Architecture ................................................................................................................................. 18
2.5.2 SPI Register Definition ...................................................................................................................................... 18
3.0 PIN CONFIGURATION ................................................................................................................................... 20
4.0 GEOMETRY & MECHANICAL ...................................................................................................................... 22
4.1 Die Geometry .............................................................................................................................................................. 22
4.2 Pin Number Assignment .............................................................................................................................................. 23
4.3 Package Drawings ...................................................................................................................................................... 24
4.4 Die Placement Dimensions and Accuracy ................................................................................................................... 25
4.5 Cover Glass ................................................................................................................................................................. 26
4.5.1 IBIS4-14000-M (monochrome) .......................................................................................................................... 26
4.5.2 IBIS4-14000-C (color) ....................................................................................................................................... 26
5.0 STORAGE AND HANDLING .......................................................................................................................... 27
5.1 Storage Conditions ...................................................................................................................................................... 27
5.2 Handling Precautions .................................................................................................................................................. 27
5.3 ESD ............................................................................................................................................................................. 27
5.4 Dust and Contamination .............................................................................................................................................. 27
5.5 Soldering ..................................................................................................................................................................... 27
5.6 Precautions and Cleaning ........................................................................................................................................... 27
5.7 RoHS (lead-free) Compliance ...................................................................................................................................... 27
6.0 ORDERING INFORMATION .......................................................................................................................... 29
6.1 Part Numbers .............................................................................................................................................................. 29
6.2 Evaluation Kit ............................................................................................................................................................... 29
Document #: 38-05709 Rev. *A
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IBIS4-14000-M
IBIS4-14000-C
List of Figures
Figure 1. IBIS4-14000 Spectral Response Curve .................................................................................................... 5
Figure 2. IBIS4-14000 Electro-voltaic Response Curve........................................................................................... 5
Figure 3. Block Diagram of the IBIS4-14000 Image Sensor .................................................................................... 7
Figure 4. Location of the 24 Additional Columns and Rows, Scan Direction of the Array ....................................... 8
Figure 5. Pixel and Column Structure Schematic .................................................................................................... 8
Figure 6. Color Filter Arrangement on the Pixels ..................................................................................................... 9
Figure 7. Color Filter Response Curve .................................................................................................................... 9
Figure 8. Output Amplifier Crossbar Switch ........................................................................................................... 10
Figure 9. B and C Subsample Mode ...................................................................................................................... 12
Figure 10. D and E Subsample Mode .................................................................................................................... 13
Figure 11. F Subsample Mode............................................................................................................................... 14
Figure 12. Line Readout Timing............................................................................................................................. 15
Figure 13. Row Readout Timing Sequence ........................................................................................................... 16
Figure 14. Fast Reset Sequence Timing ............................................................................................................... 17
Figure 15. SPI Interface ......................................................................................................................................... 18
Figure 16. Die Geometry and Location of Pixel (0,0) ............................................................................................. 22
Figure 17. Pin Number Assignment ....................................................................................................................... 23
Figure 18. Package Dimensions ............................................................................................................................ 24
Figure 19. Die Placement ...................................................................................................................................... 25
Figure 20. Tolerances ............................................................................................................................................ 25
Figure 21. D-263 Transmittance Curve.................................................................................................................. 26
Figure 22. S8612 Transmittance Curve (w/o AR coating)...................................................................................... 26
List of Tables
Table 1. Key Performance Parameters ................................................................................................................... 1
Table 2. IBIS4-14000 General Specifications ......................................................................................................... 4
Table 3. IBIS4-14000 Electro-optical Specifications ............................................................................................... 4
Table 4. IBIS4-14000 Absolute Maximum Ratings ................................................................................................. 6
Table 5. IBIS4-14000 Recommended Operating Specifications ............................................................................. 6
Table 6. IBIS4-14000 Bias Currents ........................................................................................................................ 6
Table 7. Subsampling Modes ............................................................................................................................... 11
Table 8. Frame Rates and Resolution for Various Subsample Modes ................................................................. 11
Table 9. Timing Constraints for the Row Sequencer ............................................................................................ 15
Table 10. Fast Reset Timing Constraints .............................................................................................................. 17
Table 11. Timing Requirements Serial-Parallel Interface ...................................................................................... 18
Table 12. Serial Sensor Parameters Register Bit Definitions ................................................................................ 19
Table 13. Pin List .................................................................................................................................................. 20
Table 14. Chemical Substances and Information about Any Intentional Content ................................................. 27
Table 15. Ordering Information ............................................................................................................................. 29
Document #: 38-05709 Rev. *A
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IBIS4-14000-M
IBIS4-14000-C
1.0
1.1
Specifications
General Specifications
Table 2. IBIS4-14000 General Specifications
Parameter
Value
Remarks
Pixel architecture
3T pixel
Technology
CMOS
Pixel size
8 x 8 µm2
Resolution
3048 x 4560
Power supply
3.3V
Shutter type
Electronic rolling shutter
Pixel rate
15 MHz nominal
20 MHz with extra power dissipation.
Frame rate
3.25 frames/s
Full resolution with 4 parallel analog outputs
@ 15 MHz/channel
Power dissipation
176 mW
53 mA
1.2
Electro-optical Specifications
1.2.1
Overview
13.9 megapixels
All parameters are measured using the default settings (see
recommended operating conditions) unless otherwise
specified.
Table 3. IBIS4-14000 Electro-optical Specifications
Parameter
Value
Remarks
Effective conversion gain
18.5 V/e25 V/e-
Spectral response * fill factor
0.22 A/W (peak)
Peak Q.E. * fill factor
45%
Between 500 and 700 nm.
