GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer 46.99mm Heat sink lid for power dissipation 1 Socket Li d: Bla ck a nodized 60 61 Aluminum. Thickn ess = 2.5mm. A A 2 Socket ba se : Black a nodized 606 1 A luminum. Thickn ess = 5mm. 3 Compression Plate: B lack ano dize d 6 061 Alu min um. Thickn ess = 2.5mm. 4 Compression screw: Clear an odized 6061 A luminum. Thickn ess = 5mm, Hex socke t = 5mm. 46.99mm Side View (Section AA) 5 Ela stomer: 4 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.75mm. 6 Ela stomer Guid e: Cirlex o r e quiva lent. Thickn ess = 0.745mm. 7 Bal l Gu ide: K apton polyimide. Thickn ess = 0.25mm. 8 Socket ba se screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 9.525 mm long . 9 Socket lid screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 4.76mm long. Recommended torque = 10 in lbs. 1 4 9 11.2mm Max Height 8 2 7 3 5 BGA IC Target PCB 11 6 10 Backing Plate: B lack ano dize d 6061 Alu min um. Thickn ess = 6.35mm. 11 Insulation Plate: FR4/G10, Th ickness = 1 .59 mm. 10 SG-BGA-6123 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: N/A Rev: A Drawing: H. Hansen Date: 8/3/04 File: SG-BGA-6123 Dwg Modified: PAGE 1 of 5 All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. 4.45mm±0.13mm(x4) Recommended PCB Layout Top View Orientation Mark 38.10mm (x4) 5.55mm (x4) 1.00mm typ. 4.45mm±0.13mm(x4) 10.16mm 5.55mm (x4) 8.89mm 27.94mm 46.990mm±0.125mm (x4) Socket size Ø 0.6858mm x PAD 19.05mm 10.16mm Ø 1.600mm±0.025mm(x2) Non plated alignment hole Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 3.18mm±0.05mm(x4) Non plated mounting hole 27.00mm 19.05mm Target PCB Recommendations Total thickness: 3.175mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6123 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 2:1 Rev: A Drawing: H. Hansen Date: 8/3/04 File: SG-BGA-6123 Dwg Modified: PAGE 2 of 5 Compatible BGA Spec DETAIL 5.08mm X D 5.03mm 1 E 11.50mm A1 INDEX 8.00mm Y e 14.00mm 5.03mm 3 Øb Ø0.25 Z X Y Ø0.10 0.20 7.48mm TOP VIEW DETAIL SIDE VIEW BOTTOM VIEW DIM 5 0.25 Z 1. Dimensions are in mil lime te rs. 2. Inte rpret dimensions and to leraces p er AS ME Y1 4.5 M-1 994. A Z 4 SG-BGA-6123 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 0.15 Z Status: Released MAX A A1 3.75 0.3 0.5 b 0.6 Dimension b is measure d a t th e maximum solde r b all d iameter, pa rallel to d atum pla me Z. D 29.0 BSC E 29.0 BSC 4 Datum Z (se atin g p lane) is d efined by the sp herical cro wn s of the solder ba lls. e 1.0 BSC 5 Par allelism mea su rement shal l exclude any effe ct o f mark o n top surface of package. 3 A1 MIN Scale: 2:1 Array 28x28 Rev: A Drawing: H. Hansen Date: 8/3/04 File: SG-BGA-6123 Dwg Modified: PAGE 3 of 5 R 1.60mm (x8) R 0.40mm (x13) Top View 28.00mm 28.00mm 38.10mm±0.03mm (x2) Note: Backing plate holes are tapped to accept 0-80 screws. 2.50mm [0.098"] Side View 0.025 A 6.35mm 3.175mm Description: Backing Plate A PAGE 4 of 5 SG-BGA-6123 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 2:1 Rev: A Drawing: H. Hansen Date: 8/3/04 File: SG-BGA-6123 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) Socket (direct mount - hardware) User Instructions Tooling holes have to be designed into the target PCB for this version of the GHz BGA socket Socket Lid Screw 1. Install the socket base assembly on the target PCB with the socket base screws (1 in-lb torque per screw). Check orientation of the socket with respect to the target PCB. Place insulation plate in between target PCB and backing plate. Socket base screws will thread into the backing plate. 2. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation on target PCB is critical. 3. Install the socket lid on to the socket base assembly using socket lid screws. Socket Lid (customer supplied) 4. Apply 1 in-lb torque per screw on two opposite lid screws. Then, apply 2 in-lb torque per screw on the remaining two opposite lid screws. Then, Apply 2 in-lb torque per screw on the initial two lid screws. Now, all the lid screws have 2 in-lb torque applied in gradual increments. BGA Package Socket Base Socket Base Assembly Dowel pin Angle wire elastomer Target PCB with SMT pads Insulation Plate Backing Plate Socket Base Screw © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PA UL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com PAGE 5 of 5