RF3220 - RFMD.com

RF3220
RF3220Low
Noise, Linear
Amplifier High
Linearity/Driver
Amplifier
LOW NOISE, LINEAR AMPLIFIER
HIGH LINEARITY/DRIVER AMPLIFIER
+14.0dB Gain at 1850MHz

2.9dB Noise Figure at 1850MHz

Single 5V Power Supply
Basestation Applications

Cellular and PCS Systems

CDMA, W-CDMA Systems

GSM/EDGE Systems

Final PA for Low-Power
Applications
10
9 GND
RF IN 2
8 RF OUT
GND 3
Applications

11
GND 1
+12.5dBm Input P1dB at
1850MHz

GND

12
7 GND
4
5
6
GND
+40.8dBm Output IP3
GND
500MHz to 3GHz

GND

BIAS
Features
GND
Package Style: QFN, 12-Pin, 3 x 3
Functional Block Diagram
Product Description
The RF3220 is a high-efficiency GaAs Heterojunction Bipolar Transistor (HBT)
amplifier packaged in a low-cost surface-mount package. This amplifier is ideal for
use in applications requiring high-linearity and low noise figure over the 500MHz to
3GHz frequency range. The RF3220 operates from a single 5V power supply, and is
assembled in an economical 3mmx3mm QFN package.
Ordering Information
RF3220
RF3220PCBA-41X