Full Well charge
65000 electrons
See note 1.
Linear range
90% of full well charge
Linearity definition: < 3% deviation from straight line through zero
point.
Temporal noise
(kTC noise limited)
35 electrons
kTC noise, being the dominant noise source in the dark at short
integration times.
Dynamic range
1857:1 (65.4 dB)
See note 1.
Linear dynamic range
1671:1 (64.5 dB)
See note 1. 3% deviation.
pA/cm2
Full range. See note 1.
Linear range. See note 1.
Average dark current
55
Dark current signal
223 electrons/s
4.13 mV/s
Average value @ 24°C lab temperature.
Average value @ 24°C lab temperature.
MTF at Nyquist
0.55 in X
0.57 in Y
Measured at 600 nm.
Fixed pattern noise (local)
0.11% Vsat RMS
Average value of RMS variation on local 32 x 32 pixel windows.
Fixed pattern noise (global)
0.15% Vsat RMS
PRNU
<1% RMS of signal
Anti-blooming
105
Charge spill-over to neighboring pixels (= CCD blooming
mechanism)
Note:
1. Settings: VDD = 3.3V, VDDR = 4V and VDD_ARRAY = 3V.
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IBIS4-14000-M
IBIS4-14000-C
1.2.2
Spectral Response Curve
Figure 1. IBIS4-14000 Spectral Response Curve
1.2.3
Electro-voltaic Response Curve
Figure 2. IBIS4-14000 Electro-voltaic Response Curve
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IBIS4-14000-M
IBIS4-14000-C
1.3
Electrical Specifications
1.3.1
Absolute Maximum Ratings
Table 4. IBIS4-14000 Absolute Maximum Ratings
Parameter
Description
Value
Unit
–0.5 to +4.5
V
DC input voltage
–0.5 to VDC + 0.5
V
DC output voltage
–0.5 to VDC + 0.5
V
VDC
DC supply voltage
VIN
VOUT
I
DC current per pin; any single input or output
TSTG
Storage temperature range
±50
mA
–10 to 66 (@ 15% RH)
–10 to +38 (@ 86% RH)
(RH = relative humidity)
°C
8000
feet
Altitude
1.3.2
Recommended Operating Specifications
Table 5. IBIS4-14000 Recommended Operating Specifications
Parameter
Description
Min.
Typ.
Max.
Unit
3.3
3.6
V
VDD
Nominal power supply
VDDRL
VDDRR
Reset power supply level
4
V
VDD_ARRAY
Pixel supply level
3
V
DARKREF
Dark reference offset level
1.7
2.65
3
V
GNDAB
Anti-blooming ground level
0
0
1
V
VOUT
Analog output level
0.5
3
V
VIH
Logic input high level
2.5
3.3
V
VIL
Logic input low level
0
1
V
TA
Commercial operating temperature
0
50
°C (@ 15% RH)
TA
Commercial operating temperature
0
38
°C (@ 86% RH)
1.3.3
Bias Currents and References
Table 6. IBIS4-14000 Bias Currents[2]
Pin Number
Pin Name
Connection
Input Current
Pin Voltage
1
OBIAS
10k to VDD
179 µA
1.51V
36
CBIAS
22k to VDD
91 µA
1.29V
37
PCBIAS
22k to VDD
91 µA
1.29V
48
XBIAS
10k to VDD
181 µA
1.49V
49
ABIAS
or 10M to VDD
0.8V
Note:
2. Tolerance on bias reference voltages: ±150 mV due to process variances.
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IBIS4-14000-M
IBIS4-14000-C
2.0
2.1
Architecture and Operation
Floor Plan
y shift register
pixel array
4560 x 3048 active pixels
4560 Row drivers
4560 Row drivers
y shift register
SYL
RESET
SYR
The basic architecture of the sensor is shown in Figure 3.
Pixel (0,0)
CLK_YL
SYNC_YL
CLK_YR
SYNC_YR
SHS
SHR
CLK_X
SYNC_X
3048 column amplifiers
4 parallel
analog
outputs
x-shift register
Figure 3. Block Diagram of the IBIS4-14000 Image Sensor
The Y shift registers point at a row of the imager array. This
row is selected and/or reset by the row drivers. There are 2 Y
shift registers: one points at the row that is read out and the
second one points at the row to be reset. The second pointer
may lead the first pointer by a specific number of rows. In that
case, the time difference between both pointers is the
integration time. Alternatively, both shift registers can point at
the same row for reset and readout for a faster reset
sequence. When the row is read out, it is also reset in order to
do double sampling for fixed pattern noise reduction.
Document #: 38-05709 Rev. *A
The pixel array of the IBIS4-14000 consists of 4536 x 3024
active pixels and 24 additional columns and rows, which can
also be addressed (see Figure 4). The column amplifiers read
out the pixel information and perform the double sampling
operation. They also multiplex the signals on the readout
buses, which are buffered by the output amplifiers.
The shift registers can be configured for various subsampling
modes. The output amplifiers can be individually powered
down. And some other extra functions are foreseen. These
options are configurable via a serial input port.
