Datasheet - Diodes Incorporated

2DB1386Q/R
20V PNP MEDIUM POWER TRANSISTOR IN SOT89
Features
Mechanical Data

BVCEO > -20V



IC = -5A high Continuous Current
Low saturation voltage VCE(sat) < -1V @ -4A

Case Material: Molded Plastic, "Green” Molding Compound.

UL Flammability Classification Rating 94V-0

Complementary NPN Type: 2DD2098

Moisture Sensitivity: Level 1 per J-STD-020

Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)


Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
SOT89
Case: SOT89
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208

Weight: 0.052 grams (approximate)
C
E
B
C
C
B
E
Device Symbol
Top View
Pin Out – Top View
Ordering Information (Note 4)
Part Number
2DB1386Q-13
2DB1386Q-13R
2DB1386R-13
Notes:
Marking
KP3Q
KP3Q
KP3R
Reel size (inches)
13
13
13
Tape width (mm)
12
12
12
Quantity per reel
2,500
4,000
2,500
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free,"Green"
and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
YWW
KP3x
2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
KP3x = Product Type Marking Code,
where:
KP3Q = 2DB1386Q
KP3R = 2DB1386R
YWW = Date Code Marking
Y = Last digit of year (ex: 7 = 2007)
WW = Week code (01 – 53)
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2DB1386Q/R
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
-30
-20
-6
-5
-10
-500
Unit
V
V
V
A
A
mA
Value
1
125
19
-55 to +150
Unit
W
°C/W
°C/W
°C
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient Air (Note 5)
Thermal Resistance, Junction to Leads (Note 6)
Operating and Storage Temperature Range
Notes:
Symbol
PD
RJA
RθJL
TJ, TSTG
5. For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the device is
measured when operating in steady state condition.
6. Thermal resistance from junction to solder-point (on the exposed collector pad).
1.0
Thermal Resistance (°C/W)
Max Power Dissipation (W)
Thermal Characteristics and Derating Information
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Temperature (°C)
120
100
80
D=0.5
60
40
Single Pulse
D=0.2
D=0.05
20
0
100µ
D=0.1
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
Derating Curve
Max Power Dissipation (W)
100
Single Pulse. T amb=25°C
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
Emitter Cut-Off Current
ON CHARACTERISTICS (Note 7)
Collector-Emitter Saturation Voltage
Symbol
Min
Typ
Max
Unit
BVCBO
BVCEO
BVEBO
ICBO
IEBO
-30
-20
-6










-0.5
-0.5
V
V
V
A
A
IC = -50µA, IE = 0
IC = -1mA, IB = 0
IE = -50µA, IC = 0
VCB = -20V, IE = 0
VEB = -5V, IC = 0
VCE(SAT)

120
180
-0.25


-1.0
270
390
V
IC = -4A, IB = -0.1A

IC = -0.5A, VCE = -2V
Cobo

55

pF
fT

100

MHz
VCB = -20V, IE = 0, f = 1MHz
VCE = -6V, IE = 50mA,
f = 30MHz
2DB1386Q
2DB1386R
DC Current Gain
hFE
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
Notes:
Conditions
7. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.
Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
2.0
400
TA = 150°C
1.8
VCE = -2V
-IC, COLLECTOR CURRENT (A)
350
hFE, DC CURRENT GAIN
300
TA = 85°C
250
200
TA = 25°C
150
100
TA = -55°C
50
0
0.001
1.4
2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
IB = -8mA
1.2
1.0
IB = -6mA
0.8
0.6
IB = -4mA
0.4
0.2
0.01
0.1
1
-IC, COLLECTOR CURRENT (A)
Figure 1 Typical DC Current Gain
vs. Collector Current (2DB1386Q)
IB = -10mA
1.6
IB = -2mA
0
10
-VCE, COLLECTOR EMITTER VOLTAGE (V)
Figure 2 Typical Collector Current
vs. Collector-Emitter Voltage
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Typical Electrical Characteristics
(cont.)
VBE(ON), BASE EMITTER TURN-ON VOLTAGE (V)
-VCE(SAT), COLLECTOR EMITTER
SATURATION VOLTAGE (V)
0.4
IC/IB = 40
0.3
0.2
TA = 150°C
T A = 85°C
0.1
TA = 25°C
T A = -55°C
0
0.0001
1.0
0.8
TA = -55°C
0.6
TA = 25°C
0.4
T A = 85°C
0.2
T A = 150°C
0
0.0001
1,000
1.2
1.0
Cob, OUTPUT CAPACITANCE (pF)
VBE(SAT), BASE EMITTER SATURATION VOLTAGE(V)
VCE = -2V
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Figure 4 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
0.001
0.01
0.1
1
10
-IC, COLLECTOR CURRENT (A)
Figure 3 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
0.8
TA = -55°C
0.6
100
T A = 25°C
0.4
T A = 85°C
0.2
1.2
TA = 150°C
IC/IB = 40
0
0.0001
0.001
0.01
0.1
1
10
10
IC, COLLECTOR CURRENT (A)
Figure 5 Typical Base-Emitter Saturation Voltage
vs. Collector Current
VR, REVERSE VOLTAGE (V)
Figure 6 Typical Output Capacitance Characteristics
120
fT, GAIN-BANDWIDTH PRODUCT
100
80
60
40
VCE = -6V
f = 30MHz
20
0
0
20
40
60
80
100
120
-IC, COLLECTOR CURRENT
Figure 7 Typical Gain-Bandwidth Product
vs. Collector Current
2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
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2DB1386Q/R
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D1
0
.20
R0
C
1
H
H
E
B1
L
B
e
8° (4X)
A
SOT89
Dim
Min
Max
A
1.40
1.60
B
0.44
0.62
B1
0.35
0.54
C
0.35
0.44
D
4.40
4.60
D1
1.62
1.83
E
2.29
2.60
e
1.50 Typ
H
3.94
4.25
H1
2.63
2.93
L
0.89
1.20
All Dimensions in mm
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
Dimensions Value (in mm)
X
0.900
X1
1.733
X2
0.416
Y
1.300
Y1
4.600
Y2
1.475
Y3
0.950
Y4
1.125
C
1.500
X2 (2x)
Y1
Y3
Y4
Y2
Y
C
X (3x)
2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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2DB1386Q/R
Document number: DS31147 Rev. 7 - 2
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