GaAs HBT
GaAs MESFET
InGaP HBT
Low Noise, Linear Amplifier High Linearity/Driver Amplifier
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A3 DS100520
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 10
RF3220
Absolute Maximum Ratings
Parameter
Rating
Unit
RF Input Power
+20
dBm
Device Voltage
-0.5 to +6.0
V
Device Current
200
mA
Operating Temperature
-40 to +85
°C
Storage Temperature
-40 to +150
°C
Parameter
Min.
Specification
Typ.
Max.
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Unit
Condition
VCC =5V, RFIN =-10dBm, Freq=1850MHz, with
Temp=25°C unless otherwise noted.
Overall
AC Specifications
Frequency
1850
MHz
Gain
12
14.0
Output IP3
36
40
dBm
Output P1dB
24
+25.5
dBm
2.9
dB
Noise Figure
15.5
dB
F1 = 1850MHz, F2 =1851MHz
Thermal
ThetaJC
76
°C/W
Maximum Measured Junction
Temperature at DC Bias
Conditions
146
°C
TCASE =+85°C
ICC= 160mA
VCC =5.0V
Mean Time To Failures
>100
years
TCASE =+85°C
DC Specifications
Device Voltage
Operating Current Range
5.0
110
135
V
160
mA
Note: The RF3220 must be operated at or below 160mA in order to achieve the thermal performance listed above.
2 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A3 DS100520
RF3220
Pin
1
2
Function
GND
RF IN
Description
Interface Schematic
Ground connection.
RF input pin. This pin is not internally DC-blocked. A DC blocking capacitor
suitable for the frequency of operation should be used.
To Bias
Circuit
RF OUT
RF IN
3
4
5
6
7
8
GND
GND
GND
GND
GND
RF OUT
9
10
11
GND
GND
BIAS
12
Pkg
Base
GND
GND
Ground connection.
Ground connection.
Ground connection.
Ground connection.
Ground connection.
Amplifier output pin. This pin is an open-collector output. It must be biased
to VCC through a choke or matching inductor. This pin is typically matched
to 50 with a shunt bias/matching inductor and series blocking/matching
capacitor. Refer to application schematics.
Ground connection.
See pin 2.
Ground connection.
This pin is used to control the bias current. An external resistor may be
used to set the bias current for any VPD voltage. Allows for trade-offs
between IP3 versus noise figure and TMAX.
V
C C
Ground connection.
Ground connection. Vias to ground required under the package base.
Package Drawing
2 PLCS
0.05 C
-A-
2 PLCS
0.10 C A
0.90
0.85
0.05
0.00
0.70
0.65
3.00
0.10 C B
2 PLCS
3.00
12°
MAX
2 PLCS
0.10 C B
-B-
2.75 SQ.
Dimensions in mm.
-C-
SEATING
PLANE
0.10 C A
2 PLCS
Shaded lead is pin 1.
0.10 M C A B
0.60
0.24
TYP
0.30
0.18
PIN 1 ID
R.20
0.75
0.50
1.25
0.95
SQ.
0.50
Rev A3 DS100520
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
3 of 10
RF3220
Application Schematic - 1850MHz
VCC
270 
12
11
10
1
9
2
8
3 pF
RF IN
2.2 nH
RF OUT
2.2 pF
3
7
4
4 of 10
10 nH
5
4.7 nH
6
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A3 DS100520
RF3220
Evaluation Board Schematic
BIAS
C6
0.1 F
J1
RF IN
50  strip
C1
3 pF
L1
2.2 nH
R1
270 
C5
10 pF
12
VCC
11
C3
10 pF
10
1
9
2
8
3
7
4
5
L2
10 nH
C4
0.1 F
C2
2.2 pF
50  strip
L3
4.7 nH
6
J2
RF OUT
P1
P1-1
P1-3
1
BIAS
2
GND
3
VCC
CON3
Rev A3 DS100520
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 10
RF3220
Evaluation Board Layout
Board Size 1.5" x 1.5"
Board Thickness 0.032”, Board Material FR-4
6 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A3 DS100520
RF3220
Gain versus Frequency Across Temperature
ICC versus VCC Across Temperature
210.00
(VCC=5.0V)
16.0
-40C
25C
85C
190.00
-40C
25C
85C
14.0
170.00
Gain (dB)
ICC (mA)
150.00
130.00
110.00
12.0
10.0
90.00
8.0
70.00
50.00
6.0
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
Frequency (MHz)
VCC (V)
OIP3 versus Frequency Across Temperature
43.0
Output P1dB versus Frequency Across Temperature
(VCC=5.0V)
44.0
-40C
25C
85C
-40C
25C
85C
42.0
25.0
Output P1dB (dBm)
41.0
40.0
OIP3 (dBm)
(VCC=5.0V)
26.0
39.0
38.0
37.0
36.0
24.0
23.0
35.0
34.0
33.0
22.0
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
Frequency (MHz)
Frequency (MHz)
Input SWR versus Frequency Across Temperature
Output VSWR versus Frequency Across Temperature
(VCC=5.0V)
6.0
(VCC=5.0V)
3.0
-40C
25C
85C
-40C
25C
85C
5.0
2.5
SWR
VSWR
4.0
2.0
3.0
1.5
2.0
1.0
1.0
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
Frequency (MHz)
Frequency (MHz)
Rev A3 DS100520
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
7 of 10
RF3220
Noise Figure versus Frequency Across Temperature
(VCC=5.0V)
5.5
5.0
-40C
25C
85C
Noise Figure (dB)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0
Frequency (MHz)
8 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A3 DS100520
RF3220
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.90 x 0.28 (mm) Typ.
B = 0.28 x 0.90 (mm) Typ.
C = 1.10 (mm) Sq.
1.00 Typ.
0.50 Typ.
B
Pin 1
0.50 Typ.
B
B
A
Dimensions in mm.
A
A
C
A
A
0.50
1.00 Typ.
A
0.77 Typ.
B
B
B
0.77 Typ.
0.50 (mm)
Figure 1. PCB Metal Land Pattern (Top View)
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The centergrounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of
the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
Rev A3 DS100520
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
9 of 10
RF3220
A = 1.00 x 0.38 (mm) Typ.
B = 0.38 x 1.00 (mm) Typ.
C = 1.20 (mm) Sq.
1.00 Typ.
0.50 Typ.
B
B
B
Dimensions in mm.
Pin 1
A
0.50 Typ.
A
A
C
A
A
0.50
1.00 Typ.
A
0.77 Typ.
B
B
B
0.77 Typ.
0.50
Figure 2. PCB Solder Mask Pattern (Top View)
10 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A3 DS100520