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IBIS4-14000-M
IBIS4-14000-C
24 x 4536 dummy pixels
3024 x 24 dummy pixels
Top of camera
3024 x 4536 active pixels
3048 x 4560 total pixels
------------- SKY --------------
pixel 0,0
4 analog outputs
Figure 4. Location of the 24 Additional Columns and Rows, Scan Direction of the Array
2.2
Pixel specifications
2.2.1
Architecture
Column
VDD_ARRAY
PC
RESET
M1
SELECT
M2
M3
SHS
SHR
Figure 5. Pixel and Column Structure Schematic
Document #: 38-05709 Rev. *A
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IBIS4-14000-M
IBIS4-14000-C
The pixel is a classic 3-transistor active pixel. The photodiode
is a high-fill-factor n-well/p-substrate diode. Separate power
supplies are foreseen: general power supply for the analog
image core (VDD), power supply for the reset line drivers
(VDDR) and a separate power supply for the pixel itself
(VDDARRAY).
2.2.2
2.2.3
Color Filter Array (CFA)
FPN and PRNU
Fixed Pattern Noise correction is done on chip with the
so-called Double Sampling technique. The pixel is readout
and this voltage value is sampled on capacitor SHS. After read
out the pixel is reset again and this value is sampled by SHR.
Both sample and reset values of each pixel are subtracted in
the column amplifiers to subtract FPN. Raw images taken by
the sensor typically feature a residual (local) FPN of 0.11%
RMS of the saturation voltage.
The Photo Response Non Uniformity (PRNU), caused by
mismatch of photodiode node capacitances, is not corrected
on-chip. Measurements indicate that the typical PRNU is <1%
RMS of the signal level.
Figure 6. Color Filter Arrangement on the Pixels
The IBIS4-14000 can also be processed with a Bayer RGB
color pattern. Pixel (0,0) has a green filter and is situated on a
green-red row.
Figure 7 shows the response of the color filter array as
function of the wavelength. Note that this response curve
includes the optical cross talk and the NIR filter of the color
glass lid as well (see Section 4.5 for response of the color
glass lid).
2.2.4
Output Stage
Unity gain buffers are implemented as output amplifiers.
These amplifiers can be directly DC-coupled to the
analog-digital converter or coupled to an external programmable gain amplifier.
The (dark reference) offset of the output signal is adjustable
between 1.7V and 3V. The amplifier output signal is negative
going with increasing light levels, with a max. amplitude of
1.2V (at 4V reset voltage, in hard reset mode). The output
signal range of the output amplifiers is between 0.5V and 3V.
Figure 7. Color Filter Response Curve
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IBIS4-14000-M
IBIS4-14000-C
Notes on analog video signal and output amplifier specifications:
.
CLK_YR
• Video polarity: the video signal is negative going with
increasing light level.
• Signal offset: the analog offset of the video signal is settable
by an external DC bias (pin 12 DARKREF). The settable
range is between 1.7V and 3V, with 2.65V being the nominal
expected set point. The output range (including 1.2V video
signal) is thus between 3V and 0.5V.
SYNC_YR
Manual
Q
• Power control: the output amplifiers can be switched
between an “operating” mode and a “standby” mode via the
serial port of the imager (see SPI register configuration).
• Coupling: the IBIS4-14000 can be DC- or AC-coupled to the
AD converter.
2.2.5
Power
Output Amplifier Crossbar Switch (multiplexer)
A crossbar switch is available that routes the green pixels
always to the same output (this is useful for a color device to
avoid gain and offset differences between green pixels). The
switch can be controlled automatically (with a toggle on every
CLK_Y rising edge) or manually (through the SPI register).
Figure 8 shows how it works. A pulse on SYNC_Y resets the
crossbar switch. The initial state after reset of the switchboard
is read from the SPI control register. When the automatic
toggling of the switchboard is enabled, it toggles on every
rising edge of the CLK_Y clock. Separate pins are used for the
SYNC_Y and CLK_Y signals on the crossbar logic these pins
can be connected to the SYNC_YL and CLK_YL pins of the
shift register that is used for readout.
Power
Power
Power
Figure 8. Output Amplifier Crossbar Switch
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IBIS4-14000-M
IBIS4-14000-C
2.3
Readout and Subsampling Modes
The subsampling modes available on the IBIS4-14000 are
summarized in Table 7.
Table 7. Subsampling Modes
Subsampling modes programmed into SPI register
X shift register subsampling settings
Bitcode
Mode
Use
000
001
010
1:1
Full resolution (all columns)
Full resolution (4 outputs)
4:1 subsampling
011
24:1
Select 4 columns/ skip 20
24:1 subsampling ( 2 outputs)
100
8:1
Select 4 columns / skip 4s
8:1 subsampling (2 outputs)
101
12:1
Select 4 columns / skip 8
12:1 subsampling (2 outputs)
Y shift register subsampling settings
Bitcode
Mode
Use
000
010
100
4:1
Select 2 rows / skip 2
4:1 subsampling
001
1:1
Full resolution (all rows)
Full resolution
011
6:1
Select 2 rows / skip 4
6:1 subsampling
101
12:1
Select 2 rows / skip 10
12:1 subsampling
Each mode is selected independently for the X and Y shift
registers. The subsampling mode is configured via the serial
input port of the chip. The Y and X shift registers have some
different subsampling modes, due to constraints in the design
of the chip.
The baseline full resolution operation mode uses 4 outputs to
read out the entire image. 4 consecutive pixels of a row are put
in parallel on the 4 parallel outputs.
Subsampling is implemented by a shift register with
hard-coded subsample modes. Depending on the selected
mode, the shift register skips the required number of pixels
when shifting the row or column pointer.
