RF1604 - RFMD.com

RF1604
BROADBAND HIGH POWER SP4T SWITCH
Package Style: QFN, 12-pin, 2.5mmx2.5mm
RF1604
Features







2kV HBM ESD Protection on
All Ports
Low Frequency to >2.7GHz
Operation
Low Insertion Loss:
0.4dB at 1GHz
Very High Isolation: 40dB at
1GHz
Compatible With Low Voltage
Logic (VHIGH Min=1.3V)
High Linearity:
IIP2 >120dBm
No External DC Blocking
Capacitors Required on RF
Paths Unless DC is applied
Externally
Applications





Multi-Mode
GSM/EDGE/WCDMA, and
LTE Applications
GSM/GPRS/EDGE Switch
Applications
Cellular Infrastructure Applications
Receive Diversity Switching
General Purpose Switching
Applications
RF1
RF2
RF3
RF4
VDD V1
V2
Functional Block Diagram
Product Description
The RF1604 is a single-pole four-throw (SP4T) switch designed for general
purpose switching applications which require very low insertion loss and
high power handling capability with minimal DC power consumption. The
excellent linearity performance achieved by the RF1604 make it ideal for
use in multimode GSM/EDGE/WCDMA, LTE, and cellular infrastructure
applications. The RF1604 offers very high isolation between the RF ports,
providing greater RF separation between the transmit and receive paths,
which is critical in full-duplex systems. Additionally, RF1604 includes integrated decoding logic, allowing just two control lines needed for switch
control. The RF1604 is packaged in a very compact 2.5mmx2.5mm, 12pin, leadless QFN package.
Ordering Information
RF1604
RF1604PCBA-410
Broadband High Power SP4T Switch
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
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RF1604
Absolute Maximum Ratings
Parameter
Rating
Unit
VDD
3.0
V
Maximum Power Handling
(6 to 1 VSWR over Temperature)
+36
dBm
Operating Temperature
-30 to +85
°C
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
Storage Temperature
-35 to +100
°C
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Parameter
Min.
Specification
Typ.
Max.
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
Unit
Condition
Active Mode:VHIGH >1.8V,VLOW <0.3V;
Temp=25°C; VDD =2.5V
PIN [email protected]@1.98GHz;
All RF ports terminated to ZO =50.
Electrical Characteristics
Insertion Loss
RF1, RF2, RF3, RF4-ANT
0.40
0.50
dB
0.5GHz to 1GHz
0.45
0.55
dB
1.0GHz to 2.0GHz
0.45
0.55
dB
2.0GHz to 2.5GHz
0.7
0.85
dB
2.5GHz to 3.5GHz
Isolation
RF1, RF2, RF3, RF4-ANT
36
40
dB
0.5GHz to 1.0GHz
31
35
dB
1.0GHz to 2.0GHz
30
33
dB
2.0GHz to 2.5GHz
23
28
dB
2.5GHz to 3.5GHz
23
30
dB
0.5GHz to 3.5GHz, All RF ports in Insertion
Loss state.
PIN=35dBm
RF Port Return Loss
RF1, RF2, RF3, RF4-ANT
900MHz Harmonics
Second Harmonic (2f0)
-85
-75
dBc
Third Harmonic (3f0)
-90
-75
dBc
Second Harmonic (2f0)
-85
-75
dBc
Third Harmonic (3f0)
-90
-75
dBc
1980MHz Harmonics
PIN =33dBm
IIP2
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RF1, RF2, RF3, RF4-ANT Cell
115
120
dBm
Tone 1: 836.5MHz at 26dBm, Tone 2:
1718MHz at -20dBm, Receive Freq: 881.5MHz
RF1, RF2, RF3, RF4-ANT AWS
115
120
dBm
Tone 1: 1732.5MHz at 26dBm, Tone 2:
3865MHz at -20dBm, Receive Freq:
2132.5MHz
RF1, RF2, RF3, RF4-ANT PCS
115
120
dBm
Tone 1: 1880MHz at 26dBm, Tone 2:
3840MHz at -20dBm, Receive Freq: 1960MHz
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RF1604
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
IIP3
RF1, RF2, RF3, RF4-ANT Cell
68
73
dBm
Tone 1: 836.5MHz at 26dBm, Tone 2:
791.5MHz at -20dBm, Receive Freq:
881.5MHz
RF1, RF2, RF3, RF4-ANT IMT
68
73
dBm
Tone 1: 1950MHz at 26dBm, Tone 2:
1760MHz at -20dBm, Receive Freq: 2140MHz
TBR BC0 (GSM800)
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
TBR BC1 (PCS)
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
TBR BC4
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
TBR BC5 (GSM400)
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
TBR BC14 (PCS)
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
TBR BC15 (AWS)
85
99
dBc
VSWR=2:1; Temp=-20°C, 25°C, +85°C
35
dBm
VSWR=6:1, Temp= -30to +85C
Triple Beat Ratio (TBR)
Max Operating Power
Switching Time
Switching Speed ON
2
5
s
Switching Speed OFF
2
5
s
50% control to 10% RF
10
s
Maximum set up time for the switch to reach
fully compliant operation
2.5
2.7
V
0
0.3
V
IHIGH
50
100
ILOW
0
Start-Up Time
50% control to 90% RF
Supply and Control Signal Characteristics
Switched Supply Voltage (VDD)
VHIGH
2.2
VLOW
Switched Supply Current (VDD)
A
PIN =35dBm
mA
Control Voltage (V1, V2)
VHIGH
1.3
1.8
2.6
V
VLOW
0
0
0.3
V
IHIGH
1.0
5.0
A
ILOW
0.5
1.0
A
Control Current (V1, V2)
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RF1604
Pin
1
Function
VDD
2
3
4
5
6
7
8
9
10
11
12
Pkg Base
V2
V1
RF4
GND
RF3
GND
ANT
GND
RF1
GND
RF2
GND
Description
Supply. The voltage at this node will be switched and it is important that the switch is operating within the
specified start up time. This signal might be used as a mode control.
Control signal 2.
Control signal 1.
RF output 4.
Ground.
RF output 3.
Ground.
RF input (connected to antenna).
Ground.
RF output 1.
Ground.
RF output 2.
Ground.
RF2
GND
RF1
Pin Out
12
11
10
9
GND
V2
2
8
ANT
V1
3
7
GND
RF4
4
5
6
RF3
1
GND
VDD
Top View
Package Drawing
Top View
Bottom View
Side View
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RF1604
General Information
Truth Table for Switch States
State
V1
V2
RF Path
1
VLOW
VLOW
ANT-RF1
ANT-RF2
2
VLOW
VHIGH
3
VHIGH
VLOW
ANT-RF3
4
VHIGH
VHIGH
ANT-RF4
Control Logic
The switch is operable in four states (see Truth Table). When VDD is high, the switch is active. The start-up time is defined as
the delay time that control signal(s) cross 0.8V threshold until KF output level is 90% of final RF voltage peak.
Power Sequence
ON Sequence: First turn ON VDD, then apply control signals.
OFF Sequence: First turn OFF the control signals, then turn OFF VDD.
Note:
Not following the power ON/OFF sequence could cause damage to the switch and may affect the long-term reliability of the
device.
Electrical Test Methods
The electrical parameters for the switch were measured on RFMD evaluation board. The test PWB includes means for decoupling RF signals from control signal port (shunt capacitor at control signal ports).
All measurements are done with calibration plane at switch pins. The effect of test board losses and phase delay has been
removed from the results.
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RF1604
Evaluation Board Schematic
P1
1
2
3
4
5
C1
100pF
C2
100pF
GND
CTRL1
CTRL2
VDD
GND
C3
10nF
ANT
RF1
J5
J1
3
2
R1
0
1
10
RF2
12
J2
L1
DNI
8
R2
0
RF1604
6
4
RF4
5
RF3
7
9
11
13
J4
J3
Denotes 50 ohm transmission line
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RF1604
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
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RF1604
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2 mil to 3 mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
8 of 9
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120125
RF1604
DS120125
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
9 of 9