The X shift register always selects 4 consecutive columns in
parallel. Subsampling in X can be done by activating one of
the modes wherein a multiple of 4 consecutive columns is
skipped on a CLK_X pulse. The Y shift register selects a single
row. It will consecutively select 2 adjacent rows and then skip
an amount of rows set by the subsample mode. This imple-
mentation is chosen for easy subsampling of color images
through a 2-channel readout. In this way color data from 2x2
pixels is made available in all subsample modes. On
monochrome sensors this is not required—only one output
can be used and the each second row selected by the Y shift
register can be skipped. This doubles the frame rate. Note that
for 2 or 1 channel readout, the not-used output amplifiers can
be powered down through the SPI shift register.
Rows can also be skipped by extra CLK_Y pulses. It is not
required to apply additional control pulses to rows that are
skipped. This is a way to implement extra subsampling
schemes. For example, to support the 24:1 X shift register
mode also vertically, the Y shift register can be set to the 12:1
mode and an additional CLK_Y pulse needs to be given at the
start of each row.
Table 8 lists the frame rates of the IBIS4-14000 in various
subsample modes with only one output. The row blanking time
(dead time between readout of successive rows) has been set
to 17.5 s.
Table 8. Frame Rates and Resolution for Various Subsample Modes
Ratio
# Outputs
Image Resolution
Frame rate [frames/s]
Frame readout time [s]
1:1
4
3024 x 4536
3.25
0.308
4:1
1
756 x 1134
12.99
0.077
8:1
1
378 x 567
41.30
0.024
12:1
1
252 x 378
77.13
0.013
Note that the 24 additional columns and rows (see Figure 4) do not subsample.
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IBIS4-14000-M
IBIS4-14000-C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
mode B - 1:1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
mode C - 1:4
Figure 9. B and C Subsample Mode
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IBIS4-14000-M
IBIS4-14000-C
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2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
mode D - 1:6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
mode E - 1:8
Figure 10. D and E Subsample Mode
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IBIS4-14000-M
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2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
modeF - 1:12
Figure 11. F Subsample Mode
2.4
Sensor Readout Timing Diagrams
2.4.1
Row Sequencer
The row sequencer controls pulses to be given at the start of
each new line. Figure 12 shows the timing diagram for this
sequence.
The signals to be controlled at each row are:
• CLK_YL and CLK_YR: These are the clocks of the YL and
YR shift register. They can be driven by the same signals
and at a continuous frequency. At every rising edge, a new
row is being selected.
• SELECT: This signal connects the pixels of the currently
sampled line with the columns. It is important that PC and
SELECT are never active together.
• PC: An initialization pulse that needs to be given to
precharge the column.
• SHS (Sample & Hold pixel Signal): This signal controls the
track & hold circuits in the column amplifiers. It is used to
sample the pixel signal in the columns. (0 = track ; 1 = hold)
• RESET: This pulse resets the pixels of the row that is
currently being selected. In rolling shutter mode, the RESET
signal is pulsed a second time to reset the row selected by
the YR shift register. For “reset black” dark reference
signals, the reset pulse can be pulsed also during the first
PC pulse. Normally, the rising edge of RESET and the falling
Document #: 38-05709 Rev. *A
edge of PC occur at the same position. The falling edge of
RESET lags behind the rising PC edge.
• SHR (Sample & Hold pixel Reset level): this signal controls
another track & hold circuit in the column amplifiers. It is
used to sample the pixel reset level in the columns (for
double sampling). (0 = track ; 1 = hold)
• SYL (Select YL register): Selects the YL shift register to
drive the reset line of the pixel array
• SYR (Select YR register): Selects the YR shift register to
drive the reset line of the pixel array. For rolling shutter applications, SYL and SYR are complementary. In full frame
readout, both registers may be selected together, only if it
is guaranteed that both shift registers point to the same row.
This can reduce the row blanking time.
• SYNC_YR and SYNC_YL: Synchronization pulse for the
YR and YL shift registers. The SYNC_YR/SYNC_YL signal
is clocked in during a rising edge on CLK_YR/CLK_YL and
resets the YR/YL shift register to the first row. Both pulses
are pulsed only once each frame. The exact pulsing scheme
depends on the mode of use (full frame/ rolling shutter). A
200 ns set-up time applies. See Table 9.
• SYNC_X: Resets the column pointer to the first row. This
has to be done before the end of the first PC pulse, in case
when the previous line has not been read out completely.
Figure 12 shows the basic timing diagram of the IBIS4-14000
image sensor and Table 9 shows the timing specifications of
the clocking scheme
Page 14 of 30
IBIS4-14000-M
IBIS4-14000-C
CLOCK_YL
SYNC_YR
SYNC_YL
k
Once each
frame
a
PC
l
b
b
c
SHS
d
SELECT
RESET
f
d
e
e
g
h
h
j
m
h
j
For each
new row
Optional reset pulse
for reset black
c
SHR
f
SYL
i
SYR
Only when the electronic
shutter is used
Figure 12. Line Readout Timing
Table 9. Timing Constraints for the Row Sequencer
Symbol
Min.
Typ.
Description
a
200 ns
600 ns
Min. SYNC set-up times. SYNC_Y is clocked in on rising edge on CLK_Y. SYNC_Y pulse
must overlap CLK_Y by one clock period. Set-up times of 200 ns apply after SYNC edges.
Within this set-up time no rising CLK edge may occur
b
2.7 µs
Duration of PC pulse
c
10 µs
Delay between falling edge on PC and rising edge on SHS/SHR. Duration of SHS/SHR
pulse
d
1.3 µs
Delay between rising edge on PC and rising edge on SELECT
e
6.5 µs
Delay between rising edge on SELECT and rising edge on SHS/SHR.
f
100 ns
Delay between rising edge on SHS and falling edge on SELECT.
g
1.4 µs
Delay between falling edge of SELECT and rising edge of RESET
h
5 µs
i
1.28 µs
Delay between rising edge on SHR and rising edge on SYR
500 ns
SYL and SYR pulses must overlap second RESET pulse at both sides by one clock cycle
240 ns
Duration of CLOCK_Y pulse
j
k
h+2*CLK
Duration of RESET pulse
l
3µs
Delay between falling edge of CLK_Y and Falling edge of PC and SHS
m
500ns
Delay between falling edge of RESET and falling edge of PC and SHR
Notes:
CLK = one clock period of the master clock, shortest system
time period available.
CLK_YL. The SYNC_YR pulse leads the SYNC_YL pulse by
a given number of rows. Relative to the row timing, both SYNC
pulses are given at the same time position.
In the above timing diagram, the YR shift register is used for
the electronic shutter. The CLK_YR is driven identically as
SYNC_YR and SYNC_YL are only pulsed once each frame,
SYNC_YL is pulsed when the first row will be read out and
Document #: 38-05709 Rev. *A
Page 15 of 30
IBIS4-14000-M
IBIS4-14000-C
SYNC_YR is pulsed for the electronic shutter at the appropriate moment.
This timing assumes that the registers that control the
subsampling modes have been loaded in advance (through
the SPI interface), before the pulse on SYNC_YL or
SYNC_YR.
The second reset pulse and the pulses on SYL and SYR (all
pulses drawn in red) are only applied when the rolling
electronic shutter is used. For full frame integration, these
pulses are skipped.
The SYNC_Y pulse is also used to initialize the switchboard
(output multiplexer). This is also done by a synchronous reset
on the rising edge of CLK_Y. Normally the switchboard is
controlled by the shift register used for readout (this is the YL
shift register). This means that pin SYNC_Y can be connected
to SYNC_YL, and pin CLK_Y can be connected to CLK_YL.
The additional RESET BLACK pulse (indicated in dashed lines
in Figure 12) can be given to make one or more lines black.
This can be useful to generate a dark reference signal.
2.4.2
• Important The SYNC_X signal has a set-up time Ts of
150 ns. For the YR and YS shift registers, the set-up time
is 200 ns. CLK_X must be stable at least during this set-up
time.
In the case where a partial row readout has been performed,
2 CLK_X pulses (with SYNC_X = LOW) are required to fully
deselect the column where the X pointer has been stopped. A
single CLK_X will leave the column partially selected, which
will then have a different response when read out in the next
row. When full row readout has been performed, the last
column will be fully deselected by a single CLK_X pulse (with
SYNC_X = LOW). The X-register is reset by a single CLK_X
pulse (with SYNC_X = LOW). In case of partial row readout,
the SYNC_X pulse has to be given before the sample pulses
(SHR and SHS) of the row sampling process, in order to avoid
a different response of the last column of the previous window.
For the X shift register, the analog signal is delayed by 2 clock
periods before it becomes available at the output (due to
internal processing of the signal in the columns and output
amplifier). The figure gives an example of an ADC clock for an
ADC that samples on the rising edge.
Timing Pulse Pattern for Readout of a Pixel
Figure 13 shows the timing diagram to preset (sync) the X shift
register, read out the image row, and analog-digital
conversion. There are 3 tasks:
• Preset the X shift register: apply a low level to SYNC_X
during a rising edge on CLK_X at the start of a new row
• Readout of the image row: pulse CLK_X
• Analog-digital conversion: clock the ADC
The SYNC pulses perform a synchronous reset of the shift
registers to the first row/column on a rising edge on CLK. This
is identical for all shift registers (YR, YL and X).
Ts
2.4.3
Fast Frame Reset Timing Diagram
Figure 14 shows the reset timing for a fast frame reset.
SYL and SYR can be kept both high to make the reset
mechanism faster and reduce propagation delays. PC, SHS,
SHR can be kept high since they don’t interact with the pixel
reset mechanism.
Table 10 lists timing specifications for RESET, CLK_Y and
SELECT.
Ts
SYNC _X
CLK_X
A n a lo g
O u tp ut
p ixe l 1
CLK_ADC
(e xa m p le )
p ixe l 2
p ixe l 3
X
Figure 13. Row Readout Timing Sequence
Document #: 38-05709 Rev. *A
Page 16 of 30
IBIS4-14000-M
IBIS4-14000-C
Table 10. Fast Reset Timing Constraints
Symbol
Typical
Description
a
0 µs
Delay between rising CLK_Y edge and
Reset.
b
4 µs
Reset pulse width.
c
0
Reset hold time.
d
1.6 µs
Select pulse width.
e
1 µs
Setup hold time.
CONSTRAINT: a + e > 1 us due to
propagation delay on pixel select line.
CLK_YR
CLK_YL
SELECT
a
c
d
e
PC
SHS
b
RESET
SHR
SYL
SYR
b
SYNC_YR
SYNC_YL
Figure 14. Fast Reset Sequence Timing
Document #: 38-05709 Rev. *A
Page 17 of 30
IBIS4-14000-M
IBIS4-14000-C
2.5
SPI Register
2.5.1
SPI Interface Architecture
The elementary unit cell of the serial to parallel interface
consists of two D-flip-flops. The architecture is shown in
Figure 15. 16 of these cells are connected in parallel, having
a common /CS and SCLK form the entire uploadable
parameter block, where Din is connected to Dout of the next
cell. The uploaded settings are applied to the sensor on the
rising edge of signal /CS.
To sensor core
16 outputs to sensor core
Din
D
Dout
Q
SCLK
C
CS
Entire uploadable parameter block
CS
D
Din
SCLK
Q
Dout
SCLK
C
Th
Tsclk
Unity Cell
Din
D0
D1
D2
D15
CS
Data
valid
Ts
Figure 15. SPI Interface
Table 11. Timing Requirements Serial-Parallel Interface
2.5.2
Parameter
Value
Tsclk
100 ns
Ts
50 ns
Th
50 ns
SPI Register Definition
Sensor parameters can be serially uploaded inside the sensor
at the start of a frame. The parameters are:
• Subsampling modes for X and Y shift registers (3-bit code
for 6 subsampling modes)
Document #: 38-05709 Rev. *A
• Power control of the output amplifiers, column amps and
pixel array. Each amplifier can be individually powered
up/down
• Output crossbar switch control bits. The crossbar switch is
used to route the green pixels to the same output amplifiers
at all time. A first bit controls the crossbar. When a second
bit is set, the first bit will toggle on every CLK_Y edge in
order to automatically route the green pixels of the bayer
filter pattern.
The code is uploaded serially as a 16-bit word (LSB uploaded
first).
Table 12 lists the register definition. The default code for a full
resolution readout is 33342 (decimal) or 1000 0010 0011 1110.
Page 18 of 30
IBIS4-14000-M
IBIS4-14000-C
Table 12. Serial Sensor Parameters Register Bit Definitions
BIT
Description’
0 (LSB)
set to zero (0)
1
1 = power on sensor array ; 0 = power-down
2
1 = power up output amplifier 4; 0 = power-down
3
1 = power up output amplifier 3; 0 = power-down
4
1 = power up output amplifier 2; 0 = power-down
5
1 = power up output amplifier 1; 0 = power-down
6
3-bit code for subsampling mode of X shift register:
000 = full resolution
011 = select 4, skip 20
001 = full resolution
100 = select 4, skip 4
010 = full resolution
101 = select 4, skip 8
7
8
9
10
11
12
3-bit code for subsampling mode of Y shift registers:
000 = select 2, skip 2
011 = select 2, skip 4
001 = full resolution
100 = select 2, skip 2
010 = select 2, skip 2
101 = select 2, skip 2
Crossbar switch (output multiplexer) control bit initial value.
This initial value is clocked into the crossbar switch at a SYNC_YR rising edge pulse (when the array
pointers jump back to row 1).
The crossbar switch control bit selects the correspondence between multiplexer busses and output amplifiers. Bus-to-output correspondence is according to the following table:
Bus
when bit set to 0
1
output 1
2
output 2
3 (4 outputs)
output 3
4 (4 outputs)
output 4
when bit set to 1
output 2
output 1
output 4
output 3
13
1 = Toggle crossbar switch control bit on every odd/even line. In order to let green pixels always use the
same output amplifier automatically, this bit must be set to 1. On every CLK_Y rising edge (when a new
row is selected), the crossbar switch control bit will toggle. Initial value (after SYNC_Y) is set by bit 12.
14
Not used.
15 (MSB)
1 = Power-up sensor array; 0 = Power-down
3 pins are used for the serial data interface. This interface
converts the serial data into an (internal) parallel data bus
(Serial-Parallel Interface or SPI). The control lines are:
• DATA: the data input. LSB is clocked in first.
• CS: chip select, a rising edge on CS loads the parallelized
data into the on-chip register.
The initial state of the register is undefined. However, no state
exists that destroys the device.
• CLK: clock, on each rising edge, the value of DATA is
clocked in
Document #: 38-05709 Rev. *A
Page 19 of 30
IBIS4-14000-M
IBIS4-14000-C
3.0
Pin Configuration
Table 12 lists the pin configuration of the IBIS4-14000.
Figure 17 shows the assignment of pin numbers on the
package.
Table 13. Pin List
Pin #
Name
Function
Comment
1
OBIAS
Bias current output amplifiers.
2
GND
Ground for output 3.
3
OUT3
Output 3.
4
GND
Ground for output 4.
5
OUT4
Output 4.
6
VDD
Power supply.
Nominal 3.3V
7
GND
Ground.
0V
8
OUT2
Output 2.
9
GND
Ground for output 2.
10
OUT1
Output 1.
11
GND
Ground for output 1.
12
DARKREF
Offset level of output signal.
Typ. 2.6V. min. 1.7V max. 3V
13
TEMP1
Temperature sensor.
Located near the output amplifiers (pixel
4536, 0) near the stitch line).
Any voltage above GND forward biases the diode.
Connect to GND if not used.
14
PHDIODE
Photodiode output.
Reverse biased by any voltage above GND
Yields the equivalent photocurrent of 250 x Connect to GND if not used.
50 pixels. Diode is located right under the
pad.
15
CLK_Y
Y clock for switchboard.
Clocks on rising edge
Connect to CLK_YL (or drive identically)
16
SYNC_Y
Y SYNC pulse for switchboard.
Low active: synchronous sync on rising edge of CLK_Y
Connect to SYNC_YL (or drive identically)
17
TEMP2
Temperature sensor.
Located near pixel (24,0).
Any voltage above GND forward biases the diode.
Connect to GND if not used.
18
GNDAB
Anti-blooming reference level (= pin 33).
Typ. 0V. Set to 1.5V for improved anti-blooming.
19
GND
Ground.
0V
20
VDD
Power supply.
Nominal 3.3V
21
VDDR
Power supply for reset line drivers
Nominal 4V
Connected on-chip to pin 30
22
CLK_YR
Clock of YR shift register.
Shifts on rising edge.
23
SYR
Activate YR shift register for driving of reset High active. Exact pulsing pattern see timing diagram.
and select line of pixel array.
Both SYR = 1 and SYL = 1 is not allowed, except when the
same row is selected!
24
SYNC_YR
Sets the YR shift register to row 1.
25
VDDARRAY Pixel array power supply (= pin 26).
3V
26
VDDARRAY Pixel array power supply (= pin 25).
3V
27
SYNC_YL
Sets the YL shift register to row 1.
Low active. Synchronous sync on rising edge of CLK_YL
200 ns set-up time.
28
SYL
Activate YL shift register for driving of reset High active. Exact pulsing pattern see timing diagram.
and select line of pixel array.
Both SYR = 1 and SYL = 1 is not allowed, except when the
same row is selected!
29
CLK_YL
Clock of YL shift register.
Document #: 38-05709 Rev. *A
Connect with 10kΩ to VDD and decouple with 100 nF to
GND.
Low active. Synchronous sync on rising edge of CLK_YR
200 ns set-up time
Shifts on rising edge.
Page 20 of 30
IBIS4-14000-M
IBIS4-14000-C
Table 13. Pin List(continued)
Pin #
Name
Function
Comment
30
VDDR
Power supply for reset line drivers.
Nominal 4V.
Connected on-chip to pin 21.
31
VDD
Power supply.
Nominal 3.3V
32
GND
Ground.
0V
33
GNDAB
Anti-blooming reference level (= pin 33).
Typ. 0V. Set to 1V for improved anti-blooming.
34
SELECT
Control select line of pixel array.
High active. See timing diagrams.
35
RESET
Reset of the selected row of pixels.
High active. See timing diagrams.
36
CBIAS
Bias current column amplifiers.
Connect with 22 kΩ to VDD and decouple with 100 nF to
GND.
37
PCBIAS
Bias current.
Connect with 22 kΩ to VDD and decouple with 100 nF to
GND.
38
DIN
Serial data input.
16-bit word. LSB first.
39
SCLK
SPI interface clock.
Shifts on rising edge.
40
CS
Chip select.
Data copied to registers on rising edge.
41
PC
Row initialization pulse.
See timing diagrams.
42
SYNC_X
Sets the X shift register to row 1.
Low active. Synchronous sync on rising edge of CLK_X
150 ns set-up time.
43
GND
Ground.
0V
44
VDD
Power supply.
Nominal 3.3V
45
CLK_X
Clock of YR shift register.
Shifts on rising edge.
46
SHR
Row track & hold reset level
(1 = hold; 0 = track).
See timing diagram.
47
SHS
Row track & hold signal level (1 = hold;
0 = track).
See timing diagram.
48
XBIAS
Bias current X multiplexer.
Connect with 10 kΩ to VDD and decouple with 100 nF to
GND.
49
ABIAS
Bias current pixel array.
Connect with 10 MΩ to VDD and decouple with 100 nF to
GND.
Document #: 38-05709 Rev. *A
Page 21 of 30
IBIS4-14000-M
IBIS4-14000-C
4.0
4.1
Geometry & Mechanical
Die Geometry
Pin 1
pixel 0,0
4 output
channels
500 µm
Ground pad, also connected to
package ground plane
Analog output pad
Ground for output pad (not connected
to package ground plane)
Locations of temperature sensing
diodes
Location of photodiode array
Figure 16. Die Geometry and Location of Pixel (0,0)
Document #: 38-05709 Rev. *A
Page 22 of 30
IBIS4-14000-M
IBIS4-14000-C
4.2
Pin Number Assignment
32 33 34 35 36 37
31 30 29 28 27 26
38 39 40 41 42 43
Package
Back side
49 48 47 46 45 44
20 21 22 23 24 25
1 2 3 4 5 6
19 18 17 16 15 14
13 12 11 10 9 8 7
Figure 17. Pin Number Assignment
Note: “Solid” drawn pins are connected to die attach area for
a proper ground plane
Document #: 38-05709 Rev. *A
Page 23 of 30
IBIS4-14000-M
IBIS4-14000-C
4.3
Package Drawings
all dimensions in mm
Figure 18. Package Dimensions
Document #: 38-05709 Rev. *A
Page 24 of 30
IBIS4-14000-M
IBIS4-14000-C
4.4
Die Placement Dimensions and Accuracy
200
2
all dimensions in mm
Figure 19. Die Placement
Figure 20. Tolerances
Document #: 38-05709 Rev. *A
Page 25 of 30
IBIS4-14000-M
IBIS4-14000-C
4.5
Cover Glass
4.5.1
IBIS4-14000-M (monochrome)
Schott D-263 plain glass is the cover glass of the IBIS4-14000
(monochrome).
100
90
Transmission [%]
80
70
60
50
40
30
20
10
0
400
500
600
700
800
900
Wavelength [nm]
Figure 21. D-263 Transmittance Curve
4.5.2
IBIS4-14000-C (color)
S8612 glass is the cover glass of the IBIS4-14000-C (color)
100
Transmittance [%]
90
80
70
60
50
40
30
20
10
0
400
500
600
700
800
900
1000
Wavelength [nm]
Figure 22. S8612 Transmittance Curve (w/o AR coating)
Specification
• Substrate: Schott S8612 glass
• AR coating: 400–690 nm R < 1.5%
• Thickness: 0.7 mm ±0.050 mm
• Dig, haze, scratch 20 µm after coating
• Size: 31.9 x 44.9 mm2 ±0.2 mm
Document #: 38-05709 Rev. *A
Page 26 of 30
IBIS4-14000-M
IBIS4-14000-C
Defects (digs, scratches) detected at final test using F/11 light
source. Glass defects that do not generate non-correctable
pixels are accepted.
5.0
5.1
— Do not scrub the glass surface with cloth or plastic
— Do not attach any tape or labels
— Do not clean the glass surface with dust-cleaning tape
Storage Conditions
Unit
Conditions
Temperature
–10
66
°C
@ 15% RH
Temperature
–10
38
°C
@ 86% RH
• When storing or transporting the device, put it in a container
of conductive material
5.4
Dust and Contamination
Dust or contamination of the glass surface could deteriorate
the output characteristics or cause a scar. In order to
minimize dust or contamination on the glass surface, take the
following precautions:
Note: RH = Relative Humidity
Handling Precautions
Special care should be taken when soldering image sensors
with color filter arrays (RGB color filters), onto a circuit board,
since color filters are sensitive to high temperatures.
Prolonged heating at elevated temperatures may result in
deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor performance is not compromised during end-users’ assembly
processes.
5.3
• To avoid generating static electricity:
Storage and Handling
Description Minimum Maximum
5.2
• When directly handling the device with the fingers, hold the
part without the leads and do not touch any lead.
ESD
Though not as sensitive as CCD sensors, the IBIS4-14000 is
vulnerable to ESD like other standard CMOS devices. Device
placement onto boards should be done in accordance with
strict ESD controls for Class 0, JESD22 Human Body Model,
and Class A, JESD22 Machine Model devices. Take into
account standard ESD procedures when manipulating the
device:
• Assembly operators should always wear all designated and
approved grounding equipment; grounded wrist straps at
ESD protected workstations are recommended including
the use of ionized blowers. All tools should be ESD
protected. To ground the human body, provide a resistance
of 1 MOhm between the human body and the ground to be
on the safe side.
• Handle the device in a clean environment such as a cleaned
booth (the cleanliness should be, if possible, class 100).
• Do not touch the glass surface with the fingers.
• Use gloves to manipulate the device
5.5
Soldering
Soldering should be manually performed with 5 seconds at
350°C maximum at the tip of the soldering iron.
5.6
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be adversely
affected by the flux. Avoid mechanical or particulate damage
to the cover glass. Avoid mechanical stress when mounting
the device.
5.7
RoHS (lead-free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 14. Chemical Substances and Information about Any Intentional Content
Any intentional
content?
If there is any intentional content,
in which portion is it contained?
Lead
NO
-
Cadmium
NO
-
Mercury
NO
-
Hexavalent chromium
NO
-
PBB (Polybrominated biphenyls)
NO
-
PBDE (Polybrominated diphenyl ethers)
NO
-
Chemical Substance
Document #: 38-05709 Rev. *A
Page 27 of 30
IBIS4-14000-M
IBIS4-14000-C
Information on lead free soldering
IBIS4-14000-M: the product was tested successfully for
lead-free soldering processes, using a reflow temperature
profile with maximum 260°C, minimum 40s at 255°C and
minimum 90s at 217°C.
IBIS4-14000-C: the product will not withstand a lead-free
soldering process. Maximum allowed reflow or wave soldering
temperature is 220°C. Hand soldering is recommended for this
part type.
Note:
“Intentional content” is defined as any material demanding
special attention is contained into the inquired product by
following cases:
Document #: 38-05709 Rev. *A
1. A case that the above material is added as a chemical composition into the inquired product intentionally in order to
produce and maintain the required performance and function of the intended product .
2. A case that the above material, which is used intentionally
in the manufacturing process, is contained in or adhered to
the inquired product
The following case is not treated as “intentional content”:
1. A case that the above material is contained as an impurity
into raw materials or parts of the intended product. The impurity is defined as a substance that cannot be removed
industrially, or it is produced at a process such as chemical
composing or reaction and it cannot be removed technically.
Page 28 of 30
IBIS4-14000-M
IBIS4-14000-C
6.0
6.1
Ordering Information
Part Numbers
Table 15. Ordering Information
Monochrome/Color
Glass lid
IBIS4-14000-M
Part number
49-pin PGA package
Monochrome
Monochrome
CYII4SM014KAA-GBC
(preliminary)
49-pin PGA package
Monochrome
Monochrome
IBIS4-14000-C
49-pin PGA package
RGB Color
Color
CYII4SC014KAA-GAC
(preliminary)
49-pin PGA package
RGB Color
Color
6.2
Package
Evaluation Kit
For evaluating purposes an IBIS4-14000 evaluation kit is
available. The IBIS4-14000 evaluation kit consists of a multifunctional digital board (memory, sequencer and IEEE 1394
Fire Wire interface) and an analog image sensor board. Visual
Basic software (under Win 2000 or XP) allows the grabbing
Document #: 38-05709 Rev. *A
and display of images from the sensor. All acquired images
can be stored in different file formats (8 or 16-bit). All settings
can be adjusted on the fly to evaluate the sensors’ specs.
Default register values can be loaded to start the software in a
desired state. Please contact us for more information.
Page 29 of 30
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
IBIS4-14000-M
IBIS4-14000-C
Document History Page
Document Title: IBIS4-14000-M 14-Megapixel CMOS Image Sensor
Document Number: 38-05709
REV.
ECN NO.
**
310213
See ECN
SIL
Initial Cypress release
*A
428177
See ECN
FVK
Layout converted
Figure 12 page 15 updated
Storage and handling section added
IBIS4-14000-C added
Document #: 38-05709 Rev. *A
Issue Date
Orig. of Change
Description of Change
Page 30 of 30